•Ultra-Low ON-State Resistance
– rON= 66 mΩ at VIN= 3.6 V
– rON= 75 mΩ at VIN= 2.5 V
– rON= 90 mΩ at VIN= 1.8 V
– rON= 135 mΩ at VIN= 1.2 V
•500-mA Maximum Continuous Switch Current
•Quiescent Current < 1 mA
•Shutdown Current < 1 mA
•Low Control Input Threshold Enables Use of
1.2-V/1.8-V/2.5-V/3.3-V Logic
•Controlled Slew Rate (5 ms Max at 3.6 V)
•Quick Output Discharge (TPS22904 Only)
•ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
•4-Terminal Wafer Chip-Scale Package (WCSP)
– 0.8 mm × 0.8 mm,
0.4-mm Pitch, 0.5-mm Height
APPLICATIONS
•PDAs
•Cell Phones
•GPS Devices
•MP3 Players
•Digital Cameras
•Peripheral Ports
•Portable Instrumentation
YFP PACKAGE
TERMINAL ASSIGNMENTS
BGNDON
AV
OUT
21
V
IN
DESCRIPTION
The TPS22903 and TPS22904 are ultra-small, low rONsingle channel load switches with controlled turn on. The
device contains a P-channel MOSFET that can operate over an input voltage range of 1.1 V to 3.6 V. The switch
is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage control signals. In
TPS22904, a 85-Ω on-chip load resistor is added for output quick discharge when switch is turned off.
TPS22903 and TPS22904 are available in a space-saving 4-terminal WCSP 0.4-mm pitch (YFP). The devices
are characterized for operation over the free-air temperature range of –40°C to 85°C.
1
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
FEATURE LIST
DEVICEOUTPUTENABLE
TPS2290366 mΩ5 ms maxNo500 mAActive high
TPS2290466 mΩ5 ms maxYes500 mAActive high
(1) This feature discharges the output of the switch to ground through a 85-Ω resistor, preventing the
output from floating.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
–40°C to 85°CWCSP – YFP (0.4-mm pitch)Tape and reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
Input voltage range–0.34V
Output voltage rangeVIN+ 0.3V
Input voltage range–0.34V
Power dissipation at TA= 25°C0.48W
Maximum continuous switch current0.5A
Operating free-air temperature range–4085°C
Storage temperature range–65150°C
Maximum lead temperature (10-s soldering time)300°C
Human-Body Model (HBM)2000
Charged Device Model (CDM)1000
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL IMPEDANCE RATINGS
TYP UNIT
q
Package thermal impedance
JA
(1)
YFP package205 °C/W
(1) The package thermal impedance is calculated in accordance with JESD 51-7.