•Advanced 32 Steps DC Volume Control
– Steps From –40 dB to 18 dB
– Fade Mode
– –85-dB Mute Mode
•3 W Into 3-Ω Speakers
•Differential Inputs
•Headphone Mode
•Pin-to-Pin Compatible With TPA6011A4 and
TPA6013A4
•24-Pin PowerPAD™ Package (PWP)
APPLICATIONS
•LCD Monitors
•Notebook PC
•All-in-One PC
TPA6012A4
SLOS636 –OCTOBER 2009
DESCRIPTION
The TPA6012A4 is a stereo audio power amplifier
that drives 3 W/channel of continuous RMS power
into a 3-Ω load. Advanced dc volume control
minimizes external components and allows BTL
(speaker) volume control and SE (headphone)
volume control. LCD monitors and notebook benefit
from the integrated feature set that minimizes
external components without sacrificing functionality.
To simplify design, the speaker volume level is
adjusted by applying a dc voltage to the VOLUME
terminal. To ensure a smooth transition between
active and shutdown modes, a fade mode ramps the
volume up and down.
The 24-pin PowerPAD™ package (PWP) enchances
thermal performance.
1
2PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Figure 1. Application Circuit and DC Volume Control
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS
T
A
–40°C to 85°CTPA6012A4PWP
PACKAGE
24-PIN TSSOP (PWP)
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
V
SS
V
I
T
A
T
J
T
stg
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Supply voltage, VDD, PV
DD
Input voltage, RIN+, RIN–, LIN+,LIN––0.3 V to VDD+0.3 V
Continuous total power dissipationSee Dissipation Rating Table
Operating free-air temperature range–40°C to 85°C
Operating junction temperature range–40°C to 150°C
Storage temperature range–65°C to 85°C
DISSIPATION RATING TABLE
PACKAGE
PWP2.7 mW21.8 mW/°C1.7 W1.4 W
(1) All characterization is done using an external heatsink with θSA= 25°C/W. The resulting derating factor
is 22.2 mW/°C.
TA= 25°CDERATING FACTORTA= 70°CTA= 85°C
POWER RATINGABOVE TA= 25°CPOWER RATINGPOWER RATING
(1) For other values of VDD, scale the voltage values in the table by a factor of VDD/5.
(2) Tested in production. Remaining gain steps are specified by design.
Test conditions (unless otherwise noted) for typical operating performance:
VDD= 5.0 V, CIN= 1 µF, C
Table of Graphs
Gain (BTL)vs Volume voltageFigure 1
THD+NTotal harmonic distortion plus noise (BTL)
THD+NTotal harmonic distortion plus noise (SE)vs Output powerFigure 10
P
D
P
D
Total power dissipation (BTL)vs Total output powerFigure 12
Total power dissipation (SE)vs Total output powerFigure 13
Crosstalk (BTL)vs FrequencyFigure 14
Crosstalk (SE)vs FrequencyFigure 15
PSRRPower supply rejection ratio (BTL)vs FrequencyFigure 16
PSRRPower supply rejection ratio (SE)vs FrequencyFigure 17
I
DD
I
DD
Supply current (BTL)vs Total output powerFigure 18
Supply current (SE)vs Total output powerFigure 19
Input impedancevs GainFigure 20
vs FrequencyFigure 2, Figure 3, Figure 4
vs Output powerFigure 7, Figure 8, Figure 9
vs FrequencyFigure 5, Figure 6
A. A 0.1-µF ceramic capacitor should be placed as close as possible to the IC. For filtering lower-frequency noise
SE/BTL OPERATION
The ability of the TPA6012A4 to easily switch between BTL and SE modes is one of its most important cost
saving features. This feature eliminates the requirement for an additional headphone amplifier in applications
where internal stereo speakers are driven in BTL mode but external headphone or speakers must be
accommodated. Internal to the TPA6012A4, two separate amplifiers drive OUT+ and OUT–. The SE/BTL input
controls the operation of the follower amplifier that drives LOUT– and ROUT–. When SE/BTL is held low, the
amplifier is on and the TPA6012A4 is in the BTL mode. When SE/BTL is held high, the OUT– amplifiers are in a
high output impedance state, which configures the TPA6012A4 as an SE driver from LOUT+ and ROUT+. IDDis
reduced by approximately one-third in SE mode. Control of the SE/BTL input can be from a logic-level CMOS
source or, more typically, from a resistor divider network as shown in Figure 23. The trip level for the SE/BTL
input can be found in the recommended operating conditions table.
Using a 1/8-in. (3,5 mm) stereo headphone jack, the control switch is closed when no plug is inserted. When
closed the 100-kΩ/1-kΩ divider pulls the SE/BTL input low. When a plug is inserted, the 1-kΩ resistor is
disconnected and the SE/BTL input is pulled high. When the input goes high, the OUT– amplifier is shut down
causing the speaker to mute (open-circuits the speaker). The OUT+ amplifier then drives through the output
capacitor, Co, into the headphone jack.
SHUTDOWN MODES
The TPA6012A4 employs a shutdown mode of operation designed to reduce supply current (IDD) to the absolute
minimum level during periods of nonuse for power conservation. The SHUTDOWN input terminal should be held
high during normal operation when the amplifier is in use. Pulling SHUTDOWN low causes the outputs to mute
and the amplifier to enter a low-current state, IDD= 20 µA. SHUTDOWN should never be left unconnected
because amplifier operation would be unpredictable.
Table 3. SE/BTL and Shutdown Functions
INPUTS
(1) Inputs should never be left unconnected.
(1)
SE/BTLSHUTDOWNOUTPUT
XLowMute
LowHighBTL
HighHighSE
AMPLIFIER STATE
FADE OPERATION
For design flexibility, a fade mode is provided to slowly ramp up the amplifier gain when coming out of shutdown
mode and conversely ramp the gain down when going into shutdown. This mode provides a smooth transition
between the active and shutdown states and virtually eliminates any pops or clicks on the outputs.
When the FADE input is a logic low, the device is placed into fade-on mode. A logic high on this pin places the
amplifier in the fade-off mode. The voltage trip levels for a logic low (VIL) or logic high (VIH) can be found in the
recommended operating conditions table.
When a logic low is applied to the FADE pin and a logic low is then applied on the SHUTDOWN pin, the channel
gain steps down from gain step to gain step at a rate of two clock cycles per step. With a nominal internal clock
frequency of 58 Hz, this equates to 34 ms (1/29 Hz) per step. The gain steps down until the lowest gain step is
reached. The time it takes to reach this step depends on the gain setting prior to placing the device in shutdown.
For example, if the amplifier is in the highest gain mode of 18 dB, the time it takes to ramp down the channel
gain is 1.05 seconds. This number is calculated by taking the number of steps to reach the lowest gain from the
highest gain, or 31 steps, and multiplying by the time per step, or 34 ms.
After the channel gain is stepped down to the lowest gain, the amplifier begins discharging the bypass capacitor
from the nominal voltage of VDD/2 to ground. This time is dependent on the value of the bypass capacitor. For a
0.47-µF capacitor that is used in the application diagram in Figure 21, the time is approximately 500 ms. This
time scales linearly with the value of bypass capacitor. For example, if a 1-µF capacitor is used for bypass, the
time period to discharge the capacitor to ground is twice that of the 0.47-µF capacitor, or 1 second. Figure 22
below is a waveform captured at the output during the shutdown sequence when the part is in fade-on mode.
The gain is set to the highest level and the output is at VDDwhen the amplifier is shut down.
When a logic high is placed on the SHUTDOWN pin and the FADE pin is still held low, the device begins the
start-up process. The bypass capacitor will begin charging. Once the bypass voltage reaches the final value of
VDD/2, the gain increases from the lowest gain level to the gain level set by the dc voltage applied to the
VOLUME pin.
In the fade-off mode, the output of the amplifier immediately drops to VDD/2 and the bypass capacitor begins a
smooth discharge to ground. When shutdown is released, the bypass capacitor charges up to VDD/2 and the
channel gain returns immediately to the value on the VOLUME terminal. Figure 23 below is a waveform captured
at the output during the shutdown sequence when the part is in the fade-off mode. The gain is set to the highest
level, and the output is at VDDwhen the amplifier is shut down.
The power-up sequence is different from the shutdown sequence and the voltage on the FADE pin does not
change the power-up sequence. Upon a power-up condition, the TPA6012A4 begins in the lowest gain setting
and steps up every 2 clock cycles until the final value is reached as determined by the dc voltage applied to the
VOLUME pin.
SLOS636 –OCTOBER 2009
Figure 24. Shutdown Sequence in the Fade-onFigure 25. Shutdown Sequence in the Fade-off
ModeMode
VOLUME OPERATION
The VOLUME pin controls the BTL volume when driving speakers, and the SE volume when driving
headphones. This pin is controlled with a dc voltage, which should not exceed VDD.
The output volume increases in discrete steps as the dc voltage increases and decreases in discrete steps as
the dc voltage decreases. There are a total of 32 discrete gain steps of the amplifier and range from –85 dB to
18 dB for BTL operation and –85 dB to 12 dB for SE operation.
Table 1 and Table 2 show a range of voltages for each gain step. There is a gap in the voltage between each
gain step. This gap represents the hysteresis about each trip point in the internal comparator. The hysteresis
ensures that the gain control is monotonic and does not oscillate from one gain step to another. If a
potentiometer is used to adjust the voltage on the control terminals, the gain increases as the potentiometer is
turned in one direction and decreases as it is turned back the other direction. The trip point, where the gain
actually changes, is different depending on whether the voltage is increased or decreased as a result of the
hysteresis about each trip point. The gaps in Table 1 and Table 2 can also be thought of as indeterminate states
where the gain could be in the next higher gain step or the lower gain step depending on the direction the
voltage is changing. If using a DAC to control the volume, set the voltage in the middle of each range to ensure
that the desired gain is achieved.
A pictorial representation of the typical volume control can be found in Figure 26. The graph focuses on three
gain steps with the trip points defined in Table 1 for BTL gain. The dotted line represents the hysteresis about
each gain step.
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Figure 26. DC Volume Control Operation
INPUT RESISTANCE
Each gain setting is achieved by varying the input resistance of the amplifier, which can range from its smallest
value to over six times that value. As a result, if a single capacitor is used in the input high-pass filter, the –3 dB
or cutoff frequency also changes by over six times.
Figure 27. Resistor on Input for Cut-Off Frequency
The input resistance at each gain setting is given in Figure 20.
The –3-dB frequency can be calculated using Equation 1.
In the typical application an input capacitor CIis required to allow the amplifier to bias the input signal to the
proper dc level for optimum operation. In this case, CIand the input impedance of the amplifier RIform a
high-pass filter with the corner frequency determined in Equation 2.
(2)
The value of CIis important to consider as it directly affects the bass (low frequency) performance of the circuit.
Consider the example where RIis 70 kΩ and the specification calls for a flat-bass response down to 40 Hz.
Equation 2 is reconfigured as Equation 3.
(3)
In this example, CIis 56.8 nF, so one would likely choose a value in the range of 56 nF to 1 µF. A further
consideration for this capacitor is the leakage path from the input source through the input network CIand the
feedback network to the load. This leakage current creates a dc offset voltage at the input to the amplifier that
reduces useful headroom, especially in high gain applications. For this reason, a low-leakage tantalum or
ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the capacitor
should face the amplifier input in most applications as the dc level there is held at VDD/2, which is likely higher
than the source dc level. Note that it is important to confirm the capacitor polarity in the application.
POWER SUPPLY DECOUPLING, C
(S)
The TPA6012A4 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to
ensure the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents
oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is achieved by
using two capacitors of different types that target different types of noise on the power supply leads. For higher
frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) ceramic
capacitor, typically 0.1 µF placed as close as possible to the device VDDlead, works best. For filtering
lower-frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed near the audio
power amplifier is recommended.
MIDRAIL BYPASS CAPACITOR, C
The midrail bypass capacitor C
start-up or recovery from shutdown mode, C
(BYP)
(BYP)
is the most critical capacitor and serves several important functions. During
determines the rate at which the amplifier starts up. The second
(BYP)
function is to reduce noise produced by the power supply caused by coupling into the output drive signal. This
noise is from the midrail generation circuit internal to the amplifier, which appears as degraded PSRR and
THD+N.
Bypass capacitor C
the best THD and noise performance. For the best pop performance, choose a value for C
greater than the value chosen for CI. This ensures that the input capacitors are charged up to the midrail voltage
before C
values of 0.47-µF to 1-µF ceramic or tantalum low-ESR capacitors are recommended for
(BYP)
Product Folder Link(s) :TPA6012A4
that is equal to or
(BYP)
f
c(high)
+
1
2p RLC
(C)
−3 dB
f
c
TPA6012A4
SLOS636 –OCTOBER 2009
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OUTPUT COUPLING CAPACITOR, C
In the typical single-supply SE configuration, an output coupling capacitor C
(C)
is required to block the dc bias at
(C)
the output of the amplifier, thus preventing dc currents in the load. As with the input coupling capacitor, the
output coupling capacitor and impedance of the load form a high-pass filter governed by Equation 4.
(4)
The main disadvantage, from a performance standpoint, is the load impedances are typically small, which drives
the low-frequency corner higher, degrading the bass response. Large values of C
frequencies into the load. Consider the example where a C
of 330 µF is chosen and loads vary from 4 Ω, 8 Ω,
(C)
are required to pass low
(C)
32 Ω , 10 kΩ, and 47 kΩ. Table 4 summarizes the frequency response characteristics of each configuration.
As Table 4 indicates, most of the bass response is attenuated into a 4-Ω load, an 8-Ω load is adequate,
headphone response is good, and drive into line level inputs (a home stereo for example) is exceptional.
USING LOW-ESR CAPACITORS
Low-ESR capacitors are recommended throughout this applications section. A real (as opposed to ideal)
capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this
resistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this
resistance, the more the real capacitor behaves like an ideal capacitor.
BRIDGE-TIED LOAD vs SINGLE-ENDED LOAD
Figure 28 shows a Class-AB audio power amplifier (APA) in a BTL configuration. The TPA6012A4 BTL amplifier
consists of two Class-AB amplifiers driving both ends of the load. There are several potential benefits to this
differential drive configuration, but, initially consider power to the load. The differential drive to the speaker
means that as one side is slewing up, the other side is slewing down, and vice versa. This in effect doubles the
voltage swing on the load as compared to a ground referenced load. Plugging 2 x V
where voltage is squared, yields 4x the output power from the same supply rail and load impedance (see
In a typical computer sound channel operating at 5 V, bridging raises the power into an 8-Ω speaker from a
singled-ended (SE, ground reference) limit of 250 mW to 1 W. In sound power that is a 6-dB improvement, which
is loudness that can be heard. In addition to increased power there are frequency response concerns. Consider
the single-supply SE configuration shown in Figure 29. A coupling capacitor is required to block the dc offset
voltage from reaching the load. These capacitors can be quite large (approximately 33 µF to 1000 µF), so they
tend to be expensive, heavy, occupy valuable PCB area, and have the additional drawback of limiting
low-frequency performance of the system. This frequency limiting effect is due to the high-pass filter network
created with the speaker impedance and the coupling capacitance and is calculated with Equation 6.
(6)
For example, a 68-µF capacitor with an 8-Ω speaker would attenuate low frequencies below 293 Hz. The BTL
configuration cancels the dc offsets, which eliminates the need for the blocking capacitors. Low-frequency
performance is then limited only by the input network and speaker response. Cost and PCB space are also
minimized by eliminating the bulky coupling capacitor.
Figure 29. Single-Ended Configuration and Frequency Response
Increasing power to the load does carry a penalty of increased internal power dissipation. The increased
dissipation is understandable considering that the BTL configuration produces 4x the output power of the SE
configuration. Internal dissipation versus output power is discussed further in the crest factor and thermalconsiderations section.
SINGLE-ENDED OPERATION
In SE mode (see Figure 29), the load is driven from the primary amplifier output for each channel (OUT+).
The amplifier switches single-ended operation when the SE/BTL terminal is held high. This puts the negative
outputs in a high-impedance state, and effectively reduces the amplifier's gain by 6 dB.
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BTL AMPLIFIER EFFICIENCY
Class-AB amplifiers are inefficient. The primary cause of these inefficiencies is voltage drop across the output
stage transistors. There are two components of the internal voltage drop. One is the headroom or dc voltage
drop that varies inversely to output power. The second component is due to the sinewave nature of the output.
The total voltage drop can be calculated by subtracting the RMS value of the output voltage from VDD. The
internal voltage drop multiplied by the RMS value of the supply current (IDDrms) determines the internal power
dissipation of the amplifier.
An easy-to-use equation to calculate efficiency starts out as being equal to the ratio of power from the power
supply to the power delivered to the load. To accurately calculate the RMS and average values of power in the
load and in the amplifier, the current and voltage waveform shapes must first be understood (see Figure 30).
Figure 30. Voltage and Current Waveforms for BTL Amplifiers
Although the voltages and currents for SE and BTL are sinusoidal in the load, currents from the supply are very
different between SE and BTL configurations. In an SE application the current waveform is a half-wave rectified
shape, whereas in BTL it is a full-wave rectified waveform. This means RMS conversion factors are different.
Keep in mind that for most of the waveform both the push and pull transistors are not on at the same time, which
supports the fact that each amplifier in the BTL device only draws current from the supply for half the waveform.
The following equations are the basis for calculating amplifier efficiency.
VP = Peak voltage on BTL load
IDDavg = Average current drawn from the power supply
VDD = Power supply voltage
η
BTL
= Efficiency of a BTL amplifier
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substituting PLand P
into Equation 7,
SUP
TPA6012A4
SLOS636 –OCTOBER 2009
(7)
Table 5 employs Equation 8 to calculate efficiencies for four different output power levels. Note that the efficiency
of the amplifier is quite low for lower power levels and rises sharply as power to the load is increased resulting in
a nearly flat internal power dissipation over the normal operating range. Note that the internal dissipation at full
output power is less than in the half power range. Calculating the efficiency for a specific system is the key to
proper power supply design. For a stereo 1-W audio system with 8-Ω loads and a 5-V supply, we get an
efficiency of 0.628. Total output power is 2-W. Thus the maximum draw on the power supply is almost 3.25 W.
Table 5. Efficiency vs Output Power in 5-V, 8-Ω BTL Systems
(W)(%)(V)(W)
0.2531.42.000.55
0.5044.42.830.62
1.0062.84.000.59
1.2570.24.47
Product Folder Link(s) :TPA6012A4
(1)
(8)
0.53
P=10Log
dB
=10Log
P
W
P
ref
3W
1W
=5dB
P=10xP
Wref
PdB/10
TPA6012A4
SLOS636 –OCTOBER 2009
A final point to remember about Class-AB amplifiers (either SE or BTL) is how to manipulate the terms in the
efficiency equation to utmost advantage when possible. Note that in equation 8, VDDis in the denominator. This
indicates that as VDDgoes down, efficiency goes up.
CREST FACTOR AND THERMAL CONSIDERATIONS
Class-AB power amplifiers dissipate a significant amount of heat in the package under normal operating
conditions. A typical music CD requires 12 dB to 15 dB of dynamic range, or headroom above the average power
output, to pass the loudest portions of the signal without distortion. In other words, music typically has a crest
factor between 12 dB and 15 dB. When determining the optimal ambient operating temperature, the internal
dissipated power at the average output power level must be used. From the data sheet graph (Figure 5.), one
can see that when the TPA6012A4 is operating from a 5-V supply into a 4-Ω speaker at 1% THD, that output
power is 1.5-W so maximum instantaneous output power is 3-W. Use equation 9 to convert watts to dB.
Subtracting the headroom restriction to obtain the average listening level without distortion yields:
5 dB - 15 dB = –10 dB(15-dB crest factor)
5 dB - 12 dB = –7 dB(12-dB crest factor)
5 dB - 9 dB = –4 dB(9-dB crest factor)
5 dB - 6 dB = -1 dB(6-dB crest factor)
5 dB - 3 dB = 2 dB(3-dB crest factor)
This is valuable information to consider when attempting to estimate the heat dissipation requirements for the
amplifier system. Comparing the worst case, which is 1.5 W of continuous power output with a 3-dB crest factor,
against 12-dB and 15-dB applications significantly affects maximum ambient temperature ratings for the system.
Using the power dissipation curves for a 5-V, 4-Ω system, the internal dissipation in the TPA6012A4 and
maximum ambient temperatures is shown in Table 6.
The maximum dissipated power (P
a 4-Ω load. As a result, this simple formula for calculating P
AVERAGE OUTPUT POWER
) is reached at a much lower output power level for an 8-Ω load than for
D(max)
may be used for an 8-Ω application.
D(max)
TPA6012A4
(1)
(1)
(1)
(1)
(1)
(1)
(11)
However, in the case of a 4-Ω load, the P
The amplifier may therefore be operated at a higher ambient temperature than required by the P
occurs at a point well above the normal operating power level.
D(max)
D(max)
formula for
a 4-Ω load.
The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor
for the N package with an external heatsink is shown in the dissipation rating table. Use Equation 12 to convert
this to θ
JA.
.
(12)
To calculate maximum ambient temperatures, first consider that the numbers from the dissipation graphs are per
channel, so the dissipated power needs to be doubled for two channel operation. Given θJA, the maximum
allowable junction temperature, and the total internal dissipation, the maximum ambient temperature can be
calculated using Equation 13. The maximum recommended junction temperature for the TPA6012A4 is 150°C.
The internal dissipation figures are taken from the Power Dissipation vs Output Power graphs.
(13)
NOTE
Internal dissipation of 0.6 W is estimated for a 2-W system with 15-dB crest factor per
channel.
Table 6 and Table 7 show that some applications require no airflow to keep junction temperatures in the
specified range. The TPA6012A4 is designed with thermal protection that turns the device off when the junction
temperature surpasses 150°C to prevent damage to the IC. Table 6 and Table 7 were calculated for maximum
listening volume without distortion. When the output level is reduced the numbers in the table change
significantly. Also, using 8-Ω speakers increases the thermal performance by increasing amplifier efficiency.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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information may not be available for release.
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Addendum-Page 1
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provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
ProductsApplications
Amplifiersamplifier.ti.comAudiowww.ti.com/audio
Data Convertersdataconverter.ti.comAutomotivewww.ti.com/automotive
DLP® Productswww.dlp.comCommunications andwww.ti.com/communications
DSPdsp.ti.comComputers andwww.ti.com/computers
Clocks and Timerswww.ti.com/clocksConsumer Electronicswww.ti.com/consumer-apps
Interfaceinterface.ti.comEnergywww.ti.com/energy
Logiclogic.ti.comIndustrialwww.ti.com/industrial
Power Mgmtpower.ti.comMedicalwww.ti.com/medical
Microcontrollersmicrocontroller.ti.comSecuritywww.ti.com/security
RFIDwww.ti-rfid.comSpace, Avionics &www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprfVideo and Imagingwww.ti.com/video