TPA751 MSOP
Audio Power Amplifier
Evaluation Module
User’s Guide
February 2001Mixed-Signal Products
SLOU112
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2001, Texas Instruments Incorporated
Related Documentation From Texas Instruments
TI Plug-N-Play Audio Amplifier Evaluation Platform
number SLOU011) provides detailed information on the evaluation
platform and its use with TI audio evaluation modules.
TPA751 700-mW Low-Voltage Audio Power Amplifier
number SLOS336) This is the data sheet for the TPA751 audio
amplifier integrated circuit.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
This chapter provides an overview of the Texas Instruments (TI) TPA751
MSOP Audio Power Amplifier Evaluation Module (SLOP357). It includes a list
of EVM features, a brief description of the module illustrated with a pictorial
diagram, and a list of EVM specifications.
The TI TPA751 MSOP Audio Power Amplifier Evaluation Module and the TI
Plug-n-Play Audio Amplifier Evaluation Platform include the following
features:
TPA751 low-voltage audio power amplifier evaluation module
Single-channel, bridge-tied load (BTL)
2.5-V and 5.5-V operation
700-mW output power into 8 Ω at 5 V, BTL
Ultra-low current consumption in shutdown mode
Internal thermal and short-circuit protection
Module gain is set at –4 V/V in BTL mode, –2 V/V in SE mode
Quick and Easy Configuration With The TI Plug-N-Play Audio Amplifier
Evaluation Platform
Evaluation module is designed to simply plug into the platform,
automatically making all signal, control, and power connections
Platform provides flexible power options
Jumpers on the platform select power and module control options
Switches on the platform route signals
Platform provides quick and easy audio input and output connections
Platform Power Options
Onboard 9-V battery
External 5-V to 15-V (V
External regulated V
Socket for on-board 5-V/3.3-V V
Onboard overvoltage and reverse polarity power protection
Platform Audio Input and Output Connections
Left and right RCA phono jack inputs
Miniature stereo phone jack input
Left and right RCA phono jack outputs
Left and right compression speaker terminal outputs
) supply inputs
CC
supply input
DD
voltage regulator EVM
DD
1-2
Miniature stereo headphone jack output
Introduction
1.2Description
The TPA751 MSOP Audio Power Amplifier Evaluation Module is a complete,
low-power single-channel audio power amplifier. It consists of the TI TPA751
700-mW low-voltage audio power amplifier IC in a very small MSOP package,
along with a small number of other parts mounted on a circuit board that is
approximately one and a quarter inches square (see Figure 1–1).
Figure 1–1.The TI TPA751 Audio Amplifier Evaluation Module
VDD GND
R1
Shutdown
S1
C1
R2
C2
R3
R4
C3
IN–
IN+
TPA751 MSOP EVM
INSTRUMENTS
†
U1
R5
TEXAS
SLOP357
+
C4
C5
OUT–
GND
OUT+
Description
†
Due to the very small size of the MSOP IC package, the standard part number TPA751 is
replaced with the code TIATC.
Single in-line header pins are mounted to the underside of the module circuit
board. These pins allow the EVM to be plugged into the TI plug-n-play audio
amplifier evaluation platform or to be wired directly into existing circuits and
equipment when used stand-alone.
The platform, with room for a pair of TPA751 evaluation modules, is a
convenient vehicle for demonstrating TI’s audio power amplifier and related
evaluation modules. The EVMs simply plug into the platform, which
automatically provides power to the modules, interconnects them correctly,
and connects them to a versatile array of standard audio input and output jacks
and connectors. Easy-to-use configuration controls allow the platform and
EVMs to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to hook up.
1.3TPA751 EVM Specifications
Supply voltage range, V
Supply current, I
DD
Continuous output power, P
Audio input voltage, V
Minimum load impedance, R
Quick start lists in this chapter contain steps that can be followed to quickly
prepare the TI plug-n-play audio amplifier evaluation platform for use with the
TPA751 MSOP Audio Power Amplifier Evaluation Module, or to connect
the TPA751 EVM for stand-alone operation.
Using the TPA751 EVM with the TI evaluation platform is a quick and easy way
to connect power, signal and control inputs, and signal outputs to the EVM,
using standard connectors.
The TPA751 EVM can also be used stand-alone by making connections
directly to the module pins, and it can be wired directly into existing circuits or
equipment. A stand-alone connection diagram appears below.
A schematic, parts list, and PCB and layer illustrations for the EVM are
included in the Reference section of this chapter.
Power Supply Input Polarity and Maximum Voltage
Always ensure that the polarity and voltage of the external power
connected to VCC power input connector J1, J2, and/or VDD power
input connector J6 are correct. Overvoltage or reverse-polarity
power applied to these terminals can open onboard soldered-in
fuses and cause other damage to the platform, installed evaluation
modules, and/or the power source.
Inserting or Removing EVM Boards
Do not insert or remove EVM boards with power applied – damage
to the EVM board, the platform, or both may result.
Figure 2–1.
VCC
In
+
6b
Power
Input
Audio
Input
AC/DC
In
8
Quick Start Platform Map
6b
SOURCE
J1
D4 J2
Right
In
Stereo
In
Left
In
INSTRUMENTS
1997
JP2
DC
VCC(J1)
D3
JP1
AC/DC
(J2)
D2
Batt
D1
JP3
VR1
J3
Signal Conditioning
J4
J5
****CAUTION****
Do not insert or remove
EVM boards with power
Follow these steps when using the TPA751 EVM with the TI Plug-N-Play Audio
Amplifier Evaluation Platform (see the platform user’s guide, SLOU011, for
additional details). Typical EVM settings are shown in Table 2–1. Numbered
callouts for selected steps are shown in Figure 2–1.
Platform preparations
1) Ensure that all external power sources are set to off and that the platform
power switch S1 is set to off.
2) Install a TPA751 MSOP module in platform sockets U3 and U4 for stereo
operation (or a module in either U3 or U4 for single channel operation),
taking care to align the module pins correctly.
3) Use switch S2 to select or bypass the signal conditioning EVM (U1).
4) Set control signal Polarity jumper JP8 to Hi.
5) Set jumper JP6 to select the Mute control input (causes the TPA751 to
shutdown if a plug is inserted into platform headphone jack J10).
Table 2–1. Platform Jumper and Switch Settings for the TPA751 EVM
EVMJP6JP7JP8S2S3
TPA751MuteXHiSee Note 2X
Notes:1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2 to OFF when
no signal conditioning board is installed.
Power supply
6) Select and connect the power supply:
a) Connect a n external regulated power supply set to a voltage between
2.5 V and 5.5 V to platform VDD power input connector J6, taking care
to observe marked polarity, or
b) Install a voltage regulator EVM (SLVP097 or equiv.) in platform socket
U6. Install a 9-V battery in B1 or connect a 7 V – 12 V power source
to a platform VCC power input J1 or J2 and jumper the appropriate
power input (see platform user’s guide).
Inputs and outputs
7) Ensure that signal source level is set to minimum.
8) Connect the audio source to left and right RCA phono jacks J3 and J5 or
stereo miniature phone jack J4.
9) Connect 8-Ω–32-Ω speakers to left and right RCA jacks J7 and J9 or to
stripped wire connectors J8.
Power-up
10) Verify correct voltage and input polarity and set the external power supply
to ON. If VCC and an on-board regulator EVM are used to provide VDD, set
platform power switch S1 to on.
Platform LED2 lights indicating the presence of VDD, and the evaluation
modules installed on the platform begin operation.
11) Adjust the signal source level as needed.
Operation
2-3
Quick Start List for Stand-Alone
2.3Quick Start List for Stand-Alone
Follow these steps to use the TPA751 EVM stand-alone or when connecting
it into existing circuits or equipment. Connections to the TPA751 module
header pins can be made via individual sockets, wire-wrapping, or soldering
to the pins, either on the top or the bottom of the module circuit board.
Numbered callouts for selected steps are shown in Figure 2–2.
Figure 2–2.
Quick Start Module Map
5
C2
C3
4
†
Due to the very small size of the MSOP IC package, the standard part number TPA751 is
replaced with the code TIATC.
IN–
IN+
Power supply
1) Ensure that all external power sources are set to off
2) Connect an external regulated power supply set to 5 V to the module V
and GND pins, taking care to observe marked polarity.
Inputs and outputs
3) Ensure that the signal source level is set to minimum.
R1
Shutdown
S1
C1
R2
R3
R4
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
†
U1
TEXAS
2
VDD GND
+
C5
R5
C4
OUT–
GND
OUT+
6
.
DD
2-4
4) Connect the audio source to the module IN– and IN+ pins, taking care to
observe marked polarity.
5) Connect the shutdown (S1) pin to GND through a normally open switch.
6) Connect an 8-Ω–32-Ω speaker to the module OUT+ and OUT– pins.
Power-up
7) Verify correct voltage and input polarity and set the external power supply
to on
.
The EVM should begin operation.
8) Adjust the signal source level as needed.
Operation
2.4Stand-Alone Connection Diagram
The power supply range is 2.5 V to 5.5 V and isolated OUT+ and OUT– lines
for BTL operation are required.
Note that the source of any shutdown signal applied to the EVM SHUTDOWN
pin must be able to sink the current flowing through the pullup resistor on the
module (20 kΩ) when the pin is held low.
Figure 2–3 shows a TPA751 EVM connected for stereo BTL operation.
Figure 2–3.TPA751 EVMs Connected for Stereo BTL Output
5 VDC
VDD GND
R1
C2
C3
Shutdown
S1
C1
R2
R3
R4
U1
+
C4
†
C5
R5
OUT–
GND
OUT+
Stand-Alone Connection Diagram
Right
TEXAS
Audio Input
(Right)
IN–
IN+
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
5 VDCGND
VDD GND
S1
R1
Shutdown
C1
R2
R3
R4
U1
+
C4
†
C5
R5
OUT–
GND
OUT+
Left
External Mute
Control
(active low)
C2
C3
TEXAS
Audio Input
(Left)
†
Due to the very small size of the MSOP IC package, the standard part number TPA751 is replaced with the code TIATC.
IN–
IN+
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
Operation
2-5
Reference
2.5Reference
This section includes the TPA751 EVM schematic, the EVM parts list, and the
module PCB layers.
2.5.1TPA751 EVM Schematic Diagram
Figure 2–4 shows the TPA751 EVM schematic.
Figure 2–4.TPA751 EVM Schematic Diagram
Shutdown
IN+
IN–
S1
C3
1 µF
NO
20 kΩ
C2
1 µF
R4
R1 20 kΩ
C1
1 µF
R3
20 kΩ
R2
39 kΩ
1
Shutdown
2
Bypass
3
In+
4
In–
TIATC
TPA751
R5
39 kΩ
V
O–
GND
V
DD
V
O+
VDD
2.5 V to 5.5 V
8
7
6
5
C5
1 µF
C4
10 µF
+
GND
OUT–
GND
OUT+
2-6
Operation
2.5.2TPA751 MSOP Audio Power Amplifier Evaluation Module Parts List
Due to the very small size of the MSOP IC package, the standard part number TPA751 is replaced with the code TIATC.
Note:All items are SMD except as noted.
Capacitor, 1 µF, 80%/–20%,
nonpolarized
Terminal Post Headers9Sullins
amplifier, 700 mW, mono
06034Murata
MSOP-81TI
EVM
Qty.
Manufacturer/
Part Number
ECS-TOJY106R
GRM39-Y5V105Z10PT
ERJ-3GSYJ203
ERJ-3GSYJ393
P8048SCT-ND
PTC36SABN
TPA751DGN
Vendor
Number
Digi-Key
PCS1106CT-ND
Newark
Digi-Key
P20KGCT-ND
Digi-Key
P39KGCT-ND
Digi-Key
P8048SCT-ND
Digi-Key
S1022-36-ND
Operation
2-7
TPA751 EVM PCB Layers
2.5.3TPA751 EVM PCB Layers
The following illustrations depict the TPA751 EVM PCB layers and silkscreen.
These drawings are not to scale. Gerber plots can be obtained from any TI
sales office.
Figure 2–5.TPA751 EVM PCB
Figure 2–6.TPA751 EVM Bottom Layer
2-8
Operation
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its products to the specifications applicable at the time of sale in accordance with
TI’s standard warranty . T esting and other quality control techniques are utilized to the extent TI deems necessary
to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except
those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
products or services might be or are used. TI’s publication of information regarding any third party’s products
or services does not constitute TI’s approval, license, warranty or endorsement thereof.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation
or reproduction of this information with alteration voids all warranties provided for an associated TI product or
service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Resale of TI’s products or services with statements different from or beyond the parameters
that product or service voids all express and any implied warranties for the associated TI product or service,
is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Also see: Standard Terms and Conditions of Sale for Semiconductor Products.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2001, Texas Instruments Incorporated
Printed in U.S.A by
Harte–Hanks, Inc.
V alencia, California
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