TEXAS INSTRUMENTS TPS2220A, TPS2223A, TPS2224A, TPS2226A Technical data

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24 23 22 21 20 19 18 17 16 15 14 13
1 2 3 4 5 6 7 8 9 10 11 12
TPS2223A, TPS2224A
DB OR PWP PACKAGE
(TOP VIEW)
5V 5V
DATA
CLOCK
LATCH
NC
12V
AVPP AVCC AVCC
GND
RESET
5V NC NC SHDN 12V
BVPP BVCC BVCC NC OC
3.3V
3.3V
NC − No internal connection
Pin 7 and 20 are NC for TPS2223A.
查询TPS2220ADB供应商
CARDBUS POWER-INTERFACE SWITCHES
FOR SERIAL PCMCIA CONTROLLERS
FEATURES APPLICATIONS
Single-Slot Switch: TPS2220A
Dual-Slot Switches: TPS2223A, TPS2224A, TPS2226A
Fast Current Limit Response Time
Fully Integrated VCC and VPP Switching for
3.3 V, 5 V, and 12 V (no 12 V on TPS2223A)
Meets Current PC Card™ Standards
V
12-V and 5-V Supplies Can Be Disabled
TTL-Logic Compatible Inputs
Short-Circuit and Thermal Protection
24-Pin HTSSOP, 24- or 30-Pin SSOP
140-µA (Typical) Quiescent Current from
Break-Before-Make Switching
Power-On Reset
40 ° C to 85 ° C Operating Ambient Temperature
Output Selection Independent of V
pp
3.3-V Input
Range
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
Notebook and Desktop Computers
Bar Code Scanners
Digital Cameras
Set-Top Boxes
PDAs
CC
DESCRIPTION
The TPS2223A, TPS2224A, and TPS2226A CardBus™ power-interface switches provide an integrated power-management solution for two PC Card sockets. The TPS2220A is a single-slot option for this family of devices. These devices allow the controlled distribution of 3.3 V, 5 V, and 12 V to each card slot. The current-limiting and thermal-protection features eliminate the need for fuses. Current-limit reporting helps the user isolate a system fault. The switch r requirements stated in the PC Card specification, and optimized for cost. A faster maximum current limit response time is the only difference between the TPS2223A, TPS2224A, and TPS2226A and the TPS2223, TPS2224, and TPS2226.
Like the TPS2214 and TPS2214A and the TPS2216 and TPS2216A, this family of devices supports independent VPP/VCC switching; however, the standby and interface-mode pins are not supported. Shutdown mode is now supported independently on SHDN as well as in the serial interface. Optimized for lower power implementation, the TPS2223A does not support 12-V switching to VPP. See the available options table for pin-compatible device information.
PC Card, CardBus are trademarks of PCMCIA (Personal Computer Memory Card International Association). PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
and current-limit values have been set for the peak and average current
DS(on)
Copyright © 2002–2004, Texas Instruments Incorporated
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TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
TPS2223ADB, TPS2224ADB TPS2226ADB
-40 ° C to 85 ° C TPS2220ADB TPS2220APWP
(1) The DB and PWP packages are also available taped and reeled. Add R suffix to device type (e.g., TPS2223APWPR) for taped and
reeled.
T
A
–40 ° C to 85 ° C Green
(1) The marketing status values are defined as follows:
ACTIVE: This device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend
using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued production of the device.
(2) Eco-Status Information Additional details including specific material content can be accessed at www.ti.com/leadfree
N/A: Not yet available Lead (Pb)-free, for estimated conversion dates go to www.ti.com/leadfree.
Pb-Free: TI defines "Lead (Pb)-Free" or "Pb-Free" to mean RoHS compatible, including a lead concentration that does not exceed
0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes.
Green: TI devices "Green" to mean Lead (Pb)-Free and in addition, uses package materials that do not contain halogens, including bromine (Br), or antimony (Sb) above 0.1% of total product weight.
Pin TPS2214, Pin
compatibles TPS2214A compatibles
SSOP(DB) STATUS
TPS2220ADBG4 Active TPS2220APWPRG4 Active TPS2223ADBG4 Active TPS2223APWPRG4 Preview TPS2224ADBG4 Active TPS2224APWPRG4 Preview TPS2226ADBG4 Active TPS2226APWPRG4 Preview
PLASTIC SMALL OUTLINE PowerPAD™
DB-24 DB-30
TPS2216, TPS2216A, TPS2206
PLASTIC SMALL OUTLINE
TPS2223APWP,
TPS2224APWP
LEAD (PB-FREE) ORDERING INFORMATION
(1)
HTSSOP(PWP) STATUS
(1)
(PWP-24)
(1)
ECO-STATUS
(2)
2
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TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
V
I(3.3V)
V
V
I
T T
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
(2) Not applicable for TPS2223A
Input voltage range for card power V
I
I(5V)
(2)
V
I(12V)
Logic input/output voltage –0.3 to 6 V
V
Output voltage
O
O(xVCC)
V
O(xVPP)
Continuous total power dissipation See Dissipation Rating Table
I
Output current
O
Operating virtual junction temperature range –40 to 100 ° C
J
Storage temperature range –55 to 150 ° C
stg
O(xVCC)
I
O(xVPP)
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds) 260 ° C OC sink current 10 mA
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1)
TPA222xA UNIT
–0.3 to 5.5 V –0.3 to 5.5 V
–0.3 to 14 V
–0.3 to 6 V
–0.3 to 14 V
Internally Limited Internally Limited
DISSIPATION RATING TABLE
PACKAGE
DB
(1)
24 890 mW 8.9 mW/ ° C 489 mW 356 mW 30 1095 mW 10.95 mW/ ° C 602 mW 438 mW
PWP 24 3322 mW 33.22 mW/ ° C 1827 mW 1329 mW
(1) These devices are mounted on an JEDEC low-k board (2-oz. traces on surface).
TA≤ 25 ° C DERATING FACTOR TA= 70 ° C TA= 85 ° C
POWER RATING ABOVE TA= 25 ° C POWER RATING POWER RATING
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
(1)
Input voltage, V operations. 5V and 12V are only required for V their respective functions.
I
O
f
(clock)
t
w
t
h
t
su
t
d(latch)
t
d(clock)
T
J
Output current
Clock frequency 2.5 MHz
Pulse duration ns
Data-to-clock hold time (see Figure 2 ) 100 ns Data-to-clock setup time (see Figure 2 ) 100 ns Latch delay time (see Figure 2 ) 100 ns Clock delay time (see Figure 2 ) 250 ns Operating virtual junction temperature (maximum to be calculated at worst case PDat 85 ° C
ambient)
(1) It is understood that for V (2) Not applicable for TPS2223A
V
I(3.3V)
is required for all circuit
I(3.3V) I(5V)
(2)
V
I(12V)
I
at TJ= 100 ° C 1 A
O(xVCC)
I
at TJ= 100 ° C 100 mA
O(xVPP)
Data 200 Latch 250 Clock 100 Reset 100
< 3 V, voltages within the absolute maximum ratings applied to pin 5V or pin 12V do not damage the IC.
I(3.3V)
3 3.6 3 5.5 V 7 13.5
–40 100 ° C
3
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TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
ELECTRICAL CHARACTERISTICS
TJ= 25 ° C, V noted)
POWER SWITCH
r
DS(on)
I
OS
T
J
I
I
I
lkg
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account
separately. (2) TPS2223A, TPS2224A, TPS2226A: two switches on. TPS2220A: one switch on. (3) Specified by design; not tested in production. (4) From application of short to 110% of final current limit.
= 5 V, V
I(5V)
PARAMETER TEST CONDITIONS
Static drain-source on-state resistance
Output discharge resistance
Short-circuit output current
Thermal shutdown temperature
(2)
Current-limit response time
Input current, quiescent µA
Leakage current, output off state
= 3.3 V, V
I(3.3V)
3.3V to xVCC
5V to xVCC
3.3V or 5V to xVPP
12V to xVPP
Discharge at xVCC I Discharge at xVPP I
= 12 V (not applicable for TPS2223A), all outputs unloaded (unless otherwise
I(12V)
(1)
(2)
IO= 750 mA each 85 110 IO= 750 mA each, TJ= 100 ° C 110 140
(2)
IO= 500 mA each 95 130 IO= 500 mA each, TJ= 100 ° C 120 160 IO= 50 mA each 0.8 1
(2)
IO= 50 mA each, TJ= 100 ° C 1 1.3
(2)
IO= 50 mA each 2 2.5 IO= 50 mA each, TJ= 100 ° C 2.5 3.4
= 1 mA 0.5 0.7 1
O(disc)
= 1 mA 0.2 0.4 0.5
O(disc)
I
Limit (steady-state value), output pow­ered into a short circuit
Limit (steady-state value), output pow- I ered into a short circuit, TJ= 100 ° C
OS(xVCC)
I
OS(xVPP) OS(xVCC)
I
OS(xVPP)
MIN TYP MAX UNIT
1 1.4 2 A
120 200 300 mA
1 1.4 2 A
120 200 300 mA
Thermal trip point Rising temperature 135 Hysteresis 10
(3) (4)
5V to xVCC = 5 V, with 100-m short to GND 10 5V to xVPP = 5 V, with 100-m short to GND 3
I Normal VO(xVCC) = VO(xVPP) = 3.3 V and operation also for RESET = 0 V
Shutdown mode I
Shutdown mode µA
I(3.3V)
I
I(5V)
I
I(12V)
I
I(3.3V)
VO(xVCC) = VO(xVPP) = Hi-z 0.1 2
I(5V)
I
I(12V)
V
= 5 V, V
O(xVCC)
V
= 12 V, V
O(xVPP)
= V
I(5V)
I(5V)
= 0 V
I(12V)
= V
= 0 V
I(12V)
TJ= 100 ° C 50
TJ= 100 ° C 50
m
k
° C
µs
140 200
8 12
100 180
0.3 2
0.3 2 10
10
4
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PARAMETER TEST CONDITIONS
LOGIC SECTION (CLOCK, DATA, LATCH, RESET, SHDN, OC)
(5)
I
I(/RESET)
(5)
I
I
I
V
IH
V
IL
V
O(sat)
I
lkg
Input current, logic SHDN = 0 V -50 -3 µA
High-level input voltage, logic 2 V Low-level input voltage, logic 0.8 V Output saturation voltage at OC IO= 2 mA 0.14 0.4 V Leakage current at OC V
I(/SHDN)
(5)
I
I(LATCH)
I
I(CLOCK, DATA)
RESET = 5.5 V -1 1 RESET = 0 V -30 -20 -10 SHDN = 5.5 V -1 1
LATCH = 5.5 V 50 LATCH = 0 V -1 1 0 V to 5.5 V -1 1
O(/OC)
UVLO AND POR (POWER-ON RESET)
V
I(3.3V)
V
hys(3.3V)
V
I(5V)
V
hys(5V)
t
df
V
I(POR)
Input voltage at 3.3V pin, UVLO 3.3-V level below which all switches are Hi-Z 2.4 2.7 2.9 V UVLO hysteresis voltage at VA
(6)
Input voltage at 5V pin, UVLO 5-V level below which only 5V switches are Hi-Z 2.3 2.5 V UVLO hysteresis voltage at 5V Delay time for falling response, UVLO
Input voltage, power-on reset
(6)
(6)
(6)
Delay from voltage hit (step from 3 V to 2.3 V) to Hi-Z control (90% VGto GND)
3.3-V voltage below which POR is asserted causing a RESET internally with all line switches open and all 1.7 V discharge switches closed.
(5) LATCH has low-current pulldown. RESET and SHDN have low-current pullup. (6) Specified by design; not tested in production.
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
(1)
= 5.5 V 0 1 µA
MIN TYP MAX UNIT
100 mV
100 mV
4 µs
5
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TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
SWITCHING CHARACTERISTICS
V
= 5 V, TA= 25 ° C, V
CC
otherwise noted)
PARAMETER
t
Output rise times
r
t
Output fall times
f
Propagation delay
t
pd
times
(1)
(3)
= 3.3 V, V
I(3.3V)
C
L(xVCC)
I
(3)
(3)
O(xVCC)
C
L(xVCC)
I
O(xVCC)
C
L(xVCC)
I
O(xVCC)
C
L(xVCC)
I
O(xVCC)
C
L(xVCC)
I
O(xVCC)
C
L(xVCC)
I
O(xVCC)
= 5 V, V
I(5V)
= 12 V (not applicable for TPS2223A) all outputs unloaded (unless
I(12)
LOAD CONDITION TEST CONDITIONS
= 0.1 µF, C
= 0 A, I
= 150 µF, C
= 0.75 A, I
= 0.1 µF, C
= 0 A, I
= 150 µF, C
= 0.75 A, I
= 0.1 µF, C
= 0 A, I
= 150 µF, C
= 0.75 A, I
O(xVPP)
O(xVPP)
O(xVPP)
= 0.1 µF,
L(xVPP)
= 0 A
= 10 µF,
L(xVPP)
= 50 mA
O(xVPP)
= 0.1 µF,
L(xVPP)
= 0 A
= 10 µF,
L(xVPP)
= 50 mA
O(xVPP)
= 0.1 µF,
L(xVPP)
= 0 A
= 10 µF,
L(xVPP)
= 50 mA
O(xVPP)
(2)
V V V V V
Discharge switches ON V
Discharge switches ON V V
Latch to xVPP (12V)
= 5 V 0.9
O(xVCC)
= 12 V 0.26
O(xVPP)
= 5 V 1.1
O(xVCC)
= 12 V 0.6
O(xVPP)
= 5 V,
O(xVCC)
= 12 V,
O(xVPP)
= 5 V 2.35
O(xVCC)
= 12 V 3.9
O(xVPP)
(4)
Latch to xVPP (5V)
Latch to xVPP (3.3V) ms
Latch to xVCC (5V)
Latch to xVCC (3.3V)
Latch to xVPP (12V)
(4)
Latch to xVPP (5V)
Latch to xVPP (3.3V) ms
Latch to xVCC (5V)
Latch to xVCC (3.3V)
t
pdon
t
pdoff
t
pdon
t
pdoff
t
pdon
t
pdoff
t
pdon
t
pdoff
t
pdon
t
pdoff
t
pdon
t
pdoff
t
pdon
t
pdoff
t
pdon
t
pdoff
t
pdon
t
pdoff
t
pdon
t
pdoff
MIN TYP MAX UNIT
0.5
0.2
2
0.62
0.77
0.51
0.75
0.52
0.3
2.5
0.3
2.8
2.2
0.8
0.8
0.6
0.8
0.6
0.6
2.5
0.5
2.6
ms
ms
(1) Refer to Parameter Measurement Information in Figure 1 . (2) No card inserted, assumes a 0.1-µF output capacitor (see Figure 1 ). (3) Specified by design; not tested in production. (4) Not applicable for TPS2223A
6
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CS
CS
S1
S4
CS
S7
CS
S11
Control Logic SHDN RESET DATA CLOCK LATCH
OC
GND
UVLO
POR
Current Limit
Thermal Limit
S2
S5
S3
S6
S8
S9
S10
S12
S13
S14
Discharge Element
13
14
3.3 V
3.3 V
Power Inputs
3.3V 1
2
24
5 V 5 V 5 V
Power Inputs
5V
7
12 V
Power Inputs
12V
20
12 V
21 12
3 4 5
15
9
10
AVCC
AVCC
17
18
BVCC
BVCC
8
AVPP
19
BVPP
11
Power Outputs
NOTES:A. Diagram shown for 24-pin DB package.
B. Current sense C. The two 12-V pins must be externally connected. D. No connections for TPS2223A.
See Note B
See Note B
See Note B
See Note B
See Note C
See Note C
See Note C
See Note D
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
FUNCTIONAL BLOCK DIAGRAM OF TPS2223A, TPS2224A and TPS2226A (see Note A)
7
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See Note A
See Note A
CS
S1
CS
S7
Control Logic SHDN RESET DATA CLOCK LATCH
OC
GND
UVLO
POR
Current Limit
Thermal Limit
S2
S3
S4
S5
S6
3.3 V
5 V
5 V
12 V
AVCC
AVCC
AVPP
See Note B
NOTES:A. Current sense
B. The two 12-V pins must be externally connected.
12 V See Note B
24 23 22 21 20 19 18 17 16 15 14 13
1 2 3 4 5 6 7 8 9 10 11 12
TPS2220A
DB OR PWP PACKAGE
(TOP VIEW)
5V 5V
DATA
CLOCK
LATCH
NC
12V
AVPP AVCC AVCC
GND
RESET
NC NC NC SHDN 12V NC NC NC NC OC NC
3.3V
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
TPS2226A
DB PACKAGE
(TOP VIEW)
5V 5V
DATA
CLOCK
LATCH
NC
12V
AVPP AVCC AVCC AVCC
GND
NC
RESET
3.3V
5V NC NC NC NC SHDN 12V BVPP BVCC BVCC BVCC NC OC
3.3V
3.3V
NC - No internal connection
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
FUNCTIONAL BLOCK DIAGRAM OF TPS2220A
8
PIN ASSIGNMENTS
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SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
Terminal Functions
TERMINAL
NAME
3.3V 13 13, 14 13, 14 15, 16, 17 I 3.3-V input for card power and chip power 5V 1, 2 1, 2, 24 1, 2, 24 1, 2, 30 I 5-V input for card power
12V 7, 20 NA 7, 20 7, 24 I
AVCC 9, 10 9, 10 9, 10 9, 10, 11 O
AVPP 8 8 8 8 O
BVCC -- 17, 18 17, 18 20, 21, 22 O
BVPP -- 19 19 23 O GND 11 11 11 12 Ground OC 15 15 15 18 O
SHDN 21 21 21 25 I
RESET 12 12 12 14 I CLOCK 4 4 4 4 I Logic-level clock for serial data word
DATA 3 3 3 3 I Logic-level serial data word LATCH 5 5 5 5 I Logic-level latch for serial data word, internal pulldown
NC 17, 18, 19, 26, 27, 28, No internal connection
TPS2220A TPS2223A TPS2224A TPS2226A
6, 14, 16, 6, 13, 19,
22, 23, 24 29
6, 7, 16, 6, 16, 22,
20, 22, 23 23
NO. I/O DESCRIPTION
12-V input for card power (xVPP). The two 12-V pins must be externally connected.
Switched output that delivers 3.3 V, 5 V, ground or high impedance to card
Switched output that delivers 3.3 V, 5 V, 12 V, ground or high impedance to card (12 V not applicable to TPS2223A)
Switched output that delivers 3.3 V, 5 V, ground or high impedance to card
Switched output that delivers 3.3 V, 5 V, 12 V, ground or high impedance to card (12 V not applicable for TPS2223A)
Open-drain overcurrent reporting output that goes low when an overcurrent condition exists. An external pullup is required.
Hi-Z (open) all switches. Identical function to serial D8. Asynchronous active-low command, internal pullup
Logic-level RESET input active low. Asynchronous active-low com­mand, internal pullup
TPS2220A, TPS2223A TPS2224A, TPS2226A
9
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50%
LATCH
V
DD
GND
10%
90%
t
pd(on)
GND
V
O(xVPP)
Propagation Delay (xVPP)
50%
LATCH
V
DD
GND
10%
90%
t
pd(on)
GND
V
O(xVCC)
Propagation Delay (xVCC)
10%
90%
t
r
GND
V
O(xVPP)
Rise/Fall Time (xVPP)
t
f
10%
90%
t
r
GND
V
O(xVCC)
Rise/Fall Time (xVCC)
t
f
50%
V
DD
GND
10%
90%
t
on
GND
V
O(xVCC)
Turnon/off Time (xVCC)
xVPP
VOLTAGE WAVEFORMS
LOAD CIRCUIT (xVPP)
I
O(xVPP)
xVCC
50%
LATCH
V
DD
GND
10%
90%
t
on
GND
V
O(xVPP)
Turnon/off Time (xVPP)
I
O(xVCC)
t
pd(off)
t
pd(off)
t
off
t
off
LOAD CIRCUIT (xVCC)
V
I(12V/5V/3.3V)
V
I(5V/3.3V)
V
I(12V/5V/3.3V)
V
I(5V/3.3V)
V
I(12V/5V/3.3V)
V
I(5V/3.3V)
LATCH
D10
D9
D8 D7
D6
D5
D4 D3
D2
DATA
LATCH
CLOCK
D1
D0
Data Setup Time Data Hold Time Latch Delay Time
Clock Delay Time
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
Figure 1. Test Circuits and Voltage Waveforms
NOTE: Data is clocked in on the positive edge of the clock. The positive edge of the latch signal should occur before the next
10
positive edge of the clock. For definition of D0 to D10, see the control logic table.
Figure 2. Serial-Interface Timing for TPS2226A
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TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION (continued) Table of Graphs
Short-circuit response, short applied to powered-on 5-V xVCC-switch output vs Time 3 Short-circuit response, short applied to powered-on 12-V xVPP-switch output vs Time 4 OC response with ramped overcurrent-limit load on 5-V xVCC-switch output vs Time 5 OC response with ramped overcurrent-limit load on 12-V xVPP-switch output vs Time 6 xVCC Turnon propagation delay time (C xVCC Turnoff propagation delay time (C xVPP Turnon propagation delay time (C xVPP Turnoff propagation delay time (C xVCC Turnon propagation delay time (T xVCC Turnoff propagation delay time (T xVPP Turnon propagation delay time (T xVPP Turnoff propagation delay time (T xVCC Rise time (C xVCC Fall time (C xVPP Rise time (C xVPP Fall time (C xVCC Rise time (T xVCC Fall time (T xVPP Rise time (T xVPP Fall time (T
= 150 µF) vs Junction temperature 15
L
= 150 µF) vs Junction temperature 16
L
= 10 µF) vs Junction temperature 17
L
= 10 µF) vs Junction temperature 18
L
= 25 ° C) vs Load capacitance 19
J
= 25 ° C) vs Load capacitance 20
J
= 25 ° C) vs Load capacitance 21
J
= 25 ° C) vs Load capacitance 22
J
= 150 µF) vs Junction temperature 7
L
= 150 µF) vs Junction temperature 8
L
= 10 µF) vs Junction temperature 9
L
= 10 µF) vs Junction temperature 10
L
= 25 ° C) vs Load capacitance 11
J
= 25 ° C) vs Load capacitance 12
J
= 25 ° C) vs Load capacitance 13
J
= 25 ° C) vs Load capacitance 14
J
FIGURE
11
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1 2 3 4 5
t − Time − ms
0
V
O(/OC)
2 V/div
I
O(xVPP)
2 A/div
100 200 300 400 500
t − Time − µs
0
V
O(/OC)
5 V/div
I
O(VCC)
5 A/div
V
IN(5V)
2 V/div
10 20 30 40 50
t − Time − ms
0
V
O(/OC)
5 V/div
I
O(xVCC)
1 A/div
2 4 6 8 10
t − Time − ms
0
V
O(/OC)
5 V/div
I
O(xVPP)
100 mA/div
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
SHORT-CIRCIUT RESPONSE, SHORT-CIRCIUT RESPONSE,
SHORT APPLIED TO POWERED-ON 5-V SHORT APPLIED TO POWERED-ON 12-V
xVCC-SWITCH OUTPUT xVPP-SWITCH OUTPUT
Figure 3. Figure 4.
OC RESPONSE WITH RAMPED OC RESPONSE WITH RAMPED
OVERCURRENT-LIMIT LOAD ON 5-V OVERCURRENT-LIMIT LOAD ON 12-V
xVCC-SWITCH OUTPUT xVPP-SWITCH OUTPUT
Figure 5. Figure 6.
12
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0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
−50 −20 10 40 70 100
xVCC = 5 V IO = 0.75 A C
L
= 150 µF
− Turnon Propagation Delay T ime, xVCC − ms
t
pd(on)
TJ − Junction Temperature − °C
2.25
2.3
2.35
2.4
2.45
2.5
2.55
2.6
−50 −20 10 40 70 100
xVCC = 5 V IO = 0.75 A CL = 150 µF
t
pd(off)
TJ − Junction Temperature − °C
− Turnoff Propagation Delay T ime, xVCC − ms
0
0.5
1
1.5
2
2.5
3
−50 −20 10 40 70 100
t
pd(on)
TJ − Junction Temperature − °C
xVPP = 12 V IO = 0.05 A CL = 10 µF
− Turnon Propagation Delay T ime, xVPP − ms
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
−50 −20 10 40 70 100
− Turnoff Propagation Delay T ime, xVCC − ms
t
pd(off)
TJ − Junction Temperature − °C
xVCC = 12 V IO = 0.05 A CL = 10 µF
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
TURNON PROPAGATION DELAY TIME, xVCC TURNOFF PROPAGATION DELAY TIME, xVCC
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
TURNON PROPAGATION DELAY TIME, xVPP TURNON PROPAGATION DELAY TIME, xVPP
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
vs vs
Figure 7. Figure 8.
vs vs
Figure 9. Figure 10.
13
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0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.1 1 10 100 1000
− Turnon Propagation Delay T ime, xVCC − ms
t
pd(on)
xVCC = 5 V IO = 0.75 A TJ = 25°C
CL − Load Capacitance − µF
2.25
2.3
2.35
2.4
2.45
2.5
2.55
0.1 1 10 100 1000
xVCC = 5 V IO = 0.75 A TJ = 25°C
CL − Load Capacitance − µF
t
pd(off)
− Turnoff Propagation Delay T ime, xVCC − ms
1.95
2
2.05
2.1
2.15
2.2
2.25
0.1 1 10
− Turnon Propagation Delay T ime, xVPP − ms
t
pd(on)
xVPP = 12 V IO = 0.05 A TJ = 25°C
CL − Load Capacitance − µF
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.1 1 10
− Turnoff Propagation Delay T ime, xVPP − ms
t
pd(off)
xVPP = 12 V IO = 0.05 A TJ = 25°C
CL − Load Capacitance − µF
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
TURNON PROPAGATION DELAY TIME, xVCC TURNON PROPAGATION DELAY TIME, xVCC
LOAD CAPACITANCE LOAD CAPACITANCE
TURNON PROPAGATION DELAY TIME, xVPP TURNON PROPAGATION DELAY TIME, xVPP
LOAD CAPACITANCE LOAD CAPACITANCE
vs vs
Figure 11. Figure 12.
vs vs
14
Figure 13. Figure 14.
www.ti.com
2.34
2.35
2.36
2.37
2.38
2.39
2.4
2.41
−50 −20 10 40 70 100
− Fall Time xVCC − ms
t
f
TJ − Junction Temperature − °C
xVCC = 5 V IO = 0.75 A CL = 150 µF
1.04
1.06
1.08
1.1
1.12
1.14
1.16
1.18
1.2
1.22
−50 −20 10 40 70 100
− Rise Time, xVCC − ms
t
r
TJ − Junction Temperature − °C
xVCC = 5 V IO = 0.75 A CL = 150 µF
0.575
0.58
0.585
0.59
0.595
0.6
0.605
−50 −20 10 40 70 100
− Rise Time xVPP − ms
t
r
TJ − Junction Temperature − °C
xVPP = 12 V IO = 0.05 A CL = 10 µF
3.85
3.9
3.95
4
4.05
4.1
4.15
−50 −20 10 40 70 100
− Fall Time, xVPP − ms
t
f
TJ − Junction Temperature − °C
xVPP = 12 V IO = 0.05 A CL = 10 µF
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
RISE TIME, xVCC FALL TIME, xVCC
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
TPS2220A, TPS2223A TPS2224A, TPS2226A
Figure 15. Figure 16.
RISE TIME, xVPP FALL TIME, xVPP
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
vs vs
Figure 17. Figure 18.
15
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0
0.5
1
1.5
2
2.5
0.1 1 10 100 1000
− Fall Time xVCC − ms
t
f
xVCC = 5 V IO = 0.75 A TJ = 25°C
CL − Load Capacitance − µF
0
0.2
0.4
0.6
0.8
1
1.2
0.1 1 10 100 1000
− Rise Time, xVCC − ms
t
r
xVCC = 5 V IO = 0.75 A TJ = 25°C
CL − Load Capacitance − µF
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
0.1 1 10
− Fall Time, xVPP − ms
t
f
xVPP = 12 V IO = 0.05 A TJ = 25°C
CL − Load Capacitance − µF
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.1 1 10
− Rise Time, xVPP − ms
t
r
xVPP = 12 V IO = 0.05 A TJ = 25°C
CL − Load Capacitance − µF
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
RISE TIME, xVCC FALL TIME, xVCC
LOAD CAPACITANCE LOAD CAPACITANCE
vs vs
16
Figure 19. Figure 20.
RISE TIME, xVPP FALL TIME, xVPP
vs vs
LOAD CAPACITANCE LOAD CAPACITANCE
Figure 21. Figure 22.
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0
20
40
60
80
100
120
140
160
180
−50 −20 10 40 70 100 TJ − Junction Temperature − °C
I
I
− Input Current, xVCC = 3.3 V − Aµ
0
2
4
6
8
10
12
14
−50 −20 10 40 70 100 TJ − Junction Temperature − °C
I
I
− Input Current, xVCC = 5 V − Aµ
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
Input current, xVCC = 3.3 V 23
I
r
V
I
Input current, xVCC = 5 V vs Junction temperature 24
I
Input current, xVPP = 12 V 25 Static drain-source on-state resistance, 3.3 V to xVCC switch 26 Static drain-source on-state resistance, 5 V to xVCC switch vs Junction temperature 27
DS(on)
Static drain-source on-state resistance, 12 V to xVPP switch 28 xVCC switch voltage drop, 3.3-V input 29 xVCC switch voltage drop, 5-V input vs Load current 30
O
xVPP switch voltage drop, 12-V input 31 Short-circuit current limit, 3.3 V to xVCC 32 Short-circuit current limit, 5 V to xVCC vs Junction temperature 33
OS
Short-circuit current limit, 12 V to xVPP 34
INPUT CURRENT, xVCC = 3.3 V INPUT CURRENT, xVCC = 5 V
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 23. Figure 24.
17
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0
0.02
0.04
0.06
0.08
0.1
0.12
−50 −20 10 40 70 100 TJ − Junction Temperature − °C
r
DS(on)
− Static Drain-Source On-State Resistance,
3.3 V to xVCC Switch −
0
20
40
60
80
100
120
−50 −20 10 40 70 100 TJ − Junction Temperature − °C
I
I
− Input Current, xVPP = 12 V − Aµ
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
−50 −20 10 40 70 100 TJ − Junction Temperature − °C
r
DS(on)
− Static Drain-Source On-State Resistance,
5 V to xVCC Switch −
0
0.5
1
1.5
2
2.5
3
−50 −20 10 40 70 100 TJ − Junction Temperature − °C
r
DS(on)
− Static Drain-Source On-State Resistance,
12 V to xVPP Switch −
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
INPUT CURRENT, xVPP = 12 V 3.3 V TO xVCC SWITCH
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 25. Figure 26.
STATIC DRAIN-SOURCE ON-STATE RESISTANCE, STATIC DRAIN-SOURCE ON-STATE RESISTANCE,
5 V TO xVCC SWITCH 12 V TO xVPP SWITCH
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
STATIC DRAIN-SOURCE ON-STATE RESISTANCE,
18
Figure 27. Figure 28.
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0
0.02
0.04
0.06
0.08
0.1
0.12
0 0.2 0.4 0.6 0.8 1
TJ = −40°C
TJ = 85°C
TJ = 100°C
IL − Load Current − A
− xVCC Switch Voltage Drop, 3.3-V Input − VV O
TJ = 25°C
TJ = 0°C
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0 0.2 0.4 0.6 0.8 1
IL − Load Current − A
− xVCC Switch Voltage Drop, 5-V Input − VV O
TJ = −40°C
TJ = 85°C
TJ = 100°C
TJ = 25°C
TJ = 0°C
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0 0.01 0.02 0.03 0.04 0.05
IL − Load Current − A
− xVPP Switch V oltage Drop, 12-V Input − VV
O
TJ = −40°C
TJ = 85°C
TJ = 100°C
TJ = 25°C
TJ = 0°C
1.355
1.36
1.365
1.37
1.375
1.38
1.385
1.39
1.395
−50 −20 10 40 70 100 TJ − Junction Temperature − °C
I
OS
− Short-Circuit Current Limit, 3.3 V to xVCC − A
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
xVCC SWITCH VOLTAGE DROP, 3.3-V INPUT xVCC SWITCH VOLTAGE DROP, 5-V INPUT
xVPP SWITCH VOLTAGE DROP, 12-V INPUT SHORT-CIRCUIT CURRENT LIMIT, 3.3 V TO xVCC
vs vs
LOAD CURRENT LOAD CURRENT
Figure 29. Figure 30.
vs vs
LOAD CURRENT JUNCTION TEMPERATURE
Figure 31. Figure 32.
19
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1.385
1.39
1.395
1.4
1.405
1.41
1.415
1.42
1.425
1.43
1.435
−50 −20 10 40 70 100 TJ − Junction Temperature − °C
I
OS
− Short-Circuit Current Limit, 5 V to xVCC − A
0.19
0.192
0.194
0.196
0.198
0.2
0.202
0.204
0.206
0.208
−50 −20 10 40 70 100
xVPP = 12 V
TJ − Junction Temperature − °C
I
OS
− Short-Circuit Current Limit, 12 V to xVPP − A
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
SHORT-CIRCUIT CURRENT LIMIT, 5 V TO xVCC SHORT-CIRCUIT CURRENT LIMIT, 12 V TO xVPP
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
vs vs
Figure 33. Figure 34.
20
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VDS V
O(reg)–VPS(reg)–VPCB
IOmax
V
DS
r
DS(on)
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
APPLICATION INFORMATION
OVERVIEW
PC Cards were initially introduced as a means to add flash memory to portable computers. The idea of add-in cards quickly took hold, and modems, wireless LANs, global positioning satellite system (GPS), multimedia, and hard-disk versions were soon available. As the number of PC Card applications grew, the engineering community quickly recognized the need for a standard to ensure compatibility across platforms. Therefore, the PCMCIA (Personal Computer Memory Card International Association) was established, comprising members from leading computer, software, PC Card, and semiconductor manufacturers. One key goal was to realize the plug-and-play concept, so that cards and hosts from different vendors would be transparently compatible.
PC CARD POWER SPECIFICATION
System compatibility also means power compatibility. The most current set of specifications (PC Card Standard) set forth by the PCMCIA committee states that power is to be transferred between the host and the card through eight of the 68 terminals of the PC Card connector. This power interface consists of two V ground terminals. Multiple V V
terminals were originally specified as separate signals, but are normally tied together in the host to form a
pp
single node to minimize voltage losses. Card primary power is supplied through the V programming and erase voltage is supplied through the V
and ground terminals minimize connector-terminal and line resistance. The two
CC
terminals. Cardbus cards of today typically do not
pp
CC
use 12 V, which is now more of an optional requirement in the host.
CC
, two V
, and four
pp
terminals; flash-memory
DESIGNING FOR VOLTAGE REGULATION
The current PCMCIA specification for output voltage regulation, V typical PC power-system design, the power supply has an output-voltage regulation, V Also, a voltage drop from the power supply to the PC Card results from resistive losses, V and the PCMCIA connector. A typical design would limit the total of these resistive losses to less than 1% (50 mV) of the output voltage. Therefore, the allowable voltage drop, V and TPS2226A would be the PCMCIA voltage regulation less the power supply regulation and less the PCB and connector resistive drops:
Typically, this would leave 100 mV for the allowable voltage drop across the 5-V switch. The specification for output voltage regulation of the 3.3-V output is 300 mV; therefore, using the same equation by deducting the voltage drop percentages (2%) for power-supply regulation and PCB resistive loss (1%), the allowable voltage drop for the 3.3-V switch is 200 mV. The voltage drop is the output current multiplied by the switch resistance of the device. Therefore, the maximum output current, IOmax, that can be delivered to the PC Card in regulation is the allowable voltage drop across the IC, divided by the output-switch resistance.
The xVCC outputs have been designed to deliver the peak and average currents defined by the PC Card specification within regulation over the operating temperature range. The xVPP outputs of the device have been designed to deliver 100 mA continuously.
, of the 5-V output is 5% (250 mV). In a
O(reg)
, for the TPS2220A, TPS2223A, TPS2224A,
DS
PS(reg)
PCB
, of 2% (100 mV).
, in the PCB traces
OVERCURRENT AND OVERTEMPERATURE PROTECTION
PC Cards are inherently subject to damage that can result from mishandling. Host systems require protection against short-circuited cards that can lead to power-supply or PCB trace damage. Even extremely robust systems can undergo rapid battery discharge into a damaged PC Card, resulting in the sudden and unacceptable loss of system power. In comparison, the reliability of fused systems is poor because blown fuses require troubleshooting and repair, usually by the manufacturer.
The TPS2220A, TPS2223A, TPS2224A, and TPS2226A take a two-pronged approach to overcurrent protection, which is designed to activate if an output is shorted or when an overcurrent condition is present when switches are powered up. First, instead of fuses, sense FETs monitor each of the xVCC and xVPP power outputs. Unlike
21
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TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
APPLICATION INFORMATION (continued)
sense resistors or polyfuses, these FETs do not add to the series resistance of the switch; therefore, voltage and power losses are reduced. Overcurrent sensing is applied to each output separately. Excessive current generates an error signal that limits the output current of only the affected output, preventing damage to the host. Each xVCC output overcurrent limits from 1 A to 2.2 A, typically around 1.6 A; the xVPP outputs limit from 100 mA to 250 mA, typically around 200 mA.
Second, when an overcurrent condition is detected, the TPS2220A, TPS2223A, TPS2224A, and TPS2226A assert an active low OC signal that can be monitored by the microprocessor or controller to initiate diagnostics and/or send the user a warning message. If an overcurrent condition persists, causing the IC to exceed its maximum junction temperature, thermal-protection circuitry activates, shutting down all power outputs until the device cools to within a safe operating region, which is ensured by a thermal shutdown hysteresis. Thermal limiting prevents destruction of the IC from overheating beyond the package power-dissipation ratings.
During power up, the devices control the rise times of the xVCC and xVPP outputs and limit the inrush current into a large load capacitance, faulty card, or connector.
12-V SUPPLY NOT REQUIRED
Some PC Card switches use the externally supplied 12 V to power gate drive and other chip functions, which requires that power be present at all times. The TPS2220A, TPS2224A and TPS2226A offer considerable power savings by using an internal charge pump to generate the required higher gate drive voltages from the 3.3-V input. Therefore, the external 12-V supply can be disabled except when needed by the PC Card in the slot, thereby extending battery lifetime. A special feature in the 12-V circuitry actually helps to reduce the supply current demanded from the 3.3-V input. When 12 V is supplied and requested at the VPP output, a voltage selection circuit draws the charge-pump drive current for the 12-V FETs from the 12-V input. This selection is automatic and effectively reduces demand fluctuations on the normal 3.3-V VCC rail. For proper operation of this feature, a minimum 3.3-V input capacitance of 4.7 µF is recommended, and a minimum 12-V input ramp-up rate of 12 V/50 ms (240 V/s) is required. Additional power savings are realized during a software shutdown in which quiescent current drops to a maximum of 1 µA.
VOLTAGE-TRANSITIONING REQUIREMENT
PC Cards, like portables, are migrating from 5 V to 3.3 V to minimize power consumption, optimize board space, and increase logic speeds. The TPS2220A, TPS2223A, TPS2224A, and TPS2226A meet all combinations of power delivery as currently defined in the PCMCIA standard. The latest protocol accommodates mixed 3.3-V/5-V systems by first powering the card with 5 V, then polling it to determine its 3.3-V compatibility. The PCMCIA specification requires that the capacitors on 3.3-V-compatible cards be discharged to below 0.8 V before applying 3.3-V power. This action ensures that sensitive 3.3-V circuitry is not subjected to any residual 5-V charge and functions as a power reset. PC Card specification requires that V Card resistance cannot be relied on to provide a discharge path for voltages stored on PC Card capacitance because of possible high-impedance isolation by power-management schemes. The devices include discharge transistors on all xVCC and xVPP outputs to meet the specification requirement.
be discharged within 100 ms. PC
CC
SHUTDOWN MODE
In the shutdown mode, which can be controlled by SHDN or bit D8 of the input serial DATA word, each of the xVCC and xVPP outputs is forced to a high-impedance state. In this mode, the chip quiescent current is reduced to 1 µA or less to conserve battery power.
POWER-SUPPLY CONSIDERATIONS
These switches have multiple pins for each 3.3-V (except for TPS2220A) and 5-V power input and for the switched xVCC outputs. Any individual pin can conduct the rated input or output current. Unless all pins are connected in parallel, the series resistance is higher than that specified, resulting in increased voltage drops and power loss. It is recommended that all input and output power pins be paralleled for optimum operation.
To increase the noise immunity of the TPS2220A, TPS2223A, TPS2224A, and TPS2226A, the power-supply inputs should be bypassed with at least a 4.7-µF electrolytic or tantalum capacitor paralleled by a 0.047-µF to
22
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PD r
DS(on)
I
2
T
J

PD R
JA
T
A
where:
R
θJA
is the inverse of the derating factor given in the dissipation rating table.
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
APPLICATION INFORMATION (continued)
0.1-µF ceramic capacitor. It is strongly recommended that the switched outputs be bypassed with a 0.1-µF (or larger) ceramic capacitor; doing so improves the immunity of the IC to electrostatic discharge (ESD). Care should be taken to minimize the inductance of PCB traces between the devices and the load. High switching currents can produce large negative voltage transients, which forward biases substrate diodes, resulting in unpredictable performance. Similarly, no pin should be taken below -0.3 V.
RESET INPUT
To ensure that cards are in a known state after power brownouts or system initialization, the PC Cards should be reset at the same time as the host by applying low-impedance paths from xVCC and xVPP terminals to ground. A low-impedance output state allows discharging of residual voltage remaining on PC Card filter capacitance, permitting the system (host and PC Cards) to be powered up concurrently. The active low RESET input closes internal ground switches S1, S4, S7, and S11 with all other switches left open. The TPS2220A, TPS2223A, TPS2224A, and TPS2226A remain in the low-impedance output state until the signal is deasserted and further data is clocked in and latched. The input serial data cannot be latched during reset mode. RESET is provided for direct compatibility with systems that use an active-low reset voltage supervisor. The RESET pin has an internal 150-k pullup resistor.
CALCULATING JUNCTION TEMPERATURE
The switch resistance, r is dependent on both r through Figure 28 , using an initial temperature estimate about 30 ° C above ambient. Then, calculate the power dissipation for each switch, using the formula:
, is dependent on the junction temperature, TJ, of the die. The junction temperature
DS(on)
and the current through the switch. To calculate TJ, first find r
DS(on)
DS(on)
from Figure 26
Next, sum the power dissipation of all switches and calculate the junction temperature:
Compare the calculated junction temperature with the initial temperature estimate. If the temperatures are not within a few degrees of each other, recalculate using the calculated temperature as the initial estimate.
LOGIC INPUTS AND OUTPUTS
The serial interface consists of the DATA, CLOCK, and LATCH leads. The data is clocked in on the positive edge of the clock (see Figure 2 ). The 11-bit (D0-D10) serial data word is loaded during the positive edge of the latch signal. The positive edge of the latch signal should occur before the next positive edge of the clock occurs.
The serial interface of the device is compatible with serial-interface PCMCIA controllers. An overcurrent output ( OC) is provided to indicate an overcurrent or overtemperature condition in any of the
xVCC and xVPP outputs as previously discussed.
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TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
TPS2220A, TPS2223A, TPS2224A, and TPS226A CONTROL LOGIC
xVPP
AVPP CONTROL SIGNALS BVPP CONTROL SIGNALS
D8 ( SHDN) D0 D1 D9 D8 ( SHDN) D4 D5 D10
1 0 0 X 0 V 1 0 0 X 0 V 1 0 1 0 3.3 V 1 0 1 0 3.3 V 1 0 1 1 5 V 1 0 1 1 5 V 1 1 0 X 12 V 1 1 1 X Hi-Z 1 1 1 X Hi-Z 0 X X X Hi-Z 0 X X X Hi-Z
(1) The output V_xVPP is Hi-Z for TPS2223A.
xVCC
AVCC CONTROL SIGNALS BVCC CONTROL SIGNALS
D8
( SHDN)
1 0 0 0 V 1 0 0 0 V 1 0 1 3.3 V 1 0 1 3.3 V 1 1 0 5 V 1 1 0 5 V 1 1 1 0 V 1 1 1 0 V 0 X X Hi-Z 0 X X Hi-Z
D3 D2 D8 ( SHDN) D6 D7
OUTPUT OUTPUT
V_AVPP V_BVPP
(1)
OUTPUT OUTPUT V_AVCC V_BVCC
1 1 0 X 12 V
(1)
24
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Maximum recommended output capacitance for xVCC is 220 µF including card capacitance, and for xVPP is 10 µF, without OC glitch when switches are powered on.
TPS2226A
V
CC
BVPP
BVCC
BVCC
AVPP
AVCC AVCC
LATCH
CLOCK
DATA
OC
RESET
V
CC
0.1 µF
0.1 µF
V
pp1
V
pp2
PC Card
Connector A
V
CC
V
CC
0.1 µF
0.1 µF
V
pp1
V
pp2
PC Card
Connector B
DATA CLOCK
LATCH
GPI/O
Controller
From PCI or System RST
12 V
3.3 V
5 V
12 V
3.3 V
5 V
12 V
3.3 V
3.3 V
5 V
0.1 µF
0.1 µF
0.1 µF
4.7 µF
4.7 µF
4.7 µF
5 V
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
ESD PROTECTIONS (see Figure 35 )
All inputs and outputs of these devices incorporate ESD-protection circuitry designed to withstand a 2-kV human-body-model discharge as defined in MIL-STD-883C, Method 3015. The xVCC and xVPP outputs can be exposed to potentially higher discharges from the external environment through the PC Card connector. Bypassing the outputs with 0.1-µF capacitors protects the devices from discharges up to 10 kV.
Figure 35. Detailed Interconnections and Capacitor Recommendations
25
www.ti.com
NOTE A: The enable terminal can be tied to a general-purpose I/O terminal on the PCMCIA controller or tied high.
TPS2226A
or
TPS2224A
BVPP
BVCC
BVCC
BVCC
AVPP
AVCC
AVCC
AVCC
LATCH
CLOCK
DATA
OC
RESET
3.3 V
5 V
12 V
3.3 V
5 V
12 V
3.3 V
3.3 V
5 V 5 V
SHDN
0.1 µF
0.1 µF1 µF
0.1 µF4.7 µF
EN
REF
SS
COMP
TPS6734
VCC
FB
OUT
GND
1
2
3
4
L1 18 µH
8
7
6
5
R1
10 k
Enable
(see Note A)
C1
33 µF
20 V
C2
0.01 µF
12 V
D1
33 µF, 20 V
C4
0.001 µF
3.3 V or 5 V
+
C1
+
Not on TPS2224A
TPS2220A, TPS2223A TPS2224A, TPS2226A
SLVS428B – MAY 2002 – REVISED SEPTEMBER 2004
12-V FLASH MEMORY SUPPLY
The TPS6734 is a fixed 12-V output boost converter capable of delivering 120 mA from inputs as low as 2.7 V. The device is pin-for-pin compatible with the MAX734 regulator and offers the following advantages: lower supply current, wider operating input-voltage range, and higher output currents. As shown in Figure 36 , the only external components required are: an inductor, a Schottky rectifier, an output filter capacitor, an input filter capacitor, and a small capacitor for loop compensation. The entire converter occupies less than 0.7 in implemented with surface-mount components. An enable input is provided to shut the converter down and reduce the supply current to 3 µA when 12 V is not needed.
The TPS6734 is a 170-kHz current-mode PWM (pulse-width modulation) controller with an n-channel MOSFET power switch. Gate drive for the switch is derived from the 12-V output after start-up to minimize the die area needed to realize the 0.7- MOSFET and improve efficiency at input voltages below 5 V. Soft start is accomplished with the addition of one small capacitor. A 1.22-V reference, pin 2 of TPS6734, is brought out for external use. For additional information, see the TPS6734 data sheet (SLVS127 ).
2
of PCB space when
26
Figure 36. TPS2224A and TPS2226A with TPS6734 12-V, 120-mA Supply
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38 0,22
15
14
A
0,05 MIN
0,15
5,60 5,00
M
8,20 7,40
Seating Plane
0,10
0,25 0,09
0°ā8°
Gage Plane
0,25
0,95 0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
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