Texas Instruments TPS2060DGN, TPS2060DRBR, TPS2064DGN, TPS2064DRBR, TPS2068D Schematic [ru]

...
D−8 DRB−8DGN−8
TPS2060/TPS2064
DGNPACKAGE
(TOP VIEW)
GND
1 2 3 4
8 7 6 5
EN1 EN2
OC1 OUT1 OUT2
OC2
TPS2068
DGNPACKAGE
(TOP VIEW)
GND
1 2 3 4
8 7 6 5
EN
OUT OUT OUT
OC
TPS2069
DGNPACKAGE
(TOP VIEW)
GND
1 2 3 4
8 7 6 5
EN
OUT OUT OUT
OC
TPS2068
DPACKAGE
(TOP VIEW)
GND
EN
OUT
OUT
OUT
OC
1
2
3
4
8
7
6
5
GND
IN
EN1
EN2
OC1
OUT1
OUT2
OC2
TPS2060/TPS2064
DRBPACKAGES
(TOP VIEW)
† Allenableinputsareactivehighforthe TPS2064devices.
4
3
2
1
5
6
7
8
www.ti.com
SLVS553K –MARCH 2005– REVISED MAY 2011
CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES
Check for Samples: TPS2060, TPS2064, TPS2068, TPS2069
1

FEATURES

2
70-mHigh-Side MOSFET
1.5-A Continuous Current Short-Circuit Protections
Thermal and Short-Circuit Protection
Accurate Current Limit (1.6 A min, 2.6 A max)
Operating Range: 2.7 V to 5.5 V
0.6-ms Typical Rise Time
Undervoltage Lockout
Deglitched Fault Report (OC)
No OC Glitch During Power Up
1-μA Maximum Standby Supply Current
Reverse Current Blocking
TPS2060/64 Temperature Range: 0°C to 70°C
TPS2068/69 DGN Package Temperature Range: 40°C to 85°C
TPS2068 D Package Temperature Range: 0°C to 70°C
UL Listed File No. E169910
TPS2068/69: CB Certified

APPLICATIONS

Heavy Capacitive Loads
TPS2060, TPS2064 TPS2068, TPS2069

DESCRIPTION

The TPS206x power-distribution switches are intended for applications where heavy capacitive loads and short-circuits are likely to be encountered. This device incorporates 70-mN-channel MOSFET power switches for power-distribution systems that require single or dual power switches in a single package. Each switch is controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains off until valid input voltage is present. Current limit is typically 2.1 A.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPad is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2005–2011, Texas Instruments Incorporated
TPS2060, TPS2064 TPS2068, TPS2069
SLVS553K –MARCH 2005– REVISED MAY 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMENDED TYPICAL PACKAGED
T
A
0°C to 70°C Dual
40°C to 85°C Single
ENABLE
Active low TPS2060DGN TPS2060DRB
Active high TPS2064DGN TPS2064DRB
Active low 1.5 A 2.1 A TPS2068DGN
Active high TPS2069DGN
MAXIMUM SHORT-CIRCUIT NUMBER OF DEVICES
CONTINUOUS CURRENT LIMIT SWITCHES
LOAD CURRENT AT 25°C
MSOP (DGN) SON (DRB)
0°C to 70°C Active low Single TPS2068D
(1) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2060DGN). (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted
Input voltage range, V
VIInput voltage range, V
Voltage range, V VOOutput voltage range, V I
Continuous output current, I
O
Continuous total power dissipation See Dissipation Rating Table
Operating virtual junction temperature
T
J
range
T
Storage temperature range –65°C to 150°C
stg
ESD Electrostatic discharge protection
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
I(/OC)
I(IN) I(/ENx)
, V
, V
I(/OCx)
O(OUT)
I(ENx)
, V
O(OUT)
O(OUTx)
, I
O(OUTx)
TPS2060/64 0°C to 105°C TPS2068/69 (DGN Package) –40°C to 105°C TPS2068 (D Package) 0°C to 105°C
Human body model MIL-STD-883C 2 kV Charge device model (CDM) 500 V
(1)
UNIT
0.3 V to 6 V0.3 V to 6 V0.3 V to 6 V0.3 V to 6 V
Internally limited
www.ti.com
(1) (2)

DISSIPATING RATING TABLE

(1)
THERMAL TA< 25°C DERATING TA= 70°C TA= 85°C
PACKAGE RESISTANCE POWER RATING FACTOR POWER RATING POWER RATING
DGN-8
θ
(2)
JA
1370 mW 17 mW/°C 600 mW 342 mW
ABOVE TA= 25°C
D-8 585.82 mW 5.8582 mW/°C 322.20 mW 234.32 mW
DRB-8 (Low-K)
DRB-8 (High-K)
(3)
(4)
270 °CW 370 mW 3.71 mW/°C 203 mW 148 mW
60 °CW 1600 mW 16.67 mW/°C 916 mW 866 mW
(1) Heatsink the PowerPadper the recommendations of SLMA002. PCB used for recommendations per appendix A4. (2) See Recommended Operating Conditions Table for PowerPad connection guidelines to meet qualifying conditions for CB Certificate. (3) Soldered PowerPAD on a standard 2-layer PCB without vias for thermal pad. See TI application note SLMA002 for further details. (4) Soldered PowerPAD on a standard 4-layer PCB with vias for thermal pad. See TI application note SLMA002 for further details.
2 Copyright © 2005–2011, Texas Instruments Incorporated
TPS2060, TPS2064 TPS2068, TPS2069
www.ti.com

RECOMMENDED OPERATING CONDITIONS

V
I
Input voltage, V
I
Input voltage, V Continuous output current, I
O
I(IN) I(ENx)
, V
I(/ENx)
O(OUTx)
(1)
TPS2060/64 0 105
T
Operating virtual junction temperature TPS2068/69 (DGN Package) –40 105 °C
J
TPS2068 (D Package) 0 105
(1) The PowerPad must be connected externally to GND pin to meet qualifying conditions for CB Certificate (DGN package only).

ELECTRICAL CHARACTERISTICS

0°C TJ≤ 105°C for the TPS2060/64 and TPS2068 (D package), plus –40°C ≤ TJ≤ 105° for the TPS2068/69 (DGN package), V
PARAMETER TEST CONDITIONS
POWER SWITCH
Static drain-source on-state resistance, 5-V operation and V
r
DS(on)
t
r
t
f
ENABLE INPUT EN OR EN
V
IH
V
IL
I
I
t
on
t
off
CURRENT LIMIT
I
OS
I
OC_TRIP
I
OS
I
OC_TRIP
I
OL
I
OH
I
OH
I
lkg
UNDERVOLTAGE LOCKOUT
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account (2) This configuration has not been tested for UL certification.
3.3-V operation Static drain-source on-state resistance,
2.7-V operation
Rise time, output
Fall time, output
High-level input voltage 2.7 V < V Low-level input voltage 2.7 V < V Input current V Turnon time CL= 100 μF, RL= 5 3 Turnoff time CL= 100 μF, RL= 5 10
Short-circuit output current 1.6 2.1 2.6 A
Overcurrent trip threshold A
(2)
Short-circuit output current 3.2 4.2 5.2 A Overcurrent trip threshold V
(2)
TPS2060/64 together, current measured at V
Supply current, low-level output μA
Supply current, high-level output No load on OUT, V TPS2060/64 or V
Supply current, high-level output No load on OUT, V TPS2068/69 or V
Leakage current 1 μA Reverse leakage current V
Low-level input voltage, IN 2 2.5 V Hysteresis, IN TJ= 25°C 75 mV
separately.
= 5.5 V, IO= 1 A, V
I(IN)
I(IN)
V
I(IN)
V
I(IN)
V
I(IN)
V
I(IN)
V
I(IN)
I(/ENx)
V
I(IN)
short-circuit V
I(IN)
(100 A/s) on OUT V
I(IN)
into short-circuit, current measured at V
I(IN)
No load on OUT, V or V
OUT connected to ground, V or V
I(OUTx)
I(/ENx)
= 0 V, or V
= 5.5 V (unless otherwise noted).
I(ENx)
(1)
= 5 V or 3.3 V, IO= 1.5 A 70 115 m
= 2.7 V, IO= 1.5 A 75 125 m = 5.5 V 0.6 1.5
= 2.7 V 0.4 1 = 5.5 V 0.05 0.5
CL= 1 μF, RL= 5
= 2.7 V 0.05 0.5
< 5.5 V 2
I(IN)
< 5.5 V 0.8
I(IN)
= 0 V or 5.5 V, V
= 0 V or 5.5 V -0.5 0.5 μA
I(ENx)
= 5 V, OUT connected to GND, device enabled into
= 5 V, Current ramp
= 5 V, OUT1 and OUT2 connected to GND, Device enabled
I(IN)
= 5 V, Current ramp (100 A/s) on OUT1 and OUT2 tied
I(IN)
= 5.5 V,
I(ENx)
I(ENx)
I(ENx)
I(ENx)
= 0 V
= 5.5 V
= 5.5 V
= 0 V
I(/ENx)
I(/ENx)
I(/ENx)
= 0 V,
= 0 V,
I(/ENx)
= 5.5 V,
= 5.5 V, IN = ground TJ= 25°C 0.2 μA
SLVS553K –MARCH 2005– REVISED MAY 2011
MIN MAX UNIT
2.7 5.5 V 0 5.5 V 0 1.5 A
MIN TYP MAX UNIT
TJ= 25°C ms
TPS2060/64 3.2 3.9 TPS2068/69 2.3 2.85 3.4
6.4 7.8 A
TJ= 25°C 0.5 1 Over TJrange 0.5 5 TJ= 25°C 50 70 Over TJrange 50 90 TJ= 25°C 43 60 Over TJrange 43 70
V
ms
μA
μA
Copyright © 20052011, Texas Instruments Incorporated 3
TPS2060, TPS2064 TPS2068, TPS2069
SLVS553K –MARCH 2005– REVISED MAY 2011
ELECTRICAL CHARACTERISTICS (continued)
0°C TJ≤ 105°C for the TPS2060/64 and TPS2068 (D package), plus –40°C ≤ TJ≤ 105° for the TPS2068/69 (DGN package), V
PARAMETER TEST CONDITIONS
OVERCURRENT OCx
V
OL(/OCx)
THERMAL SHUTDOWN
(3) The thermal shutdown only reacts under overcurrent conditions.
DGN and DRB PACKAGES
NAME TPS2060 TPS2064
EN1 3 I Enable input, logic low turns on power switch IN-OUT1 EN2 4 I Enable input, logic low turns on power switch IN-OUT2 EN1 3 I Enable input, logic high turns on power switch IN-OUT1 EN2 4 I Enable input, logic high turns on power switch IN-OUT2 GND 1 1 Ground IN 2 2 I Input voltage OC1 8 8 O Overcurrent, open-drain output, active low, IN-OUT1 OC2 5 5 O Overcurrent, open-drain output, active low, IN-OUT2 OUT1 7 7 O Power-switch output, IN-OUT1 OUT2 6 6 O Power-switch output, IN-OUT2
Output low voltage I Off-state current V OC deglitch OCx assertion or deassertion 4 8 15 ms
(3)
Thermal shutdown threshold 135 °C Recovery from thermal shutdown 125 °C Hysteresis 10 °C
PINS
PowerPad PowerPad Connect to GND
= 5.5 V, IO= 1 A, V
I(IN)
O(/OCx)
O(/OCx)
= 5 mA 0.4 V
= 5 V or 3.3 V 1 μA
I(/ENx)
= 0 V, or V
= 5.5 V (unless otherwise noted).
I(ENx)
(1)

DEVICE INFORMATION

Pin Functions
I/O DESCRIPTION
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MIN TYP MAX UNIT
4 Copyright © 2005–2011, Texas Instruments Incorporated
Thermal
Sense
Driver
Current
Limit
Charge
Pump
UVLO
CS
Driver
Current
Limit
CS
Thermal
Sense
Charge
Pump
GND
EN1
IN
EN2
OC1
OUT1
OUT2
OC2
Deglitch
Deglitch
(SeeNote A)
(SeeNote A)
(SeeNoteB)
(SeeNoteB)
www.ti.com
TPS2060, TPS2064 TPS2068, TPS2069
SLVS553K –MARCH 2005– REVISED MAY 2011
Functional Block Diagram (TPS2060 and TPS2064)
A. Current sense. B. Active low (ENx) for TPS2060. Active high (ENx) for TPS2064.
Copyright © 2005–2011, Texas Instruments Incorporated 5
OUT
OC
IN
EN
GND
Current
Limit
Driver
UVLO
Charge
Pump
CS
Thermal
Sense
Deglitch
(SeeNote A)
(SeeNoteB)
TPS2060, TPS2064 TPS2068, TPS2069
SLVS553K –MARCH 2005– REVISED MAY 2011

DEVICE INFORMATION

Pin Functions (TPS2068 and TPS2069)
PINS
NAME TPS2068 TPS2069
EN 4 I Enable input, logic low turns on power switch EN 4 I Enable input, logic high turns on power switch GND 1 1 Ground IN 2, 3 2, 3 I Input voltage OC 5 5 O Overcurrent, open-drain output, active-low OUT 6, 7, 8 6, 7, 8 O Power-switch output
PowerPad PowerPad Connect to GND (DGN Package Only)
(1) See the Recommended Operating Conditions Table for PowerPad connection guidelines to meet qualifying conditions for CB Certificate
(DGN package only).
Functional Block Diagram (TPS2068 and TPS2069)
I/O DESCRIPTION
(1)
www.ti.com
A. Current sense. B. Active low (EN) for TPS2068. Active high (EN) for TPS2069.
6 Copyright © 2005–2011, Texas Instruments Incorporated
R
L
C
L
OUT
t
r
t
f
90%
90%
10%
10%
50%
50%
90%
10%
V
O(OUT)
V
I(EN)
V
O(OUT)
VOLTAGE WAVEFORMS
TEST CIRCUIT
t
on
t
off
50%
50%
90%
10%
V
I(EN)
V
O(OUT)
t
on
t
off
V
I(EN)
5V/div
V
O(OUT)
2V/div
t-Time-400 sm
R =5
C =1 F,
L
L
W
m
,
=25 CT
A
°
V
I(EN)
5V/div
V
O(OUT)
2V/div
t-Time-400 sm
R =5
C =1 F,
L
L
W
m
,
=25 CT
A
°
www.ti.com
TPS2060, TPS2064 TPS2068, TPS2069
SLVS553K –MARCH 2005– REVISED MAY 2011

PARAMETER MEASUREMENT INFORMATION

Figure 1. Test Circuit and Voltage Waveforms
Figure 2. Turnon Delay and Rise Time With 1-μF Figure 3. Turnoff Delay and Fall Time With 1-μF
Load Load
Copyright © 2005–2011, Texas Instruments Incorporated 7
V
I(EN)
5V/div
V
O(OUT)
2V/div
t-Time-400 sm
R =5
C =100 F,
L
L
W
m
,
=25 CT
A
°
V
I(EN)
5V/div
V
O(OUT)
2V/div
t-Time-400 sm
R =5
C =100 F,
L
L
W
m
,
=25 CT
A
°
V
I(EN)
5 V/div
I
O(OUT)
1 A/div
t − Time − 500 ms/div
220 mF
470 mF
100 mF
V
I(EN)
5 V/div
I
O(OUT)
500 mA/div
t − Time − 500 ms/div
VIN = 5 V , RL = 3 W, TA = 255C
TPS2060, TPS2064 TPS2068, TPS2069
SLVS553K –MARCH 2005– REVISED MAY 2011
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 4. Turnon Delay and Rise Time With 100-μF Figure 5. Turnoff Delay and Fall Time With 100-μF
Load Load
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Figure 6. Short-Circuit Current, Figure 7. Inrush Current With Different
Device Enabled Into Short Load Capacitance
8 Copyright © 2005–2011, Texas Instruments Incorporated
V
O( )OCx
2V/div
I
O(OUT)
1 A/div
t-Time-2ms/div
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
2 3 4 5 6
Turnon Time − ms
VI − Input Voltage − V
CL = 100 mF, RL = 5 W, TA = 255C
1.5
1.6
1.7
1.8
1.9
2
2 3 4 5 6
CL = 100 mF, RL = 5 W, TA = 255C
Turnoff Time − mS
VI − Input Voltage − V
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TPS2060, TPS2064 TPS2068, TPS2069
SLVS553K –MARCH 2005– REVISED MAY 2011
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 8. 0.6-Load Connected to Enabled Device

TYPICAL CHARACTERISTICS

TURNON TIME TURNOFF TIME
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Copyright © 2005–2011, Texas Instruments Incorporated 9
Figure 9. Figure 10.
0
0.1
0.2
0.3
0.4
0.5
0.6
2 3 4 5 6
Rise Time − ms
VI − Input Voltage − V
CL = 1 mF, RL = 5 W, TA = 255C
0
0.05
0.1
0.15
0.2
0.25
2 3 4 5 6
CL = 1 mF, RL = 5 W, TA = 255C
Fall Time − ms
VI − Input Voltage − V
0
10
20
30
40
50
60
70
−50 0 50 100 150
VI = 5.5 V
VI = 5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − 5C
− Supply Current, Output Enabled −
I
I (IN)
Aµ
0
10
20
40
50
60
-50
0 50 100 150
30
T -JunctionTemperature- CJ°
I -SupplyCurrent,OutputEnabled- A
I(IN)
m
V =5.5V
I
V =3.3V
I
V =2.7V
I
V =5V
I
TPS2060, TPS2064 TPS2068, TPS2069
SLVS553K –MARCH 2005– REVISED MAY 2011
TYPICAL CHARACTERISTICS (continued)
RISE TIME FALL TIME
vs vs
INPUT VOLTAGE INPUT VOLTAGE
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Figure 11. Figure 12.
TPS2060, TPS2064 TPS2068, TPS2069
SUPPLY CURRENT, OUTPUT ENABLED SUPPLY CURRENT, OUTPUT ENABLED
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
10 Copyright © 2005–2011, Texas Instruments Incorporated
Figure 13. Figure 14.
vs vs
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
−50 0 50 100 150
VI = 5.5 V
VI = 5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − 5C
− Supply Current, Output Disabled −
I
I (IN)
Aµ
0
20
40
60
80
100
120
−50 0 50 100 150
Out1 = 5 V
Out1 = 3.3 V
Out1 = 2.7 V
IO = 0.5 A
TJ − Junction Temperature − 5C
r
DS(on) − Static Drain-Source
On-State Resistance − m
2.1
2.14
2.18
2.22
2.26
2.3
−50 0 50 100 150
UVLO Rising
UVLO Falling
UVOL − Undervoltage Lockout − V
TJ − Junction Temperature − 5C
1.6
1.7
1.8
1.9
2
2.2
2.3
2.4
2.5
2.6
-50
0 50 100 150
2.1
T -JunctionTemperature- CJ°
I -Short-CircuitCurrentLimit- A
OS
V =2.7V
I
V =3.3V
I
V =5V
I
V =5.5V
I
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TPS2060, TPS2064 TPS2068, TPS2069
SLVS553K –MARCH 2005– REVISED MAY 2011
TYPICAL CHARACTERISTICS (continued)
SUPPLY CURRENT, OUTPUT DISABLED STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 15. Figure 16.
SHORT-CIRCUIT OUTPUT CURRENT UNDERVOLTAGE LOCKOUT
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Copyright © 2005–2011, Texas Instruments Incorporated 11
Figure 17. Figure 18.
vs vs
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