TEXAS INSTRUMENTS TPA311 Technical data

TPA311
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MA Y 2003
D Fully Specified for 3.3-V and 5-V Operation D Wide Power Supply Compatibility
2.5 V – 5.5 V
– 350 mW at V – 250 mW at V – 250 mW at V – 75 mW at V

description

The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier devel­oped especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V
DD
= 8
L
= 5 V, BTL
DD
= 5 V, SE
DD
= 3.3 V, BTL
DD
= 3.3 V, SE
D Shutdown Control
– I
= 7 µA at 3.3 V
DD
– I
= 60 µA at 5 V
DD
D BTL to SE Mode Control D Integrated Depop Circuitry D Thermal and Short-Circuit Protection D Surface Mount Packaging
– SOIC – PowerPAD MSOP
D OR DGN PACKAGE
(TOP VIEW)
SHUTDOWN
BYPASS
SE/BTL
IN
1 2 3 4
V
8 7 6 5
O
GND V
DD
VO+
supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TP A31 1 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TP A31 1 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerP AD MSOP, which reduces board space by 50% and height by 40%.
R
F
Audio
Input
From System Control
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
R
I
C
I
C
BF
From HP Jack
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IN
24BYPASS
SHUTDOWN
1 3
SE/BTL
Bias
Control
VDD/2
6
V
DD
C
S
VO+
+
+
Copyright 1998 – 2003, Texas Instruments Incorporated
5
VO–8
7
GND
C
C
350 mW
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
AVAILABLE OPTIONS PACKAGED DEVICES
T
A
40°C to 85°C TPA311D TPA311DGN AAB
The D and DGN packages are available taped and reeled. T o order a taped and reeled part, add the suffix R to the part number (e.g., TPA311DR).
SMALL OUTLINE
(D)

Terminal Functions

MSOP
(DGN)
MSOP
Symbolization
TERMINAL
NAME NO.
BYPASS 2 I GND 7 GND is the ground connection.
IN 4 I IN is the audio input terminal. SE/BTL 3 I SHUTDOWN 1 I SHUTDOWN places the entire device in shutdown mode when held high (IDD = 60 µA, VDD = 5 V).
V
DD
VO+ 5 O VO+ is the positive output for BTL and SE modes. VO– 8 O VO– is the negative output in BTL mode and a high-impedance output in SE mode.
I/O
BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to a 0.1-µF to 1-µF capacitor when used as an audio amplifier.
When SE/BTL is held low, the TPA311 is in BTL mode. When SE/BTL is held high, the TPA311 is in SE mode.
6 VDD is the supply voltage terminal.
DESCRIPTION
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VDD 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, V
Continuous total power dissipation internally limited (see Dissipation Rating Table). . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T Operating junction temperature range, T Storage temperature range, T
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
–0.3 V to VDD +0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
(see Table 3) –40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
A
–40°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
J
DISSIPATION RATING TABLE
PACKAGE
D 725 mW 5.8 mW/°C 464 mW 377 mW
DGN 2.14 W
§
Please see the Texas Instruments document, PowerP AD Thermally Enhanced Package Application Report (literature number SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled T exas Instruments Recommended Board for PowerPAD on page 33 of the before mentioned document.
2
TA 25°C DERATING FACTOR TA = 70°C TA = 85°C
§
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
17.1 mW/°C 1.37 W 1.11 W
TPA311
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350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003

recommended operating conditions

MIN MAX UNIT
Supply voltage, V
High-level voltage, V
Low-level voltage, V
DD
IH
SE/BTL SHUTDOWN
SHUTDOWN
IL
SE/BTL
Operating free-air temperature, TA (see Table 3)
electrical characteristics at specified free-air temperature, VDD = 3.3 V , TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS
|VOO|
PSRR
I
DD
Á
I
DD(SD)
Á
|IIH|
|IIL|
Output offset voltage (measured differentially)
Power supply rejection ratio
Supply current (see Figure 6)
ББББББББББ
Supply current, shutdown mode (see Figure 7)
ББББББББББ
High-level input current
Low-level input current
p
p
SHUTDOWN = 0 V, SE/BTL = 0 V, RL = 8 Ω, RF = 10 k
VDD = 3.2 V to 3.4 V SHUTDOWN = 0 V,
SE/BTL
= 0.33 V, RF = 10 k
SHUTDOWN = 0 V,
БББББББ
SE/BTL
= 2.97 V, RF = 10 k
BTL mode SE mode
BTL mode
SE mode
ÁÁ
SHUTDOWN = VDD, SE/BTL = 0 V, RF = 10 k
ББББББББББ
SHUTDOWN, VDD = 3.3 V, VI = V SE/BTL, VDD = 3.3 V, VI = V
DD
DD
SHUTDOWN, VDD = 3.3 V, VI = 0 V SE/BTL, VDD = 3.3 V, VI = 0 V
0.9 V
0.9 V
2.5 DD DD
–40
0.1 V
0.1 V
5.5
DD DD
85
MIN TYP MAX UNIT
5
20
85 83
0.7
1.5
0.35
ÁÁÁ
ÁÁÁ
0.75
Á
7
50
Á
1 1 1 1
mV
mA
Á
Á
V
V
V
°C
dB
µA
µA
µA
operating characteristics, VDD = 3.3 V, T
= 25°C, R
A
= 8
L
PARAMETER TEST CONDITIONS
P
O
THD + N
ÁÁ
B
OM
B
1
ÁÁ
ÁÁ
V
n
Output power, see Note 1 Total harmonic distortion plus
noise
БББББББ
Maximum output power bandwidth Unity-gain bandwidth
БББББББÁÁÁÁ
Supply ripple rejection ratio
БББББББ
Noise output voltage
THD = 0.5%, THD = 0.5%, PO = 250 mW,
See Figure 12
ÁÁÁ
AV = – 2 V/V, Open loop, f = 1 kHz,
See Figure 5 f = 1 kHz,
See Figure 3
ÁÁÁ
AV = – 1 V/V, BTL,
BTL mode, SE mode f = 20 Hz to 4 kHz,
ÁÁÁÁ
THD = 3%, See Figure 36 CB = 1 µF,
ÁÁÁÁ
CB = 1 µF,
ÁÁÁÁ
CB = 0.1 µF, See Figure 42
NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz.
See Figure 14
AV = – 2 V/V,
ÁÁÁ
See Figure 12
BTL mode,
ÁÁÁ
SE mode,
ÁÁÁ
RL = 32 Ω,
MIN TYP MAX UNIT
250 110
ÁÁÁ
1.3%
1.4
ÁÁÁ
10
71
ÁÁÁ
ÁÁÁ
mW
kHz
MHz
86
ÁÁÁ
15
ÁÁÁ
µV(rms)
dB
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3
TPA311
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Á
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Á
Á
Á
Á
Á
Á
Á
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
electrical characteristics at specified free-air temperature, VDD = 5 V , TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS
|VOO|
ÁÁ
PSRR
ÁÁÁББББББББББÁБББББББ
I
DD
ÁÁ
I
DD(SD)
|IIH|
|IIL|
Output offset voltage (measured differentially)
ББББББББББ
Power supply rejection ratio
Supply current (see Figure 6)
ББББББББББ
Supply current, shutdown mode (see Figure 7)
High-level input current
Low-level input current
p
p
SHUTDOWN = 0 V, SE/BTL = 0 V, RL = 8 Ω, RF = 10 k
ББББББББББ
VDD = 4.9 V to 5.1 V SHUTDOWN = 0 V,
SE/BTL
= 0.5 V, RF = 10 k
SHUTDOWN = 0 V, SE/BTL
= 4.5 V, RF = 10
БББББББ
SHUTDOWN = VDD, SE/BTL = 0 V, RF = 10 kΩ,
SHUTDOWN, VDD = 5.5 V, VI = V SE/BTL, VDD = 5.5 V, VI = V SHUTDOWN, VDD = 5.5 V, VI = 0 V SE/BTL, VDD = 5.5 V, VI = 0 V
BTL mode SE mode
BTL mode
SE mode
DD
ÁÁ
ÁÁ
DD
MIN TYP MAX UNIT
5
20
ÁÁÁ
78 76
ÁÁÁ
0.7
Á
1.5
Á
mV
Á
dB
Á
mA
0.35
60
0.75
Á
100
Á
µA
1
µA
1 1
µA
1
ÁÁÁ
operating characteristics, VDD = 5 V, T
= 25°C, R
A
= 8
L
PARAMETER TEST CONDITIONS
P
O
THD + N B
OM
B
1
Output power, see Note 2 Total harmonic distortion plus
noise Maximum output power bandwidth Unity-gain bandwidth
THD = 0.5%, THD = 0.5%, PO = 350 mW,
See Figure 16 AV = – 2 V/V, Open loop, f = 1 kHz,
ÁÁÁББББББББÁÁÁÁ
Supply ripple rejection ratio
See Figure 5 f = 1 kHz,
BTL mode, SE mode f = 20 Hz to 4 kHz,
THD = 2%, See Figure 37 CB = 1 µF,
ÁÁÁÁ
CB = 1 µF,
See Figure 4
V
n
ÁÁ
Noise output voltage
ББББББББ
AV = – 1 V/V, BTL,
ÁÁÁ
CB = 0.1 µF, See Figure 43
ÁÁÁÁ
NOTE 2: Output power is measured at the output terminals of the device at f = 1 kHz.
See Figure 18
AV = – 2 V/V,
See Figure 16
BTL mode,
ÁÁÁ
SE mode,
RL = 32 Ω,
ÁÁÁ
MIN TYP MAX UNIT
700 300
mW
1%
10
1.4
kHz
MHz
65
ÁÁÁ
ÁÁÁ
dB
75
ÁÁÁ
15
µV(rms)
ÁÁÁ
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Audio
Input
C
I
R
I
C
0.1 µF
TPA311
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003

PARAMETER MEASUREMENT INFORMATION

6
V
DD
R
F
IN
24BYPASS
B
VDD/2
VO+
+
5
RL = 8
C
S
1 µF
V
DD
Audio
Input
C
I
0.1 µF
SHUTDOWN
1 3
SE/BTL
+
Bias
Control
VO– 8
7
GND
Figure 1. BTL Mode Test Circuit
6
V
DD
R
F
R
I
C
B
IN
24BYPASS
VDD/2
VO+
+
5
C
C
330 µF
C
S
1 µF
RL = 32
V
DD
+
SHUTDOWN
1 3
V
DD
SE/BTL
Bias
Control
VO– 8
7
GND
Figure 2. SE Mode Test Circuit
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
5
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003

TYPICAL CHARACTERISTICS

Table of Graphs

Supply voltage rejection ratio vs Frequency 3, 4, 5
I
DD
P
O
THD+N Total harmonic distortion plus noise
V
n
P
D
Supply current vs Supply voltage 6, 7
Output power
Open loop gain and phase vs Frequency 36, 37 Closed loop gain and phase vs Frequency 38, 39, 40, 41 Output noise voltage vs Frequency 42, 43 Power dissipation vs Output power 44, 45, 46, 47
FIGURE
vs Supply voltage 8, 9 vs Load resistance
vs Frequency
vs Output power
10, 11
12, 13, 16, 17, 20, 21, 24, 25, 28, 29,
32, 33
14, 15, 18, 19, 22, 23, 26, 27, 30, 31,
34, 35
SUPPLY VOLTAGE REJECTION RATIO
0
1020
30
40
Supply Voltage Rejection Ratio dB
50
6070
80
90
100
CB = 1 µF
BYPASS = 1/2 V
20 100 1 k
vs
FREQUENCY
CB = 0.1 µF
DD
f – Frequency – Hz
Figure 3
VDD = 3.3 V RL = 8 SE
10 k 20 k
SUPPLY VOLTAGE REJECTION RATIO
0
1020
30
4050
6070
80
Supply Voltage Rejection Ratio dB
90
100
CB = 1 µF
BYPASS = 1/2 V
20 100 1 k
vs
FREQUENCY
VDD = 5 V RL = 8 SE
CB = 0.1 µF
DD
10 k 20 k
f – Frequency – Hz
Figure 4
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
350-mW MONO AUDIO POWER AMPLIFIER
TYPICAL CHARACTERISTICS
TPA311
SLOS207C – JANUARY 1998 – REVISED MAY 2003
SUPPLY VOLTAGE REJECTION RATIO
0
RL = 8
–10
CB = 1 µF BTL
20
30
4050
6070
80
Supply Voltage Rejection Ratio dB
90
100
20 100 1 k
vs
FREQUENCY
VDD = 5 V
VDD = 3.3 V
f – Frequency – Hz
Figure 5
90
80
70
1.1
0.9
0.7
0.5
0.3
– Supply Current – mA
DD
I
0.1
10 k 20 k
–0.1
SUPPLY CURRENT (SHUTDOWN)
vs
SUPPLY VOLTAGE
SHUTDOWN = V SE/BTL
= 0 V
RF = 10 k
DD
SUPPLY CURRENT
SUPPLY VOLTAGE
SHUTDOWN = 0 V RF = 10 k
34 62 5
VDD – Supply Voltage – V
Figure 6
vs
SE/BTL = 0.1 V
SE/BTL = 0.9 V
DD
DD
– Supply Current – Aµ
DD(SD)
I
60
50
40
30
20 10
0
25
343.5 4.5
VDD – Supply Voltage – V
5.52.5
Figure 7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
7
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
TYPICAL CHARACTERISTICS
– Output Power – mW
O
P
1000
800
600
400
200
800
700
OUTPUT POWER
vs
SUPPLY VOLTAGE
THD+N 1% BTL
RL = 8
RL = 32
0
2.5 3.53 4 5.5
2
VDD – Supply Voltage – V
4.5 5
Figure 8
OUTPUT POWER
vs
LOAD RESISTANCE
THD+N = 1% BTL
– Output Power – mW
O
P
350
300
250
200
150
100
50
350
300
0
2
THD+N 1% SE
OUTPUT POWER
vs
SUPPLY VOLTAGE
RL = 8
RL = 32
343.5 4.5
VDD – Supply Voltage – V
Figure 9
OUTPUT POWER
vs
LOAD RESISTANCE
THD+N = 1% SE
5
5.52.5
600
VDD = 5 V
500
400
– Output Power – mW
O
P
300
200
100
VDD = 3.3 V
0
16 3224 40 64
8
RL – Load Resistance –
48 56
Figure 10
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
– Output Power – mW
O
P
250
200
150
100
50
VDD = 5 V
VDD = 3.3 V
0
14 2620 32 5083844
RL – Load Resistance –
56 62
Figure 11
350-mW MONO AUDIO POWER AMPLIFIER
TYPICAL CHARACTERISTICS
TPA311
SLOS207C – JANUARY 1998 – REVISED MAY 2003
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
10
VDD = 3.3 V PO = 250 mW RL = 8 BTL
1
AV = –10 V/V
0.1
THD+N –Total Harmonic Distortion + Noise – %
0.01 20 1k 10k
AV = –20 V/V
AV = –2 V/V
f – Frequency – Hz
Figure 12
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
VDD = 3.3 V f = 1 kHz AV = –2 V/V BTL
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
10
VDD = 3.3 V RL = 8 AV = –2 V/V BTL
1
0.1
THD+N –Total Harmonic Distortion + Noise – %
20k100
0.01 20 1k 10k
PO = 250 mW
f – Frequency – Hz
PO = 50 mW
PO = 125 mW
20k100
Figure 13
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
f = 20 kHz
f = 10 kHz
1
RL = 8
0.1
THD+N –Total Harmonic Distortion + Noise – %
0.01
0.04 0.1 0.4
0.16 0.22 0.28 0.34
PO – Output Power – W
Figure 14
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1
f = 1 kHz
0.1 f = 20 Hz
THD+N –Total Harmonic Distortion + Noise – %
0.01
0.01 0.1 1 PO – Output Power – W
VDD = 3.3 V RL = 8 AV = –2 V/V BTL
Figure 15
9
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
10
VDD = 5 V PO = 350 mW RL = 8 BTL
1
AV = –10 V/V
0.1
THD+N –Total Harmonic Distortion + Noise – %
0.01 20 1k 10k
AV = –20 V/V
AV = –2 V/V
f – Frequency – Hz
Figure 16
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
VDD = 5 V f = 1 kHz AV = –2 V/V BTL
1
RL = 8
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
10
VDD = 5 V RL = 8 AV = –2 V/V BTL
1
0.1
THD+N –Total Harmonic Distortion + Noise – %
20k100
0.01 20 1k 10k
PO = 350 mW
f – Frequency – Hz
PO = 50 mW
PO = 175 mW
20k100
Figure 17
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
f = 20 kHz
f = 10 kHz
1
f = 1 kHz
10
0.1
THD+N –Total Harmonic Distortion + Noise – %
0.01
0.1 0.25 10.40 0.55 0.70 0.85 PO – Output Power – W
Figure 18
0.1
VDD = 5 V RL = 8 AV = –2 V/V
THD+N –Total Harmonic Distortion + Noise – %
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
BTL
0.01
0.01 0.1 1
f = 20 Hz
PO – Output Power – W
Figure 19
350-mW MONO AUDIO POWER AMPLIFIER
TYPICAL CHARACTERISTICS
TPA311
SLOS207C – JANUARY 1998 – REVISED MAY 2003
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
10
VDD = 3.3 V PO = 30 mW RL = 32 SE
1
0.1 AV = –1 V/V
AV = –10 V/V
0.01 AV = –5 V/V
THD+N –Total Harmonic Distortion + Noise – %
0.001 20 1k 10k
f – Frequency – Hz
Figure 20
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
VDD = 3.3 V f = 1 kHz RL = 32 AV = –1 V/V SE
1
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
10
VDD = 3.3 V RL = 32 AV = –1 V/V SE
1
PO = 10 mW
0.1
0.01 PO = 15 mW
THD+N –Total Harmonic Distortion + Noise – %
20k100
0.001
PO = 30 mW
20 1k 10k
f – Frequency – Hz
20k100
Figure 21
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
1
f = 20 kHz
f = 10 kHz
VDD = 3.3 V RL = 32 AV = –1 V/V SE
0.1
THD+N –Total Harmonic Distortion + Noise – %
0.01
0.02 0.025 0.050.03 0.035 0.04 0.045 PO – Output Power – W
Figure 22
0.1
f = 20 Hz
THD+N –Total Harmonic Distortion + Noise – %
0.01
0.002 0.03 0.050.01
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
f = 1 kHz
0.02
PO – Output Power – W
Figure 23
11
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
10
VDD = 5 V PO = 60 mW RL = 32 SE
1
AV = –10 V/V
0.1
AV = –5 V/V
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001 20 1k 10k
AV = –1 V/V
f – Frequency – Hz
Figure 24
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
VDD = 5 V f = 1 kHz RL = 32 AV = –1 V/V SE
1
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
10
VDD = 5 V RL = 32 AV = –1 V/V SE
1
PO = 15 mW
0.1
PO = 30 mW
0.01
PO = 60 mW
THD+N –Total Harmonic Distortion + Noise – %
20k100
0.001 20 1k 10k
f – Frequency – Hz
20k100
Figure 25
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
f = 20 kHz
1
f = 10 kHz
12
0.1
THD+N –Total Harmonic Distortion + Noise – %
0.01
0.02 0.04 0.140.06 0.08 0.1 0.12 PO – Output Power – W
Figure 26
0.1
THD+N –Total Harmonic Distortion + Noise – %
0.01
0.002 0.1 0.20.01
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
f = 1 kHz
f = 20 Hz
VDD = 5 V RL = 32 AV = –1 V/V SE
PO – Output Power – W
Figure 27
350-mW MONO AUDIO POWER AMPLIFIER
TYPICAL CHARACTERISTICS
TPA311
SLOS207C – JANUARY 1998 – REVISED MAY 2003
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
1
VDD = 3.3 V PO = 0.1 mW RL = 10 k SE
0.1 AV = –1 V/V
AV = –2 V/V
AV = –5 V/V
THD+N –Total Harmonic Distortion + Noise – %
0.01 20 1k 10k
f – Frequency – Hz
Figure 28
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
VDD = 3.3 V f = 1 kHz RL = 10 k AV = –1 V/V
1
SE
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
1
VDD = 3.3 V RL = 10 k AV = –1 V/V SE
PO = 0.05 mW
0.1
THD+N –Total Harmonic Distortion + Noise – %
20k100
0.01 20 1 k 10 k
f – Frequency – Hz
PO = 0.13 mW
PO = 0.1 mW
20 k100
Figure 29
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
VDD = 3.3 V RL = 10 k AV = –1 V/V SE
1
0.1
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001 50 75 200100 125 150 175
PO – Output Power – µW
Figure 30
0.1
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001 5 100 500
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
f = 20 Hz
10
f = 20 kHz
f = 10 kHz
PO – Output Power – µW
Figure 31
f = 1 kHz
13
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
1
VDD = 5 V PO = 0.3 mW RL = 10 k SE
0.1
AV = –1 V/V
AV = –2 V/V
THD+N –Total Harmonic Distortion + Noise – %
0.01 20 1k 10k
AV = –5 V/V
f – Frequency – Hz
Figure 32
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
VDD = 5 V f = 1 kHz RL = 10 k AV = –1 V/V
1
SE
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
1
VDD = 5 V RL = 10 k AV = –1 V/V SE
PO = 0.3 mW
0.1
THD+N –Total Harmonic Distortion + Noise – %
20k100
0.01 20 1k 10k
f – Frequency – Hz
PO = 0.2 mW
PO = 0.1 mW
20k100
Figure 33
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
10
VDD = 5 V RL = 10 k AV = –1 V/V SE
1
14
0.1
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001 50 125 500200 275 350 425
PO – Output Power – µW
Figure 34
0.1
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001 5 100 500
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
f = 20 kHz
f = 20 Hz
f = 1 kHz
f = 10 kHz
10
PO – Output Power – µW
Figure 35
40
30
20
10
TPA311
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
TYPICAL CHARACTERISTICS
OPEN-LOOP GAIN AND PHASE
vs
FREQUENCY
Phase
Gain
0
VDD = 3.3 V RL = Open BTL
180
120
60
°
0
Phase –
Open-Loop Gain – dB
Open-Loop Gain – dB
10
20
30
40
30
20
10
10
60
120
1
1
10
f – Frequency – kHz
10
2
10
3
10
4
–180
Figure 36
OPEN-LOOP GAIN AND PHASE
vs
FREQUENCY
Phase
Gain
0
VDD = 5 V RL = Open BTL
180
120
60
°
0
Phase –
60
20
30
1
1
10
f – Frequency – kHz
10
2
Figure 37
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
10
–120
3
10
4
–180
15
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
TYPICAL CHARACTERISTICS
CLOSED-LOOP GAIN AND PHASE
FREQUENCY
Closed-Loop Gain – dB
0.75
0.5
0.25
0.25
0.5
0.75
1
1.25
1.5
1.75
2
1
0
VDD = 3.3 V RL = 8 PO = 0.25 W CI =1 µF BTL
1
10
10
Phase
Gain
2
10
f – Frequency – Hz
vs
180
170
160
°
150
Phase –
140
130
3
10
4
10
5
10
6
120
Closed-Loop Gain – dB
0.75
0.5
0.25
0.25
0.5
0.75
1
1.25
1.5
1.75
2
Figure 38
CLOSED-LOOP GAIN AND PHASE
vs
FREQUENCY
1
0
VDD = 5 V RL = 8 PO = 0.35 W CI =1 µF BTL
1
10
10
Phase
Gain
2
3
10
f – Frequency – Hz
Figure 39
10
180
170
160
°
150
Phase –
140
130
4
10
5
10
6
120
16
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Closed-Loop Gain dB
1
23
7
6 5 4
3
2
1
0
1
10
350-mW MONO AUDIO POWER AMPLIFIER
TYPICAL CHARACTERISTICS
CLOSED-LOOP GAIN AND PHASE
vs
FREQUENCY
Phase
Gain
VDD = 3.3 V RL = 32 AV = –2 V/V PO = 30 mW CI =1 µF CC =470 µF SE
10
2
3
10
f – Frequency – Hz
10
4
10
SLOS207C – JANUARY 1998 – REVISED MAY 2003
180
170
160
150
°
140
Phase –
130
120
110
10
100
6
5
TPA311
Closed-Loop Gain dB
1
2
7
6
5
4
3
2
1
0
1
10
Figure 40
CLOSED-LOOP GAIN AND PHASE
vs
FREQUENCY
Phase
Gain
VDD = 5 V RL = 32 AV = –2 V/V PO = 60 mW CI =1 µF CC =470 µF SE
10
2
3
10
f – Frequency – Hz
10
4
Figure 41
10
180
170
160
150
°
140
Phase –
130
120
110
10
100
6
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
17
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
TYPICAL CHARACTERISTICS
OUTPUT NOISE VOLTAGE
vs
FREQUENCY
100
VDD = 3.3 V BW = 22 Hz to 22 kHz RL = 32
V(rms)
– Output Noise Voltage –µV
n
CB =0.1 µF AV = –1 V/V
VO BTL
10
V
1
20 1 k 10 k
f – Frequency – Hz
Figure 42
POWER DISSIPATION
vs
OUTPUT POWER
300
O+
OUTPUT NOISE VOLTAGE
vs
FREQUENCY
100
VDD = 5 V BW = 22 Hz to 22 kHz RL = 32
V(rms)
– Output Noise Voltage –µV
n
20 k100
CB =0.1 µF AV = –1 V/V
VO BTL
10
1
20 1 k 10 k
V
O+
f – Frequency – Hz
20 k100
Figure 43
POWER DISSIPATION
vs
OUTPUT POWER
80
– Power Dissipation – mW
D
P
270
240
210
180
150
120
90
VDD = 3.3 V RL = 8 BTL
100 300
PO – Output Power – mW
200 4000
Figure 44
– Power Dissipation – mW
D
P
72
64 56
48
40
32
24
16
RL = 8
RL = 32
8 0
30 90
PO – Output Power – mW
60 1200
VDD = 3.3 V SE
Figure 45
18
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
350-mW MONO AUDIO POWER AMPLIFIER
TYPICAL CHARACTERISTICS
TPA311
SLOS207C – JANUARY 1998 – REVISED MAY 2003
– Power Dissipation – mW
D
P
720
640
560
480
400
320
240
160
POWER DISSIPATION
vs
OUTPUT POWER
VDD = 5 V RL = 8 BTL
200 600400 8000 1000 1200
PO – Output Power – mW
Figure 46
– Power Dissipation – mW
D
P
180
160
140
120
100
80
60
40
POWER DISSIPATION
vs
OUTPUT POWER
RL = 8
RL = 32
VDD = 5 V SE
50 150100 2000 250 300
PO – Output Power – mW
Figure 47

APPLICATION INFORMATION

bridge-tied load versus single-ended mode

Figure 48 shows a linear audio power amplifier (AP A) in a BTL configuration. The TPA31 1 BTL amplifier consists of two linear amplifiers driving both ends of the load. There are several potential benefits to this differential drive configuration but initially consider power to the load. The differential drive to the speaker means that as one side is slewing up, the other side is slewing down, and vice versa. This in effect doubles the voltage swing on the load as compared to a ground referenced load. Plugging 2 × V squared, yields 4× the output power from the same supply rail and load impedance (see equation 1).
V
V
(rms)
Power +
+
O(PP)
22
V
(rms)
R
Ǹ
2
L
into the power equation, where voltage is
O(PP)
(1)
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
19
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
APPLICATION INFORMATION
bridge-tied load versus single-ended mode (continued)
V
DD
V
O(PP)
R
V
DD
L
2x V
–V
O(PP)
O(PP)
Figure 48. Bridge-Tied Load Configuration
In typical portable handheld equipment, a sound channel operating at 3.3 V and using bridging raises the power into an 8-Ω speaker from a single-ended (SE, ground reference) limit of 62.5 mW to 250 mW. In terms of sound power that is a 6-dB improvement, which is loudness that can be heard. In addition to increased power there are frequency response concerns. Consider the single-supply SE configuration shown in Figure 49. A coupling capacitor is required to block the dc offset voltage from reaching the load. These capacitors can be quite large (approximately 33 µF to 1000 µF), tend to be expensive, heavy, and occupy valuable PCB area. These capacitors also have the additional drawback of limiting low-frequency performance of the system. This frequency limiting effect is due to the high-pass filter network created with the speaker impedance and the coupling capacitance and is calculated with equation 2.
2p R
1
C
L
C
f
+
c
(2)
For example, a 68-µF capacitor with an 8-Ω speaker would attenuate low frequencies below 293 Hz. The BTL configuration cancels the dc offsets, which eliminates the need for the blocking capacitors. Low-frequency performance is then limited only by the input network and speaker response. Cost and PCB space are also minimized by eliminating the bulky coupling capacitor.
20
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
350-mW MONO AUDIO POWER AMPLIFIER
APPLICATION INFORMATION
bridge-tied load versus single-ended mode (continued)
V
DD
TPA311
SLOS207C – JANUARY 1998 – REVISED MAY 2003
V
O(PP)
C
C
R
L
V
O(PP)
–3 dB
f
c
Figure 49. Single-Ended Configuration and Frequency Response
Increasing power to the load does carry a penalty of increased internal power dissipation. The increased dissipation is understandable, considering that the BTL configuration produces 4× the output power of the SE configuration. Internal dissipation versus output power is discussed further in the thermal considerations section.

BTL amplifier efficiency

Linear amplifiers are notoriously inefficient. The primary cause of these inefficiencies is voltage drop across the output stage transistors. There are two components of the internal voltage drop. One is the headroom or dc voltage drop that varies inversely to output power. The second component is due to the sinewave nature of the output. The total voltage drop can be calculated by subtracting the RMS value of the output voltage from V The internal voltage drop multiplied by the RMS value of the supply current, I power dissipation of the amplifier.
rms, determines the internal
DD
DD
.
An easy-to-use equation to calculate efficiency starts out as being equal to the ratio of power from the power supply to the power delivered to the load. To accurately calculate the RMS values of power in the load and in the amplifier, the current and voltage waveform shapes must first be understood (see Figure 50).
I
DD
I
DD(RMS)
V
(LRMS)
V
O
Figure 50. Voltage and Current Waveforms for BTL Amplifiers
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
21
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
APPLICATION INFORMATION
BTL amplifier efficiency (continued)
Although the voltages and currents for SE and BTL are sinusoidal in the load, currents from the supply are very different between SE and BTL configurations. In an SE application the current waveform is a half-wave rectified shape whereas, in BTL it is a full-wave rectified waveform. This means RMS conversion factors are different. Keep in mind that for most of the waveform, both the push and pull transistors are not on at the same time, which supports the fact that each amplifier in the BTL device only draws current from the supply for half the waveform. The following equations are the basis for calculating amplifier efficiency.
P
V
L
V
P
Ǹ
2
2V
p R
P
rms
R
P
L
L
SUP
L
+
V
2R
2
p
L
V
DD2VP
p R
L
2
where
Efficiency +
+
P
L
VLrms +
I
P
DD
+ VDDIDDrms +
SUP
rms +
(3)
Efficiency of a BTL Configuration +
p V
2V
DD
PLR
ǒ
p
P
+
2V
1ń2
L
Ǔ
2
DD
(4)
T able 1 employs equation 4 to calculate efficiencies for three dif ferent output power levels. The efficiency of the amplifier is quite low for lower power levels and rises sharply as power to the load is increased resulting in a nearly flat internal power dissipation over the normal operating range. The internal dissipation at full output power is less than in the half power range. Calculating the efficiency for a specific system is the key to proper power supply design.
Table 1. Efficiency Vs Output Power in 3.3-V 8- BTL Systems
OUTPUT POWER
(W)
0.125 33.6 1.41 0.26
0.25 47.6 2.00 0.29
0.375 58.3 2.45
High-peak voltage values cause the THD to increase.
EFFICIENCY
(%)
PEAK-TO-PEAK
VOLTAGE
(V)
INTERNAL
DISSIPATION
(W)
0.28
A final point to remember about linear amplifiers (either SE or BTL) is how to manipulate the terms in the efficiency equation to utmost advantage when possible. In equation 4, V that as V
goes down, efficiency goes up.
DD
is in the denominator. This indicates
DD
22
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
APPLICATION INFORMATION

application schematic

Figure 51 is a schematic diagram of a typical handheld audio application circuit, configured for a gain of –10 V/V.
TPA311
C
I
0.47 µF
2.2 µF
R
F
50 k
R
I
10 k
C
B
100 k
100 k
C
F
5 pF
Audio
Input
From System Control
0.1 µF
V
DD
IN
24BYPASS
SHUTDOWN
1 3
SE/BTL
V
DD
VDD/2
+
+
Bias
Control
VO+
VO– 8
GND
Figure 51. TPA311 Application Circuit
6
C
C
5
7
330 µF
1 k
C
S
1 µF
V
DD
The following sections discuss the selection of the components used in Figure 51.

component selection

gain setting resistors, RF and R
The gain for each audio input of the TP A31 1 is set by resistors RF and RI according to equation 5 for BTL mode.
BTL Gain + A
BTL mode operation brings about the factor 2 in the gain equation due to the inverting amplifier mirroring the voltage swing across the load. Given that the TPA311 is a MOS amplifier, the input impedance is very high, consequently input leakage currents are not generally a concern, although noise in the circuit increases as the value of R
increases. In addition, a certain range of RF values is required for proper start-up operation of the
F
amplifier. Taken together it is recommended that the effective impedance seen by the inverting node of the amplifier be set between 5 k and 20 kΩ. The effective impedance is calculated in equation 6.
Effective Impedance +
+*2
V
I
R
F
ǒ
Ǔ
R
I
R
FRI
RF) R
I
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
(5)
(6)
23
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
APPLICATION INFORMATION
component selection (continued)
As an example consider an input resistance of 10 kΩ and a feedback resistor of 50 kΩ. The BTL gain of the amplifier would be –10 V/V and the effective impedance at the inverting terminal would be 8.3 kΩ, which is well within the recommended range.
For high performance applications, metal film resistors are recommended because they tend to have lower noise levels than carbon resistors. For values of R to a pole formed from R compensation capacitor, C
and the inherent input capacitance of the MOS input structure. For this reason, a small
F
, of approximately 5 pF should be placed in parallel with RF when RF is greater than
F
50 kΩ. This, in effect, creates a low pass filter network with the cutoff frequency defined in equation 7.
3 dB
above 50 k the amplifier tends to become unstable due
F
f
c(lowpass)
+
2p R
1
FCF
f
c
For example, if RF is 100 k and CF is 5 pF then fc is 318 kHz, which is well outside the audio range.
input capacitor, C
I
In the typical application an input capacitor, CI, is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation. In this case, C
and RI form a high-pass filter with the corner frequency
I
determined in equation 8.
3 dB
f
c(highpass)
+
2p R
1
C
I
I
(7)
(8)
f
c
The value of CI is important to consider as it directly affects the bass (low frequency) performance of the circuit. Consider the example where R
is 10 k and the specification calls for a flat bass response down to 40 Hz.
I
Equation 8 is reconfigured as equation 9.
+
2p R
1
f
c
I
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
24
C
I
(9)
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
APPLICATION INFORMATION
component selection (continued)
In this example, CI is 0.40 µF, so one would likely choose a value in the range of 0.47 µF to 1 µF. A further consideration for this capacitor is the leakage path from the input source through the input network (R the feedback resistor (R that reduces useful headroom, especially in high gain applications. For this reason a low-leakage tantalum or ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most applications as the dc level there is held at V than the source dc level. It is important to confirm the capacitor polarity in the application.
) to the load. This leakage current creates a dc offset voltage at the input to the amplifier
F
/2, which is likely higher
DD
TPA311
, CI) and
I
power supply decoupling, C
The TP A311 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is achieved by using two capacitors of different types that target different types of noise on the power supply leads. For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) ceramic capacitor, typically 0.1 µF placed as close as possible to the device V lower-frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed near the audio power amplifier is recommended.
midrail bypass capacitor, C
The midrail bypass capacitor, CB, is the most critical capacitor and serves several important functions. During start-up or recovery from shutdown mode, C function is to reduce noise produced by the power supply caused by coupling into the output drive signal. This noise is from the midrail generation circuit internal to the amplifier, which appears as degraded PSRR and THD + N. The capacitor is fed from a 250-kΩ source inside the amplifier. To keep the start-up pop as low as possible, the relationship shown in equation 10 should be maintained, which insures the input capacitor is fully charged before the bypass capacitor is fuly charged and the amplifier starts up.
10
ǒ
CB 250 k
As an example, consider a circuit where CB is 2.2 µF, CI is 0.47 µF, RF is 50 k and RI is 10 k. Inserting these values into the equation 10 we get: 18.2 35.5 which satisfies the rule. Bypass capacitor, C to 2.2 µF ceramic or tantalum low-ESR capacitors are recommended for the best THD and noise performance.
Ǔ
B
v
S
ǒ
RF) R
lead, works best. For filtering
DD
determines the rate at which the amplifier starts up. The second
B
1
Ǔ
C
I
I
, values of 0.1 µF
B
(10)

single-ended operation

In SE mode (see Figure 51), the load is driven from the primary amplifier output (VO+, terminal 5). In SE mode the gain is set by the R
is not used to mirror the voltage swing on the load, the factor of 2, from equation 5, is not included.
SE Gain + A
+*
V
and RI resistors and is shown in equation 1 1. Since the inverting amplifier
F
R
F
ǒ
Ǔ
R
I
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
(11)
25
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
APPLICATION INFORMATION
single-ended operation (continued)
The output coupling capacitor required in single-supply SE mode also places additional constraints on the selection of other components in the amplifier circuit. The rules described earlier still hold with the addition of the following relationship:
10
ǒ
CB 250 k
v
Ǔ
ǒ
RF) R
1
Ǔ
C
I
1
Ơ
RLC
I
C
As an example, consider a circuit where CB is 0.2.2 µF, CI is 0.47 µF, CC is 330 µF, RF is 50 kΩRL is 32 , and R
is 10 kΩ. Inserting these values into the equation 12 we get:
I
18.2 t 35.5 Ơ 94.7 which satisfies the rule.
output coupling capacitor, C
In the typical single-supply SE configuration, an output coupling capacitor (C
C
) is required to block the dc bias
C
at the output of the amplifier, thus preventing dc currents in the load. As with the input coupling capacitor, the output coupling capacitor and impedance of the load form a high-pass filter governed by equation 13.
3 dB
f
c(high pass)
+
2p R
1
C
C
L
f
c
(12)
(13)
The main disadvantage, from a performance standpoint, is that the typically small load impedances drive the low-frequency corner higher degrading the bass response. Large values of C frequencies into the load. Consider the example where a C
of 330 µF is chosen and loads vary from 8 Ω,
C
are required to pass low
C
32, to 47 kΩ. Table 2 summarizes the frequency response characteristics of each configuration.
Table 2. Common Load Impedances vs Low Frequency Output Characteristics in SE Mode
R
L
8 330 µF
32 330 µF Ą15 Hz
47,000 330 µF
C
C
LOWEST FREQUENCY
60 Hz
0.01 Hz
As T able 2 indicates an 8-Ω load is adequate, earphone response is good, and drive into line level inputs (a home stereo for example) is exceptional.
26
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
350-mW MONO AUDIO POWER AMPLIFIER
APPLICATION INFORMATION
TPA311
SLOS207C – JANUARY 1998 – REVISED MAY 2003
SE/BTL
operation
The ability of the TP A311 to easily switch between BTL and SE modes is one of its most important cost saving features. This feature eliminates the requirement for an additional earphone amplifier in applications where internal speakers are driven in BTL mode but external earphone or speaker must be accommodated. Internal to the TP A311, two separate amplifiers drive V of the follower amplifier that drives V is in the BTL mode. When SE/BTL
– (terminal 8). When SE/BTL is held low, the amplifier is on and the TP A31 1
O
is held high, the VO– amplifier is in a high output impedance state, which configures the TP A311 as an SE driver from V mode. Control of the SE/BTL
input can be from a logic-level TTL source or, more typically , from a resistor divider
+ and VO–. The SE/BTL input (terminal 3) controls the operation
O
+ (terminal 5). IDD is reduced by approximately one-half in SE
O
network as shown in Figure 52.
C
IN
24BYPASS
SHUTDOWN
1 3
SE/BTL
Bias
Control
VO+
+
+
5
VO– 8
7
GND
C
330 µF
1 k
0.1 µF
V
DD
100 k
100 k
Figure 52. TPA311 Resistor Divider Network Circuit
Using a readily available 1/8-in. (3,5 mm) mono earphone jack, the control switch is closed when no plug is inserted. When closed the 100-kΩ/1-kΩ divider pulls the SE/BTL resistor is disconnected and the SE/BTL
input is pulled high. When the input goes high, the VO– amplifier is shutdown causing the BTL speaker to mute (virtually open-circuits the speaker). The V through the output capacitor (C
) into the earphone jack.
C
input low. When a plug is inserted, the 1-k
+ amplifier then drives
O

using low-ESR capacitors

Low-ESR capacitors are recommended throughout this application. A real (as opposed to ideal) capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance the more the real capacitor behaves like an ideal capacitor.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
27
TPA311 350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
APPLICATION INFORMATION

5-V versus 3.3-V operation

The TP A311 operates over a supply range of 2.5 V to 5.5 V. This data sheet provides full specifications for 5-V and 3.3-V operation, as these are considered to be the two most common standard voltages. There are no special considerations for 3.3-V versus 5-V operation with respect to supply bypassing, gain setting, or stability . The most important consideration is that of output power. Each amplifier in TPA311 can produce a maximum voltage swing of V opposed to V an 8- load before distortion becomes significant.
Operation from 3.3-V supplies, as can be shown from the efficiency formula in equation 4, consumes approximately two-thirds the supply power for a given output-power level of operation from 5-V supplies.
O(PP)

headroom and thermal considerations

Linear power amplifiers dissipate a significant amount of heat in the package under normal operating conditions. A typical music CD requires 12 dB to 15 dB of dynamic headroom to pass the loudest portions without distortion as compared with the average power output. From the TP A31 1 data sheet, one can see that when the TPA311 is operating from a 5-V supply into a 8- speaker that 350 mW peaks are available. Converting watts to dB:
– 1 V. This means, for 3.3-V operation, clipping starts to occur when V
DD
= 4 V at 5 V . The reduced voltage swing subsequently reduces maximum output power into
O(PP)
= 2.3 V as
P
W
ǒ
P
+ 10Log
dB
+ 10Log
+ –4.6 dB
Subtracting the headroom restriction to obtain the average listening level without distortion yields:
4.6 dB* 15 dB +*19.6 dB(15 dB headroom –4.6 dB* 12 dB +*16.6 dB(12 dB headroom –4.6 dB* 9dB +*13.6 dB(9 dB headroom –4.6 dB* 6dB +*10.6 dB(6 dB headroom –4.6 dB* 3dB +*7.6 dB(3 dB headroom
Converting dB back into watts:
P
W
PdBń10
+ 10 + 11 mW (15 dB headroom)
+ 22 mW (12 dB headroom) + 44 mW (9 dB headroom) + 88 mW (6 dB headroom) + 175 mW (3 dB headroom)
Ǔ
P
ref
350 mW
ǒ
1W
P
Ǔ
)
) ) )
)
ref
28
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
350-mW MONO AUDIO POWER AMPLIFIER
DISSIPATION
SLOS207C – JANUARY 1998 – REVISED MAY 2003
APPLICATION INFORMATION
headroom and thermal considerations (continued)
This is valuable information to consider when attempting to estimate the heat dissipation requirements for the amplifier system. Comparing the absolute worst case, which is 350 mW of continuous power output with 0 dB of headroom, against 12 dB and 15 dB applications drastically affects maximum ambient temperature ratings for the system. Using the power dissipation curves for a 5-V , 8- system, the internal dissipation in the TP A31 1 and maximum ambient temperatures is shown in Table 3.
Table 3. TPA311 Power Rating, 5-V, 8-Ω, BTL
TPA311
PEAK OUTPUT POWER
(mW) POWER
350 350 mW 600 350 175 mW (3 dB) 500 350 88 mW (6 dB) 380 350 44 mW (9 dB) 300 350 22 mW (12 dB) 200 350 11 mW (15 dB) 180
AVERAGE OUTPUT
POWER
DISSIPATION
(mW)
MAXIMUM AMBIENT
TEMPERATURE
0 CFM SOIC 0 CFM DGN
46°C 114°C 64°C 120°C 85°C 125°C
98°C 125°C 115°C 125°C 119°C 125°C
Table 3 shows that the TPA311 can be used to its full 350-mW rating without any heat sinking in still air up to 46°C.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
29
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TPA311D ACTIVE SOIC D 8 75 Green(RoHS &
no Sb/Br)
TPA311DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
TPA311DGN ACTIVE MSOP-
Power
DGN 8 80 Green (RoHS &
no Sb/Br)
PAD
TPA311DGNG4 ACTIVE MSOP-
Power
DGN 8 80 Green (RoHS &
no Sb/Br)
PAD
TPA311DGNR ACTIVE MSOP-
Power
DGN 8 2500 Green (RoHS &
no Sb/Br)
PAD
TPA311DGNRG4 ACTIVE MSOP-
Power
DGN 8 2500 Green (RoHS &
no Sb/Br)
PAD
TPA311DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
TPA311DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
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Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
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TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
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Wireless
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Copyright © 2007, Texas Instruments Incorporated
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
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TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
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Copyright © 2007, Texas Instruments Incorporated
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
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TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power www.ti.com/lpw Telephony www.ti.com/telephony
Wireless
Video & Imaging www.ti.com/video Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power www.ti.com/lpw Telephony www.ti.com/telephony
Wireless
Video & Imaging www.ti.com/video Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power www.ti.com/lpw Telephony www.ti.com/telephony
Wireless
Video & Imaging www.ti.com/video Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TPA311D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
TPA311DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
TPA311DGN ACTIVE MSOP-
Power
DGN 8 80 Green (RoHS &
no Sb/Br)
PAD
TPA311DGNG4 ACTIVE MSOP-
Power
DGN 8 80 Green (RoHS &
no Sb/Br)
PAD
TPA311DGNR ACTIVE MSOP-
Power
DGN 8 2500 Green (RoHS &
no Sb/Br)
PAD
TPA311DGNRG4 ACTIVE MSOP-
Power
DGN 8 2500 Green (RoHS &
no Sb/Br)
PAD
TPA311DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
TPA311DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
TPA311DGNR MSOP-
Power
TPA311DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
Type
PAD
Package Drawing
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA311DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TPA311DR SOIC D 8 2500 346.0 346.0 29.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Wireless www.ti.com/wireless
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