Datasheet TPS2201IDFR, TPS2201IDFLE, TPS2201IDBR, TPS2201IDBLE Datasheet (Texas Instruments)

TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
Copyright 1995, Texas Instruments Incorporated
6–1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Fully Integrated V
and Vpp Switching for
Dual-Slot PC Card Interface
Compatible With Controllers From Cirrus,
Intel, and Texas Instruments
Meets PCMCIA Standards
Internal Charge Pump (No External
Capacitors Required) – 12-V Supply Can Be Disabled Except for Programming
Short Circuit and Thermal Protection
Space Saving SSOP (DB) Package
Compatible With 3.3-V, 5-V and 12-V PC
Cards
Power Saving I
= 83 µA Typ, IQ = 1 µA
Low r
DS(on)
(160-m VCC Switch)
Break-Before-Make Switching
description
The TPS2201 PC Card (PCMCIA) power interface switch provides an integrated power-management solution for two PC Cards. All of the discrete power MOSFETs, a logic section, current limiting, thermal protection, and power-good reporting for PC Card control are combined on a single integrated circuit (IC), using Texas Instruments LinBiCMOS process. The circuit allows the distribution of 3-V, 5-V and/or 12-V card power and is compatible with most PCMCIA controllers. The current-limiting feature eliminates the need for fuses, which reduces component count and improves reliability; current-limit reporting can help the user isolate a system fault to a bad card.
The TPS2201 maximizes battery life by generating its own switch-drive voltage using an internal charge pump. Therefore, the 12-V supply can be powered down and only brought out of standby when flash memory needs to be written to or erased. End equipment for the TPS2201 includes notebook computers, desktop computers, personal digital assistants (PDAs), digital cameras, handiterminals, and bar-code scanners.
typical PC card power distribution application
CPU
PCMCIA
Controller
12 V
Power Supply
V
pp1
V
pp2
V
CC
V
CC
PC
Card A
V
DD
TPS2201
5 V 3 V
SHDN
BPWR_GOOD OC
Control Lines
8
V
pp1
V
pp2
V
CC
V
CC
PC
Card B
12V 5V
3V
AVPP
AVCC AVCC
BVPP
BVCC BVCC
APWR_GOOD
BVCC
AVCC
LinBiCMOS is a trademark of Texas Instruments Incorporated.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
5V 5V
A_VPP_PGM
A_VPP_VCC
A_VCC5 A_VCC3
12V
AVPP AVCC AVCC AVCC
GND
APWR_GOOD
SHDN
3V
5V B_VPP_PGM B_VPP_VCC B_VCC5 B_VCC3 V
DD
12V BVPP BVCC BVCC BVCC BPWR_GOOD OC 3V 3V
DB OR DF PACKAGE
(TOP VIEW)
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
AVAILABLE OPTIONS PACKAGED DEVICES
T
J
SHINK SMALL-OUTLINE
(DB)
SMALL-OUTLINE
(DF)
CHIP FORM
(Y)
–40°C to 150°C TPS2201IDB TPS2201IDF TPS2201Y
The DF package is only available left-end taped and reeled (indicated by the LE suffix on the device type; e.g., TPS2201IDFLE).
Terminal Functions
TERMINAL
NAME NO.
I/O
DESCRIPTION
A_VCC3 6 I Logic input that controls voltage on AVCC (see control-logic table) A_VCC5 5 I Logic input that controls voltage on AVCC (see control-logic table) A_VPP_PGM 3 I Logic input that controls voltage on AVPP (see control-logic table) A_VPP_VCC 4 I Logic input that controls voltage on AVPP (see control-logic table) APWR_GOOD 13 O Logic-level power-ready output that stays low as long as AVPP is within limits AVCC 9, 10, 11 O Switched output that delivers 0 V, 3.3 V, 5 V, or high impedance AVPP 8 O Switched output that delivers 0 V, 3.3 V, 5 V, 12 V, or high impedance B_VCC3 26 I Logic input that controls voltage on BVCC (see control-logic table) B_VCC5 27 I Logic input that controls voltage on BVCC (see control-logic table) B_VPP_PGM 29 I Logic input that controls voltage on BVPP (see control-logic table) B_VPP_VCC 28 I Logic input that controls voltage on BVPP (see control-logic table) BPWR_GOOD 19 O Logic-level power-ready output that stays low as long as BVPP is within limits BVCC 20, 21, 22 O Switched output that delivers 0 V, 3.3 V, 5 V, or high impedance BVPP 23 O Switched output that delivers 0 V , 3.3 V, 5 V, 12 V, or high impedance SHDN 14 I Logic input that shuts down the TPS2201 and set all power outputs to high-impedance state OC 18 O Logic-level overcurrent reporting output that goes low when an overcurrent condition exists V
DD
25 5-V power to chip GND 12 Ground 3V 15, 16, 17 I 3-V VCC input for card power 5V 1, 2, 30 I 5-V VCC input for card power 12V 7, 24 I 12-V VPP input for card power
TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TPS2201Y chip information
This chip, when properly assembled, displays characteristics similar to the TPS2201. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10% ALL DIMENSIONS ARE IN MILS
204
142
TPS2201Y
(2)
(28)
(1)
(3)
(29)
(30)
(27)(4)
5V5V
5V
A_VPP_PGM
A_VPP_VCC
B_VPP_PGM B_VPP_VCC
B_VCC5
(6)
(5)
(7) (8)
A_VCC5 A_VCC3
12V
AVPP
(10)
(9)
(11) (12)
AVCC AVCC
AVCC
GND
(14)
(13)
(15)
APWR_GOOD
SHDN
3V
(24)
(25)
(26)
(23)
B_VCC3 V
DD
12V BVPP
(20)
(21)
(22)
(19)
BVCC BVCC
BVCC BPWR_GOOD
(16)
(17)
(18)
OC 3V
3V
(2)
(1)
(3) (4)
(6)
(5)
(7)
(8)
(10)
(9)
(11)
(12)
(14)
(13)
(15)
(20)
(21)
(22)
(19)
(16)
(17)
(18)
(28) (29)
(30)
(27)
(24)
(25)
(26)
(23)
TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, V
–0.3 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range for card power: V
I(5V)
–0.3 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V
I(3V)
–0.3 V to V
I(5V)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V
I(12V)
–0.3 V to 14 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic input voltage –0.3 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current (each card): I
O(xVCC)
internally limited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
O(xVPP)
internally limited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature range, T
J
–40°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
–40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
TA 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
DB 1024 mW 8.2 mW/°C 655 mW 532 mW DF 1158 mW 9.26 mW/°C 741 mW 602 mW
Maximum values are calculated using a derating factor based on R
θJA
= 108°C/W for the package.
These devices are mounted on an FR4 board with no special thermal considerations.
recommended operating conditions
MIN MAX UNIT
Supply voltage, V
DD
4.75 5.25 V
V
I(5V)
0 5.25 V
Input voltage range, V
I
V
I(3V)
0 V
I(5V)
V
V
I(12V)
0 13.5 V
p
I
O(xVCC)
at 25°C 1 A
Output current, I
O
I
O(xVPP)
at 25°C 150 mA
Operating virtual junction temperature, T
J
–40 125 °C
V
I(3 V)
should not be taken above V
I(5 V)
.
TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics, TA = 25°C, VDD = 5 V (unless otherwise noted)
dc characteristics
TPS2201
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
5 V to xVCC 160 3 V to xVCC 225
m
Switch resistances
5 V to xVPP 6 3 V to xVPP 6
12 V to xVPP 1 Clamp low voltage Ipp at 10 mA 0.8 V Clamp low voltage ICC at 10 mA 0.8 V
p
TA = 25°C 1 10
IppHigh-impedance state
TA = 85°C 50
Leakage current
p
TA = 25°C 1 10
µ
A
ICCHigh-impedance state
TA = 85°C 50
p
I
DD
V
O(AVCC)
= V
O(BVCC)
= 5 V,
V
O(AVPP)
= V
O(BVPP)
= 12 V
83 150 µA
Input current
IDD in shutdown
V
O(BVCC)
= V
O(AVCC)
= V
O(AVPP)
= V
O(BVPP)
= high Z
1 µA
Power-ready threshold, PWR_GOOD 10.72 11.05 11.4 V Power-ready hysteresis, PWR_GOOD (12-V mode) 50 mV Short-circuit output-
I
O(xVCC)
°
p
0.75 1.3 1.9 A
current limit
I
O(xVPP)
T
J
=
85°C
, Output
shorted to GND
120 200 400 mA
logic section
TPS2201
PARAMETER
TEST CONDITIONS
MIN MAX
UNIT
Logic input current 1 µA Logic input high level 2.7 V Logic input low level 0.8 V Logic output high level
VDD–0.4 V
Logic output low level
I
O
= 1
mA
0.4 V
switching characteristics
TPS2201
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
p
V
O(xVCC)
1.2
t
r
Output rise time
V
O(xVPP)
5
ms
p
V
O(xVCC)
10
t
f
Output fall time
V
O(xVPP)
14
ms
t
on
5.8
V
I(x_VPP_PGM)
to
V
O(xVPP)
t
off
18
ms
p
t
on
5.8
t
pd
Propagation delay (see Figure 1‡)
V
I(x_VCC3)
to x
VCC (3 V)
t
off
28
ms
t
on
4
V
I(x_VCC5)
to
xVCC (5 V)
t
off
30
ms
Refer to Parameter Measurement Information
Rise and fall times are with CL = 100 µF.
TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics, TA = 25°C, VDD = 5 V (unless otherwise noted) (continued)
dc characteristics
TPS2201Y
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
IppHigh-impedance state 1
Leakage current
ICCHigh-impedance state 1
µ
A
Input current I
DD
V
O(AVCC)
= V
O(BVCC)
= 5 V,
V
O(AVPP)
= V
O(BVPP)
= 12 V
83 µA
Power-ready threshold, PWR_GOOD 11.05 V Power-ready hysteresis, PWR_GOOD (12-V mode) 50 mV
switching characteristics
TPS2201Y
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
p
V
O(xVCC)
1.2
t
r
Output rise time
V
O(xVPP)
5
ms
p
V
O(xVCC)
10
t
f
Output fall time
V
O(xVPP)
14
ms
t
on
5.8
V
I(x_VPP_PGM)
to
V
O(xVPP)
t
off
18
ms
p
t
on
5.8
t
pd
Propagation delay (see Figure 1‡)
V
I(x_VCC3)
to x
VCC
t
off
28
ms
t
on
4
V
I(x_VCC5)
to xVCC
t
off
30
ms
Refer to Parameter Measurement Information
Rise and fall times are with CL = 100 µF.
TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
LOAD CIRCUIT
C
L
t
on
VOLTAGE WAVEFORMS
V
I(12V)
GND
50% 50%
90%
V
DD
GND
V
X_VPP_PGM
V
O(xVPP)
V
pp
LOAD CIRCUIT
C
L
V
CC
t
on
t
off
VOLTAGE WAVEFORMS
V
I(5V)
GND
50% 50%
90%
10%
V
DD
GND
V
x_VCCx
V
O(xVCC)
10%
t
off
Figure 1. Test Circuits and Voltage Waveforms
Table of Timing Diagrams
FIGURE
xVCC Propagation Delay and Rise Times With 1-µF Load, 3-V Switch 2 xVCC Propagation Delay and Fall Times With 1-µF Load, 3-V Switch 3 xVCC Propagation Delay and Rise Times With 100-µF Load, 3-V Switch 4 xVCC Propagation Delay and Fall Times With 100-µF Load, 3-V Switch 5 xVCC Propagation Delay and Rise Times With 1-µF Load, 5-V Switch 6 xVCC Propagation Delay and Fall Times With 1-µF Load, 5-V Switch 7 xVCC Propagation Delay and Rise Times With 100-µF Load, 5-V Switch 8 xVCC Propagation Delay and Fall Times With 100-µF Load, 5-V Switch 9 xVPP Propagation Delay and Rise Times With 1-µF Load, 12-V Switch 10 xVPP Propagation Delay and Fall Times With 1-µF Load, 12-V Switch 11 xVPP Propagation Delay and Rise Times With 100-µF Load, 12-V Switch 12 xVPP Propagation Delay and Fall Times With 100-µF Load, 12-V Switch 13
TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
0123456789
xVCC (1 V/div)
x_VCC3 (2 V/div)
t – Time – ms
0 5 10 15 20 25 30 35 40 45
xVCC (1 V/div)
x_VCC3 (2 V/div)
t – Time – ms
Figure 2. xVCC Propagation Delay and Rise Times With 1-µF Load, 3-V Switch
Figure 3. xVCC Propagation Delay and
Fall Times With 1-µF Load, 3-V Switch
0123456789
xVCC (1 V/div)
x_VCC_3 (2 V/div)
t – Time – ms
0 5 10 15 20 25 30 35 40 45
xVCC (1 V/div)
x_VCC_3 (2 V/div)
t – Time – ms
Figure 4. xVCC Propagation Delay and
Rise Times With 100-µF Load, 3-V Switch
Figure 5. xVCC Propagation Delay and
Fall Times With 100-µF Load, 3-V Switch
TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
01234
xVCC (1 V/div)
x_VCC_5 (2 V/div)
t – Time – ms
0 5 10 15 20 25 30 35 40 45
xVCC (1 V/div)
x_VCC_5 (2 V/div)
t – Time – ms
Figure 6. xVCC Propagation Delay and
Rise Times With 1-µF Load, 5-V Switch
Figure 7. xVCC Propagation Delay and
Fall Times With 1-µF Load, 5-V Switch
Figure 8. xVCC Propagation Delay and
Rise Times With 100-µF Load, 5-V Switch
Figure 9. xVCC Propagation Delay and
Fall Times With 100-µF Load, 5-V Switch
0123456789
xVCC (1 V/div)
x_VCC_5 (2 V/div)
t – Time – ms
0 5 10 15 20 25 30 35 40 45
xVCC (1 V/div)
x_VCC_5 (2 V/div)
t – Time – ms
TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–10
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
Figure 10. xVPP Propagation Delay and
Rise Times With 1-µF Load, 12-V Switch
Figure 11. xVPP Propagation Delay and Fall Times With 1-µF Load, 12-V Switch
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
xVPP (5 V/div)
x_VPP_PGM (2 V/div)
0123456789
xVPP (5 V/div)
x_VPP_PGM (2 V/div)
t – Time – ms t – Time – ms
0123456789
xVPP (5 V/div)
x_VPP_PGM (2 V/div)
0 5 10 15 20 25 30 35 40 45
xVPP (5 V/div)
x_VPP_PGM (2 V/div)
t – Time – ms t – Time – ms
Figure 12. xVPP Propagation Delay and
Rise Times With 100-µF Load, 12-V Switch
Figure 13. xVPP Propagation Delay and
Fall Times With 100-µF Load, 12-V Switch
TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–11
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
I
DD
Supply current vs Junction temperature 14
r
DS(on)
Static drain-source on-state resistance, 3-V switch vs Junction temperature 15
r
DS(on)
Static drain-source on-state resistance, 5-V switch vs Junction temperature 16
r
DS(on)
Static drain-source on-state resistance, 12-V switch vs Junction temperature 17
V
O(xVCC)
Output voltage, 5-V switch vs Output current 18
V
O(xVCC)
Output voltage, 3-V switch vs Output current 19
xV
pp
Output voltage, Vpp switch vs Output current 20
I
SC(xVCC)
Short-circuit current, 5-V switch vs Junction temperature 21
I
SC(xVPP)
Short-circuit current, 12-V switch vs Junction temperature 22
– Supply Current –
SUPPLY CURRENT
vs
JUNCTION TEMPERATURE
TJ – Junction Temperature – °C
I
DD
Aµ
90
85
80
75
100
0 150
95
V
O(AVCC)
= V
O(BVCC)
= 5 V
V
O(AVPP)
= V
O(BVPP)
= 12 V
No load
–50
10050
Figure 14
t = pulse tested
TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–12
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
200
100
0
400
300
– Static Drain-Source On-State Resistance – m
3-V SWITCH
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
–50 0 125
r
DS(on)
TJ – Junction Temperature – °C
120
100
80
160
140
5-V SWITCH
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
TJ – Junction Temperature – °C
VDD = 5 V VCC = 3.3 V
–25 25 50 75 100 –50 0 125
–25 25 50 75 100
240
220
250
150
50
350
VDD = 5 V VCC = 5 V
– Static Drain-Source On-State Resistance – mr
DS(on)
200
180
Figure 15 Figure 16
1100
900
700
500
1300
1500
1700
–50 50 125
12-V SWITCH
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
TJ – Junction Temperature – °C
5
4.99
4.85
4.8
4.75
4.9
0 0.1 0.2 0.3 0.4 0.5
– Output Voltage – V
5.05
5-V SWITCH
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
0.6 0.7
V
O(xVCC)
I
O(xVCC)
– Output Current – A
–40°C
–25 0 25 75 100
VDD = 5 V Vpp = 12 V
25°C
85°C
125°C
VDD = 5 V VCC = 5 V
– Static Drain-Source On-State Resistance – mr
DS(on)
Figure 17 Figure 18
t = pulse tested
TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–13
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
3.2
3.15
3.1
3.05 0 0.1 0.2
3.25
3.3
3.35
0.3 0.4 0.6
0.70.5
I
O(xVCC)
– Output Current – A
3-V SWITCH
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
11.80 0 0.02 0.04 0.06
11.95
12
Vpp SWITCH
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
12.05
0.08 0.12
11.90
11.85
0.1
I
O(xVPP)
– Output Current – A
– Output Voltage – V
xV
pp
–40°C
85°C
125°C
VDD = 5 V VCC = 3.3 V
– Output Voltage – VV
O(xVCC)
25°C
VDD = 5 V Vpp = 12 V
125°C
–40°C
25°C
85°C
Figure 19 Figure 20
5-V SWITCH
SHORT-CIRCUIT CURRENT
vs
JUNCTION TEMPERATURE
TJ – Junction Temperature – °CT
J
– Junction Temperature – °C
12-V SWITCH
SHORT-CIRCUIT CURRENT
vs
JUNCTION TEMPERATURE
– Short-Circuit Current – AI
SC(xVCC)
– Short-Circuit Current – mAI
SC(xVPP)
1
0.5 050
1.5
2
100 150–50
VDD = 5 V VCC = 5 V
200
150
100
300
250
VDD = 5 V Vpp = 12 V
400
350
0–50 50 150
100
Figure 21 Figure 22
t = pulse tested
TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–14
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
overview
PC Cards were initially introduced as a means to add EEPROM (flash memory) to portable computers with limited on-board memory. The idea of add-in cards quickly took hold: modems, wireless LANs, GPS systems, multimedia, and hard-disk versions were soon available. As the number of PC Card applications grew, the engineering community quickly recognized the need for a standard to ensure compatibility across platforms. T o this end, the PCMCIA (Personal Computer Memory Card International Association) was established and was comprised of members from leading computer, software, PC card, and semiconductor manufacturers. One key goal was to realize the concept of plug and play – cards and hosts from different vendors should be compatible and able to communicate with one another transparently.
PC Card power specification
System compatibility also means power compatibility . The most current set of specifications (PC Card Standard) set forth by the PCMCIA committee states that power is to be transferred between the host and the card through eight of the PC Card connector’s 68 pins. This power interface consists of two V
, two Vpp, and four ground
pins. Multiple V
and ground pins are used to minimize connector-pin and line resistance. The two Vpp pins were originally specified as separate signals but are commonly tied together in the host to form a single node to minimize voltage losses. Card primary power is supplied through the V
pins; flash-memory programming
and erase voltage is supplied through the V
pp
pins. As each pin is rated to 0.5 A, VCC and Vpp can theoretically supply up to 1 A, assuming equal pin resistance and no pin failure. A conservative design would limit current to 500 mA. Some applications, however, require higher V
currents; disk drives, for example, may need as
much as 750-mA peak current to create the initial torque necessary to spin up the platter. V
pp
currents, on the
other hand, are defined by flash-memory programming requirements, typically under 120 mA.
future power trends
The 1-A physical-pin current alluded to in the PC Card specification has caused some host-system engineers to believe they are required to deliver 1 A within the voltage tolerance of the card. Future applications, such as RF cards, could use the extra power for their radio transmitters. The 5 W required for these cards will require very robust power supplies and special cooling considerations. The limited number of host sockets that will be able to support them makes the market for these high-powered PC Cards uncertain. The vast majority of the cards require less than 600 mA continuous current and the trend is towards even lower-powered PC Cards that will assure compatibility with a greater number of host systems. Recognizing the need for power derating, an adhoc committee of the PCMCIA is currently working to limit the amount of steady-state dc current to the PC Card to something less than the currently implied 1 A. If a system is designed to support 1 A, then the switch r
DS(on)
, power supply requirements, and PC Card cooling need to be carefully considered.
designing around 1-A delivery
Delivering 1 A means minimizing voltage (and power) losses across the PC Card power interface, which requires that designers trade off switch resistance and the cost associated with large-die (low r
DS(on)
) MOSFET transistors. The PC Card standard requires that 5 V ±5%, or 3.3 V ±0.3 V be supplied to the card. The approximate 10% tolerance for the 3.3-V supply makes the 3.3-V r
DS(on)
less critical than the 5-V switch. A conservative approach is to allow 2% for voltage-regulator tolerance and 1% for etch- and terminal-resistance drops, which leaves 2% (100 mV) voltage drop for the 5-V switch, and at least 6% (198 mV) for the 3.3-V switch.
Calculating the r
DS(on)
necessary to support a 100 mV or 198 mV switch loss, using R = E/I and setting I = 1 A, the 5-V and 3.3-V switches would need to be 100 mand 198 m respectively . One solution would be to pay for a more expensive switch with lower r
DS(on)
. A second, less expensive approach is to increase the headroom of the power supply–for example, to increase the 5-V supply 1.5% or to 5.075 ±2%. Working through the numbers once more, the 2% for the regulator plus 1 % for etch and terminal losses leaves 97% or 4.923 V . The allowable
TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–15
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
designing around 1-A delivery (continued)
voltage loss across the power distribution switch is now 4.923 V minus 4.750 V or 173 mV . Therefore, a switch with 173 mor less could deliver 1 A or greater. Setting the power supply high is a common practice for delivering voltages to allow for system switch, connector, and etch losses and has a minimal ef fect on overall battery life. In the example above, setting the power supply 1.5% high would only decrease a 3-hour battery life by approximately 2.7 minutes, trivial when compared with the decrease in battery life when running a 5-W PC Card.
heat dissipation
A greater concern in delivering 1 A or 5 W is the ability of the host to dissipate the heat generated by the PC Card. For desktop computers the solution is simpler: locate the PC Card cage such that it receives convection cooling from the forced air of the fan. Notebooks and other handheld equipment will not be able to rely on convection, but must rely on conduction of heat away from the PC Card through the rails into the card cage. This is difficult because PC Card/card cage heat transfer is very poor. A typical design scenario would require the PC Card to be held at 60°C maximum with the host platform operating as high as 50°C. Preliminary testing reveals that a PC Card can have a 20°C rise, exceeding the 10°C differential in the example, when dissipating less than 2 W of continuous power. The 60°C temperature was chosen because it is the maximum operating temperature allowable by PC Card specification. Power handling requirements and temperature rises are topics of concern and are currently being addressed by the PCMCIA committee.
overcurrent and over-temperature protection
PC Cards are inherently subject to damage that can result from mishandling. Host systems require protection against short-circuited cards that could lead to power supply or PCB-trace damage. Even systems sufficiently robust to withstand a short circuit would still undergo rapid battery discharge into the damaged PC Card, resulting in the rather sudden and unacceptable loss of system power. This can be particularly frustrating to the consumer who has already experienced problems with shortened battery life due to improper Nicad conditioning or memory effect. Most hosts include fuses for protection. The reliability of fused systems is poor, though, as blown fuses require troubleshooting and repair, usually by the manufacturer . The TPS2201 takes a two-pronged approach to overcurrent protection. First, instead of fuses, sense FETs monitor each of the power outputs. Excessive current generates an error signal that linearly limits the output current, preventing host damage or failure. Sense FET s, unlike sense resistors or polyfuses, have the added advantage that they do not add to the series resistance of the switch and thus produce no additional voltage losses. Second, when an overcurrent condition is detected, the TPS2201 asserts a signal at OC
that can be monitored by the microprocessor to initiate diagnostics and/or send the user a warning message. In the event that an overcurrent condition persists, causing the IC to exceed its maximum junction temperature, thermal-protection circuitry engages, shutting down all power outputs until the device cools to within a safe operating region.
12-V supply not required
Most PC Card switches use the externally supplied 12-V V
pp
power for switch-gate drive and other chip functions, requiring that it be present at all times. The TPS2201 offers considerable power savings by using an internal charge pump to generate the required higher voltages from the 5-V V
supply; therefore, the external 12-V supply can be disabled except when needed for flash-memory functions, thereby extending battery lifetime. Additional power savings are realized by the TPS2201 during a software shutdown, in which quiescent current drops to a maximum of 1 µA.
voltage transitioning requirement
PC Cards, like portables, are migrating from 5 V to 3.3 V to minimize power consumption, optimize board space, and increase logic speeds. The TPS2201 is designed to meet all combinations of power delivery as currently defined in the PCMCIA standard. The latest protocol accommodates mixed 3.3-V/5-V systems by first powering the card with 5 V , then polling it to determine its 3.3-V compatibility . The PCMCIA specification requires that the
TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–16
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
voltage transitioning requirement (continued)
capacitors on 3.3-V compatible cards be discharged to below 0.8 V before applying 3.3-V power. This ensures that sensitive 3.3-V circuitry is not subjected to any residual 5-V charge and functions as a power reset. The TPS2201 offers a selectable V
and V
PP
ground state, per PCMCIA 3.3-V/5-V switching specifications, to fully
discharge the card capacitors while switching between V
voltages.
output ground switches
Several PCMCIA power-distribution switches on the market do not have an active-grounding FET switch. These devices do not meet the PC Card specification requiring a discharge of V
within 100 ms. PC Card resistance can not be relied on to provide a discharge path for voltages stored on PC Card capacitance because of possible high-impedance isolation by power-management schemes. A method commonly shown to alleviate this problem is to add to the switch output an external 100 kresistor in parallel with the PC Card. Considering that this is the only discharge path to ground, a timing analysis will reveal that the RC time constant delays the required discharge time to over 2 seconds. The only way to ensure timing compatibility with PC Card standards is to use a power-distribution switch that has an internal ground switch, like that of the TPS22xx family , or add an external ground FET to each of the output lines with the control logic necessary to select it.
In summary, the TPS2201 is a complete single-chip dual-slot PC Card power interface. It meets all currently defined PCMCIA specifications for power delivery in 5-V , 3.3-V , and mixed systems, and offers a serial controller interface. The TPS2201 offers functionality, power savings, overcurrent and thermal protection, and fault reporting in one 30-pin SSOP surface-mount package for maximum value added to new portable designs.
power supply considerations
The TPS2201 has multiple terminals for each of its 3.3 V , 5 V, and 12 V power inputs and for the switched V
outputs. Any individual terminal can conduct the rated input or output current. Unless all terminals are connected in parallel, the series resistance is significantly higher than that specified, resulting in increased voltage drops and lost power. Both 12 V inputs must be connected for proper V
pp
switching; it is recommended that all input
and output power terminals be paralleled for optimum operation. The V
input lead must be connected to the
5V input leads. Although the TPS2201 is fairly immune to power input fluctuations and noise, it is generally considered good
design practice to bypass power supplies typically with a 1-µF electrolytic or tantalum capacitor paralleled by a 0.047-µF to 0.1-µF ceramic capacitor. It is strongly recommended that the switched V
and Vpp outputs be bypassed with a 0.1-µF or larger capacitor; doing so improves the immunity of the TPS2201 to electrostatic discharge (ESD). Care should be taken to minimize the inductance of PCB traces between the TPS2201 and the load. High switching currents can produce large negative-voltage transients, which forward biases substrate diodes, resulting in unpredictable performance.
The TPS2201, unlike other PC Card power-interface switches, does not use the 12-V power supply for switching or other chip functions. Instead, an internal charge pump generates the necessary voltage from V
, allowing
the 12-V input supply to be shut down except when the V
pp
programming or erase voltage is needed. Careful
system design making use of this feature reduces power consumption and extends battery lifetime. The 3.3-V power input should not be taken higher than the 5-V input. Doing so, though nondestructive, results
in high current flow into the device, and could result in abnormal operation. In any case, this occurrence indicates a malfunction of one input voltage or both, which should be investigated.
Similarly, no terminal should be taken below – 0.3 V; forward biasing the parasitic-substrate diode results in substrate currents and unpredictable performance.
TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–17
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
overcurrent and thermal protection
The TPS2201 uses sense FET s to check for overcurrent conditions in each of the VCC and Vpp outputs. Unlike sense resistors or polyfuses, these FETs do not add to the series resistance of the switch; therefore, voltage and power losses are reduced. Overcurrent sensing is applied to each output separately . When an overcurrent condition is detected, only the power output affected is limited; all other power outputs continue to function normally. The OC
indicator, normally a logic high, is a logic low when any overcurrent condition is detected,
providing for initiation of system diagnostics and/or sending a warning message to the user. During power up, the TPS2201 controls the rise time of the V
and Vpp outputs and limits the current into a faulty card or connector. If a short circuit is applied after power is established (e.g., hot insertion of a bad card), current is initially limited only by the impedance between the short and the power supply . In extreme cases, as much as 10 A to 15 A may flow into the short before the current limiting of the TPS2201 engages. If the V
or Vpp outputs are driven below ground, the TPS2201 may latch nondestructively in an off state. Cycling power will reestablish normal operation.
Overcurrent limiting for the V
outputs is designed to engage if powered up into a short in the range of
0.75 A to 1.9 A, typically at about 1.3 A; the V
pp
outputs limit from 120 mA to 400 mA, typically around 200 mA. The protection circuitry acts by linearly limiting the current passing through the switch, rather than initiating a full shutdown of the supply. Shutdown occurs only during thermal limiting.
Thermal limiting prevents destruction of the IC from overheating when the package power-dissipation ratings are exceeded. Thermal limiting, disables all power outputs (both A and B slots) until the device has cooled.
calculating junction temperature
The switch resistance, r
DS(on)
, is dependent on the junction temperature, TJ, of the die. The junction temperature
is dependent on both r
DS(on)
and the current through the switch. T o calculate TJ, first find r
DS(on)
from Figures 16, 17, and 18 using an initial temperature estimate about 50°C above ambient. Then calculate the power dissipation for each switch, using the formula:
PD+
r
DS(on)
@
I
2
Next, sum the power dissipation and calculate the junction temperature:
TJ+
ǒ
S
PD@
R
q
JA
Ǔ
)
TA,R
q
JA
+
108 CńW
°
Compare the calculated junction temperature with the initial temperature estimate. If they are not within a few degrees of each other, reiterate using the calculated temperature as the initial estimate.
logic input and outputs
The TPS2201 was designed to be compatible with most popular PCMCIA controllers and current PCMCIA and JEIDA standards. However, some controllers require slightly counterintuitive connections to achieve desired output states. The TPS2201 control logic inputs A_VCC3
, A_VCC5, B_VCC3 and B_VCC5 are defined active low (see Figure 23 and control-logic table). As such, they are directly compatible with the Cirrus Logic CL-PD6720 controller’s logic outputs (see Figure 24). The TPS2201 separate V
pp
power good indicators can
be ORed together to provide a single input to the Cirrus controller.
TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–18
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
A_VPP_PGM A_VPP_VCC A_VCC5 A_VCC3 B_VPP_PGM B_VPP_VCC B_VCC5 B_VCC3
D0–D7
SHDN
APWR_GOOD OC
Internal
Current Monitor
CPU
Controller
Thermal
VPP1
VPP2
VCC
VCC
VCC
VCC
VPP1
22
23
21
20
11
10
8
12V
5V
12V
5V
5V
3V
3V
3V
24
30
7
2
1
17
16
15
18
13
14
Logic
S6
S5
S4
S3
S2
S1
S12
S11
S10
S9
S8
S7
TPS2201
Card A
Card B
V
DD
25
VPP2
9
GND
12
3 4 5
6 29 28 27 26
BPWR_GOOD
19
51
17
52
18
51
17
52
18
CS
CS
CS
CS
Figure 23. Internal Switching Matrix
TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–19
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
TPS2201 control logic
AVPP
CONTROL SIGNALS INTERNAL SWITCH SETTINGS OUTPUT
SHDN A_VPP_PGM A_VPP_VCC S7 S8 S9 VAVPP
1 0 0 CLOSED OPEN OPEN 0 V 1 0 1 OPEN CLOSED OPEN VCC
1 1 0 OPEN OPEN CLOSED VPP(12 V) 1 1 1 OPEN OPEN OPEN Hi-Z 0 X X OPEN OPEN OPEN Hi-Z
BVPP
CONTROL SIGNALS INTERNAL SWITCH SETTINGS OUTPUT
SHDN B_VPP_PGM B_VPP_VCC S10 S11 S12 VBVPP
1 0 0 CLOSED OPEN OPEN 0 V 1 0 1 OPEN CLOSED OPEN VCC
1 1 0 OPEN OPEN CLOSED VPP(12 V) 1 1 1 OPEN OPEN OPEN Hi-Z 0 X X OPEN OPEN OPEN Hi-Z
A VCC
CONTROL SIGNALS INTERNAL SWITCH SETTINGS OUTPUT
SHDN A_VCC3 A_VCC5 S1 S2 S3 VAVCC
1 0 0 CLOSED OPEN OPEN 0 V 1 0 1 OPEN CLOSED OPEN 3 V 1 1 0 OPEN OPEN CLOSED 5 V 1 1 1 CLOSED OPEN OPEN 0 V 0 X X OPEN OPEN OPEN Hi-Z
BVCC
CONTROL SIGNALS INTERNAL SWITCH SETTINGS OUTPUT
SHDN B_VCC3 B_VCC5 S4 S5 S6 VBVCC
1 0 0 CLOSED OPEN OPEN 0 V 1 0 1 OPEN CLOSED OPEN 3 V 1 1 0 OPEN OPEN CLOSED 5 V 1 1 1 CLOSED OPEN OPEN 0 V 0 X X OPEN OPEN OPEN Hi-Z
Output depends on AVCC
Output depends on BVCC
TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–20
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
logic input and outputs (continued)
A_Vpp_PGM A_V
pp_VCC
A_V
CC_3
A_V
CC_5
B_Vpp_PGM B_Vpp_VCC B_V
CC_3
B_V
CC_5
Cirrus Logic
CL-PD6720
To CPU
GND
A_VPP_PGM
A_VPP_VCC
A_VCC3 A_VCC5
B_VPP_PGM
B_VPP_VCC
B_VCC3 B_VCC5
APWR_GOOD
TPS2201
V
pp
_Valid
OC
BPWR_GOOD
Figure 24. Logic Connections to CL-PD6720
Intel’s 82365SLDF controller uses active-high control logic for V
selection, which requires connecting the
82365SLDF’s 3-V control outputs (A_VCC_EN0, B_VCCEN0) to the TPS2201’s 5-V control inputs (A_VCC5
,
B_VCC5
) and the 5-V control outputs (A VCC_EN1, B_VCC_EN1) to the 3-V control inputs (A_VCC3, B_VCC3), as illustrated in Figure 25. Examination of the control logic tables on page 16 will confirm that these connections will in fact select the correct output voltage. An alternative approach would be to invert the Intel V
control logic
signals before routing them to the TPS2201. The separate V
pp
power-good indicators of the TPS2201 can be connected directly to the Intel controller as
shown in Figure 25. Cirrus Logic defines a (1, 1) on the V
select lines to be the PC Card no connect state; Intel chose (0, 0) to
select this state. As the tables show, either combination switches the V
outputs to 0 V . The decision to provide 0 V versus a high impedance for the no connect state eliminates potential charging at the switch-to-card interface. Feedback from the PC Card design community favors this approach.
V
pp
logic allows for 0-V or high-impedance output for no connect (0, 0) or reserved (1, 1) logic inputs, respectively (refer to A VPP and BVPP control-logic tables on page 16). Both the Cirrus Logic and Intel controllers interface directly with the V
pp
control inputs of the TPS2201.
The shutdown input of the TPS2201, SHDN
, when held at a logic low places all VCC and Vpp outputs in a
high-impedance state and reduces chip quiescent current to 1 µA to conserve battery power. An overcurrent output (OC
) is provided to indicate an overcurrent condition in any of the VCC or Vpp supplies
(see discussion above).
ESD protection
All TPS2201 inputs and outputs incorporate ESD-protection circuitry designed to withstand a 2-kV human-body-model discharge as defined in MIL-STD-883C. The V
and Vpp outputs can be exposed to potentially higher discharges from the external environment through the PC card connector. Bypassing the outputs with 0.1-µF capacitors protects the devices from discharges up to 10 kV.
TPS2201, TPS2201Y
DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES
FOR PARALLEL PCMCIA CONTROLLERS
SLVS094B – AUGUST 1994 – REVISED AUGUST 1995
6–21
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
A_VCC5 A_VCC3
A_VPP_VCC
A_VPP_PGM
B_VCC5 B_VCC3
B_VPP_VCC
B_VPP_PGM
APWR_GOOD
A_VCC _EN0
A_VCC _EN1 A_Vpp _EN0 A_Vpp _EN1 B_VCC _EN0 B_VCC _EN1 B_Vpp _EN0 B_Vpp _EN1 A:GPI
B:GPI
V
pp1
V
pp2
V
CC
V
pp1
V
pp2
V
CC
CSSHDN
PC Card
Connector B
PC Card
Connector A
INTEL
82365SL DF
AVCC AVCC AVCC
BVCC BVCC BVCC
AVPP AVPP
BVPP BVPP
3V
3 V
0.1 µF
5 V
12 V
V
DD
Shutdown
Signal
From CPU
To CPUOC
BPWR_GOOD
V
CC
V
CC
5V
5 V
GND
3V
5V
3V
5V
12V
12V
TPS2201 0.1 µF
0.1 µF
0.1 µF
Figure 25. Detailed Operating Circuits Using Intel 82365SLDF Controller
6–22
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
IMPORTANT NOTICE
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TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
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Copyright 1998, Texas Instruments Incorporated
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