Texas Instruments TPS2102D, TPS2103DR, TPS2103DBVT, TPS2103DBVR, TPS2103D Datasheet

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TPS2102, TPS2103
V
AUX
POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
Dual-Input, Single-Output MOSFET Switch With No Reverse Current Flow (No Parasitic Diodes)
D
IN1 . . . 250-m, 500-mA N-Channel; 14-µA Supply Current
D
IN2 . . . 1.3-, 100-mA P-Channel;
0.75-µA Supply Current (V
AUX
Mode)
D
Advanced Switch Control Logic
D
CMOS and TTL Compatible Enable Input
D
Controlled Rise, Fall, and Transition Times
D
2.7 V to 4 V Operating Range
D
SOT-23-5 and SOIC-8 Package
D
–40°C to 70°C Ambient Temperature Range
D
2-kV Human Body Model, 750-V Charged Device Model, 200-V Machine-Model ESD Protection
typical applications
D
Notebook and Desktop PCs
D
Cell phone, Palmtops, and PDAs
D
Battery Management
description
The TPS2102 and TPS2103 are dual-input, single-output power switches designed to provide uninterrupted output voltage when transitioning between two independent power supplies. Both devices combine one n-channel (250 mΩ) and one p-channel (1.3 Ω) MOSFET with a single output. The p-channel MOSFET (IN2) is used with auxiliary power supplies that deliver lower current for standby modes. The n-channel MOSFET (IN1) is used with a main power supply that delivers higher current required for normal operation. Low on-resistance makes the n-channel the ideal path for higher main supply current when power-supply regulation and system voltage drops are critical. When using the p-channel MOSFET, quiescent current is reduced to
0.75 µA to decrease the demand on the standby power supply . The MOSFETs in the TPS2102 and TPS2103 do not have the parasitic diodes, typically found in discrete MOSFETs, thereby preventing back-flow current when the switch is off.
DBV PACKAGE
(TOP VIEW)
GND
IN2
IN1
OUT
EN
GND
IN2
IN1
OUT
EN
DBV PACKAGE
(TOP VIEW)
TPS2102
TPS2103
NC – No internal connection
Figure 2. V
AUX
CardBus Implementation
PCI12xx / PCI14xx
CardBus Controller
PCI Bus
V
AUX
3.3 V
VGA TPS210x
V
CC
D3-STAT
1 2 3 4
8 7 6 5
IN2
GND
EN NC
OUT OUT NC IN1
D PACKAGE
(TOP VIEW)
D PACKAGE
(TOP VIEW)
1 2 3 4
8 7 6 5
IN2
GND
EN
NC
OUT OUT NC IN1
1 2 3
5
4
1 2 35 4
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Figure 1. Typical Dual-Input Single-Output
Application
TPS2102
IN1 IN2
EN
3.3 V V
CC
3.3 V V
AUX
D3 or PME Status
Control Signal
Holdup
Capacitor
Controller (CardBus,
1394,
PCI,
et al.)
3.3 V
TPS2102, TPS2103 V
AUX
POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Selection Guide, V
AUX
Power-Distribution Switches
DEVICE ENABLE
OPERATING
VOLTAGE RANGE
(V)
MAXIMUM INPUT
CURRENT, IN1
(mA)
MAXIMUM INPUT
CURRENT, IN2
(mA)
AMBIENT
TEMPERATURE RANGE
(°C)
TPS2100 EN 2.7 to 4 500 10 –40 to 70 TPS2101 EN 2.7 to 4 500 10 –40 to 70 TPS2102 EN 2.7 to 4 500 100 –40 to 70 TPS2103 EN 2.7 to 4 500 100 –40 to 70 TPS2104 EN 2.7 to 5.5 500 100 –40 to 85 TPS2105 EN 2.7 to 5.5 500 100 –40 to 85
AVAILABLE OPTIONS FOR TPS2102, TPS2103
PACKAGED DEVICES
T
A
DEVICE ENABLE
SOT-23-5
(DBV)
SOIC-8
(D)
°
°
TPS2102 EN TSP2102DBV
TPS2102D
40°C to 70°C
TPS2103 EN TPS2103DBV
TPS2103D
Both packages are available left-end taped and reeled. Add an R suffix to the D device type (e.g., TPS2103DR).
Add T (e.g., TPS2102DBVT) to indicate tape and reel at order quantity of 250 parts. Add R (e.g., TPS2102DBVR) to indicate tape and reel at order quantity of 3000 parts.
Function Tables
TPS2102 TPS2103
VIN1 VIN2 EN OUT VIN1 VIN2 EN OUT
0 V 0 V XX GND 0 V 0 V XX GND 0 V 3.3 V L GND 0 V 3.3 V H GND
3.3 V 0 V L VIN1 3.3 V 0 V H VIN1
3.3 V 3.3 V L VIN1 3.3 V 3.3 V H VIN1 0 V 3.3 V H VIN2 0 V 3.3 V L VIN2
3.3 V 0 V H VIN2 3.3 V 0 V L VIN2
3.3 V 3.3 V H VIN2 3.3 V 3.3 V L VIN2
XX = don’t care
TPS2102, TPS2103
V
AUX
POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TPS2102 functional block diagram
V
CC
Select
Charge
Pump
Driver
GND
OUT
SW2
1.3
SW1
250 m
Pullup Circuit
Driver
IN1
EN
IN2
Discharge Circuit
TPS2103 functional block diagram
V
CC
Select
Charge
Pump
Driver
GND
OUT
SW2
1.3
SW1
250 m
Driver
IN1
EN
IN2
Pulldown
Circuit
Discharge Circuit
TPS2102, TPS2103 V
AUX
POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
NO.
NAME
TPS2102 TPS2103
I/O
DESCRIPTION
DBV D DBV D
EN 1 3 I Active-high enable for IN1-OUT switch EN 1 3 I Active-low enable for IN1-OUT switch
GND 2 2 2 2 I Ground
IN1
5 5 5 5 I Main Input voltage, NMOS drain (250 m), require 0.22 µF bypass
IN2
3 1 3 1 I Auxilliary input voltage, PMOS drain (1.3 ), require 0.22 µF bypass
OUT 4 7, 8 4 7, 8 O Power switch output
NC 4, 6 4, 6 No connection
Unused INx should not be grounded.
detailed description
power switches
n-channel MOSFET
The IN1-OUT n-channel MOSFET power switch has a typical on-resistance of 250 m at 3.3-V input voltage, and is configured as a high-side switch.
p-channel MOSFET
The IN2-OUT p-channel MOSFET power switch has a typical on-resistance of 1.3 at 3.3-V input voltage and is configured as a high-side switch. When operating, the p-channel MOSFET quiescent current is reduced to typically 0.75 µA.
charge pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires very little supply current.
driver
The driver controls the gate voltage of the IN1-OUT and IN2-OUT power switches. T o limit large current surges and reduce the associated electromagnetic interference (EMI) produced, the drivers incorporate circuitry that controls the rise times and fall times of the output voltage.
enable
The logic enable will turn on the IN2-OUT power switch when a logic high is present on EN (TPS2102) or logic low is present on EN (TPS2103). A logic low input on EN (TPS2102) or logic high on EN (TPS2103) restores bias to the drive and control circuits and turns on the IN1-OUT power switch. The enable input is compatible with both TTL and CMOS logic levels.
the V
AUX
application for CardBus controllers
The PC Card specification requires the support of V
AUX
to the CardBus controller as well as to the PC Card
sockets. Both are 3.3-V requirements; however the CardBus controller’s current demand from the V
AUX
supply is limited to 10 µA, whereas the PC Card may consume as much as 200 mA. In either implementation, if support of a wake-up event is required, the controller and the socket will transition from the 3.3-V VCC rail to the 3.3-V V
AUX
rail when the equipment moves into a low power mode such as D3. The transition from VCC to V
AUX
needs
to be seamless in order to maintain all memory and register information in the system. If V
AUX
is not supported,
the system will lose all register information when it transitions to the D3 state.
TPS2102, TPS2103
V
AUX
POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
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POST OFFICE BOX 655303 DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Input voltage range, V
I(IN1)
(see Note 1) –0.3 V to 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I(IN2)
(see Note 1) –0.3 V to 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI at EN or EN (see Note 1) –0.3 V to 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) –0.3 V to 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, I
O(IN1
) 700 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, I
O(IN2)
140 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See dissipation rating table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature range, TJ –40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . .
Electrostatic discharge (ESD) protection: Human body model 2 kV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Machine model 200 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charged device model 750 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages are with respect to GND.
DISSIPATION RATING TABLE
PACKAGE
TA < 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
DBV 309 mW 3.1 mW/°C 170 mW 123 mW
D 568 mW 5.7 mW/°C 313 mW 227 mW
recommended operating conditions
MIN MAX UNIT
Input voltage, V
I(INx)
2.7 4 V Input voltage, VI at EN and EN 0 4 V Continuous output current, I
O(IN1)
500 mA
Continuous output current, I
O(IN2)
100‡mA
Operating virtual junction temperature, T
J
–40 85 °C
The device can deliver up to 220 mA at I
O(IN2)
. However, operation at the higher current levels will result in greater voltage drop across the device,
and greater voltage droop when switching between IN1 and IN2.
electrical characteristics over recommended operating junction temperature range, V
I(IN1)
= V
(IN2)
= 3.3 V, IO = rated current (unless otherwise noted)
power switch
PARAMETER
TEST
CONDITIONS
MIN TYP MAX UNIT
TJ = 25°C 250
IN1-OUT
TJ = 85°C 300 375
m
r
DS(on)
On-state resistance
TJ = 25°C 1.3
IN2-OUT
TJ = 85°C 1.5 2.1
Pulse-testing techniques maintain junction temperature close to ambient termperature; thermal effects must be taken into account separately.
TPS2102, TPS2103 V
AUX
POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended operating junction temperature range, V
I(IN1)
= V
(IN2)
= 3.3 V, IO = rated current (unless otherwise noted) (continued)
enable input (EN and EN)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
IH
High-level input voltage 2.7 V ≤ V
I(INx)
4 V 2 V
V
IL
Low-level input voltage 2.7 V ≤ V
I(INx)
4 V 0.8 V
p
TPS2102 EN = 0 V or EN = V
I(INx)
–0.5 0.5 µA
IIInput current
TPS2103 EN = 0 V or EN = V
I(INx)
–0.5 0.5 µA
supply current
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
EN = H
,
TJ = 25°C 0.75
EN H,
IN2 selected
–40°C ≤ TJ 85°C 1.5
µ
A
TPS2102
EN = L
,
TJ = 25°C 14
pp
EN L,
IN1 selected
–40°C ≤ TJ 85°C 24
µ
A
IISupply current
EN = L,
TJ = 25°C 0.75
,
IN2 selected
–40°C ≤ TJ 85°C 1.5
µ
A
TPS2103
EN = H,
TJ = 25°C 14
,
IN1 selected
–40°C ≤ TJ 85°C 24
µ
A
switching characteristics, TJ = 25°C, V
I(IN1)
= V
I(IN2)
= 3.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS
MIN TYP MAX UNIT
CL = 1 µF, IL = 500 mA 440
IN1-OUT V
I(IN2)
= 0
CL = 10 µF, IL = 500 mA 440
p
()
CL = 1 µF, IL = 100 mA 370
trOutput rise time
CL = 1 µF, IL = 100 mA 4.6
µ
s
IN2-OUT V
I(IN1)
= 0
CL = 10 µF, IL = 100 mA 50
()
CL = 1 µF, IL = 10 mA 4.6 CL = 1 µF, IL = 500 mA 5
IN1-OUT V
I(IN2)
= 0
CL = 10 µF, IL = 500 mA 100
p
()
CL = 1 µF, IL = 100 mA 13
tfOutput fall time
CL = 1 µF, IL = 100 mA 68
µ
s
IN2-OUT V
I(IN1)
= 0
CL = 10 µF, IL = 100 mA 680
()
CL = 1 µF, IL = 10 mA 720
p
p
IN1-OUT V
I(IN2)
= 0
80
t
PLH
Propagation delay time, low-to-high output
IN2-OUT V
I(IN1)
= 0
C
L
= 10 µF,
I
L
=
100 mA
2
µ
s
p
p
IN1-OUT V
I(IN2)
= 0
3
t
PHL
Propagation delay time, high-to-low output
IN2-OUT V
I(IN1)
= 0
C
L
= 10 µF,
I
L
=
100 mA
40
µ
s
All timing parameters refer to Figure 3.
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