TEXAS INSTRUMENTS TPA2028D1 Technical data

IN-
IN+
PGND
OUT+
OUT-
ToBattery
SDA
EN
MasterEnable
TPA2028D1
Digital
BaseBand
Analog
Baseband
or
CODEC
PVDD
10 Fm
C 1 F
(Optional)
IN
m
I CClock
2
I CData
2
TPA2028D1
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SLOS660 –JANUARY 2010
3-W Mono Class-D Audio Amplifier with Fast Gain Ramp SmartGain™ AGC/DRC
Check for Samples: TPA2028D1
1

FEATURES

23
Fast AGC Start-up Time: 5 ms
Pin-out Compatible with TPA2018D1
Filter-Free Class-D Architecture
3 W Into 4 at 5 V (10% THD+N)
880 mW Into 8 at 3.6 V (10% THD+N)
Power Supply Range: 2.5 V to 5.5 V
Flexible Operation With/Without I2C™
Programmable DRC/AGC Parameters
Digital I2C™ Volume Control
Selectable Gain from –28 dB to 30 dB in 1-dB speaker from damage at high power levels and
Steps (when compression is used)
Selectable Attack, Release and Hold Times
4 Selectable Compression Ratios
Low Supply Current: 1.8 mA
Low Shutdown Current: 0.2 mA
High PSRR: 80 dB
AGC Enable/Disable Function
Limiter Enable/Disable Function
Short-Circuit and Thermal Protection
Space-Saving Package – 1,63 mm × 1,63 mm Nano-Free™ WCSP
(YZF)

DESCRIPTION

The TPA2028D1 is a mono, filter-free Class-D audio power amplifier with volume control, dynamic range compression (DRC) and automatic gain control (AGC). It is available in a 1,63 mm x 1,63 mm wafer chip-scale package (WCSP).
The DRC/AGC function in the TPA2028D1 is programmable via a digital I2C interface. The DRC/AGC function can be configured to automatically prevent distortion of the audio signal and enhance quiet passages that are normally not heard. The DRC/AGC can also be configured to protect the
compress the dynamic range of music to fit within the dynamic range of the speaker. The gain can be selected from –28 dB to +30 dB in 1-dB steps. The TPA2028D1 is capable of driving 3 W at 5 V into 4 load or 880 mW at 3.6 V into 8 load. The device features hardware and software shutdown controls and also provides thermal and short-circuit protection. The TPA2028D1 has faster AGC gain ramp during start-up than TPA2018D1.
In addition to these features, a fast start-up time and small package size make the TPA2028D1 an ideal choice for cellular handsets, PDAs and other portable applications.

SIMPLIFIED APPLICATION DIAGRAM

APPLICATIONS

Wireless or Cellular Handsets and PDAs
Portable Navigation Devices
Portable DVD Player
Notebook PCs
Portable Radio
Portable Games
Educational Toys
USB Speakers
1
2Fast Gain Ramp SmartGain, Nano-Free are trademarks of Texas Instruments.
2
3I
C is a trademark of NXP Semiconductors.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2010, Texas Instruments Incorporated
OUT +
OUT -
PGND
PVDD
IN +
IN -
SDA
EN
SCL
Volume Control
1 Fm
ICEnable
Power
Stage
AGC
Reference
Biasand
References
AGC
I CInterface
2
Differential
Input
C
IN
I CInterface
andControl
2
Class-D
Modulator
IN-
PGND
ENOUT+
PVDDOUT-
SCL
IN+
SDA
C1 C2 C3
B1 B3B2
A1 A 2 A3
YZF(WCSP)PACKAGE
(TOP VIEW)
TPA2028D1
SLOS660 –JANUARY 2010
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
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FUNCTIONAL BLOCK DIAGRAM

DEVICE PINOUT

2 Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPA2028D1
TPA2028D1
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SLOS660 –JANUARY 2010
TERMINAL FUNCTIONS
TERMINAL I/O/P DESCRIPTION
NAME WCSP
EN B2 I Enable terminal (active high) IN+ B3 I Positive audio input IN– C3 I Negative audio input OUT+ B1 O Positive differential output OUT– C1 O Negative differential output PGND A1 P Power ground PVDD C2 P Power supply SCL A2 I I2C clock interface SDA A3 I/O I2C data interface

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted).
V
T T T ESD Electro-Static Discharge Tolerance, all pins Human Body Model (HBM) 2 kV
R
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
Supply voltage PVDD –0.3 V to 6.0 V
DD
Input voltage
Continuous total power dissipation Operating free-air temperature range –40°C to +85°C
A
Operating junction temperature range –40°C to +150°C
J
Storage temperature range –65°C to +150°C
stg
Minimum load resistance 3.2
LOAD
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1)
VALUE / UNIT
EN, IN+, IN– –0.3 V to VDD+0.3 V SDA, SCL –0.3 V to 6.0 V
See Dissipation Ratings
Table
Charged Device Model (CDM) 500 V

DISSIPATION RATINGS TABLE

PACKAGE TA≤ +25°C DERATING FACTOR TA= +70°C TA= +85°C
9-ball WCSP 1.19 W 9.52 mW/°C 0.76 W 0.62 W
(1) Dissipation ratings are for a 2-side, 2-plane PCB.
Copyright © 2010, Texas Instruments Incorporated 3
Product Folder Link(s): TPA2028D1
(1)
TPA2028D1
SLOS660 –JANUARY 2010
AVAILABLE OPTIONS
T
A
PACKAGED DEVICES
–40°C to 85°C 9-ball, WCSP NSU
(2)
(1)
PART NUMBER SYMBOL
TPA2028D1YZFR TPA2028D1YZFT
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(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com
(2) The YZF packages are only available taped and reeled. The suffix R indicates a reel of 3000; the suffix T indicates a reel of 250.

RECOMMENDED OPERATING CONDITIONS

MIN MAX UNIT
V
Supply voltage PVDD 2.5 5.5 V
DD
V
High-level input voltage EN, SDA, SCL 1.3 V
IH
V
Low-level input voltage EN, SDA, SCL 0.6 V
IL
T
Operating free-air temperature –40 +85 °C
A

ELECTRICAL CHARACTERISTICS

at TA= 25°C, VDD= 3.6 V, SDZ = 1.3 V, and RL= 8 + 33 mH (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
DD
I
SDZ
I
SWS
I
DD
f
SW
I
IH
I
IL
t
START
POR Power on reset ON threshold 2 2.3 V POR Power on reset hysteresis 0.2 V
CMRR Input common mode rejection –75 dB
V
oo
Z
OUT
PSRR Power supply rejection ratio VDD= 2.5 V to 4.7 V –80 dB
Supply voltage range 2.5 3.6 5.5 V
EN = 0.35 V, VDD= 2.5 V 0.1 1
Shutdown quiescent current EN = 0.35 V, VDD= 3.6 V 0.2 1 µA
EN = 0.35 V, VDD= 5.5 V 0.3 1
EN = 1.3 V, VDD= 2.5 V 35 50 Software shutdown quiescent current
EN = 1.3 V, VDD= 3.6 V 50 70 µA
EN = 1.3 V, VDD= 5.5 V 75 100
VDD= 2.5 V 1.5 2.5 Supply current VDD= 3.6 V 1.7 2.7 mA
VDD= 5.5 V 2 3.5 Class D Switching Frequency 275 300 325 kHz High-level input current VDD= 5.5 V, EN = 5.8 V 1 µA Low-level input current VDD= 5.5 V, EN = –0.3 V –1 µA Start-up time 2.5 V VDD≤ 5.5 V no pop, CIN≤ 1 mF 5 ms
RL= 8 , V
differential inputs shorted Output offset voltage 1.5 10 mV Output Impedance in shutdown 2 k
mode
VDD= 3.6 V, AV= 6 dB, RL= 8 , inputs ac
grounded
EN = 0.35 V
= 0.5 V and V
icm
= VDD– 0.8 V,
icm
Gain accuracy Compression and limiter disabled, Gain = 0 to 30 dB –0.5 0.5 dB
4 Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPA2028D1
TPA2028D1
IN+
IN–
OUT+
OUT–
V
DD
V
DD
GND
C
I
C
I
Measurement
Output
+
+
Load
30kHz
Low-Pass
Filter
Measurement
Input
+
1 Fm
TPA2028D1
www.ti.com
SLOS660 –JANUARY 2010

OPERATING CHARACTERISTICS

at TA= 25°C, VDD= 3.6V, EN = 1.3 V, RL= 8 +33 mH, and AV= 6 dB (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
k
SVR
THD+N Total harmonic distortion + noise
Nfo Nfo FR Frequency response Av = 6 dB 20 20000 Hz
Po
h Efficiency
power-supply ripple rejection ratio VDD= 3.6 Vdc with ac of 200 mVPPat 217 Hz –70 dB
f
= 1 kHz; PO= 550 mW; VDD= 3.6 V 0.1%
aud_in
f
= 1 kHz; PO= 1.25 W; VDD= 5 V 0.1%
aud_in
f
= 1 kHz; PO= 710 mW; VDD= 3.6 V 1%
aud_in
f
= 1 kHz; PO= 1.4 W; VDD= 5 V 1%
aud_in
Output integrated noise Av = 6 dB 42 mV
nF
Output integrated noise Av = 6 dB floor, A-weighted 30 mV
A
THD+N = 10%, VDD= 5 V, RL= 8 1.72 W THD+N = 10%, VDD= 3.6 V, RL= 8 880 mW
Maximum output power
max
THD+N = 1%, VDD= 5 V, RL= 8 1.4 W THD+N = 1% , VDD= 3.6 V, RL= 8 710 mW THD+N = 1% , VDD= 5 V, RL= 4 2.5 W THD+N = 10% , VDD= 5 V, RL= 4 3 W THD+N = 1%, VDD= 3.6 V, RL= 8 , PO= 0.71 W 91% THD+N = 1%, VDD= 5 V, RL= 8 , PO= 1.4 W 93%
TEST SET-UP FOR GRAPHS
(1) All measurements were taken with a 1-mF CI(unless otherwise noted.) (2) A 33-mH inductor was placed in series with the load resistor to emulate a small speaker for efficiency measurements. (3) The 30-kHz low-pass filter is required, even if the analyzer has an internal low-pass filter. An RC low-pass filter (1 k
4.7 nF) is used on each output for the data sheet graphs.
Product Folder Link(s): TPA2028D1
Copyright © 2010, Texas Instruments Incorporated 5
SCL
SDA
t
w(H)
t
w(L)
t
su1
t
h1
SCL
SDA
t
h2
t
(buf)
t
su2
t
su3
StartCondition
StopCondition
TPA2028D1
SLOS660 –JANUARY 2010

I2C TIMING CHARACTERISTICS

For I2C Interface Signals Over Recommended Operating Conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
f
SCL
t
W(H)
t
W(L)
t
SU(1)
t
h1
t
(buf)
t
SU2
t
h2
t
SU3
Frequency, SCL No wait states 400 kHz Pulse duration, SCL high 0.6 ms Pulse duration, SCL low 1.3 ms Setup time, SDA to SCL 100 ns Hold time, SCL to SDA 10 ns Bus free time between stop and start 1.3 ms
condition Setup time, SCL to start condition 0.6 ms Hold time, start condition to SCL 0.6 ms Setup time, SCL to stop condition 0.6 ms
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Figure 1. SCL and SDA Timing
Figure 2. Start and Stop Conditions Timing
6 Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPA2028D1
TPA2028D1
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SLOS660 –JANUARY 2010

TYPICAL CHARACTERISTICS

with C
(DECOUPLE)
All THD + N graphs are taken with outputs out of phase (unless otherwise noted).
= 1 mF, CI= 1 µF.

Table of Graphs

FIGURE
Quiescent supply current vs Supply voltage Figure 3 Supply current vs Supply voltage in shutdown Figure 4
vs Input level with limiter enabled Figure 5 vs Input level with 2:1 compression Figure 6
Output level vs Input level with 4:1 compression Figure 7
vs Input level with 8:1 compression Figure 8 vs Input level Figure 9
Supply ripple rejection ratio vs Frequency Figure 10
vs Frequency [RL= 8 , VDD= 3.6 V] Figure 11
Total harmonic distortion + noise
Total harmonic distortion + noise
Efficiency
Power dissipation
Supply current
Output power
Shutdown gain ramp comparison, TPA2028D1 vs TPA2018D1 Figure 25 Startup gain ramp comparison, TPA2028D1 vs TPA2018D1 Figure 26 Startup time Figure 27
vs Frequency [RL= 4 , VDD= 3.6 V] Figure 12 vs Frequency [RL= 8 , VDD= 5 V] Figure 13 vs Frequency [RL= 4 , VDD= 5 V] Figure 14 vs Output power [RL= 8 ] Figure 15 vs Output power [RL= 4 ] Figure 16 vs Output power [per channel, RL= 8 ] Figure 17 vs Output power [per channel, RL= 4 ] Figure 18 vs Output power [RL= 8 ] Figure 19 vs Output power [RL= 4 ] Figure 20 vs Output power [RL= 8 ] Figure 21 vs Output power [RL= 4 ] Figure 22 vs Supply voltage [RL= 8 ] Figure 23 vs Supply voltage [RL= 4 ] Figure 24
Copyright © 2010, Texas Instruments Incorporated 7
Product Folder Link(s): TPA2028D1
VDD − Supply Voltage − V
0
1
2
3
4
5
6
7
8
9
10
2.5 3.0 3.5 4.0 4.5 5.0 5.5
I
DD
− Quiescent Supply Current − mA
G001
RL = 8 + 33 µH EN = V
DD
VDD − Supply Voltage − V
0
10
20
30
40
50
60
70
80
90
100
2.5 3.0 3.5 4.0 4.5 5.0 5.5
I
DD
− Supply Current − µA
G002
En = 0 V
SWS = 1
RL = 8 + 33 µH
Input Level − dBV
−50
−40
−30
−20
−10
0
10
20
−40 −30 −20 −10 0 10
Output Level − dBV
G003
RL = 8 + 33 µH VDD = 5 V Fixed Gain = Max Gain = 30 dB Compression Ratio = 1:1
Limiter Level = −6.5 Limiter Level = −4.5 Limiter Level = −2.5 Limiter Level = −0.5 Limiter Level = 1.5 Limiter Level = 3.5 Limiter Level = 5.5 Limiter Level = 7.5 Limiter Level = 9
Input Level − dBV
−50
−40
−30
−20
−10
0
10
20
−70 −50 −30 −10 10
Output Level − dBV
G004
Limiter Level = 9 dBV RL = 8 + 33 µH VDD = 5 V Max Gain = 30 dB
Fixed Gain = −12 Fixed Gain = −9 Fixed Gain = −6 Fixed Gain = −3 Fixed Gain = 0 Fixed Gain = 3 Fixed Gain = 6 Fixed Gain = 9 Fixed Gain = 12
Input Level − dBV
−50
−40
−30
−20
−10
0
10
20
−70 −50 −30 −10 10
Output Level − dBV
G005
Limiter Level = 9 dBV RL = 8 + 33 µH VDD = 5 V Max Gain = 30 dB
Fixed Gain = −15 Fixed Gain = −12 Fixed Gain = −9 Fixed Gain = −6 Fixed Gain = −3 Fixed Gain = 0 Fixed Gain = 3 Fixed Gain = 6
Fixed Gain = −27 Fixed Gain = −24 Fixed Gain = −21 Fixed Gain = −18
Input Level − dBV
−50
−40
−30
−20
−10
0
10
20
−70 −50 −30 −10 10
Output Level − dBV
G006
Limiter Level = 9 dBV RL = 8 + 33 µH VDD = 5 V Max Gain = 30 dB
Fixed Gain = −12 Fixed Gain = −9 Fixed Gain = −6 Fixed Gain = −3 Fixed Gain = 0 Fixed Gain = 3
Fixed Gain = −27 Fixed Gain = −24 Fixed Gain = −21 Fixed Gain = −18 Fixed Gain = −15
TPA2028D1
SLOS660 –JANUARY 2010
QUIESCENT SUPPLY CURRENT SUPPLY CURRENT
INPUT LEVEL WITH LIMITER ENABLED INPUT LEVEL WITH 2:1 COMPRESSION
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vs vs
SUPPLY VOLTAGE SUPPLY VOLTAGE IN SHUTDOWN
Figure 3. Figure 4.
OUTPUT LEVEL OUTPUT LEVEL
vs vs
Figure 5. Figure 6.
OUTPUT LEVEL OUTPUT LEVEL
INPUT LEVEL WITH 4:1 COMPRESSION INPUT LEVEL WITH 8:1 COMPRESSION
8 Copyright © 2010, Texas Instruments Incorporated
Figure 7. Figure 8.
vs vs
Product Folder Link(s): TPA2028D1
Input Level − dBV
−50
−40
−30
−20
−10
0
10
20
−70 −50 −30 −10 10
Output Level − dBV
G007
Compression Ratio = 1:1 Compression Ratio = 2:1 Compression Ratio = 4:1 Compression Ratio = 8:1
Limiter Level = 9 dBV RL = 8 + 33 µH VDD = 5 V Fixed Gain = 0 dB Max Gain = 30 dB
−80
−70
−60
−50
−40
−30
−20
−10
0
f − Frequency − Hz
K
SVR
− Supply Ripple Rejection Ratio − dB
G014
Gain = 6 dB RL = 8 + 33 µH
20 100 1k 20k10k
VDD = 2.5 V
VDD = 5 V
VDD = 3.6 V
f − Frequency − Hz
THD+N − T otal Harmonic Distortion + Noise − %
20 100 1k 20k
10
0.1
0.01
0.001
G008
Gain = 6 dB RL = 8 + 33 µH VDD = 3.6 V
1
10k
PO = 0.05 W
PO = 0.5 W
PO = 0.25 W
f − Frequency − Hz
THD+N − T otal Harmonic Distortion + Noise − %
20 100 1k 20k
10
0.1
0.01
0.001
G010
Gain = 6 dB RL = 4 + 33 µH VDD = 3.6 V
1
10k
PO = 0.1 W
PO = 1 W
PO = 0.5 W
f − Frequency − Hz
THD+N − T otal Harmonic Distortion + Noise − %
20 100 1k 20k
10
0.1
0.01
0.001
G009
Gain = 6 dB RL = 8 + 33 µH VDD = 5 V
1
10k
PO = 0.5 W
PO = 0.1 W
PO = 1 W
f − Frequency − Hz
THD+N − T otal Harmonic Distortion + Noise − %
20 100 1k 20k
10
0.1
0.01
0.001
G011
Gain = 6 dB RL = 4 + 33 µH VDD = 5 V
1
10k
PO = 0.2 W
PO = 1 W
PO = 2 W
TPA2028D1
www.ti.com
SLOS660 –JANUARY 2010
OUTPUT LEVEL SUPPLY RIPPLE REJECTION RATIO
vs vs
INPUT LEVEL FREQUENCY
Figure 9. Figure 10.
TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE
vs vs
FREQUENCY FREQUENCY
Figure 11. Figure 12.
TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE
FREQUENCY FREQUENCY
Copyright © 2010, Texas Instruments Incorporated 9
Figure 13. Figure 14.
vs vs
Product Folder Link(s): TPA2028D1
PO − Output Power − W
THD+N − T otal Harmonic Distortion + Noise − %
0.01 0.1 1 3
100
1
0.1
0.01
G012
Gain = 6 dB RL = 8 + 33 µH f = 1 kHz
10
VDD = 3.6 V
VDD = 5 V
PO − Output Power − W
THD+N − T otal Harmonic Distortion + Noise − %
0.01 0.1 1 5
100
1
0.1
0.01
G013
Gain = 6 dB RL = 4 + 33 µH f = 1 kHz
10
VDD = 3.6 V
VDD = 5 V
PO − Output Power − W
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0
η − Efficiency − %
G015
Gain = 6 dB RL = 8 + 33 µH f = 1 kHz
VDD = 2.5 V
VDD = 3.6 V
VDD = 5 V
PO − Output Power − W
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
η − Efficiency − %
G018
Gain = 6 dB RL = 4 + 33 µH f = 1 kHz
VDD = 2.5 V
VDD = 3.6 V
VDD = 5 V
PO − Output Power − W
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.0 0.5 1.0 1.5 2.0
P
D
− Power Dissipation − W
G016
Gain = 6 dB RL = 8 + 33 µH f = 1 kHz
VDD = 5 V
VDD = 3.6 V
VDD = 2.5 V
PO − Output Power − W
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
P
D
− Power Dissipation − W
G019
Gain = 6 dB RL = 4 + 33 µH f = 1 kHz
VDD = 5 V
VDD = 3.6 V
VDD = 2.5 V
TPA2028D1
SLOS660 –JANUARY 2010
TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE
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vs vs
OUTPUT POWER OUTPUT POWER
Figure 15. Figure 16.
EFFICIENCY EFFICIENCY
vs vs
OUTPUT POWER OUTPUT POWER
Figure 17. Figure 18.
POWER DISSIPATION POWER DISSIPATION
OUTPUT POWER OUTPUT POWER
10 Copyright © 2010, Texas Instruments Incorporated
Figure 19. Figure 20.
vs vs
Product Folder Link(s): TPA2028D1
PO − Output Power − W
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.0 0.5 1.0 1.5 2.0
I
DD
− Supply Current − A
G017
Gain = 6 dB RL = 8 + 33 µH f = 1 kHz
VDD = 3.6 V
VDD = 2.5 V
VDD = 5 V
PO − Output Power − W
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
I
DD
− Supply Current − A
G020
VDD = 3.6 V
VDD = 2.5 V
VDD = 5 V
Gain = 6 dB RL = 4 + 33 µH f = 1 kHz
VDD − Supply Voltage − V
0.0
0.5
1.0
1.5
2.0
2.5
2.5 3.0 3.5 4.0 4.5 5.0 5.5
P
O
− Output Power − W
G021
Gain = 6 dB RL = 8 + 33 µH f = 1 kHz
THD = 1%
THD = 10%
VDD − Supply Voltage − V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
P
O
− Output Power − W
G022
Gain = 6 dB RL = 4 + 33 µH f = 1 kHz
THD = 1%
THD = 10%
t − Time − s
V − Voltage − V
0 5m 10m 15m 20m
−4
−2
0
2
4
6
8
10
TPA2028D1 OUTP−OUTM TPA2018D1 OUTP−OUTM SCL − Speaker Enable
VDD = 5.0 V Fixed Gain = 6 dB, CR = 1:1 VIN = 707 mV
RMS
@ 1kHz
RL = 8 + 33 µH
t − Time − s
V − Voltage − V
0 1 2 3 4 5
−4
−2
0
2
4
6
8
10
TPA2028D1 OUTP−OUTM TPA2018D1 OUTP−OUTM SCL − Speaker Enable
VDD = 5.0 V Fixed Gain = 6 dB, CR = 1:1 VIN = 707 mV
RMS
@ 1kHz
RL = 8 + 33 µH
TPA2028D1
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SLOS660 –JANUARY 2010
SUPPLY CURRENT SUPPLY CURRENT
vs vs
OUTPUT POWER OUTPUT POWER
Figure 21. Figure 22.
OUTPUT POWER OUTPUT POWER
vs vs
SUPPLY VOLTAGE SUPPLY VOLTAGE
Figure 23. Figure 24.
TPA2028D1 TPA2028D1 TPA2018D1 TPA2018D1
Figure 25. Shutdown Gain Ramp Comparison Figure 26. Startup Gain Ramp Comparison
Copyright © 2010, Texas Instruments Incorporated 11
vs vs
Product Folder Link(s): TPA2028D1
1
0.5
0.75
0.25
0
-0.25
-0.5
-0.75
-1 0 2m1m 3m 4m 5m 6m 8m7m 9m 10m
t – Time – s
V – Voltage
– V
SWSDisable
Output
G024
TPA2028D1
SLOS660 –JANUARY 2010
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Figure 27. Start-Up Time
12 Copyright © 2010, Texas Instruments Incorporated
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TPA2028D1
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SLOS660 –JANUARY 2010

APPLICATION INFORMATION

AUTOMATIC GAIN CONTROL

The Automatic Gain Control (AGC) feature provides continuous automatic gain adjustment to the amplifier through an internal PGA. This feature enhances the perceived audio loudness and at the same time prevents speaker damage from occurring (Limiter function).
The AGC function attempts to maintain the audio signal gain as selected by the user through the Fixed Gain, Limiter Level, and Compression Ratio variables. Other advanced features included are Maximum Gain and Noise Gate Threshold. Table 1 describes the function of each variable in the AGC function.
Table 1. TPA2028D1 AGC Variable Descriptions
VARIABLE DESCRIPTION
Maximum Gain The gain at the lower end of the compression region. Fixed Gain The normal gain of the device when the AGC is inactive.
The fixed gain is also the initial gain when the device comes out of shutdown mode or when the AGC is
disabled. Limiter Level The value that sets the maximum allowed output amplitude. Compression Ratio The relation between input and output voltage. Noise Gate Threshold Below this value, the AGC holds the gain to prevent breathing effects. Attack Time The minimum time between two gain decrements. Release Time The minimum time between two gain increments. Hold Time The time it takes for the very first gain increment after the input signal amplitude decreases.
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ReleaseTime
E
Limiterthreshold
GAIN
A
C
B
D
AttackTime
Limiterthreshold
Limiterthreshold
HoldTime
INPUTSIGNAL
OUTPUTSIGNAL
Limiterthreshold
TPA2028D1
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The AGC works by detecting the audio input envelope. The gain changes depending on the amplitude, the limiter level, the compression ratio, and the attack and release time. The gain changes constantly as the audio signal increases and/or decreases to create the compression effect. The gain step size for the AGC is 0.5 dB. If the audio signal has near-constant amplitude, the gain does not change. Figure 28 shows how the AGC works.
A. Gain decreases with no delay; attack time is reset. Release time and hold time are reset. B. Signal amplitude above limiter level, but gain cannot change because attack time is not over. C. Attack time ends; gain is allowed to decrease from this point forward by one step. Gain decreases because the
amplitude remains above limiter threshold. All times are reset
D. Gain increases after release time finishes and signal amplitude remains below desired level. All times are reset after
the gain increase.
E. Gain increases after release time is finished again because signal amplitude remains below desired level. All times
are reset after the gain increase.
Figure 28. Input and Output Audio Signal vs Time
Since the number of gain steps is limited the compression region is limited as well. The following figure shows how the gain changes vs. the input signal amplitude in the compression region.
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Gain-dB
V -dBV
IN
V -dBV
OUT
V -dBV
IN
Increasing FixedGain
Decreasing FixedGain
FixedGain=6dB
FixedGain=3dB
1:1
TPA2028D1
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Figure 29. Input Signal Voltage vs Gain
Thus the AGC performs a mapping of the input signal vs. the output signal amplitude. This mapping can be modified according to the variables from Table 1.
The following graphs and explanations show the effect of each variable to the AGC independently and which considerations should be taken when choosing values.
Fixed Gain: The fixed gain determines the initial gain of the AGC. Set the gain using the following variables:
Set the fixed gain to be equal to the gain when the AGC is disabled.
Set the fixed gain to maximize SNR.
Set the fixed gain such that it will not overdrive the speaker.
Figure 30 shows how the fixed gain influences the input signal amplitude vs. the output signal amplitude state
diagram. The dotted 1:1 line is displayed for reference. The 1:1 line means that for a 1dB increase in the input signal, the output increases by 1dB.
Figure 30. Output Signal vs Input Signal State Diagram Showing Different Fixed Gain Configurations
If the Compression function is enabled, the Fixed Gain is adjustable from –28dB to 30dB. If the Compression function is disabled, the Fixed gain is adjustable from 0dB to 30dB.
Limiter Level: The Limiter level sets the maximum amplitude allowed at the output of the amplifier. The limiter should be set with the following constraints in mind:
Below or at the maximum power rating of the speaker
Below the minimum supply voltage in order to avoid clipping
Figure 31 shows how the limiter level influences the input signal amplitude vs. the output signal amplitude state
diagram.
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Product Folder Link(s): TPA2028D1
V -dBV
OUT
V -dBV
IN
Increasing Limiter Level
Decreasing Limiter Level
LimiterLevel= 500 mW
LimiterLevel= 630 mW
= 400LimiterLevel mW
V -dBV
OUT
V -dBV
IN
1:1
LargeFixedGain
Small Fixed Gain
Input signal initial amplitude - |Current input signal amplitude|
Output signal amplitude =
Compression ratio
0dBV | 32 dBV|
8dBV =
4
- -
-
TPA2028D1
SLOS660 –JANUARY 2010
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Figure 31. Output Signal vs Input Signal State Diagram Showing Different Limiter Level Configurations
The limiter level and the fixed gain influence each other. If the fixed gain is set high, the AGC has a large limiter range. The fixed gain is set low, the AGC has a short limiter range. Figure 32 illustrates the two examples:
Figure 32. Output Signal vs. Input Signal State Diagram Showing Same Limiter Level Configurations with
Compression Ratio: The compression ratio sets the relation between input and output signal outside the limiter
level region. The compression ratio compresses the dynamic range of the audio. For example if the audio source has a dynamic range of 60dB and compression ratio of 2:1 is selected, then the output has a dynamic range of 30dB. Most small form factor speakers have small dynamic range. Compression ratio allows audio with large dynamic range to fit into a speaker with small dynamic range.
The compression ratio also increases the loudness of the audio without increasing the peak voltage. The higher the compression ratio, the louder the perceived audio.
For example:
A compression ratio of 4:1 is selected (meaning that a 4dB change in the input signal results in a 1dB signal change at the output)
A fixed gain of 0dB is selected and the maximum audio level is at 0dBV.
When the input signal decreases to –32dBV, the amplifier increases the gain to 24dB in order to achieve an output of –8dBV. The output signal amplitude equation is:
In this example:
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Different Fixed Gain Configurations
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(1)
(2)
1
Gain change = 1 × Input signal change
Compression ratio
æ ö
-
ç ÷ è ø
1
24 dB = 1 × 32
4
æ ö
-
ç ÷ è ø
V -dBV
OUT
V -dBV
IN
Increasing FixedGain
Decreasing
1 :1
2
:
1
4
:
1
8
:
1
1 :1
2
:
1
4
:
1
8
:
1
Rotation Point@ lowergain
Rotation Point@ highergain
TPA2028D1
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SLOS660 –JANUARY 2010
The gain change equation is:
Consider the following when setting the compression ratio:
Dynamic range of the speaker
Fixed gain level
Limiter Level
Audio Loudness vs Output Dynamic Range.
Figure 33 shows different settings for dynamic range and different fixed gain selected but no limiter level.
(3)
(4)
Figure 33. Output Signal vs Input Signal State Diagram Showing Different Compression Ratio
The rotation point is always at Vin = 10dBV. The rotation point is not located at the intersection of the limiter region and the compression region. By changing the fixed gain the rotation point will move in the y-axis direction only, as shown in the previous graph.
Interaction between compression ratio and limiter range: The compression ratio can be limited by the limiter range. Note that the limiter range is selected by the limiter level and the fixed gain.
For a setting with large limiter range, the amount of gain steps in the AGC remaining to perform compression are limited. Figure 34 shows two examples, where the fixed gain was changed.
1. Small limiter range yielding a large compression region (small fixed gain).
2. Large limiter range yielding a small compression region (large fixed gain).
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Configurations with Different Fixed Gain Configurations
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V
OUT
-dBV
V - dBV
IN
1:1
Large Limiter
Range
Small
Compression
Region
Large
Compression
Region
Small Limiter
Range
Rotation
Point @
lower gain
Rotation Point @ higher gain
time
Gain-dB
InputSignal
Amplitude-Vrms
time
NoiseGateThreshold
No
Audio
Gaindoesnotchange
inthisregion
TPA2028D1
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Figure 34. Output Signal vs Input Signal State Diagram Showing the Effects of the Limiter Range to the
Compression Region
Noise Gate Threshold: The noise gate threshold prevents the AGC from changing the gain when there is no
audio at the input of the amplifier. The noise gate threshold stops gain changes until the input signal is above the noise gate threshold. Select the noise gate threshold to be above the noise but below the minimum audio at the input of the amplifier signal. A filter is needed between delta-sigma CODEC/DAC and TPA2028D1 for effectiveness of the noise gate function. The filter eliminates the out-of-band noise from delta-sigma modulation and keeps the CODEC/DAC output noise lower than the noise gate threshold.
Figure 35. Time Diagram Showing the Relationship Between Input Signal Amplitude, Noise Gate
Maximum Gain: This variable limits the number of gain steps in the AGC. This feature is useful in order to
accomplish a more advanced output signal vs. input signal transfer characteristic. For example, to prevent the gain from going above a certain value, reduce the maximum gain. However, this variable will affect the limiter range and the compression region. If the maximum gain is
decreased, the limiter range and/or compression region is reduced. Figure 36 illustrates the effects.
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Threshold and Gain Versus Time
Product Folder Link(s): TPA2028D1
V -dBV
OUT
V -dBV
IN
MaxGain
= 22dB
MaxGain
= 30dB
1:1
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Figure 36. Output Signal vs. Input Signal State Diagram Showing Different Maximum Gains
A particular application requiring maximum gain of 22dB, for example. Thus, set the maximum gain at 22dB. The amplifier gain will never have a gain higher than 22dB; however, this will reduce the limiter range.
Attack, Release, and Hold time:
The attack time is the minimum time between gain decreases.
The release time is the minimum time between gain increases.
The hold time is the minimum time between a gain decrease (attack) and a gain increase (release). The hold time can be deactivated. Hold time is only valid if greater than release time.
Successive gain decreases are never faster than the attack time. Successive gain increases are never faster than the release time.
All time variables (attack, release and hold) start counting after each gain change performed by the AGC. The AGC is allowed to decrease the gain (attack) only after the attack time finishes. The AGC is allowed to increase the gain (release) only after the release time finishes counting. However, if the preceding gain change was an attack (gain increase) and the hold time is enabled and longer than the release time, then the gain is only increased after the hold time.
The hold time is only enabled after a gain decrease (attack). The hold time replaces the release time after a gain decrease (attack). If the gain needs to be increased further, then the release time is used. The release time is used instead of the hold time if the hold time is disabled.
The attack time should be at least 100 times shorter than the release and hold time. The hold time should be the same or greater than the release time. It is important to select reasonable values for those variables in order to prevent the gain from changing too often or too slow.
Figure 37 illustrates the relationship between the three time variables.
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InputSignal
Amplitue(Vrms)
GaindB
Attacktime
Releasetime
Timereset
Timeend
Holdtime
time
Holdtimernotusedafter
firstgainincrease
1
:
1
2:1
1:1
Noise Gate Threshold
Maximum
Gain
Fixed
Gain
Limiter Level
Compression Region
Attack Time
R
e
l
e
a
s
e
T
im
e
4:1
8:1
10dBV
Rotation Point
V
OUT
-dBV
V - dBV
IN
¥:1
TPA2028D1
SLOS660 –JANUARY 2010
www.ti.com
Figure 37. Time Diagram Showing the Relation Between the Attack, Release, and Hold Time vs Input
Signal Amplitude and Gain
Figure 38 shows a state diagram of the input signal amplitude vs. the output signal amplitude and a summary of
how the variables from table 1 described in the preceding pages affect them.
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Figure 38. Output Signal vs. Input Signal State Diagram
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TPA2028D1 AGC AND START-UP OPERATION

The TPA2028D1 is controlled by the I2C interface. The correct start-up sequence is:
1. Apply the supply voltage to the PVDDpin.
2. Apply a voltage above VIHto the EN pin. The TPA2028D1 powers up the I2C interface and the control logic. I2C registers are reset to default value. By default, the device is in active mode (SWS = 0). After 5 ms the amplifier will enable the class-D output stage and become fully operational.
CAUTION
Do not interrupt the start-up sequence after changing EN from VILto V
CAUTION
Do not interrupt the start-up sequence after changing SWS from 1 to 0.

AGC STARTUP CONDITION

The amplifier gain at start-up depends on the following conditions:
1. Start-up from hardware reset (EN from 0 to 1): The amplifier starts up immediately at default fixed gain. AGC starts controlling gain once the input audio signal exceeds noise gate threshold.
2. Start-up from software shutdown (SWS from 1 to 0): The amplifier starts up immediately at the latest fixed gain during software shutdown, regardless the attack/ release time. For example:
– Audio is playing at fixed gain 6dB – Devices goes to software shutdown (SWS = 1) – Set fixed gain from 6 dB to 12 dB – Remove software shutdown (SWS = 0) – Amplifier starts up immediately at 12 dB
3. During audio playback with AGC on, gain changes according to attack/ release time. For example: – Audio is playing at fixed gain 6 dB and 1:1 compression ratio – Set fixed gain from 6 dB to 12 dB, at release time 500 ms / 6 dB – Amplifier will take 500 ms to ramp from 6 dB to 12 dB
4. When EN = 0 and SWS = 0, the amplifier is set at fixed gain. The amplifier starts up at fixed gain when EN transitions from 0 to 1.
The default conditions of TPA2028D1 allows audio playback without I2C control. Refer to Table 4 for entire default conditions.
There are several options to disable the amplifier:
Write EN = 0 to the register (0x01, 6). This write disables the amplifier, but leaves all other circuits operating.
Write SWS = 1 to the register (0x01, 5). This action disables most of the amplifier functions.
Apply VILto EN. This action shuts down all the circuits and has very low quiescent current consumption. This action resets the register to its default values.
IH.
CAUTION
Do not interrupt the shutdown sequence after changing EN from VIHto VIL. Do not interrupt the shutdown sequence after changing SWS from 0 to 1.
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Register(N)
8-BitDatafor 8-BitDatafor
Register(N+1)
TPA2028D1
SLOS660 –JANUARY 2010
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TPA2028D1 AGC RECOMMENDED SETTINGS

Table 2. Recommended AGC Settings for Different Types of Audio Source (VDD= 3.6V)
AUDIO COMPRESSION ATTACK TIME RELEASE TIME HOLD TIME FIXED GAIN LIMITER LEVEL
SOURCE RATIO (ms/6 dB) (ms/6 dB) (ms) (dB) (dBV)
Pop Music 4:1 1.28 to 3.84 986 to 1640 137 6 7.5 Classical 2:1 2.56 1150 137 6 8 Jazz 2:1 5.12 to 10.2 3288 6 8 Rap / Hip Hop 4:1 1.28 to 3.84 1640 6 7.5 Rock 2:1 3.84 4110 6 8 Voice / News 4:1 2.56 1640 6 8.5

GENERAL I2C OPERATION

The I2C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a system. The bus transfers data serially one bit at a time. The address and data 8-bit bytes are transferred most significant bit (MSB) first. In addition, each byte transferred on the bus is acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master device driving a start condition on the bus and ends with the master device driving a stop condition on the bus. The bus uses transitions on the data terminal (SDA) while the clock is at logic high to indicate start and stop conditions. A high-to-low transition on SDA indicates a start and a low-to-high transition indicates a stop. Normal data-bit transitions must occur within the low time of the clock period. Figure 39 shows a typical sequence. The master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another device, and then waits for an acknowledge condition. The TPA2028D1 holds SDA low during the acknowledge clock period to indicate acknowledgment. When this acknowledgment occurs, the master transmits the next byte of the sequence. Each device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the same signals via a bidirectional bus using a wired-AND connection.
An external pull-up resistor must be used for the SDA and SCL signals to set the logic high level for the bus.
Figure 39. Typical I2C Sequence
There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is shown in Figure 39.

SINGLE-AND MULTIPLE-BYTE TRANSFERS

The serial control interface supports both single-byte and multi-byte read/write operations for all registers. During multiple-byte read operations, the TPA2028D1 responds with data, one byte at a time, starting at the
register assigned, as long as the master device continues to respond with acknowledgments. The TPA2028D1 supports sequential I2C addressing. For write transactions, if a register is issued followed by
data for that register and all the remaining registers that follow, a sequential I2C write transaction has occurred. For I2C sequential write transactions, the register issued then serves as the starting point, and the amount of data subsequently transmitted, before a stop or start is transmitted, determines the number of registers written.
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A6 A5 A4 A3 A2 A1 A0
R/W
ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK
Start
Condition
Stop
Condition
Acknowledge Acknowledge Acknowledge
I2CDeviceAddressand
Read/WriteBit
Register DataByte
Register
TPA2028D1
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SLOS660 –JANUARY 2010

SINGLE-BYTE WRITE

As Figure 40 shows, a single-byte data write transfer begins with the master device transmitting a start condition followed by the I2C device address and the read/write bit. The read/write bit determines the direction of the data transfer. For a write data transfer, the read/write bit must be set to '0'. After receiving the correct I2C device address and the read/write bit, the TPA2028D1 responds with an acknowledge bit. Next, the master transmits the register byte corresponding to the TPA2028D1 internal memory address being accessed. After receiving the register byte, the TPA2028D1 again responds with an acknowledge bit. Next, the master device transmits the data byte to be written to the memory address being accessed. After receiving the register byte, the TPA2028D1 again responds with an acknowledge bit. Finally, the master device transmits a stop condition to complete the single-byte data write transfer.
Figure 40. Single-Byte Write Transfer

MULTIPLE-BYTE WRITE AND INCREMENTAL MULTIPLE-BYTE WRITE

A multiple-byte data write transfer is identical to a single-byte data write transfer except that multiple data bytes are transmitted by the master device to the TPA2028D1 as shown in Figure 41. After receiving each data byte, the TPA2028D1 responds with an acknowledge bit.
Figure 41. Multiple-Byte Write Transfer

SINGLE-BYTE READ

As Figure 42 shows, a single-byte data read transfer begins with the master device transmitting a start condition followed by the I2C device address and the read/write bit. For the data read transfer, both a write followed by a read are actually executed. Initially, a write is executed to transfer the address byte of the internal memory address to be read. As a result, the read/write bit is set to a '0'.
After receiving the TPA2028D1 address and the read/write bit, the TPA2028D1 responds with an acknowledge bit. The master then sends the internal memory address byte, after which the TPA2028D1 issues an acknowledge bit. The master device transmits another start condition followed by the TPA2028D1 address and the read/write bit again. This time the read/write bit is set to '1', indicating a read transfer. Next, the TPA2028D1 transmits the data byte from the memory address being read. After receiving the data byte, the master device transmits a not-acknowledge followed by a stop condition to complete the single-byte data read transfer.
Copyright © 2010, Texas Instruments Incorporated 23
Product Folder Link(s): TPA2028D1
A6 A5 A0 R/W ACK A7 A6 A5 A4 A0 ACK A6 A5 A0 ACK
Start
Condition
Stop
Condition
Acknowledge Acknowledge Acknowledge
I2CDeviceAddressand
Read/WriteBit
Register DataByte
D7 D6 D1 D0 ACK
I2CDeviceAddressand
Read/WriteBit
Not
Acknowledge
R/WA1 A1
RepeatStart
Condition
A6 A0 ACK
Acknowledge
I2CDeviceAddressand
Read/WriteBit
R/WA6 A0 R/W ACK A0 ACK D7 D0 ACK
Start
Condition
Stop
Condition
Acknowledge Acknowledge Acknowledge
LastDataByte
ACK
FirstDataByte
RepeatStart
Condition
Not
Acknowledge
I2CDeviceAddressand
Read/WriteBit
Register
OtherDataBytes
A7 A6 A5 D7 D0 ACK
Acknowledge
D7 D0
TPA2028D1
SLOS660 –JANUARY 2010
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Figure 42. Single-Byte Read Transfer

MULTIPLE-BYTE READ

A multiple-byte data read transfer is identical to a single-byte data read transfer except that multiple data bytes are transmitted by the TPA2028D1 to the master device as shown in Figure 43. With the exception of the last data byte, the master device responds with an acknowledge bit after receiving each data byte.
Figure 43. Multiple-Byte Read Transfer

Register Map

Table 3. TPA2028D1 Register Map
Register Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
1 0 EN SWS 0 FAULT Thermal 1 NG_EN 2 0 0 ATK_time [5] ATK_time [4] ATK_time [3] ATK_time [2] ATK_time [1] ATK_time [0] 3 0 0 REL_time [5] REL_time [4] REL_time [3] REL_time [2] REL_time [1] REL_time [0] 4 0 0 Hold_time [5] Hold_time [4] Hold_time [3] Hold_time [2] Hold_time [1] Hold_time [0] 5 0 0 FixedGain [5] FixedGain [4] FixedGain [3] FixedGain [2] FixedGain [1] FixedGain [0]
6 Limiter Threshold
Output NoiseGate
Disable [1]
7 Max Gain [1] Max Gain [0] 0 0
Max Gain Max Gain Compression Compression
[3] [2] Ratio [1] Ratio [0]
The default register map values are given in Table 4.
Register 0x01 0x02 0x03 0x04 0x05 0x06 0x07
Default C3h 05h 0Bh 00h 06h 3Ah C2h
Any register above address 0x08 is reserved for testing and should not be written to because it may change the function of the device. If read, these bits may assume any value.
Some of the default values can be reprogrammed through the I2C interface and written to the EEPROM. This function is useful to speed up the turn-on time of the device and minimizes the number of I2C writes. If this is required, contact your local TI representative.
24 Copyright © 2010, Texas Instruments Incorporated
NoiseGate Output Limiter Output Limiter Output Limiter Output Limiter Output Limiter
Threshold [2] Level [4] Level [3] Level [2] Level [1] Level [0]
Table 4. TPA2028D1 Default Register Values Table
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The TPA2028D1 I2C address is 0xB0 (binary 10110000) for writing and 0xB1 (binary 10110001) for reading. If a different I2C address is required, please contact your local TI representative. See the General I2C operation section for more detail.
The following tables show the details of the registers, the default values, and the values that can be programmed through the I2C interface.

IC FUNCTION CONTROL (Address: 1)

REGISTER I2C BIT LABEL DEFAULT DESCRIPTION ADDRESS
01 (01H) – IC 7 Unused 1 Function Control
6 EN 1 (enabled) Enables amplifier 5 SWS 0 (enabled) Shutdown IC when bit = 1 4 Unused 0 3 FAULT 0 Changes to a 1 when there is a short at the output. Reset by writing a 0 2 Thermal 0 Changes to a 1 when die temperature is above 150°C 1 Unused 1 0 NG_EN 1 (enabled) Enables Noise Gate function
EN: Enable bit for the audio amplifier channel. Amplifier is active when bit is high. This function is
gated by thermal and returns once the IC is below the threshold temperature
SWS: Software shutdown control. The device is in software shutdown when the bit is '1' (control, bias
and oscillator are inactive). When the bit is '0' the control, bias and oscillator are enabled.
Fault: This bit indicates that an over-current event has occurred on the channel with a '1'. This bit is
cleared by writing a '0' to it.
Thermal: This bit indicates a thermal shutdown that was initiated by the hardware with a '1'. This bit is
deglitched and latched, and can be cleared by writing a '0' to it.
NG_EN: Enable bit for the Noise Gate function. This function is enabled when this bit is high. This
function can only be enabled when the Compression ratio is not 1:1.

AGC ATTACK CONTROL (Address: 2)

REGISTER I2C
ADDRESS BIT
02 (02H) – 7:6 Unused 00 AGC Attack Control
5:0 ATK_time 000101 AGC Attack time (gain ramp down)
LABEL DEFAULT DESCRIPTION
(6.4 ms/6 dB)
000001 0.1067 ms 1.28 ms 5.76 ms 000010 0.2134 ms 2.56 ms 11.52 ms 000011 0.3201 ms 3.84 ms 17.19 ms 000100 0.4268 ms 5.12 ms 23.04 ms
(time increases by 0.1067 ms with every step)
111111 6.722 ms 80.66 ms 362.99 ms
Per Step Per 6 dB 90% Range
ATK_time These bits set the attack time for the AGC function. The attack time is the minimum time
between gain decreases.
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AGC RELEASE CONTROL (Address: 3)

REGISTER I2C
ADDRESS BIT
03 (03H) – 7:6 Unused 00 AGC Release Control
5:0 REL_time 001011 AGC Release time (gain ramp down)
LABEL DEFAULT DESCRIPTION
(1.81 sec/6 dB)
000001 0.0137 s 0.1644 s 0.7398 s 000010 0.0274 s 0.3288 s 1.4796 s 000011 0.0411 s 0.4932 s 2.2194 s 000100 0.0548 s 0.6576 s 2.9592 s
(time increases by 0.0137 s with every step)
111111 0.8631 s 10.36 s 46.6 s
Per Step Per 6 dB 90% Range
REL_time These bits set the release time for the AGC function. The release time is the minimum time
between gain increases.

AGC HOLD TIME CONTROL (Address: 4)

REGISTER I2C
ADDRESS BIT
04 (04H) – 7:6 Unused 00 AGC Hold Time Control
5:0 Hold_time 000000 (Disabled) AGC Hold time
LABEL DEFAULT DESCRIPTION
(time increases by 0.0137 s with
Per Step 000000 000001 0.0137 s
000010 0.0274 s 000011 0.0411 s 000100 0.0548 s
every step)
111111 0.8631 s
Hold Time
Disable
Hold_time These bits set the hold time for the AGC function. The hold time is the minimum time between
a gain decrease (attack) and a gain increase (release). The hold time can be deactivated.
26 Copyright © 2010, Texas Instruments Incorporated
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TPA2028D1
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SLOS660 –JANUARY 2010

AGC FIXED GAIN CONTROL (Address: 5)

REGISTER I2C
ADDRESS BIT
05 (05H) – 7:6 UNUSED 00 AGC Fixed Gain Control
5:0 Fixed Gain 00110 (6dB) Sets the fixed gain of the amplifier: two's complement
LABEL DEFAULT DESCRIPTION
Gain 100100 –28 dB 100101 –27 dB 100110 –26 dB
(gain increases by 1 dB with every step)
111101 –3 dB 111110 –2 dB 111111 –1 dB 000000 0 dB 000001 1 dB 000010 2 dB 000011 3 dB
(gain increases by 1dB with every step)
011100 28 dB 011101 29 dB 011110 30 dB
Fixed Gain These bits are used to select the fixed gain of the amplifier. If the Compression is enabled,
fixed gain is adjustable from –28dB to 30dB. If the Compression is disabled, fixed gain is adjustable from 0dB to 30dB.
Copyright © 2010, Texas Instruments Incorporated 27
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SLOS660 –JANUARY 2010
www.ti.com

AGC CONTROL (Address: 6)

REGISTER I2C
ADDRESS BIT
06 (06H) – 7 Output Limiter 0 (enable) Disables the output limiter function. Can only be disabled when the AGC AGC Control Disable compression ratio is 1:1 (off)
6:5 NoiseGate 01 (4 mV
4:0 Output Limiter 11010 (6.5dBV) Selects the output limiter level
LABEL DEFAULT DESCRIPTION
) Select the threshold of the noise gate
Threshold
Level
rms
Output Power Peak Output
(Wrms) Voltage (Vp) 00000 0.03 0.67 –6.5 00001 0.03 0.71 –6 00010 0.04 0.75 –5.5
(Limiter level increases by 0.5dB with every step) 11101 0.79 3.55 8 11110 0.88 3.76 8.5 11111 0.99 3.99 9
Threshold 00 1 mV 01 4 mV 10 10 mV 11 20 mV
dBV
Output Limiter This bit disables the output limiter function when set to 1. Can only be disabled when Disable the AGC compression ratio is 1:1
NoiseGate Threshold These bits set the threshold level of the noise gate. NoiseGate Threshold is only
functional when the compression ratio is not 1:1
Output Limiter Level These bits select the output limiter level. Output Power numbers are for 8load.
rms rms
rms rms

AGC CONTROL (Address: 7)

REGISTER I2C
ADDRESS BIT
07 (07H) – 7:4 Max Gain 1100 (30 dB) Selects the maximum gain the AGC can achieve AGC Control
3:2 UNUSED 00 1:0 Compression 10 (4:1) Selects the compression ratio of the AGC
LABEL DEFAULT DESCRIPTION
(gain increases by 1 dB with every step)
Ratio
Gain 0000 18 dB 0001 19 dB 0010 20 dB
1100 30 dB
Ratio 00 1:1 (off) 01 2:1 10 4:1 11 8:1
Compression Ratio These bits select the compression ratio. Output Limiter is enabled by default when the
compression ratio is not 1:1.
Max Gain These bits select the maximum gain of the amplifier. In order to maximize the use of the
AGC, set the Max Gain to 30dB
28 Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPA2028D1
C
I I
1
f =
(2 R C )p ´ ´
I
I C
1
C =
(2 R f )p ´ ´
TPA2028D1
www.ti.com
SLOS660 –JANUARY 2010

DECOUPLING CAPACITOR CS)

The TPA2028D1 is a high-performance Class-D audio amplifier that requires adequate power supply decoupling to ensure the efficiency is high and total harmonic distortion (THD) is low. For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) 1-mF ceramic capacitor (typically) placed as close as possible to the device PVDD lead works best. Placing this decoupling capacitor close to the TPA2028D1 is important for the efficiency of the Class-D amplifier, because any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency. For filtering lower-frequency noise signals, a 4.7 mF or greater capacitor placed near the audio power amplifier would also help, but it is not required in most applications because of the high PSRR of this device.

INPUT CAPACITORS CI)

TPA2028D1 requires input capacitors to ensure low output offset and low pop.
The input capacitors and input resistors form a high-pass filter with the corner frequency, fC, determined in
Equation 5.
(5)
The value of the input capacitor is important to consider as it directly affects the bass (low frequency) performance of the circuit. Speakers in wireless phones cannot usually respond well to low frequencies, so the corner frequency can be set to block low frequencies in this application. Not using input capacitors can increase output offset. Equation 6 is used to solve for the input coupling capacitance. If the corner frequency is within the audio band, the capacitors should have a tolerance of ±10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below.
(6)

PACKAGE INFORMATION

Package Dimensions

The package dimensions for this YZF package are shown in the table below. See the package drawing at the end of this data sheet for more details.
Table 5. YZF Package Dimensions
Packaged Devices D E
TPA2028D1YZF
Min = 1594mm Min = 1594mm
Max = 1654mm Max = 1654mm

BOARD LAYOUT

In making the pad size for the WCSP balls, it is recommended that the layout use non solder mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 44 and Table 6 shows the appropriate diameters for a WCSP layout. The TPA2028D1 evaluation module (EVM) layout is shown in the next section as a layout example.
Copyright © 2010, Texas Instruments Incorporated 29
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SLOS660 –JANUARY 2010
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Figure 44. Land Pattern Dimensions
Table 6. Land Pattern Dimensions
SOLDER PAD SOLDER MASK
DEFINITIONS OPENING THICKNESS THICKNESS
Non solder mask 275 mm × 275 mm Sq. (rounded
defined (NSMD) corners)
(1) Circuit traces from NSMD defined PWB lands should be 75 mm to 100 mm wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application. (3) Recommend solder paste is Type 3 or Type 4. (4) For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance. (5) Solder mask thickness should be less than 20 mm on top of the copper circuit pattern (6) Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control. (7) Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
COPPER PAD STENCIL
275 mm 375 mm
(+0.0, –25 mm) (+0.0, –25 mm)
(5)
COPPER STENCIL
1 oz max (32 mm) 125 mm thick
(1) (2) (3) (4)
(6) (7)
OPENING

COMPONENT LOCATION

Place all the external components very close to the TPA2028D1. Placing the decoupling capacitor, CS, close to the TPA2028D1 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency.

TRACE WIDTH

Recommended trace width at the solder balls is 75 mm to 100 mm to prevent solder wicking onto wider PCB traces. For high current pins (PVDD (L, R), PGND, and audio output pins) of the TPA2028D1, use 100-mm trace widths at the solder balls and at least 500-mm PCB traces to ensure proper performance and output power for the device. For the remaining signals of the TPA2028D1, use 75-mm to 100-mm trace widths at the solder balls. The audio input pins (IN+ and IN–) must run side-by-side to maximize common-mode noise cancellation
30 Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPA2028D1
105°C/W
A J JA DMAX
T Max = T Max - θ P = 150 - 105 (0.4) = 108°C
Ferrite
ChipBead
Ferrite
ChipBead
1nF
1nF
OUTP
OUTN
TPA2028D1
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SLOS660 –JANUARY 2010

EFFICIENCY AND THERMAL INFORMATION

The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor for the packages are shown in the dissipation rating table. Converting this to qJAfor the WCSP package:
(7)
Given qJAof 105°C/W, the maximum allowable junction temperature of 150°C, and the maximum internal dissipation of 0.4 W for 3 W output power, 4-load, 5-V supply, from Figure 17, the maximum ambient temperature can be calculated with the following equation.
(8)
Equation 8 shows that the calculated maximum ambient temperature is 108°C at maximum power dissipation
with a 5-V supply and 4-a load. The TPA2028D1 is designed with thermal protection that turns the device off when the junction temperature surpasses 150°C to prevent damage to the IC. Also, using speakers more resistive than 8-dramatically increases the thermal performance by reducing the output current and increasing the efficiency of the amplifier.

OPERATION WITH DACS AND CODECS

In using Class-D amplifiers with CODECs and DACs, sometimes there is an increase in the output noise floor from the audio amplifier. This occurs when output frequencies of the CODEC/DAC mix with the Class-D switching frequency and create sum/difference components in the audio band. The noise increase can be solved by placing an RC low-pass filter between the CODEC/DAC and audio amplifier. The filter reduces high frequencies that cause the problem and allows proper performance.
TPA2028D1 includes an integrated low-pass filter for this purpose. It is still possible that Class-D output noise will be affected in extreme cases. In such a case, the RC filter may still be needed.

SHORT CIRCUIT AUTO-RECOVERY

When a short circuit event happens, the TPA2028D1 goes to low duty cycle mode and tries to reactivate itself every 110 µs. This auto-recovery will continue until the short circuit event stops. This feature can protect the device without affecting the device's long term reliability. FAULT bit (register 1, bit 3) still requires a write to clear.

FILTER FREE OPERATION AND FERRITE BEAD FILTERS

A ferrite bead filter can often be used if the design is failing radiated emissions without an LC filter and the frequency sensitive circuit is greater than 1 MHz. This filter functions well for circuits that just have to pass FCC and CE because FCC and CE only test radiated emissions greater than 30 MHz. When choosing a ferrite bead, choose one with high impedance at high frequencies, and low impedance at low frequencies. In addition, select a ferrite bead with adequate current rating to prevent distortion of the output signal.
Use an LC output filter if there are low frequency (< 1 MHz) EMI sensitive circuits and/or there are long leads from amplifier to speaker. Figure 45 shows typical ferrite bead and LC output filters.
Figure 45. Typical Ferrite Bead Filter (Chip bead example: TDK: MPZ1608S221A)
Copyright © 2010, Texas Instruments Incorporated 31
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SLOS660 –JANUARY 2010
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Figure 46. EMC Performance under FCC Class-B
Figure 46 shows the EMC performance of TPA2028D1 under FCC Class-B. The test circuit configuration is
shown in Figure 45. The worst-case quasi peak margin is 29.8 dB at 30.5 MHz.
V A f V V R
DD V
AUD
I O L
Table 7. Measurement Condition for TPA2028D1 EMC Test
PARAMETER VALUE UNIT
Supply voltage 4.2 V Gain 6 dB Input signal frequency 1 kHz Input signal amplitude 1 V Output signal amplitude 2 V Load impedance 8 Output cable length 100 mm
RMS RMS
32 Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPA2028D1
PACKAGE OPTION ADDENDUM
www.ti.com 8-Feb-2010
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TPA2028D1YZFR ACTIVE DSBGA YZF 9 3000 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
SNAGCU Level-1-260C-UNLIM
(3)
no Sb/Br)
TPA2028D1YZFT ACTIVE DSBGA YZF 9 250 Green (RoHS &
SNAGCU Level-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
TPA2028D1YZFR DSBGA YZF 9 3000 180.0 8.4 1.71 1.71 0.81 4.0 8.0 Q1 TPA2028D1YZFT DSBGA YZF 9 250 180.0 8.4 1.71 1.71 0.81 4.0 8.0 Q1
Type
Package Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)B0(mm)K0(mm)P1(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Jul-2010
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA2028D1YZFR DSBGA YZF 9 3000 190.5 212.7 31.8 TPA2028D1YZFT DSBGA YZF 9 250 190.5 212.7 31.8
Pack Materials-Page 2
D: Max =
1655 µm, Min =
1594 µm
E: Max =
1655 µm, Min =
1594 µm
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