10 µ F
220 nF 220 nF
PVCC PVCC
220 nF 220 nF
PVCC PVCC
220 pF
Left Differential
Inputs
Right Differential
Inputs
Shutdown/Mute
Gain
Control
BSLP
PVCCL
PVCCL
LOUTP
LOUTP
PGNDL
PGNDL
LOUTN
LOUTN
PVCCL
PVCCL
BSLN
TPA3008D2
VCLAMPR
SHUTDOWN
V2P5
RINP
LINN
LINP
AVDDREF
NC
GAIN0
GAIN1
NC
NC
AVDD
AGND
COSC
ROSC
AVCC
VCLAMPL
BSRP
PVCCR
PVCCR
ROUTP
ROUTP
PGNDR
PGNDR
ROUTN
ROUTN
PVCCR
PVCCR
BSRN
RINN
AVCC
AGND
10 µ F
0.1 µ F
0.1 µ F
0.47 µ F
0.47 µ F
0.47 µ F
0.47 µ F
0.47 µ F
0.1 µ F
0.1 µ F
10 µ F
10 µ F
1 µ F
120 kΩ
1 µ F
NC
NC
NC
FAULT
0.1 µ F
10 µ F
1 µ F
Control
†Optional output filter for EMI suppression
†
10-W STEREO CLASS-D AUDIO POWER AMPLIFIER
FEATURES DESCRIPTION
• 10-W/Channel Into an 16- Ω Load From a
17-V Supply
• Up to 92% Efficient, Class-D Operation
Eliminates Need For Heatsinks
• 8.5-V to 18-V Single-Supply Operation
• Four Selectable, Fixed Gain Settings
• Differential Inputs Minimizes Common-Mode
Noise
• Space-Saving, Thermally Enhanced
PowerPAD™ Packaging
• Thermal and Short-Circuit Protection
With Auto Recovery Option
• Pinout Similar to TPA3000D Family
APPLICATIONS
• LCD Monitors and TVs
• All-In-One PCs
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
The TPA3008D2 is a 10-W (per channel) efficient,
class-D audio amplifier for driving bridged-tied stereo
speakers. The TPA3008D2 can drive stereo speakers
as low as 8 Ω . The high efficiency of the TPA3008D2
eliminates the need for external heatsinks when
playing music.
The gain of the amplifier is controlled by two gain
select pins. The gain selections are 15.3, 21.2, 27.2,
and 31.8 dB.
The outputs are fully protected against shorts to
GND, VCC, and output-to-output shorts. A fault terminal allows short-circuit fault reporting and automatic
recovery. Thermal protection ensures that the maximum junction temperature is not exceeded.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004, Texas Instruments Incorporated
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
Supply voltage range AV
Load Impedance, R
Input voltage range, V
L
I
Continuous total power dissipation See Dissipation Rating Table
Operating free–air temperature range, T
Operating junction temperature range, T
Storage temperature range, T
stg
A
J
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260° C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
, PV
CC
CC
SHUTDOWN -0.3 V to VCC + 0.3 V
GAIN0, GAIN1, RINN, RINP, LINN, LINP -0.3 V to 6 V
(1)
TPA3008D2
-0.3 V to 20 V
≥ 6 Ω
- 40° C to 85° C
- 40° C to 150° C
- 65° C to 150° C
DISSIPATION RATING TABLE
(1)
DERATING
FACTOR TA= 70° C TA= 85° C
(1/θ JA)
34.7 mW/° C
(1)
2.7 W 2.2 W
PACKAGE TA≤ 25°C θ
JC
PHP 4.3 W 1.14 ° C/W
(1) Based on a JEDEC high-K PCB with the PowerPAD™ soldered to a thermal land on the
printed-circuit board. See the PowerPAD Thermally Enhanced Package application note (SLMA002).
The PowerPAD must be soldered to the PCB.
RECOMMENDED OPERATING CONDITIONS
TA= 25° C (unless otherwise noted)
Supply voltage, V
High-level input voltage, V
Low-level input voltage, V
High-level input current, I
Low-level input current, I
High-level output voltage, V
Low-level output voltage, V
Oscillator frequency, f
Operating free–air temperature, T
CC
IH
IL
IH
IL
OSC
MIN MAX UNIT
PV
, AV
CC
CC
8.5 18 V
SHUTDOWN, GAIN0, GAIN1 2 V
SHUTDOWN, GAIN0, GAIN1 0.8 V
SHUTDOWN, VI= V
GAIN0, GAIN1, VI= 5.5 V, V
SHUTDOWN, VI= 0 V, V
GAIN0, GAIN1, VI= 5.5 V, V
FAULT, IOH= 100 µA AV
OH
FAULT, IOL= -100 µA AGND + 0.8 V V
OL
Frequency is set by selection of ROSC and COSC
(see the Application Information Section ).
A
= 18 V 10 µA
CC
= 18 V 1 µA
CC
= 18 V 1 µA
CC
= 18 V 1 µA
CC
- 0.8 V V
DD
200 300 kHz
-40 85 ° C
2
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
AVAILABLE OPTIONS
T
A
-40° C to 85° C TPA3008D2PHP
(1) The PHP package is available taped and reeled. To order a taped
and reeled part, add the suffix R to the part number (e.g.,
TPA3008D2PHPR).
DC ELECTRICAL CHARACTERISTICS
TA= 25° C, V
|V
| 2 5 55 mV
OO
V2P5 2.5-V Bias voltage No load 2.5 V
AV
DD
PSRR Power supply rejection ratio V
I
CC
I
CC(SD)
r
DS(on)
G Gain dB
t
on
t
off
= 12 V, RL= 8 Ω (unless otherwise noted)
CC
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Class-D output offset voltage INN and INP connected together,
(measured differentially) Gain = 31.8 dB
+5-V internal supply voltage 4.5 5 5.5 V
IL= 10 mA, SHUTDOWN = 2 V,
V
= 8.5 V to 18 V
CC
= 11.5 V to 12.5 V -76 dB
CC
Quiescent supply current SHUTDOWN = 2 V, no load 11 22 mA
Quiescent supply current in shut-
down mode
Drain-source on-state resistance IO= 1 A, Low side 500 mΩ
SHUTDOWN = 0 V 1.6 25 µA
V
= 12 V,
CC
TJ= 25° C
GAIN1 = 0.8 V
GAIN1 = 2 V
Turnon time C
Turnoff time C
= 1 µF, SHUTDOWN = 2 V 16 ms
(V2P5)
= 1 µF, SHUTDOWN = 0.8 V 60 µs
(V2P5)
PACKAGED DEVICE
48-PIN HTQFP (PHP)
(1)
High side 600
Total 1100 1300
GAIN0 = 0.8 V 14.6 15.3 16.2
GAIN0 = 2 V 20.5 21.2 21.8
GAIN0 = 0.8 V 26.4 27.2 27.8
GAIN0 = 2 V 31.1 31.8 32.5
AC ELECTRICAL CHARACTERISTICS
TA= 25° C, V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
k
SVR
P
O
THD+N PO= 1 W, f = 1 kHz, RL= 8 Ω 0.1%
V
n
SNR Signal-to-noise ratio 97 dB
= 12 V, RL= 8 Ω , (unless otherwise noted)
CC
Supply voltage rejection ratio -70 dB
200 mV
Gain = 15.6 dB, Inputs ac-coupled to GND
ripple from 20 Hz to 1 kHz,
PP
THD+N = 0.13%, f = 1 kHz, RL= 8 Ω 5
THD+N = 10%, f = 1 kHz, RL= 8 Ω 8.5
Continuous output power W
THD+N = 0.16%, f = 1 kHz, RL= 16 Ω ,
V
= 17 V
CC
THD+N = 10%, f = 1 kHz, RL= 16 Ω ,
V
= 17 V
CC
5
10
Total harmonic distortion plus
noise
Output integrated noise floor -80 dB
20 Hz to 22 kHz, A-weighted filter,
Gain = 15.6 dB
Crosstalk PO= 1 W, RL= 8 Ω , Gain = 15.6 dB, -93 dB
f = 1 kHz
Maximum output at THD+N < 0.5%,
f = 1 kHz, Gain = 15.6 dB
Thermal trip point 150 ° C
Thermal hystersis 20 ° C
3
Biases
and
References
TTL Input
Buffer
(VCC Compl)
Start-up and
Protection
Logic
SC
Detect
Thermal
VDDok
RINP
RINN
Ramp
Generator
COSC
ROSC
VCCok
5-V LDO
AVCC
AVDD
AVDD
VDD
and
PWM
Mode
Logic
Gain
Adj.
Gain
Control
Deglitch
and
PWM
Mode
Logic
Gain
Adj.
LINP
LINN
Gate
Drive
VClamp
Gen
Gate
Drive
PVCC
BSRP
PVCCR(2)
ROUTP(2)
PGNDR
PGNDR
ROUTN(2)
PVCCR(2)
BSRN
Gate
Drive
VClamp
Gen
Gate
Drive
PVCC
BSLP
PVCCL(2)
LOUTP(2)
PGNDL
PGNDL
LOUTN(2)
PVCCL(2)
BSLN
VCLAMPL
VCLAMPR
GAIN0
4
To Gain Adj.
Blocks and
Start-up Logic
SHUTDOWN
V2P5
V2P5
V2P5
AVCC
AGND(2)
V2P5
V2P5
Deglitch
GAIN1
AVDDREF
FAULT
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
FUNCTIONAL BLOCK DIAGRAM
4
13 14 15 16 17 18 19 20 21 22 23 24
25
26
27
28
29
30
31
32
33
34
35
36
48 47 46 45 44 43 42 41 40 39 38 37
1
2
3
4
5
6
7
8
9
10
11
12
BSRN
PVCCR
PVCCR
ROUTN
ROUTN
PGNDR
PGNDR
ROUTP
ROUTP
PVCCR
PVCCR
BSRP
VCLAMPR
NC
NC
NC
NC
AGND
COSC
ROSC
AGND
VCLAMPL
SHUTDOWN
RINN
RINP
V2P5
LINP
LINN
NC
GAIN0
GAIN1
FAULT
NC
BSLN
PVCCL
PVCCL
LOUTN
LOUTN
PGNDL
PGNDL
LOUTP
LOUTP
PVCCL
PVCCL
BSLP
TPA3008D2
AV
CC
AV
DD
AVDDREF
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
PHP PACKAGE
(TOP VIEW)
5
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
TERMINAL FUNCTIONS
PIN NAME PIN NUMBER I/O DESCRIPTION
AGND 26, 30 - Analog ground for digital/analog cells in core
AV
CC
AV
DD
AV
REF 7 O 5-V Reference output—connect to gain setting resistor or directly to GAIN0, GAIN1.
DD
BSLN 13 - Bootstrap I/O for left channel, negative high-side FET
BSLP 24 - Bootstrap I/O for left channel, positive high-side FET
BSRN 48 - Bootstrap I/O for right channel, negative high-side FET
BSRP 37 - Bootstrap I/O for right channel, positive high-side FET
COSC 28 I/O I/O for charge/discharging currents onto capacitor for ramp generator.
FAULT 11 O
GAIN0 9 I Gain select least significant bit. TTL logic levels with compliance to AV
GAIN1 10 I Gain select most significant bit. TTL logic levels with compliance to AV
LINN 6 I Negative audio input for left channel
LINP 5 I Positive audio input for left channel
LOUTN 16, 17 O Class-D 1/2-H-bridge negative output for left channel
LOUTP 20, 21 O Class-D 1/2-H-bridge positive output for left channel
NC - No internal connection
PGNDL 18, 19 - Power ground for left channel H-bridge
PGNDR 42, 43 - Power ground for right channel H-bridge
PVCCL 14, 15 -
PVCCL 22, 23 -
PVCCR 38, 39 -
PVCCR 46, 47 RINP 3 I Positive audio input for right channel
RINN 2 I Negative audio input for right channel
ROSC 27 I/O I/O current setting resistor for ramp generator.
ROUTN 44, 45 O Class-D 1/2-H-bridge negative output for right channel
ROUTP 40, 41 O Class-D 1/2-H-bridge positive output for right channel
SHUTDOWN 1 I
VCLAMPL 25 - Internally generated voltage supply for left channel bootstrap capacitors.
VCLAMPR 36 - Internally generated voltage supply for right channel bootstrap capacitors.
V2P5 4 O 2.5-V Reference for analog cells.
Thermal Pad - -
33 - High-voltage analog power supply, not connected internally to PVCCR or PVCCL
29 O
5-V Regulated output for use by internal cells and GAIN0, GAIN1 pins only. Not
specified for driving other external circuitry.
Short-circuit detect fault output.
FAULT = high, short-circuit detected.
FAULT = low, normal operation.
Status is reset when power is cycled or SHUTDOWN is cycled.
8, 12, 31, 32,
34, 35
Power supply for left channel H-bridge (internally connected to pins 22 and 23), not
connected to PVCCR or AV
.
CC
Power supply for left channel H-bridge (internally connected to pins 14 and 15), not
connected to PVCCR or AV
.
CC
Power supply for right channel H-bridge (internally connected to pins 46 and 47),
not connected to PVCCL or AV
.
CC
Power supply for right channel H-bridge (internally connected to pins 38 and 39),
not connected to PVCCL or AV
.
CC
Shutdown signal for IC (low = shutdown, high = operational). TTL logic levels with
compliance to VCC.
Connect to AGND and PGND—should be the center point for both grounds. Internal
resistive connection to AGND.
.
DD
.
DD
6
0.01
20
20 k
100
1 k 10 k
THD+N −Total Harmonic Distortion + Noise − %
VCC = 18 V ,
RL = 16
Gain = 21.6 dB
f − Frequency − Hz
10
0.1
PO = 2.5 W
PO = 0.5 W
PO = 1 W
1
0.005
10
0.01
0.1
20
20 k
100
1 k
10 k
PO = 2.5 W
THD+N −Total Harmonic Distortion + Noise − %
VCC = 12 V ,
RL = 16 ,
Gain = 21.6 dB
f − Frequency − Hz
PO = 1 W
1
PO = 0.5 W
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
TYPICAL CHARACTERISTICS
TABLE OF GRAPHS
FIGURE
THD+N Total harmonic distortion + noise vs Frequency 1, 2, 3, 4
THD+N Total harmonic distortion + noise vs Output power 5, 6
Closed-loop response 7
Output power vs Supply voltage 8, 9
Efficiency vs Output power 10
Efficiency vs Total output power 11
V
CC
k
SVR
CMRR Commom-mode rejection ratio vs Frequency 15
Supply current vs Total output power 12
Crosstalk vs Frequency 13
Supply ripple rejection ratio vs Frequency 14
TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE
vs vs
FREQUENCY FREQUENCY
Figure 1. Figure 2.
7
0.005
10
0.01
0.1
20
20 k
100
1 k 10 k
PO = 5 W
THD+N −Total Harmonic Distortion + Noise − %
VCC = 18 V ,
RL = 8 ,
Gain = 21.6 dB
f − Frequency − Hz
PO = 1 W
PO = 2.5 W
1
0.01
0.1
10
20
20 k
100
1 k 10 k
THD+N −Total Harmonic Distortion + Noise − %
VCC = 12 V ,
RL = 8
Gain = 21.6 dB
f − Frequency − Hz
PO = 1 W
PO = 2.5 W
PO = 0.5 W
1
0.01
10
0.1
1
20m 10 100 m 1
THD+N −Total Harmonic Distortion + Noise − %
PO− Output Power − W
VCC = 12 V ,
RL = 8 ,
Gain = 21.6 dB
20 200 m 2
1 kHz
20
20 Hz
20 kHz
0.01
10
0.1
1
20m 10 100 m 1
THD+N −Total Harmonic Distortion + Noise − %
PO− Output Power − W
VCC = 18 V ,
RL = 16 ,
Gain = 21.6 dB
20 Hz
20 200 m 2
20 kHz
1 kHz
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE
vs vs
FREQUENCY FREQUENCY
Figure 3. Figure 4.
TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE
vs vs
OUTPUT POWER OUTPUT POWER
8
Figure 5. Figure 6.
28
24
20
16
10 100 1k
Gain − dB
32
36
f − Frequency − Hz
40
10k
12
8
4
0
80k
VCC = 12 V ,
RL = 8 Ω,
Gain = 32 dB
33 kHz, RC LPF
Gain
Phase
Phase −
50
0
100
−150
−100
−50
150
0
1
2
3
4
5
6
7
8
9
10
11
12
8 9
10 11 12 13 14 15 16 17 18
P
O
− Output Power − W
THD+N = 10%
THD+N = 1%
RL = 16
VCC − Supply Voltage − V
2
3
4
5
6
7
8
9
8 9 10 11 12 13 14
THD+N = 1%
THD+N = 10%
RL = 8
VCC − Supply Voltage − V
P
O
− Output Power − W
10
11
12
Power represented by dashed line
may require external heatsinking
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6
PO − Output Power (Per Channel) − W
Efficiency − %
80
90
100
7 8 9 10
VCC = 18 V ,
RL = 16
CLOSED-LOOP RESPONSE SUPPLY VOLTAGE
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
OUTPUT POWER
vs
OUTPUT POWER EFFICIENCY
SUPPLY VOLTAGE OUTPUT POWER
Figure 7. Figure 8.
vs vs
Figure 9. Figure 10.
9
0
10
20
30
40
50
60
70
80
90
100
0 1 2 3 4 5 6 7 8 9 10
Efficiency − %
16
8
PO − Total Output Power − W
11 12
VCC = 12 V ,
LC Filter,
Resistive Load,
Stereo Operation
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0 2 4 6 8 10 12
PO − Total Output Power − W
1.6
1.8
2.0
14 16 18 20
LC Filter,
Resistive Load,
Stereo Operation
− Supply Current − A V
CC
VCC = 18 V ,
RL = 16
VCC = 12 V ,
RL = 16
VCC = 12 V ,
RL = 8
−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
20 100 1 k 10 k
Crosstalk − dB
f − Frequency − Hz
VCC = 12 V ,
PO = 2.5 W,
Gain = 21.6 dB
RL = 8
20 k
−100
−90
−80
−70
−60
−50
−40
20 100 1 k 10 k
f − Frequency − Hz
k
SVR
− Supply Ripple Rejection Ratio − dB
VCC = 12 V ,
V
(RIPPLE)
= 200 mVPP,
RL = 8 ,
Gain = 15.6 dB
20 k
−30
−20
−10
0
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
TOTAL OUTPUT POWER TOTAL OUTPUT POWER
EFFICIENCY SUPPLY CURRENT
vs vs
10
Figure 11. Figure 12.
CROSSTALK SUPPLY RIPPLE REJECTION RATIO
vs vs
FREQUENCY FREQUENCY
Figure 13. Figure 14.
−70
−60
−50
−40
−30
−20
−10
0
100 1 k 10 k 20
VCC = 12 V ,
Gain = 15.6 dB,
RL = 8
Output Referred
f − Frequency − Hz
CMRR − Common-Mode Rejection Ratio − dB
20 k
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
COMMON-MODE REJECTION RATIO
vs
FREQUENCY
Figure 15.
11
220 nF
220 nF
PVCC PVCC
220 nF 220 nF
PVCC PVCC
220 pF
Right Differential
Inputs
Shutdown/Mute
BSLP
PVCCL
PVCCL
LOUTP
LOUTP
PGNDL
PGNDL
LOUTN
LOUTN
PVCCL
PVCCL
BSLN
TPA3008D2
VCLAMPR
SHUTDOWN
V2P5
RINP
LINN
LINP
AVDDREF
NC
GAIN0
GAIN1
NC
NC
AVDD
AGND
COSC
ROSC
AVCC
VCLAMPL
BSRP
PVCCR
PVCCR
ROUTP
ROUTP
PGNDR
PGNDR
ROUTN
ROUTN
PVCCR
PVCCR
BSRN
RINN
AVCC
AGND
10 F 10 F
0.1 F
0.1 F
0.47 F
0.47 F
0.47 F
0.47 F
0.47 F
0.1 F 0.1 F
10 F 10 F
1 F
120 k
1 F
NC
NC
NC
FAULT
0.1 F
10 F
1 F
Control
Left Differential
Inputs
Gain
Control
1 nF 1 nF
Chip ferrite bead (example: Fair-Rite 251206700743) shown for EMI suppression.
1 nF
1 nF
Fault Reporting
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
APPLICATION INFORMATION
Figure 16. Stereo Class-D With Differential Inputs
12
0 V
−12 V
+12 V
Current
OUTP
Differential Voltage
Across Load
OUTN
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
APPLICATION INFORMATION (continued)
CLASS-D OPERATION
This section focuses on the class-D operation of the TPA3008D2.
Traditional Class-D Modulation Scheme
The traditional class-D modulation scheme, which is used in the TPA032D0x family, has a differential output
where each output is 180 degrees out of phase and changes from ground to the supply voltage, V
the differential prefiltered output varies between positive and negative V
, where filtered 50% duty cycle yields
CC
0 V across the load. The traditional class-D modulation scheme with voltage and current waveforms is shown in
Figure 17 . Note that even at an average of 0 V across the load (50% duty cycle), the current to the load is high,
causing high loss and thus causing a high supply current.
. Therefore,
CC
TPA3008D2 Modulation Scheme
The TPA3008D2 uses a modulation scheme that still has each output switching from 0 to the supply voltage.
However, OUTP and OUTN are now in phase with each other with no input. The duty cycle of OUTP is greater
than 50% and OUTN is less than 50% for positive output voltages. The duty cycle of OUTP is less than 50% and
OUTN is greater than 50% for negative output voltages. The voltage across the load sits at 0 V throughout most
of the switching period, greatly reducing the switching current, which reduces any I2R losses in the load.
Figure 17. Traditional Class-D Modulation Scheme's Output Voltage and Current Waveforms Into an
Inductive Load With No Input
13
0 V
−12 V
+12 V
Current
OUTP
OUTN
Differential
Voltage
Across
Load
0 V
−12 V
+12 V
Current
OUTP
OUTN
Differential
Voltage
Across
Load
Output = 0 V
Output > 0 V
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
APPLICATION INFORMATION (continued)
Figure 18. The TPA3008D2 Output Voltage and Current Waveforms Into an Inductive Load
Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme
The main reason that the traditional class-D amplifier needs an output filter is that the switching waveform results
in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripple current is
large for the traditional modulation scheme, because the ripple current is proportional to voltage multiplied by the
time at that voltage. The differential voltage swing is 2 x V
the traditional modulation scheme. An ideal LC filter is needed to store the ripple current from each half cycle for
the next half cycle, while any resistance causes power dissipation. The speaker is both resistive and reactive,
whereas an LC filter is almost purely reactive.
The TPA3008D2 modulation scheme has little loss in the load without a filter because the pulses are short and
the change in voltage is V
ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most
instead of 2 x V
CC
. As the output power increases, the pulses widen, making the
CC
applications the filter is not needed.
An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow
through the filter instead of the load. The filter has less resistance than the speaker, which results in less power
dissipation, therefore increasing efficiency.
14
, and the time at each voltage is half the period for
CC
Efficiency (theoretical, %)
R
L
RL r
ds(on)
100%
8
(8 1.3)
100% 86%
P
(total)
P
O
Efficiency
8.5 W
0.86
9.88 W
Other losses P
(total)
(measured) P
(total)
(theoretical) 10.49 9.88 0.61 W
P
(dis)
0.61 W (12 V 22 mA) 0.35 W
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
APPLICATION INFORMATION (continued)
Effects of Applying a Square Wave Into a Speaker
Audio specialists have advised for years not to apply a square wave to speakers. If the amplitude of the
waveform is high enough and the frequency of the square wave is within the bandwidth of the speaker, the
square wave could cause the voice coil to jump out of the air gap and/or scar the voice coil. A 250-kHz switching
frequency, however, does not significantly move the voice coil, as the cone movement is proportional to 1/f
frequencies beyond the audio band.
Damage may occur if the voice coil cannot handle the additional heat generated from the high-frequency
switching current. The amount of power dissipated in the speaker may be estimated by first considering the
overall efficiency of the system. If the on-resistance (rds(on)) of the output transistors is considered to cause the
dominant loss in the system, then the maximum theoretical efficiency for the TPA3008D2 with an 8-Ω load is as
follows:
The maximum measured output power is approximately 8.5 W with an 12-V power supply. The total theoretical
power supplied (P(total)) for this worst-case condition would therefore be as follows:
The efficiency measured in the lab using an 8-Ω speaker was 81%. The power not accounted for as dissipated
across the r
may be calculated by simply subtracting the theoretical power from the measured power:
DS(on)
2
for
(1)
(2)
The quiescent supply current at 12 V is measured to be 22 mA. It can be assumed that the quiescent current
encapsulates all remaining losses in the device, i.e., biasing and switching losses. It may be assumed that any
remaining power is dissipated in the speaker and is calculated as follows:
Note that these calculations are for the worst-case condition of 8.5 W delivered to the speaker. Because the 0.35
W is only 4% of the power delivered to the speaker, it may be concluded that the amount of power actually
dissipated in the speaker is relatively insignificant. Furthermore, this power dissipated is well within the
specifications of most loudspeaker drivers in a system, as the power rating is typically selected to handle the
power generated from a clipping waveform.
When to Use an Output Filter for EMI Suppression
Design the TPA3008D2 without the filter if the traces from amplifier to speaker are short (< 50 cm). Powered
speakers, where the speaker is in the same enclosure as the amplifier, is a typical application for class-D without
a filter.
Most applications require a ferrite bead filter. The ferrite filter reduces EMI around 1 MHz and higher (FCC and
CE only test radiated emissions greater than 30 MHz). When selecting a ferrite bead, choose one with high
impedance at high frequencies, but low impedance at low frequencies.
Use a LC output filter if there are low frequency (<1 MHz) EMI-sensitive circuits and/or there are long wires from
the amplifier to the speaker.
When both an LC filter and a ferrite bead filter are used, the LC filter should be placed as close as possible to
the IC followed by the ferrite bead filter.
(3)
(4)
15
0.1 µ F
0.1 µ F
0.47 µ F
33 µ H
33 µ H
OUTP
OUTN
L
1
L
2
C
1
C
2
C
3
1 nF
Ferrite
Chip Bead
OUTP
OUTN
Ferrite
Chip Bead
1 nF
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
APPLICATION INFORMATION (continued)
Figure 19. Typical LC Output Filter, Cutoff Frequency of 27 kHz, Speaker Impedance = 8 Ω
Figure 20. Typical Ferrite Chip Bead Filter (Chip bead example: Fair-Rite 2512067007Y3)
Gain setting via GAIN0 and GAIN1 inputs
The gain of the TPA3008D2 is set by two input terminals, GAIN0 and GAIN1.
The gains listed in Table 1 are realized by changing the taps on the input resistors inside the amplifier. This
causes the input impedance (Z
) to be dependent on the gain setting. The actual gain settings are controlled by
i
ratios of resistors, so the gain variation from part-to-part is small. However, the input impedance may shift by
20% due to shifts in the actual resistance of the input resistors.
For design purposes, the input network (discussed in the next section) should be designed assuming an input
impedance of 26 kΩ , which is the absolute minimum input impedance of the TPA3008D2. At the lower gain
settings, the input impedance could increase as high as 165 kΩ
Table 1. Gain Setting
GAIN1 GAIN0
0 0 15.3 137
0 1 21.2 88
1 0 27.2 52
1 1 31.8 33
AMPLIFIER GAIN (dB)
TYP TYP
INPUT IMPEDANCE
(kΩ )
INPUT RESISTANCE
Each gain setting is achieved by varying the input resistance of the amplifier that can range from its smallest
value, 33 kΩ , to the largest value, 137 kΩ . As a result, if a single capacitor is used in the input high-pass filter,
the -3 dB or cutoff frequency changes when changing gain steps.
16
C
i
IN
Z
i
Z
f
Input
Signal
f
c
1
2 ZiC
i
−3 dB
f
c
The -3-dB frequency can be calculated using Equation 5. Use Table 1 for Zivalues.
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
(5)
INPUT CAPACITOR, C
In the typical application, an input capacitor (C
proper dc level for optimum operation. In this case, C
I
) is required to allow the amplifier to bias the input signal to the
i
and the input impedance of the amplifier (Z
i
) form a
i
high-pass filter with the corner frequency determined in Equation 6 .
The value of Ciis important, as it directly affects the bass (low-frequency) performance of the circuit. Consider
the example where Ziis 137 kΩ and the specification calls for a flat bass response down to 20 Hz. Equation 6 is
reconfigured as Equation 7 .
In this example, Ciis 58 nF; so, one would likely choose a value of 0.1 µF as this value is commonly used. If the
gain is known and is constant, use Zifrom Table 1 to calculate Ci. A further consideration for this capacitor is the
leakage path from the input source through the input network (C
) and the feedback network to the load. This
i
leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especially
in high gain applications. For this reason, a low-leakage tantalum or ceramic capacitor is the best choice. When
polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most
applications as the dc level there is held at 2.5 V, which is likely higher than the source dc level. Note that it is
important to confirm the capacitor polarity in the application.
For the best pop performance, CIshould be less than or equal to 1µF.
(6)
(7)
Power Supply Decoupling,C
S
The TPA3008D2 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling
to ensure that the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also
prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is
achieved by using two capacitors of different types that target different types of noise on the power supply leads.
For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR)
ceramic capacitor, typically 0.1 µF placed as close as possible to the device V
lower frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed near the audio
lead works best. For filtering
CC
power amplifier is recommended. The 10-µF capacitor also serves as local storage capacitor for supplying
current during large signal transients on the amplifier outputs.
17
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
BSN and BSP Capacitors
The full H-bridge output stages use only NMOS transistors. Therefore, they require bootstrap capacitors for the
high side of each output to turn on correctly. A 220-nF ceramic capacitor, rated for at least 25 V, must be
connected from each output to its corresponding bootstrap input. Specifically, one 220-nF capacitor must be
connected from xOUTP to xBSP, and one 220-nF capacitor must be connected from xOUTN to xBSN. (See the
application circuit diagram in Figure 16 .)
The bootstrap capacitors connected between the BSxx pins and corresponding output function as a floating
power supply for the high-side N-channel power MOSFET gate drive circuitry. During each high-side switching
cycle, the bootstrap capacitors hold the gate-to-source voltage high enough to keep the high-side MOSFETs
turned on.
VCLAMP Capacitors
To ensure that the maximum gate-to-source voltage for the NMOS output transistors is not exceeded, two
internal regulators clamp the gate voltage. Two 1-µF capacitors must be connected from VCLAMPL (pin 25) and
VCLAMPR (pin 36) to ground and must be rated for at least 25 V. The voltages at the VCLAMP terminals vary
with V
and may not be used for powering any other circuitry.
CC
Internal Regulated 5-V Supply (AV
The AV
terminal (pin 29) is the output of an internally generated 5-V supply, used for the oscillator,
DD
)
DD
preamplifier, and volume control circuitry. It requires a 1-µF capacitor, placed close to the pin, to keep the
regulator stable.
This regulated voltage can be used to control GAIN0 and GAIN1 terminals, but should not be used to drive
external circuitry.
Differential Input
The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To
use the TPA3008D2 with a differential source, connect the positive lead of the audio source to the INP input and
the negative lead from the audio source to the INN input. To use the TPA3008D2 with a single-ended source, ac
ground the INP or INN input through a capacitor equal in value to the input capacitor on INN or INP and apply
the audio source to either input. In a single-ended input application, the unused input should be ac grounded at
the audio source instead of at the device input for best noise performance.
SHUTDOWN OPERATION
The TPA3008D2 employs a shutdown mode of operation designed to reduce supply current (I
minimum level during periods of nonuse for power conservation. The SHUTDOWN input terminal should be held
high (see specification table for trip point) during normal operation when the amplifier is in use. Pulling
SHUTDOWN low causes the outputs to mute and the amplifier to enter a low-current state. Never leave
SHUTDOWN unconnected, because amplifier operation would be unpredictable.
For the best power-off pop performance, place the amplifier in the shutdown mode prior to removing the power
supply voltage.
) to the absolute
CC
USING LOW-ESR CAPACITORS
Low-ESR capacitors are recommended throughout this application section. A real (as opposed to ideal) capacitor
can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor
minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance,
the more the real capacitor behaves like an ideal capacitor.
18
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
SHORT-CIRCUIT PROTECTION AND AUTOMATIC RECOVERY FEATURE
The TPA3008D2 has short-circuit protection circuitry on the outputs that prevents damage to the device during
output-to-output shorts, output-to-GND shorts, and output-to-V
outputs, the part immediately disables the output drive. This is a latched fault and must be reset by cycling the
voltage on the SHUTDOWN pin to a logic low and back to the logic high state for normal operation. This clears
the short-circuit flag and allows for normal operation if the short was removed. If the short was not removed, the
protection circuitry again activates.
The fault terminal can be used for automatic recovery from a short-circuit event, or used to monitor the status
with an external GPIO.
THERMAL PROTECTION
Thermal protection on the TPA3008D2 prevents damage to the device when the internal die temperature
exceeds 150° C. There is a ± 15 degree tolerance on this trip point from device to device. Once the die
temperature exceeds the thermal set point, the device enters into the shutdown state and the outputs are
disabled. This is not a latched fault. The thermal fault is cleared once the temperature of the die is reduced by
20° C. The device begins normal operation at this point with no external system interaction.
PRINTED-CIRCUIT BOARD (PCB) LAYOUT
Because the TPA3008D2 is a class-D amplifier that switches at a high frequency, the layout of the printed-circuit
board (PCB) should be optimized according to the following guidelines for the best possible performance.
• Decoupling capacitors—The high-frequency 0.1-µF decoupling capacitors should be placed as close to the
PVCC (pins 14, 15, 22, 23, 38, 39, 46, and 47) and AV
capacitor, AV
to the device as possible. Large (10 µF or greater) bulk power supply decoupling capacitors should be
placed near the TPA3008D2 on the PVCCL, PVCCR, and AV
• Grounding—The AV
(pin 28) capacitor, and ROSC (pin 27) resistor should each be grounded to analog ground (AGND, pins 26
and 30). The PVCC decoupling capacitors should each be grounded to power ground (PGND, pins 18, 19,
42, and 43). Analog ground and power ground may be connected at the PowerPAD, which should be used
as a central ground connection or star ground for the TPA3008D2. Basically, an island should be created
with a single connection to PGND at the PowerPAD.
• Output filter—The ferrite EMI filter (Figure 20 ) should be placed as close to the output terminals as possible
for the best EMI performance. The LC filter (Figure 19 ) should be placed close to the outputs. The capacitors
used in both the ferrite and LC filters should be grounded to power ground. If both filters are used, the LC
filter should be placed first, following the outputs.
• PowerPAD—The PowerPAD must be soldered to the PCB for proper thermal performance and optimal
reliability. The dimensions of the PowerPAD thermal land should be 5 mm by 5 mm (197 mils by 197 mils).
The PowerPAD size measures 4,55 x 4,55 mm. Four rows of solid vias (four vias per row, 0,3302 mm or 13
mils diameter) should be equally spaced underneath the thermal land. The vias should connect to a solid
copper plane, either on an internal layer or on the bottom layer of the PCB. The vias must be solid vias, not
thermal relief or webbed vias. For additional information, see the PowerPAD Thermally Enhanced Package
application note, (SLMA002).
For an example layout, see the TPA3008D2 Evaluation Module (TPA3008D2EVM) User Manual, (SLOU165).
Both the EVM user manual and the PowerPAD application note are available on the TI Web site at
http://www.ti.com.
(pin 29) capacitor, and VCLAMP (pins 25 and 36) capacitor should also be placed as close
DD
(pin 33) decoupling capacitor, AV
CC
shorts. When a short circuit is detected on the
CC
(pin 33) terminals as possible. The V2P5 (pin 4)
CC
terminals.
CC
(pin 29) capacitor, V2P5 (pin 4) capacitor, COSC
DD
19
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
BASIC MEASUREMENT SYSTEM
This application note focuses on methods that use the basic equipment listed below:
• Audio analyzer or spectrum analyzer
• Digital multimeter (DMM)
• Oscilloscope
• Twisted-pair wires
• Signal generator
• Power resistor(s)
• Linear regulated power supply
• Filter components
• EVM or other complete audio circuit
Figure 21 shows the block diagrams of basic measurement systems for class-AB and class-D amplifiers. A sine
wave is normally used as the input signal because it consists of the fundamental frequency only (no other
harmonics are present). An analyzer is then connected to the APA output to measure the voltage output. The
analyzer must be capable of measuring the entire audio bandwidth. A regulated dc power supply is used to
reduce the noise and distortion injected into the APA through the power pins. A System Two audio measurement
system (AP-II) (Reference 1) by Audio Precision includes the signal generator and analyzer in one package.
The generator output and amplifier input must be ac-coupled. However, the EVMs already have the ac-coupling
capacitors, (C
attenuating the test signal, and is important because the input resistance of APAs is not high. Conversely, the
analyzer-input impedance should be high. The output impedance, R
of milliohms and can be ignored for all but the power-related calculations.
Figure 21 (a) shows a class-AB amplifier system. It takes an analog signal input and produces an analog signal
output. This amplifier circuit can be directly connected to the AP-II or other analyzer input.
This is not true of the class-D amplifier system shown in Figure 21 (b), which requires low-pass filters in most
cases in order to measure the audio output waveforms. This is because it takes an analog input signal and
converts it into a pulse-width modulated (PWM) output signal that is not accurately processed by some
analyzers.
), so no additional coupling is required. The generator output impedance should be low to avoid
IN
, of the APA is normally in the hundreds
OUT
20
Analyzer
20 Hz − 20 kHz
(a) Basic Class−AB
APA
Signal
Generator
Power Supply
Analyzer
20 Hz − 20 kHz
R
L
(b) Filter-Free and Traditional Class-D
Class-D APA
Signal
Generator
Power Supply
R
L
Low-Pass RC
Filter
Low-Pass RC
Filter
(A)
(A)
For efficiency measurements with filter-free class-D, RL should be an inductive load like a speaker.
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
Figure 21. Audio Measurement Systems
The TPA3008D2 uses a modulation scheme that does not require an output filter for operation, but they do
sometimes require an RC low-pass filter when making measurements. This is because some analyzer inputs
cannot accurately process the rapidly changing square-wave output and therefore record an extremely high level
of distortion. The RC low-pass measurement filter is used to remove the modulated waveforms so the analyzer
can measure the output sine wave.
DIFFERENTIAL INPUT AND BTL OUTPUT
All of the class-D APAs and many class-AB APAs have differential inputs and bridge-tied load (BTL) outputs.
Differential inputs have two input pins per channel and amplify the difference in voltage between the pins.
Differential inputs reduce the common-mode noise and distortion of the input circuit. BTL is a term commonly
used in audio to describe differential outputs. BTL outputs have two output pins providing voltages that are 180
degrees out of phase. The load is connected between these pins. This has the added benefits of quadrupling the
output power to the load and eliminating a dc blocking capacitor.
A block diagram of the measurement circuit is shown in Figure 22 . The differential input is a balanced input,
meaning the positive (+) and negative (-) pins have the same impedance to ground. Similarly, the BTL output
equates to a balanced output.
21
C
IN
Audio Power
Amplifier
Generator
Low−Pass
RC Filter
C
IN
R
GEN
R
GEN
R
IN
R
IN
V
GEN
R
OUT
R
OUT
Analyzer
R
ANA
R
ANA
C
ANA
Low−Pass
RC Filter
R
L
C
ANA
Twisted-Pair Wire
Evaluation Module
Twisted-Pair Wire
TPA3008D2
SLOS435A – MAY 2004 – REVISED JULY 2004
Figure 22. Differential Input, BTL Output Measurement Circuit
The generator should have balanced outputs, and the signal should be balanced for best results. An unbalanced
output can be used, but it may create a ground loop that affects the measurement accuracy. The analyzer must
also have balanced inputs for the system to be fully balanced, thereby cancelling out any common-mode noise in
the circuit and providing the most accurate measurement.
The following general rules should be followed when connecting to APAs with differential inputs and BTL outputs:
• Use a balanced source to supply the input signal.
• Use an analyzer with balanced inputs.
• Use twisted-pair wire for all connections.
• Use shielding when the system environment is noisy.
• Ensure that the cables from the power supply to the APA, and from the APA to the load, can handle the large
currents (see Table 2 ).
Table 2 shows the recommended wire size for the power supply and load cables of the APA system. The real
concern is the dc or ac power loss that occurs as the current flows through the cable. These recommendations
are based on 12-inch long wire with a 20-kHz sine-wave signal at 25° C.
Table 2. Recommended Minimum Wire Size for Power Cables
P
(W) RL(Ω ) AWG Size
OUT
10 4 18 22 16 40 18 42
2 4 18 22 3.2 8 3.7 8.5
1 8 22 28 2 8 2.1 8.1
< 0.75 8 22 28 1.5 6.1 1.6 6.2
DC POWER LOSS AC POWER LOSS
(MW) (MW)
CLASS-D RC LOW-PASS FILTER
An RC filter is used to reduce the square-wave output when the analyzer inputs cannot process the pulse-width
modulated class-D output waveform. This filter has little effect on the measurement accuracy because the cutoff
frequency is set above the audio band. The high frequency of the square wave has negligible impact on
measurement accuracy because it is well above the audible frequency range, and the speaker cone cannot
respond at such a fast rate. The RC filter is not required when an LC low-pass filter is used, such as with the
class-D APAs that employ the traditional modulation scheme (TPA032D0x, TPA005Dxx).
The component values of the RC filter are selected using the equivalent output circuit as shown in Figure 23 . R
is the load impedance that the APA is driving for the test. The analyzer input impedance specifications should be
available and substituted for R
system. The filter should be grounded to the APA near the output ground pins or at the power supply ground pin
to minimize ground loops.
22
and C
ANA
. The filter components, R
ANA
FILT
and C
, can then be derived for the
FILT
L
R
FILT
R
L
R
FILT
C
FILT
VL= V
IN
V
OUT
R
ANA
C
ANA
R
ANA
C
ANA
C
FILT
To APA
GND
AP Analyzer Input
RC Low-Pass Filters
Load
V
OUT
V
IN
R
ANA
R
ANARFILT
1 j
O
C
FILT
1
2 fC R
FILT
SLOS435A – MAY 2004 – REVISED JULY 2004
Figure 23. Measurement Low-Pass Filter Derivation Circuit-Class-D APAs
TPA3008D2
The transfer function for this circuit is shown in Equation 8 where ω
C
= (C
EQ
+ C
FILT
). The filter frequency should be set above f
ANA
MAX
, the highest frequency of the measurement
= R
C
O
, R
EQ
EQ
= R
EQ
|| R
FILT
ANA
bandwidth, to avoid attenuating the audio signal. Equation 9 provides this cutoff frequency, fC. The value of R
must be chosen large enough to minimize current that is shunted from the load, yet small enough to minimize the
attenuation of the analyzer-input voltage through the voltage divider formed by R
that R
1% for R
An exception occurs with the efficiency measurements, where R
reduce the current shunted through the filter. C
should be small (~100 Ω ) for most measurements. This reduces the measurement error to less than
FILT
≥ 10 k Ω .
ANA
must be increased by a factor of ten to
must be decreased by a factor of ten to maintain the same
FILT
FILT
and R
FILT
. A rule of thumb is
ANA
cutoff frequency. See Table 3 for the recommended filter component values.
Once fCis determined and R
is selected, the filter capacitance is calculated using Equation 9 . When the
FILT
calculated value is not available, it is better to choose a smaller capacitance value to keep fCabove the minimum
desired value calculated in Equation 10 .
Table 3 shows recommended values of R
was originally calculated to be 28 kHz for an f
and C
FILT
MAX
of 20 kHz. C
based on common component values. The value of f
FILT
, however, was calculated to be 57,000 pF, but
FILT
the nearest values of 56,000 pF and 51,000 pF were not available. A 47,000-pF capacitor was used instead, and
fCis 34 kHz, which is above the desired value of 28 kHz.
and
FILT
(8)
(9)
(10)
C
MEASUREMENT R
All other measurements 100 Ω 56,000 pF
Table 3. Typical RC Measurement Filter Values
FILT
Efficiency 1000 Ω 5,600 pF
C
FILT
23
PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2007
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TPA3008D2PHP ACTIVE HTQFP PHP 48 250 Green (RoHS &
no Sb/Br)
TPA3008D2PHPG4 ACTIVE HTQFP PHP 48 250 Green (RoHS &
no Sb/Br)
TPA3008D2PHPR ACTIVE HTQFP PHP 48 1000 Green (RoHS &
no Sb/Br)
TPA3008D2PHPRG4 ACTIVE HTQFP PHP 48 1000 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-4-260C-72HR
CU NIPDAU Level-4-260C-72HR
CU NIPDAU Level-4-260C-72HR
CU NIPDAU Level-4-260C-72HR
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL BOX INFORMATION
5-Oct-2007
Device Package Pins Site Reel
Diameter
(mm)
TPA3008D2PHPR PHP 48 SITE60 330 16 9.6 9.6 1.5 12 16 Q2
Reel
Width
(mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2007
Device Package Pins Site Length (mm) Width (mm) Height (mm)
TPA3008D2PHPR PHP 48 SITE 60 346.0 346.0 33.0
Pack Materials-Page 2
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