TEXAS INSTRUMENTS TPA4411 Technical data

Download

TPA4411RTJ

INR

INL

PGND

OUTL PVSSSVSS

C1N

PVDDSGND

A3 A4

SDL

SVDD

C1P

SDR

OUTR

TPA4411YZH

TPA4411MRTJ

TPA4411

TPA4411M

www.ti.com

80-mW DIRECTPATH™ STEREO HEADPHONE DRIVER

FEATURES

• Space Saving Packages – 20-Pin, 4 mm × 4 mm Thin QFN

– TPA4411 – Thermally Optimized

PowerPAD™ Package

– TPA4411M – Thermally Enhanced

PowerPAD™ Package

– 16-Ball, 2.18 mm × 2.18 mm WCSP

• Ground-Referenced Outputs Eliminate DC-Bias Voltages on Headphone Ground Pin

– No Output DC-Blocking Capacitors

– Reduced Board Area – Reduced Component Cost – Improved THD+N Performance – No Degradation of Low-Frequency

Response Due to Output Capacitors

• Wide Power Supply Range: 1.8 V to 4.5 V

• 80-mW/Ch Output Power into 16- Ω at 4.5 V

• Independent Right and Left Channel

Shutdown Control

• Short-Circuit and Thermal Protection

• Pop Reduction Circuitry

APPLICATIONS

• Notebook Computers

• CD / MP3 Players

• Smart Phones

• Cellular Phones

• PDAs

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

DESCRIPTION

The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.

The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- Ω load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of – 1.5 V/V and headphone outputs that have ± 8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.

The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 PowerPAD, DirectPath are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com

15 14

13 12

PVDD

SDL

SGND

C1P

PGND

C1N

PVSS

INR SDR INL NC OUTR

SVSS

OUTL

SVDD

NC − No internal connection

15 14

13 12

PVDD

SDL

SGND

C1P

PGND

C1N

PVSS

INR SDR INL NC OUTR

SVSS

OUTL

SVDD

NC − No internal connection

TPA4411MRTJTPA4411RTJ

INR

INL

PGND

OUTL PVSSSVSS

C1N

PVDDSGND

A2 A3 A4

SDL

SVDD

C1P

SDR

NC-Nointernalconnection

OUTR

TPA4411YZH

TPA4411 TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

RTJ (QFN) PACKAGE

(TOP VIEW)

YZH (WCSP) PACKAGE

(TOP VIEW)

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

TERMINAL FUNCTIONS

TERMINAL

NAME QFN WCSP

C1P 1 A4 I/O Charge pump flying capacitor positive terminal PGND 2 B4 I Power ground, connect to ground. C1N 3 C4 I/O Charge pump flying capacitor negative terminal

4, 6, 8,

NC 12, 16, B3, C3 No connection

20 PVSS 5 D4 O Output from charge pump. SVSS 7 D3 I Amplifier negative supply, connect to PVSS via star connection. OUTL 9 D2 O Left audio channel output signal SVDD 10 D1 I Amplifier positive supply, connect to PVDD via star connection. OUTR 11 C2 O Right audio channel output signal INL 13 C1 I Left audio channel input signal SDR 14 B1 I Right channel shutdown, active low logic. INR 15 A1 I Right audio channel input signal SGND 17 A2 I Signal ground, connect to ground. SDL 18 B2 I Left channel shutdown, active low logic. PVDD 19 A3 I Supply voltage, connect to positive supply.

Exposed Pad -

I/O DESCRIPTION

Exposed pad must be soldered to a floating plane. Do NOT connect to power or ground.

TPA4411

TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range, TA= 25 ° C (unless otherwise noted)

VALUE / UNIT

Supply voltage, AVDD, PVDD – 0.3 V to 5.5 V

T T T

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

Input voltage – 0.3 V to V

Output Continuous total power dissipation See Dissipation Rating Table Operating free-air temperature range – 40 ° C to 85 ° C

Operating junction temperature range – 40 ° C to 150 ° C

Storage temperature range – 65 ° C to 150 ° C

stg

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 ° C

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

+ 0.3 V

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

TPA4411 TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

DISSIPATION RATINGS TABLE

PACKAGE DERATING FACTOR

RTJ

(TPA4411)

RTJ

(TPA4411M)

TA≤ 25 ° C TA= 70 ° C TA= 85 ° C

POWER RATING POWER RATING POWER RATING

5200 mW 41.6 mW/ ° C 3120 mW 2700 mW

3450 mW 34.5 mW/ ° C 1898 mW 1380 mW

YZH 1200 mW 9.21 mW/ ° C 690 mW 600 mW

(1) Derating factor measured with High K board.

AVAILABLE OPTIONS

PACKAGED DEVICES

20-pin, 4 mm × 4 mm QFN TPA4411RTJ

– 40 ° C to 85 ° C 20-pin, 4 mm × 4 mm QFN TPA4411MRTJ

16-ball, 2.18 mm × 2.18 mm WSCP TPA4411YZH AKT

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com .

(2) The RTJ package is only available taped and reeled. To order, add the suffix “ R ” to the end of the part number for a reel of 3000, or add

the suffix “ T ” to the end of the part number for a reel of 250 (e.g., TPA4411RTJR).

(1)

PART NUMBER SYMBOL

(2)

AKQ BPB

RECOMMENDED OPERATING CONDITIONS

Supply voltage, AVDD, PVDD 1.8 4.5

High-level input voltage SDL, SDR 1.5 V

Low-level input voltage SDL, SDR 0.5 V

Operating free-air temperature – 40 85 ° C

(1) Device can shut down for VDD > 4.5 V to prevent damage to the device.

ELECTRICAL CHARACTERISTICS

TA= 25 ° C (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

|VOS| Output offset voltage V PSRR Power Supply Rejection Ratio V V V

High-level output voltage V

Low-level output voltage V

|IIH| High-level input current ( SDL, SDR) V |IIL| Low-level input current ( SDL, SDR) V

Supply Current

= 1.8 V to 4.5 V, Inputs grounded 8 mV

= 1.8 V to 4.5 V – 69 – 80 dB

= 3 V, RL= 16 Ω 2.2 V

= 3 V, RL= 16 Ω – 1.1 V

= 4.5 V, VI= V

= 4.5 V, VI= 0 V 1 µA

= 1.8 V, No load, SDL= SDR = V

= 3 V, No load, SDL = SDR = V

= 4.5 V, No load, SDL = SDR = V

Shutdown mode, V

= 1.8 V to 4.5 V 1 µA

MIN MAX UNIT

5.3 6.5

6.5 8.0 mA

8.0 10.0

(1)

1 µA

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

TPA4411

TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

OPERATING CHARACTERISTICS

= 3 V , TA= 25 ° C, RL= 16 Ω (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

THD = 1%, V

Output power (Outputs In Phase) mW

THD = 1%, V THD = 1%, V

Ω

THD+N Total harmonic distortion plus noise

PO= 25 mW, f = 1 kHz 0.054% PO= 25 mW, f = 20 kHz 0.010%

Crosstallk PO= 20 mW, f = 1 kHz – 83 dB

200-mV

SVR

Δ A

Supply ripple rejection ratio 200-mV

200-mV

Closed-loop voltage gain – 1.45 – 1.5 – 1.55 V/V Gain matching 1% Slew rate 2.2 V/µs Maximum capacitive load 400 pF

Noise output voltage 10 µV Electrostatic discharge, IEC OUTR, OUTL ± 8 kV

osc

Charge pump switching frequency 280 320 420 kHz Start-up time from shutdown 450 µs Input impedance 12 15 18 k Ω

SNR Signal-to-noise ratio Po= 40 mW (THD+N = 0.1%) 98 dB

Thermal shutdown

Threshold 150 170 ° C Hysteresis 15 ° C

= 3 V, f = 1 kHz 50

= 4.5 V, f = 1 kHz 100

= 3 V, f = 1 kHz, RL= 32

ripple, f = 217 Hz – 82.5 ripple, f = 1 kHz – 70.4 dB ripple, f = 20 kHz – 45.1

RMS

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

_ +

SVDD

SVSS

SVDD

SVSS

Charge

Pump

Bias

Circuitry

TPA4411

SGND

Av = −1.5 V/V

Audio Out − R

Audio Out − L

C1P

C1N

PVSS

Audio In − R

Audio In − L

SDx

Short

Circuit

Protection

Shutdown

Control

C1P C1N

OUTR

OUTL

SDR

INL

INR

SDL

1.8 − 4.5 V

TPA4411

TPA2012D2

TLV320AIC26

TLV320AIC28

HPL or SPK1

HPR or SPK2

PGND SGND

TPA4411 TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

Functional Block Diagram

APPLICATION CIRCUIT

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

0.001

0.01

0.1

100

1 10

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

In Phase

180° Out of Phase

VDD = 1.8 V, RL = 16 Ω, fIN = 20 Hz

Single Channel

0.01

0.1

100

1 10 30

In Phase

Single Channel

180° Out of Phase

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 1.8 V, RL = 16 Ω, fIN = 10 kHz

0.01

0.1

100

1 10 30

In Phase

Single Channel

180° Out of Phase

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 1.8 V, RL = 16 Ω, fIN = 1 kHz

0.01

0.1

100

1 10

In Phase

Single Channel

180° Out of Phase

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 1.8 V, RL = 32 Ω, fIN = 1 kHz

0.01

0.1

100

1 10

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 1.8 V, RL = 32 Ω, fIN = 10 kHz

0.001

0.01

0.1

100

1 10 30

In Phase

Single Channel

180° Out of Phase

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 1.8 V, RL = 32 Ω, fIN = 20 Hz

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

TYPICAL CHARACTERISTICS

= C

(PUMP)

(PVSS)

= 2.2 µF , C

= 1 µF (unless otherwise noted)

Table of Graphs

Total harmonic distortion + noise vs Output power 1 – 24 Total harmonic distortion + noise vs Frequency 25 – 32 Supply voltage rejection ratio vs Frequency 33, 34 Power dissipation vs Output power 35 – 42 Crosstalk vs Frequency 43 – 46 Output power vs Supply voltage 47 – 50 Quiescent supply current vs Supply voltage 51 Output power vs Load resistance 5 – 60 Output spectrum 61 Gain and phase vs Frequency 62, 63

TPA4411

TPA4411M

FIGURE

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE + NOISE

vs vs vs

OUTPUT POWER OUTPUT POWER OUTPUT POWER

Figure 1. Figure 2. Figure 3.

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE + NOISE

vs vs vs

OUTPUT POWER OUTPUT POWER OUTPUT POWER

Figure 4. Figure 5. Figure 6.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

0.01

0.1

100

1 10 100 300

In Phase

Single Channel

180° Out of Phase

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3 V, RL = 16 Ω, fIN = 10 kHz

0.001

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3 V, RL = 16 Ω, fIN = 20 Hz

0.01

0.1

100

1 10 100 300

In Phase

Single Channel

180° Out of Phase

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3 V, RL = 16 Ω, fIN = 1 kHz

0.001

0.01

0.1

100

1 10 100 300

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

In Phase

Single Channel

180° Out of Phase

VDD = 3 V, RL = 32 Ω, fIN = 20 Hz

0.01

0.1

100

1 10

100 300

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3 V, RL = 32 Ω, fIN = 1 kHz

0.001

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3 V, RL = 32 Ω, fIN = 10 kHz

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 16 Ω, fIN = 1 kHz

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 16 Ω, fIN = 10 kHz

0.001

0.01

0.1

100

1 10 100

300

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 16 Ω, fIN = 20 Hz

TPA4411 TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE + NOISE

vs vs vs

OUTPUT POWER OUTPUT POWER OUTPUT POWER

Figure 7. Figure 8. Figure 9.

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE + NOISE

vs vs vs

OUTPUT POWER OUTPUT POWER OUTPUT POWER

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

Figure 10. Figure 11. Figure 12.

+ NOISE + NOISE + NOISE

vs vs vs

OUTPUT POWER OUTPUT POWER OUTPUT POWER

Figure 13. Figure 14. Figure 15.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

0.001

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 32 Ω, fIN = 20 Hz

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 32 Ω, fIN = 1 kHz

0.001

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

− Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

Single Channel

VDD = 3.6 V, RL = 32 Ω, fIN = 10 kHz

0.001

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

− Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

Single Channel

VDD = 4.5 V, RL = 16 Ω, fIN = 20 Hz

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

− Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

Single Channel

VDD = 4.5 V, RL = 16 Ω, fIN = 1 k Hz

0.01

0.1

100

100 300

In Phase

180° Out of Phase

Single Channel

− Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 4.5 V, RL = 16 Ω, fIN = 10 k Hz

0.001

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

− Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

Single Channel

VDD = 4.5 V, RL = 32 Ω, fIN = 20 Hz

0.01

0.1

100

1 10

100

300

In Phase

180° Out of Phase

− Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

Single Channel

VDD = 4.5 V, RL = 32 Ω, fIN = 1 kHz

0.01

0.1

100

1 10 100 300

In Phase

180° Out of Phase

− Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

Single Channel

VDD = 4.5 V, RL = 32 Ω, fIN = 10 kHz

TPA4411

TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE + NOISE

vs vs vs

OUTPUT POWER OUTPUT POWER OUTPUT POWER

Figure 16. Figure 17. Figure 18.

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE + NOISE

vs vs vs

OUTPUT POWER OUTPUT POWER OUTPUT POWER

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

Figure 19. Figure 20. Figure 21.

+ NOISE + NOISE + NOISE

vs vs vs

OUTPUT POWER OUTPUT POWER OUTPUT POWER

Figure 22. Figure 23. Figure 24.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

f − Frequency − Hz

THD+N − Total Harmonic Distortion + Noise − %

0.001

0.01

0.1

100

1 k 10 k 100 k

PO = 2 mW

PO = 5 mW

PO = 6 mW

VDD = 1.8 V RL = 32 Ω

f − Frequency − Hz

THD+N − Total Harmonic Distortion + Noise − %

0.001

0.01

0.1

100

1 k 10 k 100 k

PO = 5 mW

PO = 25 mW

VDD = 3 V RL = 16 Ω

PO = 40 mW

f − Frequency − Hz

THD+N − Total Harmonic Distortion + Noise − %

0.001

0.01

0.1

100

1 k 10 k 100 k

PO = 1 mW

PO = 2 mW

PO = 3 mW

VDD = 1.8 V RL = 16 Ω

f − Frequency − Hz

THD+N − Total Harmonic Distortion + Noise − %

0.001

0.01

0.1

100

1 k 10 k 100 k

PO = 5 mW

VDD = 3 V RL = 32 Ω

PO = 25 mW

PO = 45 mW

f − Frequency − Hz

THD+N − Total Harmonic Distortion + Noise − %

0.001

0.01

0.1

100

1 k 10 k 100 k

PO = 5 mW

PO = 20 mW

VDD = 3.6 V RL = 16 Ω

PO = 40 mW

f − Frequency − Hz

THD+N − Total Harmonic Distortion + Noise − %

0.001

0.01

0.1

100 1 k 10 k 100 k

PO = 5 mW

VDD = 3.6 V RL = 32 Ω

PO = 70 mW

PO = 35 mW

−100

−90

−80

−70

−60

−50

−40

−30

−20

−10

10 100 1 k 10 k 100 k

SVR

− Supply Voltage Rejection Ratio − V

1.8 V

3 V

3.6 V

4.5 V

= 16 Ω

f − Frequency − Hz

THD+N − Total Harmonic Distortion + Noise − %

0.001

0.01

0.1

100 1 k 10 k 100 k

PO = 5 mW

PO = 50 mW

PO = 35 mW

PO = 25 mW

VDD = 4.5 V RL = 16 Ω

f − Frequency − Hz

THD+N − Total Harmonic Distortion + Noise − %

0.001

0.01

0.1

100

1 k 10 k 100 k

PO = 5 mW

PO = 80 mW

PO = 25 mW

PO = 50 mW

VDD = 4.5 V RL = 32 Ω

TPA4411 TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE + NOISE

vs vs vs

FREQUENCY FREQUENCY FREQUENCY

Figure 25. Figure 26. Figure 27.

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE + NOISE

vs vs vs

FREQUENCY FREQUENCY FREQUENCY

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION SUPPLY VOLTAGE

Figure 28. Figure 29. Figure 30.

+ NOISE + NOISE REJECTION RATIO

vs vs vs

FREQUENCY FREQUENCY FREQUENCY

Figure 31. Figure 32. Figure 33.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

0 5 10 15 20 25 30 35 40

− Output Power − mW

− Power Dissipation − mW P

In Phase

180° Out of Phase

VDD = 1.8 V, R

= 32 Ω

−100

−90

−80

−70

−60

−50

−40

−30

−20

−10

100 1 k

10 k 100 k

SVR

− Supply Voltage Rejection Ratio − V

1.8 V

3 V

4.5 V

= 32 Ω

f − Frequency − Hz

3.6 V

0 5 10 15 20 25 30

− Output Power − mW

− Power Dissipation − mW

In Phase

180° Out of Phase

VDD = 1.8 V, R

= 16 Ω

100

150

200

250

300

0 50 100 150 200

− Output Power − mW

− Power Dissipation − mW

In Phase

180° Out of Phase

VDD = 3 V, R

= 16 Ω

− Output Power − mW

− Power Dissipation − mW P

100

150

200

250

300

350

400

0 50 100 150 200 250 300

In Phase

180° Out of Phase

VDD = 3.6 V, R

= 16 Ω

100

120

140

160

50 100 150 200

− Output Power − mW

− Power Dissipation − mW

In Phase

VDD = 3 V, R

= 32 Ω

180° Out of Phase

− Output Power − mW

− Power Dissipation − mW P

100

150

200

250

300

350

0 50 100 150 200 250 300

In Phase

180° Out of Phase

VDD = 4.5 V, R

= 32 Ω

100

150

200

250

0 50 100 150 200 250 300 350

− Output Power − mW

− Power Dissipation − mW

In Phase

180° Out of Phase

VDD = 3.6 V, R

= 32 Ω

100

200

300

400

500

600

50 100 150 200 250

− Output Power − mW

− Power Dissipation − mW P

In Phase

180° Out of Phase

VDD = 4.5 V, R

= 16 Ω

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

SUPPLY VOLTAGE REJECTION RATIO POWER DISSIPATION POWER DISSIPATION

vs vs vs

FREQUENCY OUTPUT POWER OUTPUT POWER

Figure 34. Figure 35. Figure 36.

TPA4411

TPA4411M

POWER DISSIPATION POWER DISSIPATION POWER DISSIPATION

vs vs vs

OUTPUT POWER OUTPUT POWER OUTPUT POWER

Figure 37. Figure 38. Figure 39.

POWER DISSIPATION POWER DISSIPATION POWER DISSIPATION

vs vs vs

OUTPUT POWER OUTPUT POWER OUTPUT POWER

Figure 40. Figure 41. Figure 42.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

−120

−100

−80

−60

−40

−20

10 100 1 k 10 k 100 k

Left to Right

Right to Left

f − Frequency − Hz

Crosstalk − dB

VDD = 3 V, PO = 20 mW RL = 16 Ω

−120

−100

−80

−60

−40

−20

10 100 1 k 10 k

100 k

Left to Right

Right to Left

f − Frequency − Hz

Crosstalk − dB

VDD = 3.6 V, PO = 1.6 mW RL = 16 Ω

−120

−100

−80

−60

−40

−20

10 100 1 k 10 k 100 k

Left to Right

Right to Left

VDD = 3 V, PO = 1.6 mW RL = 16 Ω

f − Frequency − Hz

Crosstalk − dB

−120

−100

−80

−60

−40

−20

10 100 1 k 10 k 100 k

Left to Right

Right to Left

f − Frequency − Hz

Crosstalk − dB

VDD = 3.6 V, PO = 20 mW RL = 16 Ω

100

120

1.8 2.3 2.8 3.3 3.8 4.3

180° Out of Phase

In Phase

− Output Power − mW

VDD − Supply Voltage − V

THD = 1 % R

= 16 Ω

100

150

200

250

1.8 2.3 2.8 3.3 3.8 4.3

180° Out of Phase

In Phase

− Output Power − mW

VDD − Supply Voltage − V

THD = 10 % R

= 16 Ω

100

120

140

160

1.8 2.3 2.8 3.3 3.8 4.3

180° Out of Phase

In Phase

− Output Power − mW

VDD − Supply Voltage − V

THD = 1 % R

= 32 Ω

100

150

200

250

1.8 2.3 2.8 3.3 3.8 4.3

180° Out of Phase

In Phase

− Output Power − mW

VDD − Supply Voltage − V

THD = 10 % R

= 32 Ω

− Quiescent Supply Current − mA

VDD − Supply Voltage − V

0 1 1.5 2 2.5 3 3.5 4 4.5 5

TPA4411 TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

CROSSTALK CROSSTALK CROSSTALK

vs vs vs

FREQUENCY FREQUENCY FREQUENCY

Figure 43. Figure 44. Figure 45.

CROSSTALK OUTPUT POWER OUTPUT POWER

vs vs vs

FREQUENCY SUPPLY VOLTAGE SUPPLY VOLTAGE

SUPPLY VOLTAGE SUPPLY VOLTAGE SUPPLY VOLTAGE

Figure 46. Figure 47. Figure 48.

OUTPUT POWER OUTPUT POWER QUIESCENT SUPPLY CURRENT

vs vs vs

Figure 49. Figure 50. Figure 51.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

100

110

120

0 10 20 30 40 50

2.2 µF

1 µF

0.68 µF

0.47 µF

− Output Power − mW

RL − Load Resistance − Ω

In Phase, VDD = 3 V, THD = 1%, Vary C

(PUMP)

10 100 1000 10000

Out of Phase

In Phase

− Output Power − mW

RL − Load Resistance − Ω

VDD = 1.8 V, THD = 10%, f

= 1 kHz,

= P

OUTL

+ P

OUTR

10 100 1000 10000

Out of Phase

In Phase

− Output Power − mW

RL − Load Resistance − Ω

VDD = 1.8 V, THD = 1%, f

= 1 kHz,

= P

OUTL

+ P

OUTR

100

120

140

160

10 100

1000

10000

Out of Phase

In Phase

− Output Power − mW

RL − Load Resistance − Ω

VDD = 3 V, THD = 1%, f

= 1 kHz,

= P

OUTL

+ P

OUTR

100

150

200

250

100 1000 10000

Out of Phase

In Phase

− Output Power − mW

RL − Load Resistance − Ω

VDD = 3 V, THD = 10%, f

= 1 kHz,

= P

OUTL

+ P

OUTR

100

150

200

250

10 100 1000 10000

Out of Phase

In Phase

− Output Power − mW

RL − Load Resistance − Ω

VDD = 3.6 V, THD = 1%, f

= 1 kHz,

= P

OUTL

+ P

OUTR

100

150

200

250

300

350

10 100 1000 10000

Out of Phase

In Phase

− Output Power − mW

RL − Load Resistance − Ω

VDD = 3.6 V, THD = 10%, f

= 1 kHz,

= P

OUTL

+ P

OUTR

100

150

200

250

300

350

10 100 1000 10000

Out of Phase

In Phase

− Output Power − mW

RL − Load Resistance − Ω

VDD = 4.5 V, THD = 10%, f

= 1 kHz,

= P

OUTL

+ P

OUTR

100

150

200

250

300

350

400

450

500

10 100 1000 10000

Out of Phase

In Phase

− Output Power − mW

RL − Load Resistance − Ω

VDD = 4.5 V, THD = 10%, f

= 1 kHz,

= P

OUTL

+ P

OUTR

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

OUTPUT POWER OUTPUT POWER OUTPUT POWER

vs vs vs

LOAD RESISTANCE LOAD RESISTANCE LOAD RESISTANCE

Figure 52. Figure 53. Figure 54.

OUTPUT POWER OUTPUT POWER OUTPUT POWER

vs vs vs

LOAD RESISTANCE LOAD RESISTANCE LOAD RESISTANCE

TPA4411

TPA4411M

OUTPUT POWER OUTPUT POWER OUTPUT POWER

LOAD RESISTANCE LOAD RESISTANCE LOAD RESISTANCE

Figure 55. Figure 56. Figure 57.

vs vs vs

Figure 58. Figure 59. Figure 60.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

-40

-20

100

0.5

1.5

2.5

3.5

Gain

− dB

10 100 1k 10k 100k 1G

f − Frequency − Hz

Phase

− Degrees

VCC=3.6V, R

=16 Ω

Phase

Gain

-40

-20

100

Phase − Degrees

f − Frequency − Hz

10 100 1k 10k 100k 1G

VCC=3V, RL=16 Ω

Phase

Gain

Gain − dB

0.5

1.5

2.5

3.5

−160

−140

−120

−100

−80

−60

−40

−20

10 100 1 k 10 k 100 k

Output Spectrum − dBv

f − Frequency − Hz

VO = 1 V

RMS

VDD = 3 V f

= 1 kHz

= 32 Ω

TPA4411 TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

GAIN AND PHASE GAIN AND PHASE

vs vs

OUTPUT SPECTRUM FREQUENCY FREQUENCY

Figure 61. Figure 62. Figure 63.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

f =

2 R Cp

L O

C =

2 R fp

TPA4411

TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

APPLICATION INFORMATION

Headphone Amplifiers

Single-supply headphone amplifiers typically require dc-blocking capacitors. The capacitors are required because most headphone amplifiers have a dc bias on the outputs pin. If the dc bias is not removed, the output signal is severely clipped, and large amounts of dc current rush through the headphones, potentially damaging them. The top drawing in Figure 64 illustrates the conventional headphone amplifier connection to the headphone jack and output signal.

DC blocking capacitors are often large in value. The headphone speakers (typical resistive values of 16 Ω or 32 Ω ) combine with the dc blocking capacitors to form a high-pass filter. Equation 1 shows the relationship between the load impedance

can be determined using Equation 2 , where the load impedance and the cutoff frequency are known.

If fCis low, the capacitor must then have a large value because the load resistance is small. Large capacitance values require large package sizes. Large package sizes consume PCB area, stand high above the PCB, increase cost of assembly, and can reduce the fidelity of the audio output signal.

Two different headphone amplifier applications are available that allow for the removal of the output dc blocking capacitors. The Capless amplifier architecture is implemented in the same manner as the conventional amplifier with the exception of the headphone jack shield pin. This amplifier provides a reference voltage, which is connected to the headphone jack shield pin. This is the voltage on which the audio output signals are centered. This voltage reference is half of the amplifier power supply to allow symmetrical swing of the output voltages. Do not connect the shield to any GND reference or large currents will result. The scenario can happen if, for example, an accessory other than a floating GND headphone is plugged into the headphone connector. See the second block diagram and waveform in Figure 64 .

), the capacitor

), and the cutoff frequency (fC).

(1)

(2)

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

OUT

GND

V /2

BIAS

Conventional

Capless

GND

BIAS

DirectPath

2p RINC

2p fcINR

TPA4411 TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

Figure 64. Amplifier Applications

The DirectPath™ amplifier architecture operates from a single supply but makes use of an internal charge pump to provide a negative voltage rail. Combining the user provided positive rail and the negative rail generated by the IC, the device operates in what is effectively a split supply mode. The output voltages are now centered at zero volts with the capability to swing to the positive rail or negative rail. The DirectPath™ amplifier requires no output dc blocking capacitors, and does not place any voltage on the sleeve. The bottom block diagram and waveform of Figure 64 illustrate the ground-referenced headphone architecture. This is the architecture of the TPA4411.

Input-Blocking Capacitors

DC input-blocking capacitors are required to be added in series with the audio signal into the input pins of the TPA4411 and TPA4411M. These capacitors block the DC portion of the audio source and allow the TPA4411 and TPA4411M inputs to be properly biased to provide maximum performance.

These capacitors form a high-pass filter with the input impedance of the TPA4411 and TPA4411M. The cutoff frequency is calculated using Equation 3 . For this calculation, the capacitance used is the input-blocking capacitor and the resistance is the input impedance of the TPA4411 or TPA4411M. Because the gains of both the TPA4411 and TPA4411M are fixed, the input impedance remains a constant value. Using the input impedance value from the operating characteristics table, the frequency and/or capacitance can be determined when one of the two values are given.

(3)

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

0.001

0.01

0.1

10 100 1 k 10 k 100 k

f − Frequency − Hz

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 32 Ω, PO = 35 mW,

C = 1 µF

C = 2.2 µF

0.1

100

0.0001 0.001 0.01 0.1 1

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 16 Ω, fIN = 20 HZ C = 1 µF

− Output Power − mW

In Phase

180° Out of Phase

Single Channel

0.001

0.01

0.1

100

0.001 0.01 0.1

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 16 Ω, fIN = 20 Hz C = 2.2 µF

TPA4411

TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

Charge Pump Flying Capacitor and PVSS Capacitor

The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage. The PVSS capacitor must be at least equal to the charge pump capacitor in order to allow maximum charge transfer. Low ESR capacitors are an ideal selection, and a value of 2.2 µF is typical. Capacitor values that are smaller than 2.2 µF can be used, but the maximum output power is reduced and the device may not operate to specifications. Figure 65 through Figure 75 compare the performance of the TPA4411 and TPA4411M with the recommended 2.2-µF capacitors and 1-µF capacitors.

TOTAL HARMONIC DISTORTION

+ NOISE

FREQUENCY

Figure 65.

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE

vs vs

OUTPUT POWER OUTPUT POWER

Figure 66. Figure 67.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

0.01

0.1

100

0.001 0.01 0.1

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 16 Ω, fIN = 1 kHz C = 2.2 µF

0.01

0.1

100

0.0001 0.001 0.01 0.1

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 16 Ω, fIN = 1 kHZ C = 1 µF

− Output Power − mW

In Phase

180° Out of Phase

Single Channel

0.01

0.1

100

0.001 0.01 0.1

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 16 Ω, fIN = 10 kHz C = 2.2 µF

0.001

0.01

0.1

100

0.0001 0.001 0.01 0.1 1

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 16 Ω, fIN = 10 kHZ C = 1 µF

− Output Power − mW

In Phase

180° Out of Phase

Single Channel

0.1

100

0.0001 0.001 0.01 0.1 1

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 32 Ω, fIN = 20 HZ C = 1 µF

− Output Power − mW

180° Out of Phase

Single Channel

In Phase

0.001

0.01

0.1

100

0.001 0.01 0.1

In Phase

180° Out of Phase

Single Channel

PO − Output Power − mW

THD+N − Total Harmonic Distortion + Noise − %

VDD = 3.6 V, RL = 32 Ω, fIN = 20 Hz C = 2.2 µF

TPA4411 TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE

vs vs

OUTPUT POWER OUTPUT POWER

Figure 68. Figure 69.

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE

vs vs

OUTPUT POWER OUTPUT POWER

Figure 70. Figure 71.

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION

+ NOISE + NOISE

vs vs

OUTPUT POWER OUTPUT POWER

Figure 72. Figure 73.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

−100

−90

−80

−70

−60

−50

−40

−30

−20

−10

10 100 1 k 10 k 100 k

SVR

− Supply Voltage Rejection Ratio − V

f − Frequency − Hz

VDD = 3.6 V, RL = 32 Ω, C = 1 µF

−100

−90

−80

−70

−60

−50

−40

−30

−20

−10

100 1 k

10 k 100 k

SVR

− Supply Voltage Rejection Ratio − V

1.8 V

3 V

4.5 V

= 32 Ω

C = 2.2 µF

f − Frequency − Hz

3.6 V

TPA4411

TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

SUPPLY VOLTAGE SUPPLY VOLTAGE REJECTION RATIO REJECTION RATIO

Decoupling Capacitors

The TPA4411 and TPA4411M are DirectPath™ headphone amplifiers that require adequate power supply decoupling to ensure that the noise and total harmonic distortion (THD) are low. A good low equivalent-series-resistance (ESR) ceramic capacitor, typically 2.2 µF, placed as close as possible to the device V

lead works best. Placing this decoupling capacitor close to the TPA4411 or TPA4411M is important for the

performance of the amplifier. For filtering lower frequency noise signals, a 10-µF or greater capacitor placed near the audio power amplifier would also help, but it is not required in most applications because of the high PSRR of this device.

vs vs

FREQUENCY FREQUENCY

Figure 74. Figure 75.

Supply Voltage Limiting At 4.5 V

The TPA4411 and TPA4411M have a built-in charge pump which serves to generate a negative rail for the headphone amplifier. Because the headphone amplifier operates from a positive voltage and negative voltage supply, circuitry has been implemented to protect the devices in the amplifier from an overvoltage condition. Once the supply is above 4.5 V, the TPA4411 and TPA4411M can shut down in an overvoltage protection mode to prevent damage to the device. The TPA4411 and TPA4411M resume normal operation once the supply is reduced to 4.5 V or lower.

Layout Recommendations

Exposed Pad On TPA4411RTJ and TPA4411MRTJ Package Option

The exposed metal pad on the TPA4411RTJ and TPA4411MRTJ packages must be soldered down to a pad on the PCB in order to maintain reliability. The pad on the PCB should be allowed to float and not be connected to ground or power. Connecting this pad to power or ground prevents the device from working properly because it is connected internally to PVSS.

TPA4411RTJ and TPA441MRTJ PowerPAD Sizes

Both the TPA4411 and TPA4411M are available in a 4 mm × 4mm QFN. The exposed pad on the bottom of the package is sized differently between the two devices. The TPA4411RTJ PowerPAD is larger than the TPA4411MRTJ PowerPAD. Please see the layout and mechanical drawings at the end of the datasheet for proper sizing.

SGND and PGND Connections

The SGND and PGND pins of the TPA4411 and TPA4411M must be routed separately back to the decoupling capacitor in order to provide proper device operation. If the SGND and PGND pins are connected directly to each other, the part functions without risk of failure, but the noise and THD performance do not meet the specifications.

Product Folder Link(s): TPA4411 TPA4411M

www.ti.com

PGND

Control

C1P C1N

2.2 mF

OUTR

OUTL

1 mF

SDR

INL

INR

SDL

2.2 mF

TPA4411

SDR SDL

Gain0 Gain1

TPA2012D2

TLV320AIC26

TLV320AIC28

CODEC

INL+

INL−

INR+

INR−

HPL or SPK1

HPR or SPK2

AGND

PGND SGND

2.2 mF

1.8 − 4.5 V

Shutdown Control

Right Audio Input

Shutdown Control

Left Audio Input

+− + −

1 mF

Note: PowerPAD must be soldered down and plane must be floating.

No Output DC-Blocking Capacitors

TPA4411 TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

Product Folder Link(s): TPA4411 TPA4411M

Figure 76. Application Circuit

Figure 77. Typical Circuit

www.ti.com

TPA4411

TPA4411M

SLOS430E – AUGUST 2004 – REVISED MARCH 2008

Product Folder Link(s): TPA4411 TPA4411M

PACKAGE OPTION ADDENDUM

www.ti.com

15-Feb-2008

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

TPA4411MRTJR ACTIVE QFN RTJ 20 3000 Green (RoHS &

no Sb/Br)

TPA4411MRTJRG4 ACTIVE QFN RTJ 20 3000 Green (RoHS &

no Sb/Br)

TPA4411MRTJT ACTIVE QFN RTJ 20 250 Green (RoHS &

no Sb/Br)

TPA4411MRTJTG4 ACTIVE QFN RTJ 20 250 Green (RoHS &

no Sb/Br)

TPA4411RTJR ACTIVE QFN RTJ 20 3000 Green (RoHS &

no Sb/Br)

TPA4411RTJRG4 ACTIVE QFN RTJ 20 3000 Green (RoHS &

no Sb/Br)

TPA4411RTJT ACTIVE QFN RTJ 20 250 Green (RoHS &

no Sb/Br)

TPA4411RTJTG4 ACTIVE QFN RTJ 20 250 Green (RoHS &

no Sb/Br)

TPA4411YZHR ACTIVE DSBGA YZH 16 3000 Green (RoHS &

no Sb/Br)

TPA4411YZHT ACTIVE DSBGA YZH 16 250 Green (RoHS &

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-2-260C-1 YEAR

Call TI Level-1-260C-UNLIM

(3)

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

11-Mar-2008

*All dimensions are nominal

Device Package

TPA4411MRTJR QFN RTJ 20 3000 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q1 TPA4411MRTJT QFN RTJ 20 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q1

TPA4411RTJR QFN RTJ 20 3000 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2

TPA4411RTJT QFN RTJ 20 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 TPA4411YZHR DSBGA YZH 16 3000 180.0 8.4 2.35 2.35 0.81 4.0 8.0 Q1 TPA4411YZHR DSBGA YZH 16 3000 178.0 8.4 2.35 2.35 0.81 4.0 8.0 Q1

TPA4411YZHT DSBGA YZH 16 250 180.0 8.4 2.35 2.35 0.81 4.0 8.0 Q1

TPA4411YZHT DSBGA YZH 16 250 178.0 8.4 2.35 2.35 0.81 4.0 8.0 Q1

Type

Package

Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPA4411MRTJR QFN RTJ 20 3000 346.0 346.0 29.0

TPA4411MRTJT QFN RTJ 20 250 190.5 212.7 31.8

TPA4411RTJR QFN RTJ 20 3000 346.0 346.0 29.0

TPA4411RTJT QFN RTJ 20 250 190.5 212.7 31.8 TPA4411YZHR DSBGA YZH 16 3000 220.0 220.0 34.0 TPA4411YZHR DSBGA YZH 16 3000 217.0 193.0 35.0 TPA4411YZHT DSBGA YZH 16 250 220.0 220.0 34.0 TPA4411YZHT DSBGA YZH 16 250 217.0 193.0 35.0

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Wireless www.ti.com/wireless

TEXAS INSTRUMENTS TPA4411 Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

DESCRIPTION

ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS TABLE

RECOMMENDED OPERATING CONDITIONS

ELECTRICAL CHARACTERISTICS

OPERATING CHARACTERISTICS

APPLICATION CIRCUIT

TYPICAL CHARACTERISTICS

Table of Graphs

APPLICATION INFORMATION

Headphone Amplifiers

Input-Blocking Capacitors

Charge Pump Flying Capacitor and PVSS Capacitor

Decoupling Capacitors

Supply Voltage Limiting At 4.5 V

Layout Recommendations

Exposed Pad On TPA4411RTJ and TPA4411MRTJ Package Option

TPA4411RTJ and TPA441MRTJ PowerPAD Sizes

SGND and PGND Connections