Texas Instruments TPA751 MSOP User Manual

TPA751 MSOP Audio Power Amplifier Evaluation Module
User’s Guide
February 2001 Mixed-Signal Products
SLOU112
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Mailing Address:
Texas Instruments Post Office Box 655303 Dallas, Texas 75265
Copyright 2001, Texas Instruments Incorporated
Related Documentation From Texas Instruments
TI Plug-N-Play Audio Amplifier Evaluation Platform
number SLOU011) provides detailed information on the evaluation platform and its use with TI audio evaluation modules.
TPA751 700-mW Low-Voltage Audio Power Amplifier
number SLOS336) This is the data sheet for the TPA751 audio amplifier integrated circuit.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.
Preface
(literature
(literature
Chapter Title—Attribute Reference
iii
iv
Running Title—Attribute Reference
Contents
1 Introduction 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Feature Highlights 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 TPA751 EVM Specifications 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Operation 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Precautions 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Quick Start List for Platform 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Quick Start List for Stand-Alone 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Stand-Alone Connection Diagram 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5 Reference 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5.1 TPA751 EVM Schematic Diagram 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5.2 TPA751 MSOP Audio Power Amplifier Evaluation Module Parts List 2-7. . . . . . . .
2.5.4 TPA751 EVM PCB Layers 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures
1–1 The TI TPA751 Audio Amplifier Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 Quick Start Platform Map 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 Quick Start Module Map 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 TPA751 EVMs Connected for Stereo BTL Output 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–4 TPA751 EVM Schematic Diagram 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–5 TPA751 EVM PCB 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–6 TPA751 EVM Bottom Layer 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
2–1. Platform Jumper and Switch Settings for the TPA751 EVM 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2. TPA751 EVM Parts List 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents
v
vi
Chapter 1
Introduction
This chapter provides an overview of the Texas Instruments (TI) TPA751 MSOP Audio Power Amplifier Evaluation Module (SLOP357). It includes a list of EVM features, a brief description of the module illustrated with a pictorial diagram, and a list of EVM specifications.
Topic Page
1.1 Feature Highlights 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 TPA751 EVM Specifications 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
Feature Highlights
1.1 Feature Highlights
The TI TPA751 MSOP Audio Power Amplifier Evaluation Module and the TI Plug-n-Play Audio Amplifier Evaluation Platform include the following features:
TPA751 low-voltage audio power amplifier evaluation module
Single-channel, bridge-tied load (BTL)2.5-V and 5.5-V operation700-mW output power into 8 at 5 V, BTLUltra-low current consumption in shutdown modeInternal thermal and short-circuit protectionModule gain is set at –4 V/V in BTL mode, –2 V/V in SE mode
Quick and Easy Configuration With The TI Plug-N-Play Audio Amplifier
Evaluation Platform
Evaluation module is designed to simply plug into the platform,
automatically making all signal, control, and power connections
Platform provides flexible power optionsJumpers on the platform select power and module control optionsSwitches on the platform route signalsPlatform provides quick and easy audio input and output connections
Platform Power Options
Onboard 9-V batteryExternal 5-V to 15-V (VExternal regulated VSocket for on-board 5-V/3.3-V VOnboard overvoltage and reverse polarity power protection
Platform Audio Input and Output Connections
Left and right RCA phono jack inputsMiniature stereo phone jack inputLeft and right RCA phono jack outputsLeft and right compression speaker terminal outputs
) supply inputs
CC
supply input
DD
voltage regulator EVM
DD
1-2
Miniature stereo headphone jack output
Introduction
1.2 Description
The TPA751 MSOP Audio Power Amplifier Evaluation Module is a complete, low-power single-channel audio power amplifier. It consists of the TI TPA751 700-mW low-voltage audio power amplifier IC in a very small MSOP package, along with a small number of other parts mounted on a circuit board that is approximately one and a quarter inches square (see Figure 1–1).
Figure 1–1.The TI TPA751 Audio Amplifier Evaluation Module
VDD GND
R1
Shutdown
S1
C1 R2
C2
R3 R4
C3
IN– IN+
TPA751 MSOP EVM
INSTRUMENTS
U1
R5
TEXAS
SLOP357
+
C4
C5
OUT–
GND
OUT+
Description
Due to the very small size of the MSOP IC package, the standard part number TPA751 is replaced with the code TIATC.
Single in-line header pins are mounted to the underside of the module circuit board. These pins allow the EVM to be plugged into the TI plug-n-play audio amplifier evaluation platform or to be wired directly into existing circuits and equipment when used stand-alone.
The platform, with room for a pair of TPA751 evaluation modules, is a convenient vehicle for demonstrating TI’s audio power amplifier and related evaluation modules. The EVMs simply plug into the platform, which automatically provides power to the modules, interconnects them correctly, and connects them to a versatile array of standard audio input and output jacks and connectors. Easy-to-use configuration controls allow the platform and EVMs to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers included with the platform to hook up.
1.3 TPA751 EVM Specifications
Supply voltage range, V Supply current, I
DD
Continuous output power, P Audio input voltage, V Minimum load impedance, R
DD
:8-Ω BTL, V
O
I
L
= 5 V 700 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DD
2.5 V to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
450 mA, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Vpp, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction
1-3
1-4
Introduction
Chapter 2
Operation
Quick start lists in this chapter contain steps that can be followed to quickly prepare the TI plug-n-play audio amplifier evaluation platform for use with the TPA751 MSOP Audio Power Amplifier Evaluation Module, or to connect the TPA751 EVM for stand-alone operation.
Using the TPA751 EVM with the TI evaluation platform is a quick and easy way to connect power, signal and control inputs, and signal outputs to the EVM, using standard connectors.
The TPA751 EVM can also be used stand-alone by making connections directly to the module pins, and it can be wired directly into existing circuits or equipment. A stand-alone connection diagram appears below.
A schematic, parts list, and PCB and layer illustrations for the EVM are included in the Reference section of this chapter.
Topic Page
2.1 Precautions 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Quick Start List for Platform 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Quick Start List for Stand-Alone 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Stand-Alone Connection Diagram 2–5. . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5 Reference 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operation
2-1
Precautions
2.1 Precautions
Power Supply Input Polarity and Maximum Voltage Always ensure that the polarity and voltage of the external power
connected to VCC power input connector J1, J2, and/or VDD power input connector J6 are correct. Overvoltage or reverse-polarity power applied to these terminals can open onboard soldered-in fuses and cause other damage to the platform, installed evaluation modules, and/or the power source.
Inserting or Removing EVM Boards Do not insert or remove EVM boards with power applied – damage
to the EVM board, the platform, or both may result.
Figure 2–1.
VCC
In
+
6b
Power
Input
Audio Input
AC/DC
In
8
Quick Start Platform Map
6b
SOURCE
J1
D4 J2
Right
In
Stereo
In
Left
In
INSTRUMENTS
1997
JP2
DC
VCC(J1)
D3
JP1
AC/DC
(J2)
D2
Batt
D1
JP3
VR1
J3
Signal Conditioning
J4
J5
****CAUTION**** Do not insert or remove EVM boards with power
TEXAS
Plug-N-Play Audio Amplifier Evaluation Platform SLOP097 Rev. C.1
F1
LED1
VCC
applied
C1+
R1
U1
1
Off Pwr
10
On
ICC JP4
S1
Audio Power Amps
S2
OnOff
Conditioning
TP1
GND
B1
6b 6b
SUPPLY
JP5
IDD
R2
U3 U4
U2-U4
U5
U5
HP
Source
S3
POWER
VDD
U2
HP(U5)
Polarity
JP7
R3
R4
LED2
JP6
Lo Hi
+ +
U6
Out
Mode Mute
Spk(U2-U4)
Out
JP8
C3 C2
HP Out
F2
J7
Right
J8
+– +– Right
Out
Left
Out
J9
Left
Stereo
In/Out
VDD
J10
R5
VR2
6a DC
Power In/Out
+
J6
9
Speaker Output
Headphone
Output
2-2
23
5
4
Operation
Quick Start List for Platform
2.2 Quick Start List for Platform
Follow these steps when using the TPA751 EVM with the TI Plug-N-Play Audio Amplifier Evaluation Platform (see the platform user’s guide, SLOU011, for additional details). Typical EVM settings are shown in Table 2–1. Numbered callouts for selected steps are shown in Figure 2–1.
Platform preparations
1) Ensure that all external power sources are set to off and that the platform power switch S1 is set to off.
2) Install a TPA751 MSOP module in platform sockets U3 and U4 for stereo operation (or a module in either U3 or U4 for single channel operation), taking care to align the module pins correctly.
3) Use switch S2 to select or bypass the signal conditioning EVM (U1).
4) Set control signal Polarity jumper JP8 to Hi.
5) Set jumper JP6 to select the Mute control input (causes the TPA751 to shutdown if a plug is inserted into platform headphone jack J10).
Table 2–1. Platform Jumper and Switch Settings for the TPA751 EVM
EVM JP6 JP7 JP8 S2 S3
TPA751 Mute X Hi See Note 2 X
Notes: 1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2 to OFF when no signal conditioning board is installed.
Power supply
6) Select and connect the power supply: a) Connect a n external regulated power supply set to a voltage between
2.5 V and 5.5 V to platform VDD power input connector J6, taking care to observe marked polarity, or
b) Install a voltage regulator EVM (SLVP097 or equiv.) in platform socket
U6. Install a 9-V battery in B1 or connect a 7 V – 12 V power source to a platform VCC power input J1 or J2 and jumper the appropriate power input (see platform user’s guide).
Inputs and outputs
7) Ensure that signal source level is set to minimum.
8) Connect the audio source to left and right RCA phono jacks J3 and J5 or stereo miniature phone jack J4.
9) Connect 8-Ω–32-Ω speakers to left and right RCA jacks J7 and J9 or to stripped wire connectors J8.
Power-up
10) Verify correct voltage and input polarity and set the external power supply to ON. If VCC and an on-board regulator EVM are used to provide VDD, set platform power switch S1 to on.
Platform LED2 lights indicating the presence of VDD, and the evaluation modules installed on the platform begin operation.
11) Adjust the signal source level as needed.
Operation
2-3
Quick Start List for Stand-Alone
2.3 Quick Start List for Stand-Alone
Follow these steps to use the TPA751 EVM stand-alone or when connecting it into existing circuits or equipment. Connections to the TPA751 module header pins can be made via individual sockets, wire-wrapping, or soldering to the pins, either on the top or the bottom of the module circuit board. Numbered callouts for selected steps are shown in Figure 2–2.
Figure 2–2.
Quick Start Module Map
5
C2 C3
4
Due to the very small size of the MSOP IC package, the standard part number TPA751 is replaced with the code TIATC.
IN– IN+
Power supply
1) Ensure that all external power sources are set to off
2) Connect an external regulated power supply set to 5 V to the module V and GND pins, taking care to observe marked polarity.
Inputs and outputs
3) Ensure that the signal source level is set to minimum.
R1
Shutdown
S1
C1 R2 R3 R4
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
U1
TEXAS
2
VDD GND
+
C5
R5
C4
OUT–
GND
OUT+
6
.
DD
2-4
4) Connect the audio source to the module IN– and IN+ pins, taking care to observe marked polarity.
5) Connect the shutdown (S1) pin to GND through a normally open switch.
6) Connect an 8-–32- speaker to the module OUT+ and OUT– pins.
Power-up
7) Verify correct voltage and input polarity and set the external power supply to on
.
The EVM should begin operation.
8) Adjust the signal source level as needed.
Operation
2.4 Stand-Alone Connection Diagram
The power supply range is 2.5 V to 5.5 V and isolated OUT+ and OUT– lines for BTL operation are required.
Note that the source of any shutdown signal applied to the EVM SHUTDOWN pin must be able to sink the current flowing through the pullup resistor on the module (20 k) when the pin is held low.
Figure 2–3 shows a TPA751 EVM connected for stereo BTL operation.
Figure 2–3.TPA751 EVMs Connected for Stereo BTL Output
5 VDC
VDD GND
R1
C2 C3
Shutdown
S1
C1 R2 R3 R4
U1
+
C4
C5
R5
OUT–
GND
OUT+
Stand-Alone Connection Diagram
Right
TEXAS
Audio Input
(Right)
IN– IN+
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
5 VDC GND
VDD GND
S1
R1
Shutdown
C1 R2 R3 R4
U1
+
C4
C5
R5
OUT–
GND
OUT+
Left
External Mute
Control
(active low)
C2 C3
TEXAS
Audio Input
(Left)
Due to the very small size of the MSOP IC package, the standard part number TPA751 is replaced with the code TIATC.
IN– IN+
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
Operation
2-5
Reference
2.5 Reference
This section includes the TPA751 EVM schematic, the EVM parts list, and the module PCB layers.
2.5.1 TPA751 EVM Schematic Diagram
Figure 2–4 shows the TPA751 EVM schematic.
Figure 2–4.TPA751 EVM Schematic Diagram
Shutdown
IN+
IN–
S1
C3
1 µF
NO
20 k
C2
1 µF
R4
R1 20 k
C1
1 µF
R3
20 k
R2
39 k
1
Shutdown
2
Bypass
3
In+
4
In–
TIATC
TPA751
R5
39 k
V
O–
GND
V
DD
V
O+
VDD
2.5 V to 5.5 V
8 7 6
5
C5 1 µF
C4
10 µF
+
GND
OUT– GND
OUT+
2-6
Operation
2.5.2 TPA751 MSOP Audio Power Amplifier Evaluation Module Parts List
Table 2–2 shows the TPA751 EVM parts list.
Table 2–2.TPA751 EVM Parts List
Reference
Reference Description Size
C4 Capacitor, 10 µF, 6.3 V A 1 Panasonic
C1, C2, C3, C5
R1, R3, R4 Resistor, 20 k, 1/16 W, 5% 0603 3 Panasonic
R2, R5 Resistor, 39 kΩ, 1/16 W, 5% 0603 2 Panasonic
S1 Switch, momentary 1 Panasonic
U1 IC, TPA751DGN†, audio
PCB1 PCB, TPA751 MSOP EVM 1
Due to the very small size of the MSOP IC package, the standard part number TPA751 is replaced with the code TIATC.
Note: All items are SMD except as noted.
Capacitor, 1 µF, 80%/–20%, nonpolarized
Terminal Post Headers 9 Sullins
amplifier, 700 mW, mono
0603 4 Murata
MSOP-8 1 TI
EVM
Qty.
Manufacturer/
Part Number
ECS-TOJY106R
GRM39-Y5V105Z10PT
ERJ-3GSYJ203
ERJ-3GSYJ393
P8048SCT-ND
PTC36SABN
TPA751DGN
Vendor
Number
Digi-Key PCS1106CT-ND
Newark
Digi-Key P20KGCT-ND
Digi-Key P39KGCT-ND
Digi-Key P8048SCT-ND
Digi-Key S1022-36-ND
Operation
2-7
TPA751 EVM PCB Layers
2.5.3 TPA751 EVM PCB Layers
The following illustrations depict the TPA751 EVM PCB layers and silkscreen. These drawings are not to scale. Gerber plots can be obtained from any TI sales office.
Figure 2–5.TPA751 EVM PCB
Figure 2–6.TPA751 EVM Bottom Layer
2-8
Operation
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its products to the specifications applicable at the time of sale in accordance with TI’s standard warranty . T esting and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, license, warranty or endorsement thereof.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation or reproduction of this information with alteration voids all warranties provided for an associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Resale of TI’s products or services with statements different from or beyond the parameters that product or service voids all express and any implied warranties for the associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Also see: Standard Terms and Conditions of Sale for Semiconductor Products.
Mailing Address:
Texas Instruments Post Office Box 655303 Dallas, Texas 75265
Copyright 2001, Texas Instruments Incorporated
Printed in U.S.A by Harte–Hanks, Inc. V alencia, California
www.ti.com/sc/docs/stdterms.htm
stated by TI for
TI W orldwide T echnical Support
Internet
TI Semiconductor Product Information Center Home Page
www.ti.com/sc/support
TI Semiconductor KnowledgeBase Home Page
www.ti.com/sc/knowledgebase
Product Information Cent ers
Americas
Phone +1(972) 644-5580 Fax +1(214) 480-7800 Internet www.ti.com/sc/ampic
Europe, Middle East, and Africa
Phone
Belgium (English) +32 (0) 27 45 55 32 France +33 (0) 1 30 70 11 64 Germany +49 (0) 8161 80 33 11 Israel (English) 1800 949 0107 Italy 800 79 11 37 Netherlands (English) +31 (0) 546 87 95 45 Spain +34 902 35 40 28 Sweden (English) +46 (0) 8587 555 22
United Kingdom +44 (0) 1604 66 33 99 Fax +44 (0) 1604 66 33 34 Email epic@ti.com Internet www.ti.com/sc/epic
Japan
Phone
International +81-3-3344-5311
Domestic 0120-81-0026 Fax
International +81-3-3344-5317
Domestic 0120-81-0036 Internet
International www.ti.com/sc/jpic
Domestic www.tij.co.jp/pic
Asia
Phone
International +886-2-23786800 Domestic Local Access Code TI Number
Australia 1-800-881-011 -800-800-1450 China 1-0810 -800-800-1450 Hong Kong 800-96-1111 -800-800-1450 India 000-117 -800-800-1450 Indonesia 001-801-10 -800-800-1450 Korea 080-551-2804 ­Malaysia 1-800-800-011 -800-800-1450 New Zealand 000-911 -800-800-1450 Philippines 105-11 -800-800-1450 Singapore 800-0111-111 -800-800-1450 Taiwan 080-006800 -
Thailand 0019-991-1111 -800-800-1450 Fax 886-2-2378-6808 Email tiasia@ti.com Internet www.ti.com/sc/apic
© 2001 Texas Instr uments Incorporated Printed in the USA
A121400
Loading...