_
+
IN–
IN+
PWM H–
Bridge
V
O+
V
O–
Internal
Oscillator
C
S
To Battery
V
DD
GND
Bias
Circuitry
R
I
R
I
+
–
Differential
Input
TPA2005D1
SHUTDOWN
Actual Solution Size
2.5 mm
C
S
R
I
R
I
6 mm
(MicroStar Junior BGA)
1.4-W MONO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER
TPA2005D1-Q1
SLOS474 – AUGUST 2005
FEATURES
• Qualification in Accordance With AEC-Q100
(1)
• Space Saving Package
– 3 mm x 3 mm QFN package (DRB)
• Qualified for Automotive Applications – 2,5 mm x 2,5 mm MicroStar Junior™
• Customer-Specific Configuration Control Can
BGA Package (ZQY)
Be Supported Along With Major-Change – 3 mm x 5 mm MSOP PowerPAD™ Package
Approval (DGN)
• 1.4 W Into 8 Ω From a 5-V Supply at – TPA2010D1 Available in 1,45 mm x 1,45 mm
THD = 10% (Typ) WCSP (YZF)
• Maximum Battery Life and Minimum Heat
– Efficiency With an 8- Ω Speaker:
• 84% at 400 mW
APPLICATIONS
• Ideal for Wireless or Cellular Handsets and
PDAs
• 79% at 100 mW
– 2.8-mA Quiescent Current
– 0.5- µ A Shutdown Current
• Only Three External Components
– Optimized PWM Output Stage Eliminates LC
Output Filter
– Internally Generated 250-kHz Switching
Frequency Eliminates Capacitor and
Resistor
– Improved PSRR (-71 dB at 217 Hz) and
Wide Supply Voltage (2.5 V to 5.5 V)
Eliminates Need for a Voltage Regulator
– Fully Differential Design Reduces RF
Rectification and Eliminates Bypass
Capacitor
– Improved CMRR Eliminates Two Input
DESCRIPTION
The TPA2005D1 is a 1.4-W high-efficiency filter-free
class-D audio power amplifier in a MicroStar Junior™
BGA, QFN, or MSOP package that requires only
three external components.
Features like 84% efficiency, -71-dB PSRR at
217 Hz, improved RF-rectification immunity, and
15-mm
for cellular handsets. A fast start-up time of 9 ms with
minimal pop makes the TPA2005D1 ideal for PDA
applications.
In cellular handsets, the earpiece, speaker phone,
and melody ringer can each be driven by the
TPA2005D1. The device allows independent gain
control by summing the signals from each function,
while minimizing noise to only 48 µ V
2
total PCB area make the TPA2005D1 ideal
RMS
.
Coupling Capacitors
(1) Contact factory for details. Q100 qualification data available
on request.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar Junior, PowerPAD are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
APPLICATION CIRCUIT
Copyright © 2005, Texas Instruments Incorporated
TPA2005D1-Q1
SLOS474 – AUGUST 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
-40 ° C to 85 ° C
(1) The GQY, ZQY, and DRB packages are only available taped and reeled. An R at the end of the part number indicates the devices are
taped and reeled.
(2) The GQY is the standard MicroStar Junior™ package. The ZQY is lead-free option, and is qualified for 260 ° lead-free assembly.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
In active mode -0.3 V to 6 V
V
Supply voltage
DD
V
Input voltage -0.3 V to V
I
Continuous total power dissipation See Dissipation Rating Table
T
Operating free-air temperature -40 ° C to 85 ° C
A
T
Operating junction temperature -40 ° C to 150 ° C
J
T
Storage temperature -65 ° C to 85 ° C
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 ° C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For the MSOP (DGN) package option, the maximum V
(2)
In SHUTDOWN mode -0.3 V to 7 V
PACKAGE PART NUMBER SYMBOL
MicroStar Junior™ (GQY) TPA2005D1GQYR
MicroStar Junior™ (ZQY)
(2)
TPA2005D1ZQYR
8-pin QFN (DRB) TPA2005D1DRBR
8-pin MSOP (DGN) TPA2005D1DGN(R) PREVIEW
(1)
should be limited to 5 V if short-circuit protection is desired.
DD
(1)
(1)
(1)
PREVIEW
PREVIEW
BIQ
UNIT
+ 0.3 V
DD
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
V
Supply voltage 2.5 5.5 V
DD
V
High-level input voltage SHUTDOWN 2 V
IH
V
Low-level input voltage SHUTDOWN 0 0.7 V
IL
R
Input resistor Gain ≤ 20 V/V (26 dB) 15 k Ω
I
V
Common-mode input voltage range V
IC
T
Operating free-air temperature -40 85 ° C
A
= 2.5 V, 5.5 V, CMRR ≤ -49 dB 0.5 VDD-0.8 V
DD
DISSIPATION RATINGS
PACKAGE
GQY, ZQY 16 mW/ ° C 2 W 1.28 W 1.04 W
DRB 21.8 mW/ ° C 2.7 W 1.7 W 1.4 W
DGN 17.1 mW/ ° C 2.13 W 1.36 W 1.11 W
2
DERATING TA≤ 25 ° C TA= 70 ° C TA= 85 ° C
FACTOR POWER RATING POWER RATING POWER RATING
V
DD
TPA2005D1-Q1
SLOS474 – AUGUST 2005
ELECTRICAL CHARACTERISTICS
TA= -40 ° C to 85 ° C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|V
PSRR Power-supply rejection ratio V
CMRR Common-mode rejection ratio VIC= VDD/2 to 0.5 V, dB
|IIH| High-level input current V
|IIL| Low-level input current V
I
(Q)
I
(SD)
r
DS(on)
f
(sw)
Output offset voltage
| VI= 0 V, AV= 2 V/V, V
OS
(measured differentially)
= 2.5 V to 5.5 V -75 -55 dB
DD
V
= 2.5 V to 5.5 V, TA= 25 ° C -68 -49
DD
VIC= VDD/2 to V
= 5.5 V, VI= 5.8 V 50 µ A
DD
= 5.5 V, VI= 0.3 V 4 µ A
DD
V
= 5.5 V, no load 3.4 4.5
DD
Quiescent current V
Shutdown current V
Static drain-source
on-state resistance
Output impedance in
SHUTDOWN
Switching frequency V
= 3.6 V, no load 2.8 mA
DD
V
= 2.5 V, no load 2.2 3.2
DD
(SHUTDOWN)
V
= 2.5 V 770
DD
V
= 3.6 V 590 m Ω
DD
V
= 5.5 V 500
DD
V
(SHUTDOWN)
= 2.5 V to 5.5 V 200 250 300 kHz
DD
= 2.5 V to 5.5 V 25 mV
DD
DD
= 0.8 V, V
- 0.8 V
TA= -40 ° C to 85 ° C -35
= 2.5 V to 5.5 V 0.5 2 µ A
DD
= 0.8 V >1 k Ω
Gain
OPERATING CHARACTERISTICS
TA= 25 ° C, Gain = 2 V/V, RL= 8 Ω (unless otherwise noted)
PARAMETER TEST CONDITIOINS MIN TYP MAX UNIT
THD + N= 1%, f = 1 kHz,
RL= 8 Ω
P
THD+N PO= 0.5 W, f = 1 kHz, RL= 8 Ω V
k
SVR
SNR Signal-to-noise ratio PO= 1 W, RL= 8 Ω V
V
CMRR Common-mode rejection ratio VIC= 1 Vpp, f = 217 Hz V
Z
I
Output power
O
THD + N= 10%, f = 1 kHz,
RL= 8 Ω
PO= 1 W, f = 1 kHz, RL= 8 Ω V
Total harmonic distortion plus
noise
PO= 200 mW, f = 1 kHz, RL= 8 Ω V
Supply ripple rejection ratio V
Output voltage noise µ V
n
f = 217 Hz, V
Inputs ac-grounded with Ci= 2 µ F
V
= 3.6 V, f = 20 Hz to 20 kHz,
DD
Inputs ac-grounded with Ci= 2 µ F
= 200 mV
(RIPPLE)
,
pp
Input impedance 142 150 158 k Ω
Start-up time from shutdown V
V
= 5 V 1.18
DD
V
= 3.6 V 0.58 W
DD
V
= 2.5 V 0.26
DD
V
= 5 V 1.45
DD
V
= 3.6 V 0.75 W
DD
V
= 2.5 V 0.35
DD
= 5 V 0.18%
DD
= 3.6 V 0.19%
DD
= 2.5 V 0.20%
DD
= 3.6 V -71 dB
DD
= 5 V 97 dB
DD
No weighting 48
A weighting 36
= 3.6 V -63 dB
DD
= 3.6 V 9 ms
DD
RMS
3
(A1)
(B1)
(A4)
(C4)
(D4)
(SIDE VIEW)
MicroStar Junior (GQY) PACKAGE
(TOP VIEW)
NC V
DD
SHUTDOWN
IN+
IN−
V
O−
V
DD
V
O+
(C1)
(D1)
(B4)
GND
8
SHUTDOWN
NC
IN+
IN−
V
O−
GND
V
DD
V
O+
8-PIN QFN (DRB) PACKAGE
(TOP VIEW)
7
6
5
1
2
3
4
NC − No internal connection
V
O−
GND
V
DD
V
O+
8
7
6
5
1
2
3
4
SHUTDOWN
NC
IN+
IN−
8-PIN MSOP (DGN) PACKAGE
(TOP VIEW)
_
+
_
+
_
+
_
+
150 kΩ
150 kΩ
_
+
_
+
Deglitch
Logic
Deglitch
Logic
Gate
Drive
Gate
Drive
V
DD
Short
Circuit
Detect
Startup
& Thermal
Protection
Logic
Ramp
Generator
Biases
and
References
TTL
Input
Buffer
SD
Gain = 2 V/V
B4, C4
V
DD
A4
V
O−
D4
V
O+
†
GND
D1
IN−
C1
IN+
A1
SHUTDOWN
†
A2, A3, B3, C2, C3, D2, D3
(terminal labels for MicroStar Junior package)
TPA2005D1-Q1
SLOS474 – AUGUST 2005
PIN ASSIGNMENTS
A. The shaded terminals are used for electrical and thermal connections to the ground plane. All of the shaded terminals
must be electrically connected to ground. No connect (NC) terminals still need a pad and trace.
B. The thermal pad of the DRB and DGN packages must be electrically and thermally connected to a ground plane.
Terminal Functions
TERMINAL
NAME ZQY, GQY DRB, DGN
IN- D1 4 I Negative differential input
IN+ C1 3 I Positive differential input
V
DD
V
O+
B4, C4 6 I Power supply
D4 5 O Positive BTL output
A2, A3, B3,
GND C2, C3, D2, 7 I High-current ground
D3
V
O-
A4 8 O Negative BTL output
SHUTDOWN A1 1 I Shutdown terminal (active low logic)
NC B1 2 No internal connection
Thermal Pad Must be soldered to a grounded pad on the PCB.
I/O DESCRIPTION
4
FUNCTIONAL BLOCK DIAGRAM
TPA2005D1
IN+
IN−
OUT+
OUT−
V
DD
GND
C
I
C
I
R
I
R
I
Measurement
Output
+
−
1 µ F
+
−
V
DD
Load
30 kHz
Low Pass
Filter
Measurement
Input
+
−
TPA2005D1-Q1
SLOS474 – AUGUST 2005
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
Efficiency vs Output power 1, 2
P
I
(Q)
I
(SD)
P
THD+N Total harmonic distortion plus noise vs Frequency 13, 14, 15, 16
k
SVR
CMRR Common-mode rejection ratio
Power dissipation vs Output power 3
D
Supply current vs Output power 4, 5
Quiescent current vs Supply voltage 6
Shutdown current vs Shutdown voltage 7
Output power
O
vs Supply voltage 8
vs Load resistance 9, 10
vs Output power 11, 12
vs Common-mode input voltage 17
Supply-voltage rejection ratio
GSM power-supply rejection
vs Frequency 18, 19, 20
vs Common-mode input voltage 21
vs Time 22
vs Frequency 23
vs Frequency 24
vs Common-mode input voltage 25
TEST SET-UP FOR GRAPHS
A. CIwas shorted for any common-mode input voltage measurement.
B. A 33- µ H inductor was placed in series with the load resistor to emulate a small speaker for efficiency measurements.
C. The 30-kHz low-pass filter is required, even if the analyzer has a low-pass filter. An RC filter (100 Ω , 47 nF) is used
on each output for the data sheet graphs.
5
0
10
20
30
40
50
60
70
80
90
0 0.2 0.4 0.6 0.8 1 1.2
VDD = 2.5 V,
RL= 8 Ω , 33 µ H
VDD = 5 V,
RL = 8 Ω , 33 µ H
Class-AB,
VDD = 5 V,
RL = 8 Ω
P
O
- Output Power - W
Efficiency - %
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0 0.2 0.4 0.6 0.8 1 1.2
- Power Dissipation - W P
D
P
O
- Output Power - W
Class-AB, VDD = 5 V, RL = 8 Ω
Class-AB,
VDD = 3.6 V,
R
L
= 8 Ω
VDD = 3.6 V,
RL = 8 Ω, 33 µ H
VDD = 5 V,
RL = 8 Ω, 33 µ H
0
10
20
30
40
50
60
70
80
90
100
0 0.1 0.2 0.3 0.4 0.5 0.6
P
O
- Output Power - W
Efficiency - %
VDD = 3.6
RL = 32 Ω , 33 µ H
RL = 16 Ω , 33 µ H
RL = 8 Ω , 33 µ H
Class-AB,
RL = 8 Ω
0
50
100
150
200
250
300
0 0.2 0.4 0.6 0.8 1 1.2
P
O
- Output Power - W
VDD = 2.5 V,
RL = 8 Ω , 33 µ H
VDD = 3.6 V,
RL = 8 Ω , 33 µ H
VDD = 5 V,
RL = 8 Ω , 33 µ H
Supply Current - mA
0
50
100
150
200
250
0 0.1 0.2 0.3 0.4 0.5 0.6
RL = 8 Ω , 33 µ H
VDD = 3.6 V
RL = 32 Ω , 33 µ H
Supply Current - mA
P
O
- Output Power - W
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
3.8
2.5 3 3.5 4 4.5 5 5.5
I
(Q)
− Quiescent Current − mA
VDD − Supply Voltage − V
No Load
RL = 8 Ω , 33 µ H
2.5 3 3.5 4 4.5 5
V
DD
- Supply Voltage - V
- Output Power - W P
O
RL = 8 Ω
f = 1 kHz
Gain = 2 V/V
THD+N = 1%
THD+N = 10%
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
VDD = 2.5 V
VDD = 3.6 V
VDD = 5 V
Shutdown Voltage - V
- Shutdown Current -
I
(SD)
Aµ
0
0.2
0.4
0.6
0.8
1
1.2
1.4
8 12 16 20 28
RL - Load Resistance - Ω
- Output Power - W P
O
32 24
f = 1 kHz
THD+N = 1%
Gain = 2 V/V
VDD = 2.5 V
VDD = 3.6 V
VDD = 5 V
TPA2005D1-Q1
SLOS474 – AUGUST 2005
EFFICIENCY EFFICIENCY POWER DISSIPATION
vs vs vs
OUTPUT POWER OUTPUT POWER OUTPUT POWER
Figure 1. Figure 2. Figure 3.
SUPPLY CURRENT SUPPLY CURRENT QUIESCENT CURRENT
vs vs vs
OUTPUT POWER OUTPUT POWER SUPPLY VOLTAGE
Figure 4. Figure 5. Figure 6.
SHUTDOWN CURRENT OUTPUT POWER OUTPUT POWER
vs vs vs
SHUTDOWN VOLTAGE SUPPLY VOLTAGE LOAD RESISTANCE
6
Figure 7. Figure 8. Figure 9.
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
8 12 16 20 24 28 32
VDD = 5 V
VDD = 3.6 V
VDD = 2.5 V
R
L
- Load Resistance - Ω
- Output Power - W P
O
f = 1 kHz
THD+N = 10%
Gain = 2 V/V
0.1
30
0.2
0.5
1
2
5
10
20
0.01 2 0.1 1
PO − Output Power − W
THD+N − Total Harmonic Distortion + Noise − %
5 V
3.6 V
2.5 V
RL = 8 Ω ,
f = 1 kHz,
Gain = 2 V/V
0.1
30
0.2
0.5
1
2
5
10
20
0.01 2 0.1 1
PO − Output Power − W
THD+N − Total Harmonic Distortion + Noise − %
5 V
3.6 V
2.5 V
RL = 16 Ω ,
f = 1 kHz,
Gain = 2 V/V
0.008
10
0.02
0.05
0.1
0.2
0.5
1
2
5
20 100 1 k 20 k
f − Frequency − Hz
THD+N − Total Harmonic Distortion + Noise − %
50 mW
250 mW
1 W
VDD = 5 V
CI = 2 µ F
RL = 8 Ω
Gain = 2 V/V
1
2
5
10
0.5
0.2
0.1
0.05
0.02
0.01
20 100 1 k 20 k
f − Frequency − Hz
THD+N − Total Harmonic Distortion + Noise − %
VDD = 3.6 V
CI = 2 µ F
RL = 8 Ω
Gain = 2 V/V
500 mW
25 mW
125 mW
10
5
2
1
0.5
0.2
0.1
0.05
0.02
0.01
20 100 1 k 20 k
f − Frequency − Hz
THD+N − Total Harmonic Distortion + Noise − %
15 mW
VDD = 2.5 V
CI = 2 µ F
RL = 8 Ω
Gain = 2 V/V
75 mW
200 mW
0.1
1
10
0 0.5 1 1.5 2 2.5 3 3.5
VDD = 2.5 V
VDD = 3.6 V
f = 1 kHz
PO = 200 mW
V
IC
- Common Mode Input Voltage - V
THD+N - Total Harmonic Distortion + Noise - %
−80
−70
−60
−50
−40
−30
−20
−10
0
20 100 1 k 20 k
f − Frequency − Hz
− Supply Voltage Rejection Ratio − dB k
SVR
CI = 2 µ F
RL = 8 Ω
V
p-p
= 200 mV
Inputs ac-Grounded
Gain = 2 V/V
VDD = 5 V
VDD = 3.6 V
VDD =2. 5 V
VDD = 3.6 V
CI = 2 µ F
RL = 16 Ω
Gain = 2 V/V
f − Frequency − Hz
THD+N − Total Harmonic Distortion + Noise − %
1
2
5
10
0.5
0.2
0.1
0.05
0.02
0.01
20 100 1 k 20 k
15 mW
75 mW
200 mW
TPA2005D1-Q1
SLOS474 – AUGUST 2005
OUTPUT POWER TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION +
LOAD RESISTANCE vs vs
vs NOISE NOISE
OUTPUT POWER OUTPUT POWER
Figure 10. Figure 11. Figure 12.
TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION +
NOISE NOISE NOISE
vs vs vs
FREQUENCY FREQUENCY FREQUENCY
Figure 13. Figure 14. Figure 15.
TOTAL HARMONIC DISTORTION + TOTAL HARMONIC DISTORTION + SUPPLY-VOLTAGE REJECTION
NOISE NOISE RATIO
vs vs vs
FREQUENCY COMMON MODE INPUT VOLTAGE FREQUENCY
Figure 16. Figure 17. Figure 18.
7
−80
−70
−60
−50
−40
−30
−20
−10
0
f − Frequency − Hz
− Supply Voltage Rejection Ratio − dB k
SVR
20 100 1 k 20 k
Gain = 5 V/V
CI = 2 µ F
RL = 8 Ω
V
p-p
= 200 mV
Inputs ac-Grounded
VDD = 5 V
VDD = 2. 5 V
VDD = 3.6 V
−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
f − Frequency − Hz
− Supply Voltage Rejection Ratio − dB k
SVR
VDD = 3.6 V
CI = 2 µ F
RL = 8 Ω
Inputs Floating
Gain = 2 V/V
20 100 1 k 20 k
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
V
IC
- Common Mode Input Voltage - V
f = 217 Hz
RL = 8 Ω
Gain = 2 V/V
VDD = 2.5 V
- Supply Voltage Rejection Ratio - dB k
SVR
VDD = 3.6 V
VDD = 5 V
C1 - Duty
12.6%
C1 -
Frequency
216.7448 Hz
C1 - Amplitude
512 mV
C1 - High
3.544 V
Voltage - V
t - Time - ms
V
DD
V
OUT
-150
-100
-50
0 400 800 1200 1600 2000
-150
-100
-50
0
0
f - Frequency - Hz
- Output Voltage - dBV V
O
- Supply Voltage - dBV V
DD
VDD Shown in Figure 22
CI = 2 µ F,
Inputs ac-grounded
Gain = 2V/V
−70
−60
−50
−40
−30
−20
−10
0
f − Frequency − Hz
CMRR − Common Mode Rejection Ratio − dB
20 100 1 k 20 k
VDD = 2.5 V to 5 V
VIC = 1 V
p−p
RL = 8 Ω
Gain = 2 V/V
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
RL = 8 Ω
Gain = 2 V/V
V
IC
- Common Mode Input Voltage - V
CMRR - Common Mode Rejection Ratio - dB
VDD = 5 V
VDD = 2.5 V VDD = 3.6 V
TPA2005D1-Q1
SLOS474 – AUGUST 2005
SUPPLY-VOLTAGE REJECTION SUPPLY-VOLTAGE REJECTION SUPPLY-VOLTAGE REJECTION
RATIO RATIO RATIO
vs vs vs
FREQUENCY FREQUENCY COMMON-MODE INPUT VOLTAGE
Figure 19. Figure 20. Figure 21.
GSM POWER-SUPPLY REJECTION GSM POWER-SUPPLY REJECTION
vs vs
TIME FREQUENCY
8
Figure 22. Figure 23.
COMMON-MODE REJECTION RATIO COMMON-MODE REJECTION RATIO
vs vs
FREQUENCY COMMON-MODE INPUT VOLTAGE
Figure 24. Figure 25.
_
+
IN–
IN+
PWM H–
Bridge
V
O+
V
O–
Internal
Oscillator
C
S
To Battery
V
DD
GND
Bias
Circuitry
R
I
R
I
+
–
Differential
Input
TPA2005D1
Filter-Free Class D
SHUTDOWN
TPA2005D1-Q1
SLOS474 – AUGUST 2005
APPLICATION INFORMATION
FULLY DIFFERENTIAL AMPLIFIER
The TPA2005D1 is a fully differential amplifier with differential inputs and outputs. The fully differential amplifier
consists of a differential amplifier and a common-mode amplifier. The differential amplifier ensures that the
amplifier outputs a differential voltage on the output that is equal to the differential input times the gain. The
common-mode feedback ensures that the common-mode voltage at the output is biased around V
regardless of the common-mode voltage at the input. The fully differential TPA2005D1 can still be used with a
single-ended input; however, the TPA2005D1 should be used with differential inputs when in a noisy
environment, like a wireless handset, to ensure maximum noise rejection.
Advantages of Fully Differential Amplifiers
• Input-coupling capacitors not required:
– The fully differential amplifier allows the inputs to be biased at a voltage other than midsupply. For
example, if a codec has a midsupply lower than the midsupply of the TPA2005D1, the common-mode
feedback circuit adjusts, and the TPA2005D1 outputs still is biased at midsupply of the TPA2005D1. The
inputs of the TPA2005D1 can be biased from 0.5 V to V
- 0.8 V. If the inputs are biased outside of that
DD
range, input-coupling capacitors are required.
• Midsupply bypass capacitor, C
(BYPASS)
, not required:
– The fully differential amplifier does not require a bypass capacitor. This is because any shift in the
midsupply affects both positive and negative channels equally and cancels at the differential output.
• Better RF-immunity:
– GSM handsets save power by turning on and shutting off the RF transmitter at a rate of 217 Hz. The
transmitted signal is picked-up on input and output traces. The fully differential amplifier cancels the signal
much better than the typical audio amplifier.
DD
/2,
COMPONENT SELECTION
Figure 26 shows the TPA2005D1 typical schematic with differential inputs, and Figure 27 shows the TPA2005D1
with differential inputs and input capacitors, and Figure 28 shows the TPA2005D1 with single-ended inputs.
Differential inputs should be used whenever possible, because the single-ended inputs are much more
susceptible to noise.
Table 1. Typical Component Values
REF DES VALUE EIA SIZE MANUFACTURER PART NUMBER
R
I
C
S
(1)
C
I
(1) CIis needed only for single-ended input or if V
high-pass corner frequency of 321 Hz.
Figure 26. Typical TPA2005D1 Application Schematic With Differential Input for a Wireless Phone
150 k Ω ( ± 0.5%) 0402 Panasonic ERJ2RHD154V
1 µ F (+22%, -80%) 0402 Murata GRP155F50J105Z
3.3 nF ( ± 10%) 0201 Murata GRP033B10J332K
is not between 0.5 V and V
ICM
- 0.8 V. CI= 3.3 nF (with RI= 150 k Ω ) gives a
DD
9
_
+
IN–
IN+
PWM H–
Bridge
V
O+
V
O–
Internal
Oscillator
C
S
To Battery
V
DD
GND
Bias
Circuitry
R
I
R
I
Differential
Input
TPA2005D1
Filter-Free Class D
SHUTDOWN
C
I
C
I
_
+
IN–
IN+
PWM H–
Bridge
V
O+
V
O–
Internal
Oscillator
C
S
To Battery
V
DD
GND
Bias
Circuitry
R
I
R
I
Single-ended
Input
TPA2005D1
Filter-Free Class D
SHUTDOWN
C
I
C
I
TPA2005D1-Q1
SLOS474 – AUGUST 2005
Figure 27. TPA2005D1 Application Schematic With Differential Input and Input Capacitors
Figure 28. TPA2005D1 Application Schematic With Single-Ended Input
10
Gain 2
150 k
R
I
V
V
TPA2005D1-Q1
SLOS474 – AUGUST 2005
Input Resistors (R
The input resistors (R
Resistor matching is very important in fully differential amplifiers. The balance of the output on the
reference voltage depends on matched ratios of the resistors. CMRR, PSRR, and cancellation of the second
harmonic distortion diminish if resistor mismatch occurs. Therefore, it is recommended to use 1% tolerance
resistors, or better, to keep the performance optimized. Matching is more important than overall tolerance.
Resistor arrays with 1% matching can be used with a tolerance greater than 1%.
Place the input resistors very close to the TPA2005D1 to limit noise injection on the high-impedance nodes.
For optimal performance, the gain should be set to 2 V/V or lower. Lower gain allows the TPA2005D1 to operate
at its best and keeps a high voltage at the input, making the inputs less susceptible to noise.
Decoupling Capacitor (C
The TPA2005D1 is a high-performance class-D audio amplifier that requires adequate power-supply decoupling
to ensure the efficiency is high and total harmonic distortion (THD) is low. For higher frequency transients,
spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) ceramic capacitor, typically
1 µ F, placed as close as possible to the device V
the TPA2005D1 is very important for the efficiency of the class-D amplifier, because any resistance or
inductance in the trace between the device and the capacitor can cause a loss in efficiency. For filtering
lower-frequency noise signals, a 10- µ F, or greater, capacitor placed near the audio power amplifier also helps,
but it is not required in most applications because of the high PSRR of this device.
)
I
) set the gain of the amplifier according to equation Equation 1 .
I
)
S
lead, works best. Placing this decoupling capacitor close to
DD
(1)
Input Capacitors (C
The TPA2005D1 does not require input coupling capacitors if the design uses a differential source that is biased
from 0.5 V to V
common-mode input range, if needing to use the input as a high pass filter (shown in Figure 27 ), or if using a
single-ended source (shown in Figure 28 ), input coupling capacitors are required.
The input capacitors and input resistors form a high-pass filter with the corner frequency, fc, determined in
Equation 2 .
The value of the input capacitor is important to consider, as it directly affects the bass (low frequency)
performance of the circuit. Speakers in wireless phones usually cannot respond well to low frequencies, so the
corner frequency can be set to block low frequencies in this application.
Equation 3 is reconfigured to solve for the input coupling capacitance.
If the corner frequency is within the audio band, the capacitors should have a tolerance of ± 10% or better,
because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below.
For a flat low-frequency response, use large input coupling capacitors (1 µ F). However, in a GSM phone the
ground signal is fluctuating at 217 Hz, but the signal from the codec does not have the same 217-Hz fluctuation.
The difference between the two signals is amplified, sent to the speaker, and heard as a 217-Hz hum.
)
I
- 0.8 V (shown in Figure 26 ). If the input signal is not biased within the recommended
DD
(2)
(3)
SUMMING INPUT SIGNALS WITH THE TPA2005D1
Most wireless phones or PDAs need to sum signals at the audio power amplifier or just have two signal sources
that need separate gain. The TPA2005D1 makes it easy to sum signals or use separate signal sources with
different gains. Many phones now use the same speaker for the earpiece and ringer, where the wireless phone
would require a much lower gain for the phone earpiece than for the ringer. PDAs and phones that have stereo
headphones require summing of the right and left channels to output the stereo signal to the mono speaker.
11
Gain 1
V
O
V
I1
2
150 k
R
I1
V
V
Gain 2
V
O
V
I2
2
150 k
R
I2
V
V
_
+
IN–
IN+
PWM H–
Bridge
V
O+
V
O–
Internal
Oscillator
C
S
To Battery
V
DD
GND
Bias
Circuitry
R
I2
R
I2
+
–
Differential
Input 1
SHUTDOWN
R
I1
R
I1
+
–
Differential
Input 2
Filter-Free Class D
Gain 1
V
O
V
I1
2
150 k
R
I1
V
V
Gain 2
V
O
V
I2
2
150 k
R
I2
V
V
TPA2005D1-Q1
SLOS474 – AUGUST 2005
Summing Two Differential Input Signals
Two extra resistors are needed for summing differential signals (a total of 5 components). The gain for each input
source can be set independently (see Equation 4 and Equation 5 and Figure 29 ).
If summing left and right inputs with a gain of 1 V/V, use R
If summing a ring tone and a phone signal, set the ring-tone gain to gain 2 = 2 V/V, and the phone gain to
gain 1 = 0.1 V/V. The resistor values are:
• R
= 3 M Ω and R
I1
= 150 k Ω .
I2
= RI2= 300 k Ω .
I1
(4)
(5)
Figure 29. Application Schematic With TPA2005D1 Summing Two Differential Inputs
Summing a Differential Input Signal and a Single-Ended Input Signal
Figure 30 shows how to sum a differential input signal and a single-ended input signal. Ground noise can couple
in through IN+ with this method. It is better to use differential inputs. The corner frequency of the single-ended
input is set by C
, shown in Equation 8 . To ensure that each input is balanced, the single-ended input must be
I2
driven by a low-impedance source even if the input is not in use.
(6)
(7)
(8)
12
C
I2
1
2 150k 20Hz
_
+
IN–
IN+
PWM H–
Bridge
V
O+
V
O–
Internal
Oscillator
C
S
To Battery
V
DD
GND
Bias
Circuitry
R
I2
R
I2
Differential
Input 1
Filter-Free Class D
SHUTDOWN
R
I1
R
I1
Single-Ended
Input 2
C
I2
C
I2
TPA2005D1-Q1
SLOS474 – AUGUST 2005
If summing a ring tone and a phone signal, the phone signal should use a differential input signal while the ring
tone might be limited to a single-ended signal. If phone gain is set at gain 1 = 0.1 V/V, and the ring-tone gain is
set to gain 2 = 2 V/V, the resistor values are:
• R
The high-pass corner frequency of the single-ended input is set by C
than 20 Hz, then:
= 3 M Ω and R
I1
= 150 k Ω .
I2
. If the desired corner frequency is less
I2
(9)
(10)
Figure 30. Application Schematic With TPA2005D1 Summing Differential Input and
Single-Ended Input Signals
Summing Two Single-Ended Input Signals
Four resistors and three capacitors are needed for summing single-ended input signals. The gain and corner
frequencies (f
and fc2) for each input source can be set independently (see Equation 11 through Equation 14
c1
and Figure 31 ). Resistor, RP, and capacitor, CP, are needed on the IN+ terminal to match the impedance on the
IN- terminal. The single-ended inputs must be driven by low-impedance sources, even if one of the inputs is not
outputting an ac signal.
13
Gain 1
V
O
V
I1
2
150 k
R
I1
V
V
Gain 2
V
O
V
I2
2
150 k
R
I2
V
V
P
RI1 R
I2
RI1 R
I2
_
+
IN–
IN+
PWM H–
Bridge
V
O+
V
O–
Internal
Oscillator
C
S
To Battery
V
DD
GND
Bias
Circuitry
R
I2
R
P
Filter-Free Class D
SHUTDOWN
R
I1
Single-Ended
Input 2
C
I2
C
P
Single-Ended
Input 1
C
I1
JA
1
Derating Factor
1
0.016
62.5° C W
TAMax TJMax JAP
Dmax
150 62.5 (0.2) 137.5° C
TPA2005D1-Q1
SLOS474 – AUGUST 2005
(11)
(12)
(13)
(14)
(15)
(16)
Figure 31. Application Schematic With TPA2005D1 Summing Two Single-Ended Inputs
EFFICIENCY AND THERMAL INFORMATION
The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor
for the 2,5-mm x 2,5-mm MicroStar Junior package is shown in the dissipation rating table. Converting this to θ JA:
Given θ
dissipation of 0.2 W (worst case 5-V supply), the maximum ambient temperature can be calculated with equation
Equation 18 .
Equation 18 shows that the calculated maximum ambient temperature is 137.5 ° C at maximum power dissipation
with a 5-V supply; however, the maximum ambient temperature of the package is limited to 85 ° C. Because of the
efficiency of the TPA2005D1, it can be operated under all conditions to an ambient temperature of 85 ° C. The
TPA2005D1 is designed with thermal protection that turns the device off when the junction temperature
surpasses 150 ° C to prevent damage to the IC. Also, using speakers more resistive than 8 Ω dramatically
increases the thermal performance by reducing the output current and increasing the efficiency of the amplifier.
14
of 62.5 ° C/W, the maximum allowable junction temperature of 150 ° C, and the maximum internal
JA
(17)
(18)
0,28
mm
0,38
mm
0,25
mm
SD
NC
IN+
IN−
GND GND
GND
GND GND
GND GND
VDD
VDD
Vo+
Vo−
Solder Mask
Paste Mask
Copper Trace
TPA2005D1-Q1
SLOS474 – AUGUST 2005
BOARD LAYOUT
Component Location
Place all the external components very close to the TPA2005D1. The input resistors need to be very close to the
TPA2005D1 input pins so noise does not couple on the high-impedance nodes between the input resistors and
the input amplifier of the TPA2005D1. Placing the decoupling capacitor, CS, close to the TPA2005D1 is important
for the efficiency of the class-D amplifier. Any resistance or inductance in the trace between the device and the
capacitor can cause a loss in efficiency.
Trace Width
Make the high current traces going to pins VDD, GND, V
0,7 mm. If these traces are too thin, the TPA2005D1 performance and output power will decrease. The input
traces do not need to be wide, but do need to run side-by-side to enable common-mode noise cancellation.
MicroStar Junior™ BGA Layout
Use the following MicroStar Junior BGA ball diameters:
• 0,25 mm diameter solder mask
• 0,28 mm diameter solder paste mask/stencil
• 0,38 mm diameter copper trace
Figure 32 shows how to lay out a board for the TPA2005D1 MicroStar Junior BGA.
and V
O+
of the TPA2005D1 have a minimum width of
O-
Figure 32. TPA2005D1 MicroStar Junior BGA Board Layout (Top View)
8-Pin QFN (DRB) Layout
Use the following land pattern for board layout with the 8-pin QFN (DRB) package. Note that the solder paste
should use a hatch pattern to fill solder paste at 50% to ensure that there is not too much solder paste under the
package.
15
0,65 mm
0,38 mm
Solder Mask: 1,4 mm x 1,85 mm centered in package
0,7 mm
1,4 mm
Make solder paste a hatch pattern to fill 50%
3,3 mm
1,95 mm
0,33 mm plugged vias (5 places)
TPA2005D1-Q1
SLOS474 – AUGUST 2005
Figure 33. TPA2005D1 8-Pin QFN (DRB) Board Layout (Top View)
ELIMINATING THE OUTPUT FILTER WITH THE TPA2005D1
This section focuses on why the user can eliminate the output filter with the TPA2005D1.
Effect on Audio
The class-D amplifier outputs a pulse-width modulated (PWM) square wave, which is the sum of the switching
waveform and the amplified input audio signal. The human ear acts as a band-pass filter such that only the
frequencies between approximately 20 Hz and 20 kHz are passed. The switching frequency components are
much greater than 20 kHz, so the only signal heard is the amplified input audio signal.
Traditional Class-D Modulation Scheme
The traditional class-D modulation scheme, which is used in the TPA005Dxx family, has a differential output in
which each output is 180 degrees out of phase and changes from ground to the supply voltage, V
the differential pre-filtered output varies between positive and negative V
0 V across the load. The traditional class-D modulation scheme with voltage and current waveforms is shown in
Figure 34 . Note that, even at an average of 0 V across the load (50% duty cycle), the current to the load is high,
causing a high loss and thus causing a high supply current.
, where filtered 50% duty cycle yields
DD
. Therefore,
DD
16
0 V
–5 V
+5 V
Current
OUT+
Differential Voltage
Across Load
OUT–
0 V
–5 V
+5 V
Current
OUT+
OUT–
Voltage
Across
Load
0 V
–5 V
+5 V
Current
OUT+
OUT–
Voltage
Across
Load
Output = 0 V
Output > 0 V
TPA2005D1-Q1
SLOS474 – AUGUST 2005
Figure 34. Traditional Class-D Modulation Scheme Output Voltage and Current Waveforms Into an
Inductive Load With No Input
TPA2005D1 Modulation Scheme
The TPA2005D1 uses a modulation scheme that still has each output switching from 0 to the supply voltage.
However, OUT+ and OUT- are now in phase with each other, with no input. The duty cycle of OUT+ is greater
than 50% and OUT- is less than 50% for positive voltages. The duty cycle of OUT+ is less than 50% and OUT- is
greater than 50% for negative voltages. The voltage across the load remains at 0 V throughout most of the
switching period, greatly reducing the switching current, which reduces any I2R losses in the load.
Figure 35. The TPA2005D1 Output Voltage and Current Waveforms Into an Inductive Load
17
P
SPKR
P
SUP–PSUP THEORETICAL
(at max output power)
SPKR
P
SUP
P
OUT
–
P
SUP THEORETICAL
P
OUT
(at max output power)
SPKR
P
OUT
1
MEASURED
1
THEORETICAL
(at max output power)
THEORETICAL
R
L
RL 2r
DS(on)
(at max output power)
TPA2005D1-Q1
SLOS474 – AUGUST 2005
Efficiency: Why You Must Use a Filter With the Traditional Class-D Modulation Scheme
The main reason that the traditional class-D amplifier needs an output filter is that the switching waveform results
in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripple current is
large for the traditional modulation scheme because the ripple current is proportional to voltage multiplied by the
time at that voltage. The differential voltage swing is 2 × V
for the traditional modulation scheme. An ideal LC filter is needed to store the ripple current from each half-cycle
for the next half-cycle, while any resistance causes power dissipation. The speaker is both resistive and reactive,
whereas an LC filter is almost purely reactive.
The TPA2005D1 modulation scheme has very little loss in the load without a filter because the pulses are very
short and the change in voltage is V
instead of 2 × V
DD
making the ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for
most applications the filter is not needed.
An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow
through the filter instead of the load. The filter has less resistance than the speaker, resulting in less power
dissipation, which increases efficiency.
Effects of Applying a Square Wave Into a Speaker
If the amplitude of a square wave is high enough and the frequency of the square wave is within the bandwidth
of the speaker, a square wave could cause the voice coil to jump out of the air gap and/or scar the voice coil. A
250-kHz switching frequency, however, is not significant because the speaker cone movement is proportional to
2
1/f
for frequencies beyond the audio band. Therefore, the amount of cone movement at the switching frequency
is very small. However, damage could occur to the speaker if the voice coil is not designed to handle the
additional power. To size the speaker for added power, the ripple current dissipated in the load must be
calculated by subtracting the theoretical supplied power, P
maximum output power, P
efficiency, η
MEASURED
, minus the theoretical efficiency, η
. The switching power dissipated in the speaker is the inverse of the measured
OUT
, and the time at each voltage is one-half the period
DD
. As the output power increases, the pulses widen,
DD
SUP THEORETICAL
THEORETICAL
.
, from the actual supply power, P
SUP
, at
(19)
The maximum efficiency of the TPA2005D1 with a 3.6-V supply and an 8- Ω load is 86% from Equation 22 . Using
Equation 21 with the efficiency at maximum power (84%), we see that there is an additional 17 mW dissipated in
the speaker. The added power dissipated in the speaker is not an issue as long as it is taken into account when
choosing the speaker.
When to Use an Output Filter
Design the TPA2005D1 without an output filter if the traces from amplifier to speaker are short. The TPA2005D1
passed FCC and CE radiated emissions with no shielding and with speaker trace wires 100 mm long or less.
Wireless handsets and PDAs are great applications for class-D without a filter.
A ferrite bead filter often can be used if the design is failing radiated emissions without an LC filter, and the
frequency-sensitive circuit is greater than 1 MHz. This is good for circuits that just have to pass FCC and CE
because FCC and CE only test radiated emissions greater than 30 MHz. If choosing a ferrite bead, choose one
with high impedance at high frequencies, but very low impedance at low frequencies.
Use an LC output filter if there are low-frequency (< 1 MHz) EMI-sensitive circuits and/or there are long leads
from amplifier to speaker.
Figure 36 and Figure 37 show typical ferrite bead and LC output filters.
(20)
(21)
(22)
18
1 nF
Ferrite
Chip Bead
OUTP
OUTN
Ferrite
Chip Bead
1 nF
1 µ F
1 µ F
33 µ H
33 µ H
OUTP
OUTN
Figure 36. Typical Ferrite Chip Bead Filter (Chip bead example: NEC/Tokin: N2012ZPS121)
TPA2005D1-Q1
SLOS474 – AUGUST 2005
Figure 37. Typical LC Output Filter, Cut-Off Frequency of 27 kHz
19
PACKAGE OPTION ADDENDUM
www.ti.com
18-Apr-2006
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TPA2005D1DRBQ1 ACTIVE SON DRB 8 3000 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
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Addendum-Page 1
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