•TPS2068/69 DGN Package TemperatureRange: –40°C to 85°C
•TPS2068 D Package Temperature Range:0°C to 70°C
•UL Listed – File No. E169910
•TPS2068/69: CB Certified
APPLICATIONS
•Heavy Capacitive Loads
TPS2060, TPS2064
TPS2068, TPS2069
DESCRIPTION
The TPS206x power-distribution switches are intended for applications where heavy capacitive loads and
short-circuits are likely to be encountered. This device incorporates 70-mΩ N-channel MOSFET power switches
for power-distribution systems that require single or dual power switches in a single package. Each switch is
controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to control the
power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no
external components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When
continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction
temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal
shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains
off until valid input voltage is present. Current limit is typically 2.1 A.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPad is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMENDEDTYPICALPACKAGED
T
A
0°C to 70°CDual
–40°C to 85°CSingle
ENABLE
Active lowTPS2060DGNTPS2060DRB
Active highTPS2064DGNTPS2064DRB
Active low1.5 A2.1 ATPS2068DGN
Active highTPS2069DGN
MAXIMUMSHORT-CIRCUITNUMBER OFDEVICES
CONTINUOUSCURRENT LIMITSWITCHES
LOAD CURRENTAT 25°C
MSOP (DGN)SON (DRB)
0°C to 70°CActive lowSingleTPS2068D
(1) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2060DGN).
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
Input voltage range, V
VIInput voltage range, V
Voltage range, V
VOOutput voltage range, V
I
Continuous output current, I
O
Continuous total power dissipationSee Dissipation Rating Table
Operating virtual junction temperature
T
J
range
T
Storage temperature range–65°C to 150°C
stg
ESD Electrostatic discharge protection
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
I(/OC)
I(IN)
I(/ENx)
, V
, V
I(/OCx)
O(OUT)
I(ENx)
, V
O(OUT)
O(OUTx)
, I
O(OUTx)
TPS2060/640°C to 105°C
TPS2068/69 (DGN Package)–40°C to 105°C
TPS2068 (D Package)0°C to 105°C
Human body model MIL-STD-883C2 kV
Charge device model (CDM)500 V
(1)
UNIT
–0.3 V to 6 V
–0.3 V to 6 V
–0.3 V to 6 V
–0.3 V to 6 V
(1) Heatsink the PowerPad™per the recommendations of SLMA002. PCB used for recommendations per appendix A4.
(2) See Recommended Operating Conditions Table for PowerPad connection guidelines to meet qualifying conditions for CB Certificate.
(3) Soldered PowerPAD on a standard 2-layer PCB without vias for thermal pad. See TI application note SLMA002 for further details.
(4) Soldered PowerPAD on a standard 4-layer PCB with vias for thermal pad. See TI application note SLMA002 for further details.
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account
(2) This configuration has not been tested for UL certification.
0°C ≤ TJ≤ 105°C for the TPS2060/64 and TPS2068 (D package), plus –40°C ≤ TJ≤ 105° for the
TPS2068/69 (DGN package), V
PARAMETERTEST CONDITIONS
OVERCURRENT OCx
V
OL(/OCx)
THERMAL SHUTDOWN
(3) The thermal shutdown only reacts under overcurrent conditions.
DGN and DRB PACKAGES
NAME TPS2060TPS2064
EN13—IEnable input, logic low turns on power switch IN-OUT1
EN24—IEnable input, logic low turns on power switch IN-OUT2
EN1—3IEnable input, logic high turns on power switch IN-OUT1
EN2—4IEnable input, logic high turns on power switch IN-OUT2
GND11Ground
IN22IInput voltage
OC188OOvercurrent, open-drain output, active low, IN-OUT1
OC255OOvercurrent, open-drain output, active low, IN-OUT2
OUT177OPower-switch output, IN-OUT1
OUT266OPower-switch output, IN-OUT2
Output low voltageI
Off-state currentV
OC deglitchOCx assertion or deassertion4815ms
(3)
Thermal shutdown threshold135°C
Recovery from thermal shutdown125°C
Hysteresis10°C