Texas Instruments TPA6110A2 MSOP User Manual

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User’s Guide
2000 Mixed-Signal Products
SLOU085
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
Information About Cautions and Warnings
This book may contain cautions and warnings.
This is an example of a caution statement.
Information About Cautions and Warnings
Preface
Read This First
A caution statement describes a situation that could potentially damage your software or equipment.
This is an example of a warning statement. A warning statement describes a situation that could potentially
cause harm to you.
The information in a caution or a warning is provided for your protection. Please read each caution and warning carefully.
Related Documentation From Texas Instruments
TI Plug-N-Play Audio Amplifier Evaluation Platform
number SLOU011) provides detailed information on the evaluation platform and its use with TI audio evaluation modules.
TPA6110A2 150-mW Stereo Audio Power Amplifier
number SLOS314) This is the data sheet for the TPA6110A2 audio amplifier integrated circuit.
(literature
(literature
Read This First
iii
Running Title—Attribute Reference
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.
iv
Running Title—Attribute Reference
Contents
1 Introduction 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 TPA6110A2 MSOP EVM Specifications 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Operation 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Precautions 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Quick Start List for Platform 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Quick Start List for Stand-Alone 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 References 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.1 TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier 2-5. . . . .
2.4.2 TPA6110A2 MSOP EVM Schematic Diagram 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.3 TPA6110A2 MSOP Audio Power Amplifier Evaluation Module Parts List 2-6. . . .
2.4.4 TPA6110A2 EVM PCB Layers 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures
1–1 The TI TPA6110A2 Audio Amplifier Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 Quick Start Platform Map 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 Quick Start Module Map 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier 2-5. . . . . . . . . . . . . . .
2–4 TPA6110A2 MSOP EVM Schematic Diagram 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–5 TPA6110A2 EVM PCB Layers 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–6 TPA6110A2 EVM Silkscreen 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–7 TPA6110A2 EVM PCB Top Layer 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–8 TPA6110A2 EVM PCB Bottom Layer 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
T ables
2–1 Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
2–2 Platform Jumper and Switch Settings for the TPA6110A2 MSOP EVM 2-3. . . . . . . . . . . . . . .
2–3 TPA6110A2 MSOP EVM Parts List 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TP A6110A2 MSOP EVM 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents
v
vi
Chapter 1
Introduction
This chapter provides an overview of the Texas Instruments (TI) TPA6110A2 MSOP audio amplifier evaluation module (SLOP338). It includes a list of EVM features, a brief description of the module illustrated with a pictorial diagram, and a list of EVM specifications.
Topic Page
1.1 Features 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 TP A6110A2 MSOP EVM Specifications 1–3. . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
Features
1.1 Features
The TI TPA6110A2 MSOP audio amplifier evaluation module and the TI plug-n-play audio amplifier evaluation platform include the following features:
TPA6110A2 MSOP Stereo Audio Power Amplifier Evaluation Module
Dual channel, single-ended operation150-mW output power into 8 at 5 V2.5-V to 5.5-V operationVery low distortion:
THD+N is less than 0.01% at 1 kHz and less than 0.03% from 20
Hz to 20 kHz into 10-k loads
Less than 0.02% at 1 kHz and less than 0.4% from 20 Hz to 20 kHz
into 32- loads
Less than 0.05% at 1 kHz and less than 0.8% from 20 Hz to 20 kHz
into 8- loads
Extremely low current consumption in shutdown modeInternal thermal and short-circuit protectionInternal pop reduction circuitry
Quick and Easy Configuration With the TI Plug-N-Play Audio Amplifier
Evaluation Platform
Evaluation module is designed to simply plug into the platform,
automatically making all signal, control, and power connections
Platform provides flexible power optionsJumpers on the platform select power and module control optionsSwitches on the platform route signalsPlatform provides quick and easy audio input and output connections
Platform Power Options
Onboard 9-V batteryExternal 5-V–15-V (VExternal regulated VSocket for on-board 5-V VOnboard overvoltage and reverse polarity power protection
Platform Audio Input and Output Connections
Left and right RCA phono jack inputs
) supply inputs
CC
supply input
DD
voltage regulator EVM
DD
1-2
Miniature stereo phone jack inputLeft and right RCA phono jack outputsLeft and right compression speaker terminal outputsMiniature stereo headphone jack output
Introduction
1.2 Description
The TPA6110A2 MSOP audio power amplifier evaluation module is a complete, low-power stereo audio power amplifier for high-fidelity line-level output, headphone, and small speaker applications. It consists of the TI TPA6110A2 150-mW stereo audio power amplifier IC in a very small MSOP package, along with a small number of other parts mounted on a circuit board that is approximately one and a quarter inches square (Figure 1–1).
Figure 1–1.The TI TPA6110A2 Audio Amplifier Evaluation Module
Description
S1
R2
C3
R4
TEXAS
SLOP338
VDD GND
C5
R5
C4
Vo1
GND
GND
Vo2
Shutdown
IN1
R1
GND
C1
U1
C2 R3
INSTRUMENTS
IN2 GND
TPA6110A2 MSOP EVM
Due to the very small size of the MSOP IC package, the standard part number TPA6110A2 is replaced with the code TIAIZ.
Single in-line header pins are mounted to the underside of the module circuit board; these pins allow the EVM to be plugged into the TI plug-n-play audio amplifier evaluation platform, or to be wired directly into existing circuits and equipment when used stand-alone.
The platform has room for a single TPA6110A2 evaluation module and is a convenient vehicle for demonstrating TI’s audio power amplifier and related evaluation modules. The EVMs simply plug into the platform, which automatically provides power to the modules, interconnects them correctly, and connects them to a versatile array of standard audio input and output jacks and connectors. Easy-to-use configuration controls allow the platform and EVMs to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers included with the platform to hook up.
1.3 TPA6110A2 MSOP EVM Specifications
Supply voltage range, V Supply current, I
DD
Continuous output power, P Audio input voltage, V Minimum load impedance, R
DD
:8 Ω, VDD=5 V 150 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
I
L
2.5 V to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
160 mA, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VDD + 0.3 Vpp, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction
8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-3
1-4
Introduction
Chapter 2
Operation
Follow the steps in this chapter to quickly prepare the TPA6110A2 MSOP audio amplifier EVM for use. The TPA6110A2 MSOP EVM and the TI plug-n-play audio amplifier evaluation platform provide a quick and easy way to connect power, signal and control inputs, and signal outputs to the EVM using standard connectors. However, the audio amplifier evaluation module can be used stand-alone by making connections directly to the module pins and can be wired directly into existing circuits or equipment.
The platform switch and jumper settings shown in T able 2–1 are typical for the TP A61 10A2 MSOP EVM and will cause the TP A61 10A2 IC to shutdown/mute when a plug is removed from platform headphone jack J10.
Table 2–1. Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
TPA6110A2 MSOP EVM
EVM JP6 JP7 JP8 S2 S3
TP A6110A2 X Lo X See Note 2 U5
Notes: 1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2 to OFF when no signal conditioning board is installed.
T opic Page
2.1 Precautions 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Quick Start List for Platform 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Quick Start List for Stand-Alone 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 References 2–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operation
2-1
Precautions
2.1 Precautions
Power Supply Input Polarity and Maximum Voltage Always ensure that the polarity and voltage of the external power
connected to VCC power input connector J1, J2, and/or VDD power input connector J6 are correct. Overvoltage or reverse-polarity power applied to these terminals can open onboard soldered-in fuses and cause other damage to the platform, installed evaluation modules, and/or the power source.
Inserting or Removing EVM Boards Do not insert or remove EVM boards with power applied—damage
to the EVM board, the platform, or both may result.
Power
Input
6b
Audio Input
8
Figure 2–1.
SOURCE
VCC
J1
In
+
D4
AC/DC
In
J2
Right
In
Stereo
In
Left
In
1997
Quick Start Platform Map
6b
JP3
JP2
JP1
DC
VCC(J1)
AC/DC
(J2)
Batt
D1
D2
D3
J3
Signal Conditioning
J4
J5
****CAUTION**** Do not insert or remove EVM boards with power
TEXAS
INSTRUMENTS
Plug-N-Play Audio Amplifier Evaluation Platform SLOP097 Rev. C.1
VR1
F1
LED1
VCC
applied
C1+
R1
U1
110
Off Pwr
ConditioningS2
GND
On
S1
Audio Power Amps
OnOff
TP1
ICC JP4
B1
IDD
U5
JP5
6b
U3 U4
R2
U2-U4
U5
HP
Source
SUPPLY
U2
HP(U5)
S3
R3
R4
POWER
LED2
VDD
JP6
Polarity
Lo Hi
JP7
+
+
7b
U6
Out
Mode Mute
Spk(U2-U4)
JP8
C3 C2
HP Out
J7
Right
Out
Out
J9
Out
Stereo
VR2
F2
+
J6
In/Out
VDD
J8
+–+– Right
Left
Left
Headphone Output
J10
R5
DC Power In/Out
Speaker Output
6a
9
2-2
3
2
4
5
Operation
Quick Start List for Platform
2.2 Quick Start List for Platform
Follow these steps when using the TPA6110A2 MSOP EVM with the TI plug-n-play audio amplifier evaluation platform (see the platform user’s guide, SLOU011, for additional details). Numbered callouts for selected steps are shown in Figure 2–1.
Platform preparations
1) Ensure that all external power sources are set to off and that the platform power switch S1 is set to off
2) Install a TPA61 10A2 MSOP module in platform socket U5, taking care to align the module pins correctly.
3) Use switch S2 to select or bypass the signal conditioning EVM (U1)
4) Set control signal polarity jumper JP7 to Lo.
5) Set HP source switch S3 to U5 to route the output signal to the headphone jack (J10).
Table 2–2. Platform Jumper and Switch Settings for the TPA6110A2 MSOP EVM
.
EVM JP6 JP7 JP8 S2 S3
TPA6110A2 X Lo X See Note 2 U5
Notes: 1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2 to OFF when no signal conditioning board is installed.
Power supply
6) Select and connect the power supply: a) Connect an external regulated power supply set to a voltage between
2.5 V and 5.5 V to platform V
power input connector J6, taking care
DD
to observe marked polarity, or
b) Install 3-V to 5-V voltage regulator EVM (SLVP097 or equiv.) in plat-
form socket U6. Install a 9-V battery in B1 or connect a 7 V – 12 V pow­er source to a platform V
power input J1 or J2 and jumper the ap-
CC
propriate power input (see platform user’s guide).
Inputs and outputs
7) Ensure that signal source level is set to minimum.
8) Connect the audio source to left and right RCA phono jacks J3 and J5 or stereo miniature phone jack J4.
9) Connect 32- headphones to headphone jack J10.
Power-up
10) Verify correct voltage and input polarity and set the external power supply to ON. If V
and an onboard regulator EVM are used to provide VDD, set
CC
platform power switch S1 to ON.
Platform LED2 lights indicating the presence of VDD, and the evaluation modules installed on the platform begin operation.
11) Adjust the signal source level as needed.
Operation
2-3
Quick Start List for Stand-Alone
2.3 Quick Start List for Stand-Alone
Follow these steps to use the TPA6110A2 MSOP EVM stand-alone or when connecting it to existing circuits or equipment. Connections to the TP A61 10A2 MSOP module header pins can be made via individual sockets, wire-wrapping, or soldering to the pins, either on the top or the bottom of the module circuit board. Numbered callouts for selected steps are shown in Figure 2–2 and details appear in Chapter 3.
Figure 2–2.
Quick Start Module Map
5 4
4
Due to the very small size of the MSOP IC package, the standard part number TPA6110A2 is replaced with the code TIAIZ.
Power supply
1) Ensure that all external power sources are set to off
2) Connect an external regulated power supply set to 5 V to the module V and GND pins, taking care to observe marked polarity.
Inputs and outputs
Shutdown
S1
IN1 GND
C1
IN2 GND
C3
R1
U1
C2 R3
INSTRUMENTS
SLOP338
TPA6110A2 MSOP EVM
R2
R4
TEXAS
VDD
2
C4
GND
C5
R5
Vo1
GND
GND
Vo2
6
6
.
DD
2-4
3) Ensure that the signal source level is set to minimum.
4) Connect the audio source to the module IN1, IN2, and GND pins, taking care to observe marked polarity.
5) Connect the shutdown (S1) pin to V
6) Connect 32-Ω headphones to the module V µF to 1000 µF output-coupling capacitors (see Figure 2–3) and return to the GND pin, or
7) For line output, connections to the VO1 and VO2 pins must be made through 33 µF to 1000 µF output-coupling capacitors and returned to GND.
Power-up
8) Verify correct voltage and input polarity and set the external power supply to
The EVM should begin operation.
9) Adjust the signal source level as needed.
ON.
through a normally open switch.
DD
, and VO2 pins through 33
O1
Operation
References
2.4 References
2.4.1 TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier
Figure 2–3.TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier
5 VDC
C4
C5
GND
R5
Vo1
GND
GND
Vo2
+
33 µF – 1000 µF
33 µF – 1000 µF
+
Shutdown
NO
Audio Input
(Right)
Audio Input
(Left)
Due to the very small size of the MSOP IC package, the standard part number TPA6110A2 is replaced with the code TIAIZ.
Shutdown
IN1
R1
GND
C1
IN2 GND
TPA6110A2 MSOP EVM
VDD
S1
R2
C3
U1
C2 R3
R4
TEXAS
INSTRUMENTS
SLOP338
2.4.2 TPA6110A2 MSOP EVM Schematic Diagram
Figure 2–4.TPA6110A2 MSOP EVM Schematic Diagram
Audio Input 1
Shutdown
(VDD to
Shutdown)
Audio Input 2
C3
1 µF
V
DD
C2
1 µF
SHUTDOWN
S1
R2
20 k
R1 82 k
20 k
C1
1 µF
R3
1
Bypass
2
GND
3
Shutdown
4
IN 2
TPA6110A2
MSOP
R4, 82 k
IN 1
Vo1
V
Vo2
DD
8
R5
C4
1 µF
82 k
C5
10 µF
Vo1 V
2 to 5.5 V
+
GND
Vo2
DD
7
6
5
Operation
2-5
TP A6110A2 MSOP Audio Power Amplifier Evaluation Module Parts List
2.4.3 TPA6110A2 MSOP Audio Power Amplifier Evaluation Module Parts List
Table 2–3.TPA6110A2 MSOP EVM Parts List
Ref. Description Size Qty.
R2, R3 Resistor, 20 kΩ, 1/16
W, 5%, SMD
R1, R4, R5 Resistor, 82 kΩ, 1/16
W, 5%, SMD
C1–C4 Capacitor, 1 µF,
+20/–80%, Non-polarized, SMD
C5 Capacitor, 10 µF, 6.3 V,
SMD
S1 (SHUTDOWN)
U1 IC, TPA6110A2, APA,
PNP Pins Terminal post headers 11 Sullins Digi-Key
Switch, momentary SMD
150 mW, 2 channel
0603 3 Panasonic
0603 2 Panasonic
0603 4 Murata
A 1 Panasonic
1 Panasonic
MSOP-8 1 TI
Manufacturer/
Part Number
ERJ-3GSYJ203
ERJ-3GSYJ823
GRM39-Y5V105Z10
ECS-TOJY106R
P8048SCT-ND
TPA6110A2DGN
Vendor/Number
Digi-Key P20PGCT–ND
Digi-Key P82KGCT–ND
Newark
Digi-Key PCS1106CT-ND
Digi-Key P8048SCT-ND
S1022-36-ND
The following illustrations depict the TPA6110A2 EVM PCB layers and silks­creen. These drawings are not to scale. Gerber plots can be obtained from any TI sales office.
2.4.4 TPA6110A2 EVM PCB Layers
Figure 2–5.TPA6110A2 EVM PCB Layers
2-6
Operation
Figure 2–6.TPA6110A2 EVM Silkscreen
Figure 2–7.TPA6110A2 EVM PCB Top Layer
TPA6110A2 EVM PCB Layers
Figure 2–8.TPA6110A2 EVM PCB Bottom Layer
Operation
2-7
2-8
Operation
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