Texas Instruments TPA032D04 User Manual

TPA032D04 ClassĆD Stereo
Audio Power Amplifier
Evaluation Module

User’s Guide

September 2000 Mixed-Signal Products

SLOU068A

IMPORTANT NOTICE

T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.

Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating

safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent

that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

Copyright  2000, Texas Instruments Incorporated

Related Documentation From Texas Instruments

J

TI Plug-N-Play Audio Amplifier Evaluation Platform

Number SLOU011) provides detailed information on the evaluation
platform and its use with TI audio evaluation modules.

J

TP A032D04 CLASS-D STEREO AUDIO POWER AMPLIFIER

(TI Literature Number SLOS203) This is the data sheet for the
TPA032D04 audio amplifier integrated circuit.

J

Design Considerations for Class-D Audio Power Amplifiers

(TI Literature Number SLOA031) This application report provides
detailed information on designing audio power amplifier systems
using TI class-D amplifier ICs.

J

Reducing and Eliminating the Class-D Output Filter

(TI Literature Number SLOA023) This application report covers
output filter theory and design for class-D audio power amplifiers.

Preface

(TI Literature

FCC Warning

This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.

Trademarks

TI is a trademark of Texas Instruments.
PowerPAD is a trademark of Texas Instruments.

Chapter Title—Attribute Reference

iii

iv

Running Title—Attribute Reference

Contents

1 Introduction 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.1 Feature Highlights 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Description 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 TPA032D04 Class-D EVM Specifications 1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3.1 Maximum 1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3.2 Typical 1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Quick Start 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1 Precautions 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2 Quick Start List for Platform 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3 Quick Start List for Stand-Alone 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 Details 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1 Precautions 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2 The TPA032D04 Class-D Audio Power Amplifier Evaluation Module 3-3. . . . . . . . . . . . . . .

3.2.1 TPA032D04 Class-D Stereo Audio Amplifier IC 3-5. . . . . . . . . . . . . . . . . . . . . . . . . .

3.2.2 Overview of Class-D Audio Amplifiers 3-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2.3 Bridge-Tied Load (BTL) Operation 3-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2.4 Class-D Differential and Headphone Single-Ended Inputs 3-8. . . . . . . . . . . . . . . . .

3.2.5 Control and Indicator Circuits 3-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2.6 TPA032D04 Class-D EVM Test Points 3-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3 Class-D Amplifier Design Considerations 3-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4 Using the TPA032D04 Class-D EVM With the Plug-N-Play Platform 3-11. . . . . . . . . . . . . .

3.4.1 Installing and Removing EVM Boards 3-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4.2 Module Switches 3-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4.3 Signal Routing 3-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4.4 Shutdown 3-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4.5 Power Requirements 3-16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4.6 Inputs and Outputs 3-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5 Using the TPA032D04 Class-D EVM Stand-Alone 3-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5.1 Power Connections 3-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5.2 Input Connections 3-19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5.3 Output Connections 3-19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5.4 Controls and Indicators 3-19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.6 TPA032D04 Class-D EVM Performance Characteristics 3-20. . . . . . . . . . . . . . . . . . . . . . . .

3.7 TPA032D04 Class-D EVM Power Supply Decoupling Data 3-27. . . . . . . . . . . . . . . . . . . . . .

3.8 TPA032D04 Class-D EVM Interconnects 3-28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.9 TPA032D04 Class-D EVM Bill of Materials 3-29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.10 TPA032D04 Class-D EVM Schematic 3-30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.11 TPA032D04 Class-D EVM PCB Layers 3-31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter Title—Attribute Reference

v

Running Title—Attribute Reference

Figures

1–1 The TI TPA032D04 Class-D Stereo Audio Power Amplifier EVM—Top View 1-3. . . . . . . . . .

1–2 The TI TPA032D04 Class-D Stereo Audio Power Amplifier EVM—Bottom View 1-4. . . . . . .

2–1 Quick Start Platform Map 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–1 The TI Plug-N-Play Audio Amplifier Evaluation Platform 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–2 The TI TPA032D04 Class-D Stereo Audio Power Amplifier EVM—Top View 3-4. . . . . . . . . .

3–3 The TI TPA032D04 Class-D Stereo Audio Power Amplifier EVM—Bottom View 3-4. . . . . . .

3–4 TPA032D04 Class-D EVM Schematic Diagram 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–5 Class-D Functional Diagram 3-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–6 Class-D Input and Output Waveforms 3-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–7 Platform Signal Routing and Outputs 3-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–8 Mute/Mode and Polarity Control 3-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–9 Typical Headphone Plug 3-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–10 TPA032D04 Class-D EVM Stand-Alone Connections for Stereo BTL Output 3-18. . . . . . . . .

3–11 Class-D Amplifier Frequency Response at 4 Ω 3-20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–12 Class-D Amplifier Distortion versus Output Power at 4 Ω 3-21. . . . . . . . . . . . . . . . . . . . . . . . . .

3–13 Class-D Amplifier Distortion versus Output Power at 8 Ω 3-21. . . . . . . . . . . . . . . . . . . . . . . . . .

3–14 Class-D Amplifier Distortion versus Frequency at 1 W Into 4 Ω. 3-22. . . . . . . . . . . . . . . . . . . .

3–15 Class-D Amplifier Distortion versus Frequency at 1 W Into 8 Ω. 3-22. . . . . . . . . . . . . . . . . . . .

3–16 Class-D Amplifier Crosstalk versus Frequency Into 4 Ω. 3-23. . . . . . . . . . . . . . . . . . . . . . . . . . .

3–17 Class-D Amplifier Crosstalk versus Frequency Into 8 Ω. 3-23. . . . . . . . . . . . . . . . . . . . . . . . . . .

3–18 Class AB Headphone Amplifier Frequency Response. 3-24. . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–19 Class AB Headphone Amplifier Distortion versus Output Power. 3-25. . . . . . . . . . . . . . . . . . . .

3–20 Class AB Headphone Amplifier Distortion versus Frequency. 3-25. . . . . . . . . . . . . . . . . . . . . .

3–21 Class AB Headphone Amplifier Crosstalk versus Frequency 3-26. . . . . . . . . . . . . . . . . . . . . . .

3–22 Power Supply Decoupling 3-27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–23 TPA032D04 Class-D EVM Schematic Diagram 3-30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–24 TPA032D04 Class-D EVM Top Assembly 3-31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–25 TPA032D04 Class-D EVM Bottom Assembly 3-31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–26 TPA032D04 Class-D EVM Top Layer 3-32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–27 TPA032D04 Class-D EVM Second Layer . 3-32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–28 TPA032D04 Class-D EVM Third Layer. 3-33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–29 TPA032D04 Class-D EVM Bottom Layer . 3-33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

T ables

2–1 Typical TI Plug-N-Play Platform Jumper and Switch Settings for the

2–2 Platform Jumper and Switch Settings for the TPA032D04 2-3. . . . . . . . . . . . . . . . . . . . . . . . . .

3–1 TPA032D04 Class-D EVM Fault Indicator Table 3-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–2 TPA032D04 Class-D EVM Test Points 3-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3–3 Platform Jumper and Switch Settings for the TPA032D04 EVM Power Inputs 3-16. . . . . . . .

3–4 TPA032D04 Class-D EVM/Plug-N-Play Platform Interconnects 3-28. . . . . . . . . . . . . . . . . . . . .

3–5 TPA032D04 Class-D EVM Bill of Materials 3-29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

vi

TPA032D04 Class-D EVM 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1

Introduction

This chapter provides an overview of the T exas Instruments (TI) TP A032D04
class-D stereo audio power amplifier evaluation module (SLOP131). It
includes a list of EVM features, a brief description of the module illustrated with
a pictorial diagram, and a list of EVM specifications.

Topic Page

1.1 Feature Highlights 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Description 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 TPA032D04 Class-D EVM Specifications 1–5. . . . . . . . . . . . . . . . . . . . . . . .

Introduction

1-1

Feature Highlights

1.1 Feature Highlights

The TI TPA032D04 class-D stereo audio power amplifier evaluation module
and the TI plug-n-play audio amplifier evaluation platform include the following
features:

-

TPA032D04 Class-D Stereo Audio Power Amplifier Evaluation Module

J

J

J

J

J

J

J

J

J

Internal depop circuitry to significantly reduce turn-on transients in
outputs

Dual channel, bridge-tied load (BTL) only operation
12 V operation
10 W BTL output into 4 Ω at 12 V
Low current consumption in shutdown/mute mode (147 µA/2.5 mA)
Internal class-D gain set to 25 dB
IC shutdown, mute, and mode control inputs—TTL logic level
High efficiency
Class-AB stereo headphone driver—capable of 50 mW into 32 Ω

J

CE tested and approved

-

Quick and Easy Configuration With the TI Plug-N-Play Audio Amplifier
Evaluation Platform

J

Evaluation module is designed to simply plug into the platform,
automatically making all signal, control, and power connections

J

Platform provides flexible power options

J

Jumpers on the platform select power and module control options

J

Switches on the platform route signals

J

Platform provides quick and easy audio input and output connections

-

Platform Power Options

J

External 5-V – 15-V VCC supply inputs

J

External regulated VDD supply input

J

Socket for onboard 5 V/3.3 V VDD voltage regulator EVM

J

Onboard overvoltage and reverse polarity power protection

-

Platform Audio Input and Output Connections

J

J

J

J

J

1-2

Left and right RCA phono jack inputs
Miniature stereo phone jack input
Left and right RCA phono jack outputs
Left and right compression speaker terminal outputs
Miniature stereo headphone jack output

Introduction

1.2 Description

Description

The TP A032D04 class-D stereo audio power amplifier evaluation module is a
complete, 10-W per channel stereo audio power amplifier. It consists of the TI
TPA032D04 class-D stereo audio power amplifier IC along with a small
number of other parts mounted on a circuit board that measures approximately
2

1/4

inches by 2

1/4

inches (Figure 1–1 and 1–2).

Figure 1–1.The TI TPA032D04 Class-D Stereo Audio Power Amplifier EVM—

SD

S2

Mute

–LIN+GND

C4

Lout–

C5

R2

L4

L2

C16

C3

+

R6
R5

R3

L3

VCC

L1

GND

C15

Rev. B

+

SLOP204 TPA032D04 EVM Board

R14
R13

TP2

R12
R11

J1

Rout+

TP4

TP5

RHPGND LHP

Rout–

C24

R8 R9

R7

C22 C23

C6

C7

R4

C2

+RIN– Mode

Mute

Texas
Instruments
1999

C25

C21

U1

C1

R1

R10

SD

TP1

C17

S1

Top View

Lout+

VCC

GND

VDD

Note: Capacitors C15 and C16 are optional (not assembled) and locations for them on the EVM PCB have been provided to

increase design flexibility and allow decoupling capacitance to be added (Section 3.7

Power Supply Decoupling

Introduction

).

1-3

Description

Figure 1–2.The TI TPA032D04 Class-D Stereo Audio Power Amplifier EVM—

C27

C30

C14

C26

C13

C8

C29

C20

C18

C12

C10

C9

C31

C28

C19

C11

Bottom View

Single in-line header pins extend from the underside of the module circuit
board to allow the EVM to either be plugged into the TI plug-n-play audio
amplifier evaluation platform, or to be wired directly into existing circuits and
equipment when used stand-alone.

The platform has room for a single TP A032D04 class-D evaluation module and
is a convenient vehicle for demonstrating TI’s audio power amplifier and
related evaluation modules. The EVM simply plugs into the platform, which
automatically provides power to the modules, interconnects them correctly,
and connects them to a versatile array of standard audio input and output jacks
and connectors. Easy-to-use configuration controls allow the platform and
EVMs to quickly model many possible end-equipment configurations.

There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to hook up.

1-4

Introduction

1.3 TPA032D04 Class-D EVM Specifications

All measurements made with VDD = 5 V and RL = 4 Ω, unless otherwise noted.

1.3.1 Maximum

TPA032D04 Class-D EVM Specifications

Supply voltage range, V
Supply current, I

DD

Continuous output power per channel, BTL, P

DD

10 W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

O

Continuous output power per channel, headphones, PO: 32-Ω SE 50 mW. . . . . . . . . . . . . . . . . .

Audio input voltage, class-D, V
Audio input voltage, headphone, V

I

I

1.3.2 Typical

Supply current, no input, class-D active, I
Supply current, no input, headphone active, I
Supply current, EVM mute, class-D active, I
Supply current, EVM mute, headphone active, I
Supply current, EVM shutdown, I
Gain, class-D

25 dB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DD

Gain, headphone 0 dB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Crosstalk, class-D, P
Crosstalk, headphone, P

= 2 W @ 1 kHz –55 dB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

O

= 30 mW @ 1 kHz –70 dB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

O

Total harmonic distortion + noise, class-D, P
Total harmonic distortion + noise, headphone, P

DD

DD

DD

DD

= 1 W @ 1 kHz 0.14 %. . . . . . . . . . . . . . . . . . . . . .

O

= 30 mW @ 1 kHz 0.3 %. . . . . . . . . . . . . . . . .

O

9 V to 14 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.6 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

350 mVrms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.6 Vrms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

55 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.5 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

147 µA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction

1-5

1-6

Introduction

Chapter 2

Quick Start

Follow the steps in this chapter to quickly prepare the TPA032D04 class-D
stereo audio amplifier EVM for use. Using the TP A032D04 class-D EVM with
the TI plug-n-play audio amplifier evaluation platform is a quick and easy way
to connect power, signal and control inputs, and signal outputs to the EVM
using standard connectors. However, the audio amplifier evaluation module
can be used stand-alone by making connections directly to the module pins,
and it can be wired directly into existing circuits or equipment.

The platform switch and jumper settings shown in T able 2–1 are typical for the
TPA032D04 class-D EVM. There are no jumpers or switches to set on
the TPA032D04 class-D EVM board, itself.

Table 2–1. Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
TPA032D04 Class-D EVM

POWER TYPE (Note 2) JP1 JP4 JP5 JP6 JP7 JP8 S1 S2 (Note3) S3

VCC (J1) ON ON ON Mute X Lo ON OFF U5

Notes: 1) ON = Jumper installed, OFF = Jumper

2) Install a voltage regulator EVM (SLVP097) in platform socket U6 for VDD power to EVM control inputs.

3) Set to ON when tone control board SLOP109 is installed in U1.

NOT

Installed, X = Don’t care

T opic Page

2.1 Precautions 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2 Quick Start List for Platform 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3 Quick Start List for Stand-Alone 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Quick Start

2-1

Precautions

2.1 Precautions

Power Supply Input Polarity and Maximum Voltage
Always ensure that the polarity and voltage of the external power

connected to VCC power input connector J1, J2, and/or VDD power
input connector J6 are correct. Overvoltage or reverse-polarity
power applied to these terminals can open onboard soldered-in
fuses and cause other damage to the platform, installed evaluation
modules, and/or the power source.

Inserting or Removing EVM Boards
Do not insert or remove EVM boards with power applied—damage

to the EVM board, the platform, or both may result.

Figure 2–1.

In

+

7

Power

Audio
Input

Input

In

12
13

17

Quick Start Platform Map

SOURCE

J1

VCC

D4

AC/DC

J2

Right

In

Stereo

In

Left

In

INSTRUMENTS

1997

J3

J4

J5

JP2

JP1

DC

VCC(J1)

AC/DC

(J2)

Batt

D1

D2

D3

Signal Conditioning

Do not insert or remove
EVM boards with power

TEXAS

Plug-N-Play Audio Amplifier
Evaluation Platform
SLOP097 Rev. C.1

JP3

VR1

F1

VCC

C1+

LED1

****CAUTION****

applied

R1

U1

Off Pwr

1

GND

On

S1

Audio
Power
Amps

OnOff

ConditioningS2

TP1

ICC
JP4

B1

IDD

U5

119 108

JP5

U3 U4

R2

U2-U4

U5

HP

Source

SUPPLY

U2

HP(U5)

S3

R4

POWER

U6

LED2

VDD

JP6

Polarity

Lo

Hi

JP7

+

+

R3

J7

Out

Out

Out

Mode
Mute

Spk(U2-U4)

Out

JP8

C3 C2

HP Out

F2

Right

J8

+– +–
Right

Left

J9

Left

Stereo

In/Out

VDD

J10

R5

J6

VR2

DC
Power
In/Out

+

Speaker
Output

14

Headphone
Output

5

2-2

16

3

2

4 6

Quick Start

2.2 Quick Start List for Platform

Follow these steps when using the TPA032D04 class-D EVM with the TI
plug-n-play audio amplifier evaluation platform (see the platform user’s guide,
SLOU011, for additional details). Numbered callouts for selected steps are
shown in Figure 2–1 and details appear in Chapter 3.

-

Platform Preparations

Quick Start List for Platform

1) Ensure that all external power sources are set to

OFF

.

2) Install a TP A032D04 module in platform socket U2, taking care to align the
module pins correctly (EVM power pins engage sockets U2 and U3).

OFF

3) Set switch S2 to

.

4) Set switch S3 to U5.

5) Set jumper JP6 to select the

6) Set control signal Polarity jumper JP8 to

Mute

control input.

Lo.

Table 2–2. Platform Jumper and Switch Settings for the TPA032D04

POWER TYPE (Note 2) JP1 JP4 JP5 JP6 JP7 JP8 S1 S2 (Note3) S3

VCC (J1) ON ON ON Mute X Lo ON OFF U5

Notes: 1) ON = Jumper installed, OFF = Jumper

2) Install a voltage regulator EVM (SLVP097) in platform socket U6 for VDD power to EVM control inputs.

3) Set to ON when Tone Control Board SLOP109 is installed in U1.

-

Power supply

7) Connect a

OFF

) to J1, taking care to observe marked polarity.

8) Set jumper JP1 for dc source to be from input J1.

9) Set jumper JP4 for VCC power to EVMs.

10) Install a voltage regulator EVM (SLVP097) in platform socket U6.

11) Set jumper JP5 for VDD power to EVMs.

NOT

Installed, X = Don’t care

12-V

regulated power supply (ensure power supply is set to

-

Inputs and outputs

12) Ensure that the audio signal source level is set to minimum.

13) Connect the audio source to left and right RCA phono jacks J3 and J5 or

14) Connect 4-Ω – 8-Ω speakers to left and right RCA jacks J7 and J9 or to

-

Power up

15) Verify correct voltage and input polarity and set the external power supply

Platform LED1 and LED2 should light indicating the presence of VCC and
VDD, and the evaluation module(s) installed on the platform should begin
operation.

16) Set switch S2 to ON if tone control board SLOP109 is installed in U1.

17) Adjust the signal source level as needed.

stereo miniature phone jack J4.

stripped wire speaker connectors J8.

to

ON.

Quick Start

2-3

Quick Start List for Stand-Alone

2.3 Quick Start List for Stand-Alone

Follow these steps to use the TPA032D04 class-D EVM stand-alone or to
connect it into existing circuits or equipment. Connections to the TP A032D04
module header pins can be made via individual sockets, wire-wrapping, or
soldering to the pins, either on the top or the bottom of the module circuit board.

-

Power supply

1) Ensure that all external power sources are set to

OFF.

2) Connect an external regulated power supply set to 12 V to the module
VCC, and GND pins taking care to observe marked polarity. It is only

necessary to use the ground pins adjacent to the module power pins.

3) Connect an external regulated power supply set to 5 V to the module VDD
pin taking care to observe marked polarity.

-

Inputs and outputs

4) Ensure that audio signal source level adjustments are set to minimum.

5) Connect the audio source to the module RIN+/RIN– and LIN+/LIN– pins
for class-D operation, taking care to observe marked polarity. For
single-ended input, the negative input pins (RIN– and LIN–) should be
connected to the ground of the audio signal source.

6) Connect a control signal to the module Mode pin, if necessary . The control
signal should be low (or tied to ground) for class-D operation, or high (2 V
to 5 V) to activate the headphone circuit. Ensure that a headphone is
plugged into module headphone jack J1 if controlling the Mode pin
externally.

7) Connect a control signal to the module Mute pin, if necessary . The control
signal should be high (2 V to 5 V or left floating) for normal operation, or
low (tied to ground) to mute the output.

2-4

8) Connect a control signal to the module SD pin, if necessary. The control
signal should be high (2 V to 5 V or left floating) for normal operation, or
low (tied to ground) to shut down the TPA032D04 amplifier IC on the EVM.

Note that the control signals applied to the EVM Mode, Mute, and SD inputs
must have sufficient current capability to overcome the 100-kΩ pullup resistor
on each input. Miniature pushbutton switches on the EVM allow manual
shutdown (S1) and manual muting (S2) of the amplifier.

9) Connect a 4-Ω – 8-Ω speaker to the module Rout+/Rout– pins and
another speaker to the Lout+/Lout– pins, taking care to observe marked
polarity .

-

Power up

10) Verify correct voltage and input polarity and set the external power supply

ON.

to

The EVM should begin operation.

11) Adjust the signal source level as needed.

Quick Start

Chapter 3

Details

This chapter provides details on the TPA032D04 IC, the evaluation module,
and the steps in the Quick-Start list, a discussion of class-D amplifiers,
additional application information, a parts list for the TPA032D04 class-D
evaluation module, module performance graphs, and module PCB layer
illustrations.

Topic Page

3.1 Precautions 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2 The TPA032D04 Class-D Audio Power Amplifier EVM 3-3. . . . . . . . . . . .

3.3 Class-D Amplifier Design Considerations 3-10. . . . . . . . . . . . . . . . . . . . . .

3.4 Using the TPA032D04 Class-D EVM With the P-N-P Platform 3-11. . . . .

3.5 Using the TPA032D04 Class-D EVM Stand-Alone 3-18. . . . . . . . . . . . . . .

3.6 TPA032D04 Class-D EVM Performance Characteristics 3-20. . . . . . . . . .

3.7 TPA032D04 Class-D EVM Power Supply Decoupling Data 3-27. . . . . . .

3.8 TPA032D04 Class-D EVM Interconnects 3-28. . . . . . . . . . . . . . . . . . . . . . . .

3.9 TPA032D04 Class-D EVM Bill of Materials 3-29. . . . . . . . . . . . . . . . . . . . . .

3.10 TPA032D04 Class-D EVM Schematic 3-30. . . . . . . . . . . . . . . . . . . . . . . . . . .

3.11 TPA032D04 Class-D EVM PCB Layers 3-31. . . . . . . . . . . . . . . . . . . . . . . . .

Details

3-1

Precautions

3.1 Precautions

Power Supply Input Polarity and Maximum Voltage
Always ensure that the polarity and voltage of the external power

connected to VCC power input connector J1, J2, and/or VDD power
input connector J6 are correct. Overvoltage or reverse-polarity
power applied to these terminals can open onboard soldered-in
fuses and cause other damage to the platform, installed evaluation
modules, and/or the power source.

Inserting or Removing EVM Boards
Do not insert or remove EVM boards with power applied—damage

to the EVM board, the platform, or both may result.

Figure 3–1.The TI Plug-N-Play Audio Amplifier Evaluation Platform

On

R1

U1

Off Pwr

S1

Audio
Power
Amps

OnOff

ConditioningS2

ICC
JP4

B1

IDD

JP5

U3 U4

Power

Input

Audio
Input

+

In

VCC

In

AC/DC

J1

D4

J2

In

In

In

SOURCE

DC

VCC(J1)

D3

Right

J3

Stereo

J4

Left

J5

JP2

JP1

AC/DC

(J2)

D2

D1

Batt

JP3

VR1

Signal Conditioning

F1

VCC

C1+

LED1

R2

SUPPLY

VDD

U2

POWER

U6

LED2

Out

J7

Right

Out

Out

F2

J8

+– +–
Right

Left

In/Out

VDD

J6

VR2

+

DC
Power
In/Out

Speaker
Output

****CAUTION****
Do not insert or remove
EVM boards with power

TEXAS

INSTRUMENTS

1997

applied

Plug-N-Play Audio Amplifier
Evaluation Platform
SLOP097 Rev. C.1

3-2

GND

TP1

U5

U2-U4

U5

HP

Source

HP(U5)

S3

R4

JP6

Polarity

Lo

Hi

JP7

+

+

R3

Mode
Mute

Spk(U2-U4)

Out

JP8

C3 C2

HP Out

J9

Left

Stereo

J10

R5

Headphone
Output

Details

The TP A032D04 Class-D Audio Power Amplifier Evaluation Module

3.2 The TPA032D04 Class-D Audio Power Amplifier Evaluation Module

The TPA032D04 class-D stereo audio power amplifier evaluation module is
powered by a TPA032D04 class-D stereo power amplifier integrated circuit.
The EVM is capable of delivering greater than 10 W of continuous average
power per channel into 4-Ω loads at less than 0.5% THD+N over a 20-Hz to
20-kHz frequency range from a 12-V supply. The TPA032D04 amplifier IC
includes a separate internal 50-mW class-AB headphone amplifier circuit and
the necessary interface logic to select between the class-D and headphone
modes of operation.

The TP A032D04 amplifier IC operates in the bridge-tied load (BTL) mode for
maximum efficiency during class-D operation. The high IC switching
frequency reduces the size of the output filter to three small capacitors and two
small inductors per class-D channel. The evaluation module includes onboard
pushbutton switches for manual muting and shutdown, and input pins for logic
control of mode, mute, and shutdown. A miniature stereo headphone jack is
mounted on the EVM board for convenient connection of headphones. The
jack has switch contacts and the module includes related circuitry to switch the
amplifier IC to the headphone mode when a headphone plug is inserted into
the jack.

The module can be used with the TI plug-n-play audio amplifier evaluation
platform (Figure 3–1) or wired directly into circuits or equipment. The module
has single in-line header connector pins mounted to the underside of the
board. These pins allow the module to be plugged into the platform, which
automatically makes all the signal input and output, power, and control
connections to the module.

The module connection pins are on 0.1-inch centers to allow easy use with
standard perf board and plug board-based prototyping systems. Or, the EVM
can be wired directly into existing circuits and equipment when used
stand-alone.

The module appears in Figure 3–2 (top side) and Figure 3–3 (bottom side),
and its schematic is shown in Figure 3–4. Note that several components are
mounted on the bottom side of the EVM PCB.

Details

3-3

The TP A032D04 Class-D Audio Power Amplifier Evaluation Module

Figure 3–2.The TI TPA032D04 Class-D Stereo Audio Power Amplifier EVM—

SD

S2

Mute

–LIN+GND

C4

Lout–

C5

R2

L4

L2

C16

C3

+

R6
R5

R3

L3

VCC

L1

GND

C15

Rev. B

+

SLOP204 TPA032D04 EVM Board

R14
R13

TP2

R12
R11

J1

Rout+

TP4

TP5

RHPGND LHP

Rout–

C24

R8 R9

R7

C22 C23

C6

C7

R4

C2

+RIN– Mode

Mute

Texas
Instruments
1999

C25

C21

U1

C1

R1

R10

SD

TP1

C17

S1

Top View

Lout+

VCC

GND

VDD

Note: Capacitors C15 and C16 are optional (not assembled) and locations for them on the EVM PCB have been provided to

increase design flexibility and allow decoupling capacitance to be added (Section 3.7

Figure 3–3.The TI TPA032D04 Class-D Stereo Audio Power Amplifier EVM—

C30

C20

C18

C29

C19

C12

C9

C27

C14

C26

C13

C10

C8

Power Supply Decoupling

Bottom View

C31

C28

C11

).

3-4

Details

The TP A032D04 Class-D Audio Power Amplifier Evaluation Module

Figure 3–4.TPA032D04 Class-D EVM Schematic Diagram

SD
Mute

Mode
LIN–
LIN+

VCC

LOUT+

LOUT–

TIP

HPDL

LHP

Mode

C16

VDD

†

C3

0.1µF

R3
100k

R1

100k

C14 C13

10µF

C30

1µF

C25

33µF

R2

100k

0.22µF

0.22µF

R10

100k

VCC

1µF

C27

C26

HPDL

R5
100k

S2
Mute

C18

C23

5.6pF

1µF

C20

0.1µF

C10

15µH

15µH

†

R6
100k

S1
SD

C4
C5
C8

L2

L4

1µF
1µF

1000pF

1µF

HPVCC

1

SHUTDOWN

2

MUTE

3

MODE

4

LINN

5

LINP

6

LCOMP

7

AGND

8

VDD

9

LPVDD

10

LOUTP

11

LOUTP

12

PGND

13

PGND

14

LOUTN

15

LOUTN

16

LPVDD

17

HPREG

18

HPLOUT

19

HPLIN

20

AGND

21

PVDD

22

VCP

23

HPDL

24

CP1

5V
12V

TPA032D04

FAULT_0

FAULT_1

HPROUT

0.047µF

C21

COSC
AGND
AGND

RINN
RINP

RCOMP

RPVDD
ROUTP
ROUTP

PGND

PGND
ROUTN
ROUTN
RPVDD
HPVCC

HPRIN

V2P5
PVDD
PGND
HPDR

CP2

VDD

VCC

48
47
46

1µF

45

1µF

44

1000pF

43
42

R11 100k

41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25

TP5

R12 100k

TP4

15µH

15µH

Ring

C1
C6
C9

L1

L3

C17
1µF

R8

1 k

C22

5.6pF

TIP

C7

1000pF

VDD

C28

0.22µF
C29

0.22µF

†

C19
1µF

Mode

R9

1 k

1µF

R7

100k

HPDR

R14

150k

C11C12
10µF

C31
1µF

R4

100k

3
B
A

2

1

C24

33µF

VCC

500k

0.1µF

R13

C15

C2

J1

RIN–
RIN+

†

VCC

ROUT+

ROUT–

RING

HPDR

RHP

HPVCC

†

Capacitors C15 and C16 are optional (not assembled) and locations for them on the EVM PCB have been provided to increase
design flexibility and allow decoupling capacitance to be added (Section 3.7

Power Supply Decoupling

). Capacitors C22 and

C23 are required only when the headphone amplifier gain is set greater than 10 V/V .

3.2.1 TPA032D04 Class-D Stereo Audio Amplifier IC

The TPA032D04 class-D stereo audio power amplifier integrated circuit
converts low-level audio into pulse-width-modulated (PWM) signals, which
result in an audio output with a 25-dB increase in amplitude. The IC features
high-current DMOS output transistors and internal feedback that provides
excellent performance without the need for external components (beyond
input isolation and output filtering).

A full range of protection features are built into the TP A032D04 amplifier IC to
increase device reliability: thermal, overcurrent, and undervoltage shutdown,
with status terminals that report any error conditions encountered.

The device is provided in a very small 48-pin thermally-enhanced PowerP AD
TSSOP surface-mount package (DCA) and consumes less than 1 µA in the
shutdown mode, making the TPA032D04 an excellent choice for portable
battery-powered applications.

Details

3-5

The TP A032D04 Class-D Audio Power Amplifier Evaluation Module

3.2.2 Overview of Class-D Audio Amplifiers

Class-D audio amplifiers are very similar in operation to switch-mode power
supplies in that both compare an input signal with a reference to create an error
voltage that controls a pulse-width modulator (PWM) circuit. The PWM circuit
then produces an output signal at constant frequency and with a duty cycle that
varies according to the input signal. A block diagram of the major components
that make up the amplifier is shown in Figure 3–5.

Figure 3–5.Class-D Functional Diagram

Audio
Analog
Source

Ramp

Generator

V

CONTROL

V

OUT

H-Bridge

Load

V

V

RAMP

V

Comparator

IN

ERROR

PWM

Control

LPF

The audio input signal (VIN) is applied to a very fast comparator along with a
ramp signal (V

) created by the ramp generator. Each time the triangle

RAMP

wave from the ramp generator crosses the audio input signal level, the
comparator sends an error signal (V
PWM control signal (V

CONTROL

ERROR

) then regulates the duty cycle of the

) to the PWM control circuit. The

high-current DMOS power transistors of the H-bridge, providing the output
signal (V

OUT

).

These transistors operate in either the cutoff or saturated regions, rather than
the linear region, which is where class AB amplifiers operate. This reduces
switching and conduction losses, reducing the power dissipated by the power
transistors and allowing more power to be delivered to the load. An
inductor-capacitor (LC) low-pass filter (LPF) then removes the high frequency
switching component from V

, leaving an amplified version of the original

OUT

input signal. Examples of these waveforms are shown in Figure 3–6.

3-6

Details

The TP A032D04 Class-D Audio Power Amplifier Evaluation Module

Figure 3–6.Class-D Input and Output Waveforms

V

RAMP

V

0 V

DD

V

OUT

V

IN

The V

signal must be at a much higher frequency than the highest

RAMP

frequency component of VIN to obtain an accurate representation at the
low-pass filter output and allow greater attenuation of the switching
component of V

. The TPA032D04 class-D EVM uses a 250 kHz V

OUT

signal to sample VIN. This frequency is more than ten times higher than the
highest frequency component of the 20 Hz to 20 kHz range of the audio input,
providing excellent output resolution and easy filtering by the LPF.

3.2.3 Bridge-Tied Load (BTL) Operation

The DMOS output transistors of the TPA032D04 class-D amplifier IC are
arranged in an H-bridge configuration to allow BTL operation. In the BTL
output mode, each half of the H-bridge operates 180° out of phase from the
other. The load, in this case, a speaker, is then connected between the two
halves, and is not connected directly to ground. The load is, in a sense,
floating.

BTL operation has two main advantages over single-ended operation. First,
it eliminates the need for a bulky output coupling capacitor to block any dc
offset voltage that may be present (which reduces the speaker response and
may damage the speaker). And second, it quadruples the output power that
can be delivered to the load. For more information, see the TPA032D04
amplifier IC data sheet, TI Literature Number SLOS203.

RAMP

To operate in the BTL output mode, the EVM output signal from Rout+/Lout+
must go through the speaker load and be returned directly
to Rout–/Lout–, and
lines be isolated not only from system ground, but also from each other and
the out– lines of any other amplifiers in the system. The plug-n-play platform
provides such isolated output lines, connecting the EVM output pins directly
to left and right speaker connectors.

NOT

to system ground. This requires that the Rout–/Lout–

Details

3-7

The TP A032D04 Class-D Audio Power Amplifier Evaluation Module

3.2.4 Class-D Differential and Headphone Single-Ended Inputs

The TP A032D04 EVM line inputs allow the use of a single-ended or differential
audio source. The differential input stage of the amplifier cancels any noise
that appears on both input lines of a channel. T o use the EVM with a differential
source, connect the positive lead of the audio source to the RIN+/LIN+ inputs
and the negative lead to the RIN–/LIN– inputs. To use the EVM with a
single-ended source, connect the positive lead of the audio source to the
RIN+/LIN+ inputs and the ground lead to the RIN–/LIN– inputs. These
connections should only be made to the EVM input pins in order to keep the
input impedance of the class-D amplifiers balanced. This is due to the ac
coupling capacitors that are in series with the amplifier inputs.

The headphone inputs are for single-ended connections, with the positive
leads connected to the RHP and LHP inputs. For best results, the ground of
the signal source should be connected to the GND pins at the EVM inputs. This
provides a ground return path for the current.

3.2.5 Control and Indicator Circuits

Three main control circuits are provided with the TPA032D04. The mode
circuit selects which amplifier is active, the mute circuit grounds the output of
the active amplifier, and the shutdown circuit places the entire device into a
power-saving sleep mode to minimize current consumption. Each of these
inputs is TTL compatible: less than 0.8 V applied to these pins is considered
a logic low, and any voltage greater than 2 V is considered a logic high.

Two indicator pins are also provided for feedback when an under-voltage,
over-current, or thermal fault exists. Module pins are provided for easy
connection of off-board control and monitoring. Signals on these pins provide
the status of the class-D amplifier: operational, over-current, thermal fault, and
under-voltage lockout. The only status reported for the class-AB headphone
amplifier is for a thermal fault, indicated by the same error code as for the
class-D amplifier. Table 3–1 lists the possible output conditions of these pins
and a description of the fault indicated.

Table 3–1.TPA032D04 Class-D EVM Fault Indicator Table

FAULT 0

(TP 5)

1 1 No fault. — The device is operating normally.
1 0 Charge pump under-voltage lockout (VCP-UV) fault — the charge pump voltage is < (PVDD + 6V).

0 1 Over-current fault — the output current limit has been exceeded. All output transistors are switched

0 0 Thermal fault — the internal junction temperature has exceeded 125°C. All of the low-side

FAULT 1

(TP 4)

DESCRIPTION

All low-side transistors are turned on, shorting the load to ground. Normal operation resumes when
the charge pump voltage is restored (not a latched fault), however the Fault
active until cleared by cycling MUTE

off, causing the load to see a high impedance state. This is a

, SHUTDOWN, or the power supply.

MUTE

transistors are turned on, shorting the load to ground. Once the junction temperature drops by 20°C
and is below 125°C, normal operation resumes (not a latched fault). The Fault
active until cleared by cycling MUTE

, SHUTDOWN, or the power supply.

latched

fault and is cleared by cycling

, SHUTDOWN, or the power supply.

indication

indication

remains

remains

3-8

Details

The TP A032D04 Class-D Audio Power Amplifier Evaluation Module

3.2.6 TPA032D04 Class-D EVM Test Points

Test points have been included on the TPA032D04 class-D EVM to facilitate
user analysis of device performance and design adjustments. Table 3–2 lists
each test point and its corresponding function.

Table 3–2.TPA032D04 Class-D EVM Test Points

TEST

POINT

IC PIN or EVM

FUNCTION

1 VCP Charge pump storage capacitor
2 J1–3 (Ring) Headphone right channel output
3 J1–2 (Tip) Headphone left channel output
4 FAULT_1 MSB for logic-level fault output signal, open drain
5 FAULT_0 LSB for logic-level fault output signal, open drain

FUNCTION

Details

3-9

Class-D Amplifier Design Considerations

3.3 Class-D Amplifier Design Considerations

Detailed information for proper design and implementation of TI class-D audio
power amplifiers is located in the application report

Class-D Audio Power Amplifiers

website (http://www.ti.com/sc/apa). This report provides background
information, general equations, and component selection criteria for the topics
listed below. General layout considerations are also included in the report.

-

Class-D amplifier circuits (input, output, charge pump, and switching)

-

Headphone circuit

-

Control and indicator circuits

-

Power supply decoupling

, TI Literature Number SLOA031, on the TI

Design Considerations for

The application report

Reducing and Eliminating the Class-D Output Filter

, TI
Literature Number SLOA023, is also available from the website, and provides
information to help determine what type of output filter, if any, may be
necessary.

3-10

Details

Using the TPA032D04 Class-D EVM With the Plug-N-Play Platform

3.4 Using the TPA032D04 Class-D EVM With the Plug-N-Play Platform

The TPA032D04 class-D stereo audio amplifier evaluation module was
designed to be used with the TI plug-n-play audio amplifier evaluation
platform. It simply plugs into socket U2 and U3.

The following paragraphs provide additional details for using the TP A032D04
class-D EVM with the platform.

3.4.1 Installing and Removing EVM Boards

TI plug-n-play evaluation modules use single-in-line header pins installed on
the underside of the module circuit board to plug into sockets on the platform.
The EVM pins and the platform sockets are keyed such that only the correct
type of EVM can be installed in a particular socket, and then only with the
proper orientation.

Evaluation modules are easily removed from the platform by simply prying
them up and lifting them out of their sockets. Care must be taken, however, to
prevent bending the pins.

3.4.1.1 EVM Insertion

3.4.1.2 EVM Removal

1) Remove all power from the evaluation platform.

2) Locate sockets U2 and U3 on the platform.

3) Orient the module correctly.

4) Carefully align the pins of the module with the socket pin receptacles.

5) Gently press the module into place.

6) Check to be sure that all pins are seated properly and that none are bent
over.

1) Remove all power from the evaluation platform.

2) Using an appropriate tool as a lever, gently pry up one side of the module
a small amount.

3) Change to the opposite side of the module and use the tool to pry that side
up a small amount.

4) Alternate between sides, prying the module up a little more each time to
avoid bending the pins, until it comes loose from the socket.

5) Lift the EVM off of the platform.

Details

3-11

Using the TPA032D04 Class-D EVM With the Plug-N-Play Platform

3.4.2 Module Switches

The TPA032D04 class-D stereo audio amplifier evaluation module is
equipped with two pushbutton switches that allow the module shutdown and
mute functions to be manually activated.

3.4.2.1 S1 — Shutdown

To have the module amplifier IC enter the shutdown mode, press the
Shutdown switch (S1) on the module. S1 connects the amplifier IC
SHUTDOWN
be controlled by an external control input to the SD module pin.

The shutdown mode reduces the amplifier IC current consumption to less than
1 µA compared to approximately 2.5 mA in the mute mode. The EVM
shutdown current is based on V
leakage currents, but will typically be 147 µA ±5% for VCC = 12 V and VDD =
5 V . The plug-n-play platform typically draws 60 mA of current when configured
for the TPA032D04 EVM.

3.4.2.2 S2 — Mute Switch

Pushbutton switch S2 on the TP A032D04 class-D EVM allows manual muting
of the amplifier IC. S2 connects the amplifier IC MUTE pin to ground, muting
the output. The EVM Mute control input pin also allows external control of this
function.

pin to ground, forcing it into a low-power state. This function can

CC,

VDD, R3, R6, R8, R13, R14, and capacitor

In the mute mode, the amplifier IC lowside output transistors are turned on,
shorting the load to ground. This reduces the EVM current to 2.5 mA in the
class-D mode and to 2 mA in the class-AB headphone amplifier mode.

3-12

Details

Using the TPA032D04 Class-D EVM With the Plug-N-Play Platform

3.4.3 Signal Routing

Signal flow on the platform is controlled by two signal routing switches, as
shown in Figure 3–7.

Figure 3–7.Platform Signal Routing and Outputs

Off

R

Audio

Input

L

U1

Signal

Conditioning

S2

On

U2/U3

TPA032D04

Amplifier EVM

U5

Stereo

Headphone

Amplifier

+

GND

R

L

R

L

–

J7, J8, J9

Speaker

Outputs

–
+

+
–

Headphone

Output

–
+

J10

R

L

U2–U4

R

S3

L

U5

3.4.3.1 Signal Conditioning

The audio signal from input jacks can be applied to the signal conditioning
socket (U1) if an EVM is installed there, or socket U1 can be bypassed and the
audio input signal applied directly to the inputs of the TPA032D04 class-D
EVM.

-

Platform switch S2 selects signal conditioning or bypasses it.

3.4.3.2 Headphone Output Jack

Switch S3 is the source select for the stereo headphone output jack, J10. The
headphone jack is capacitively coupled (via 470 µF electrolytics) and can
output either the signal from the headphone amplifier in socket U5, or the
signal from the power amplifier installed in socket U2, as determined by the
setting of headphone source select switch S3.

-

The platform headphone output jack (J10) is not used in conjunction with
the TP A032D04 class-D EVM. Switch S3 should be set to the U5 position
when the TPA032D04 class-D EVM is installed on the platform.

Details

3-13

Using the TPA032D04 Class-D EVM With the Plug-N-Play Platform

3.4.4 Shutdown

The TP A032D04 class-D EVM is equipped with a shutdown control input pin.
When this input is tied to GND, the TPA032D04 amplifier IC on the module
enters the shutdown mode and dissipates very little power. When the EVM
control input is tied to VDD or allowed to float, amplifier operation resumes.

In typical applications, as often found in notebook computers and other
portable audio products, the internal speakers mute when headphones are
plugged into the headphone jack, or internal speakers mute when external
speakers are connected. In applications using separate speaker and
headphone amplifiers, the one not being used can be muted to conserve
power.

The TP A032D04 EVM shutdown control pin connects to the platform mute line
of JP6 when the EVM is inserted in the plug-n-play platform. When JP6 is set
to mute and JP8 is set to Lo, the class-D EVM will operate normally until a
headphone plug is inserted into platform jack J10 and the class-D amplifier is
placed into shutdown. Once the jack is removed from J10, the class-D EVM
again becomes active. Note that when JP6 is set to mute and the class-D EVM
shutdown pin is activated, the platform current increases by approximately 20
mA. This current is set by the connection of the 240-Ω platform resistor (R3)
to ground through the EVM shutdown switch.

3.4.4.1 Headphone Jack Control Signals

The platform headphone output jack (J10) contains an internal switch that
changes the state of a pair of control lines when a plug is inserted (Figure 3–8).
Each control line is pulled down by a 1-kΩ resistor to ground (R4 and R5). The
switch in the headphone jack pulls one line or the other up to VDD through a
240-Ω resistor (R3) depending on whether a plug is inserted in J10 or not.

Figure 3–8.Mute/Mode and Polarity Control

V

DD

R3
240 Ω

J10

Headphone

Jack

R4
1 kΩ

R5
1 kΩ

Polarity

JP8 JP6

Lo

Hi

SPK

(U2–U4)

Mode

Mute

U2

Power

Amplifier

3-14

Details

Using the TPA032D04 Class-D EVM With the Plug-N-Play Platform

3.4.4.2 Mute/Mode Select (JP6)

A 3-pin jumper header (JP6) on the platform, functioning as an SPDT switch,
routes the control signal from the headphone jack to either the mute control
input pin or the mode control input pin of the evaluation module.

J

Set jumper JP6 to

NOT

installed in U5

J

Set jumper JP6 to
installed in U5. This will cause the TP A032D04 class-D EVM to shut
down when a plug is inserted into platform headphone jack J10.

3.4.4.3 Mute/Mode Polarity Select (JP8)

A second 3-pin jumper header (JP8) on the platform selects the control signal
polarity by connecting either the active-high or the active-low line from the
headphone jack to jumper JP6.

-

Set jumper JP8 to Lo for normal class-D operation when a separate
headphone amplifier IS installed in U5

MODE

when a separate headphone amplifier is

.

MUTE

when a separate headphone amplifier

.

IS

Details

3-15

Power Requirements

3.4.5 Power Requirements

The TPA032D04 class-D stereo audio power amplifier evaluation module is
designed to operate from a supply voltage between 9 V and 14 V. For best
performance (highest output power with lowest distortion), the module should
be operated at 12 V.

The TI plug-n-play audio amplifier evaluation platform provides several
options for powering the TPA032D04 class-D EVM. Table 3–3 shows the

platform

jumper and switch settings for each power source option (see the
User’s Guide for the TI plug-n-play audio amplifier platform, TI Literature
Number SLOU011 for more information). The TPA032D04 class-D EVM
requires no setup for power source selection.

Table 3–3.Platform Jumper and Switch Settings for the TPA032D04 EVM Power Inputs

POWER TYPE (Note 2) JP1 JP2 JP3 JP4 JP5 JP6 JP7 JP8 S1 S2 S3

VCC (J1) ON OFF OFF ON ON Mute X Hi ON Note 3 U5

AC/DC (J2) OFF ON OFF ON ON Mute X Hi ON Note 3 U5

Notes: 1) ON = Jumper installed, OFF = Jumper

2) Install a voltage regulator EVM (SLVP097) in platform socket U6 for VDD power to EVM control inputs.

3) Set to ON when Tone Control Board SLOP109 is installed in U1, otherwise set to OFF.

NOT

Installed, X = Don’t care

Although the TP A032D04 amplifier IC draws approximately 1.6 A per channel
from the power supply during continuous full power output, peak current draw
can be as high as 2.3 A per channel. Any power supply connected to the
platform should be capable of providing 4.6 A to avoid clipping of the output
signal during voltage peaks. Current consumption driving speakers at normal
listening levels is typically 0.1 A or less.

supply of 5 V is required for normal operation of the EVM. VDD can either

A V

DD

be applied to the platform VDD power input terminals (J6) or a voltage regulator
(SL VP097 or equiv.) can be installed in platform socket U6 to provide VDD from
the platform VCC supply.

The platform is equipped with overvoltage and reverse-polarity supply voltage
input protection in the form of fused crowbar circuits.

-

VDD voltage applied to platform screw terminals J6

MUST NOT

exceed
the absolute maximum rating for the TP A032D04 amplifier IC installed on
the evaluation module (5.5 V) or damage to the IC may result. In no case
should VDD voltage of the incorrect polarity or in excess of 6.0 V be applied
to screw terminals J6 of the platform, or the power protection circuit on the

line will trip.

V

DD

-

VCC voltage applied to the platform

MUST NOT

exceed the maximum
voltage input specified for the voltage regulator module installed in socket
U6 (12 V for the SLVP097), or damage to the voltage regulator module
may result. In no case should VCC voltage applied to the platform exceed
15 V, or the overvoltage protection circuit on the V

bus will trip.

CC

3-16

Details

3.4.6 Inputs and Outputs

The TI plug-n-play audio amplifier evaluation platform is equipped with several
standard conectors for audio inputs and outputs.

3.4.6.1 Inputs

In most cases, audio signals enter the platform through either a pair of RCA
phono jacks (J3 and J5) or a miniature (1/8″) stereo phone jack (J4). Certain
signal conditioning and amplifier EVMs, however, may have additional signal
input connectors mounted on the module circuit board.

The platform audio signal input jacks (J3, J4, and J5) are of the closed-circuit
type, grounding the signal input lines when no plugs are inserted.

3.4.6.2 Outputs

Amplified audio output signals leave the platform through left and right RCA
phono jacks (J7 and J9), left and right pairs of compression connectors for
stripped speaker wires (J8), and optionally , through a miniature (1/8″) stereo
phone jack (J10), for headphones.

The audio output lines from the power amplifiers are separate all the way to
the edge of the platform (output jacks J7, J8, and J9)—the OUT– lines from
the power amplifier sockets are not tied to each other or to platform ground.
This allows the TPA032D04 class-D power amplifier EVM to operate in the
highly-efficient bridge-tied load configuration when driving speakers.

Inputs and Outputs

The headphone jack (J10) is capacitively coupled to source select switch S3,
which connects J10 to the output lines of either the headphone amplifier
socket or the power amplifier sockets (Figure 3–9).

Figure 3–9.Typical Headphone Plug

Left Right GND

Details

3-17

Using the TPA032D04 Class-D EVM Stand-Alone

3.5 Using the TPA032D04 Class-D EVM Stand-Alone

Using the TPA032D04 class-D stereo audio power amplifier evaluation
module stand-alone is much the same as using it with the platform. The same
9-V to 14-V power supply range and the isolated out+ and out– lines for BTL
operation (Section 3.2.3) requirements exist. Figure 3–10 shows the
connections that are required for operation (with the exception of the fault
monitor circuit, which is optional). The discussion in this section is in reference
to this figure unless otherwise noted.

Figure 3–10. TPA032D04 Class-D EVM Stand-Alone Connections for Stereo BTL Output

5 V

Audio
Inputs
(Right)

Audio
Inputs

(Left)

Fault

Monitor

Mode

LED 1

R

R

LED 0

J1

RHPGND LHP

+RIN– Mode

R1

–LIN+GND

C1

R3

R11

R12

TP2

TP5

C2

R4

C6

C7

SD

S1
Mute

S2

C4
C5

R2

C3

R6

R5

SLOP204 TPA032D04 EVM Board

Rev. B

C15

+

R14

R13

TP4

C22 C23

C21

U1

TP1

C17

C16

+

VDD

R7

R8 R9

R10

GND

GND

12 V

L1

L2

VCC

VCC

C24

C25

1999

Instruments

Texas

L3

L4

Rout+

Rout–

Mute

SD

Lout–

Lout+

Right

Mute

Shutdown

Left

Note: Capacitors C15 and C16 are optional (not assembled) and locations for them on the EVM PCB have been provided to

increase design flexibility and allow decoupling capacitance to be added (Section 3.7

3.5.1 Power Connections

Power must be connected to both the VCC and VDD module pins. Power
supply ground can be connected to any module ground pin, although best
results are achieved if power supply grounds are connected to the pins
adjacent to the VCC and VDD module pins. The ground and power wires
should be twisted to reduce inductance and noise pickup if they are long.

3-18

5 V

Power Supply Decoupling

Details

).

3.5.2 Input Connections

The class-D amplifier input signals can be connected in either of two ways:
differential or single-ended. For differential operation, connect the two lines
from the signal source to the positive and negative inputs of each channel
(RIN+/RIN– and LIN+/LIN– module pins). For single-ended operation, the
input signal lines should be connected to the RIN+ and LIN+ module pins and
the signal source ground wires should be connected to the RIN– and LIN–
module pins. The EVM headphone amplifier inputs are single-ended, and the
signal source should be connected to the HPRIN and HPLIN module pins.

For best results, the ground of the signal source should be connected to the
GND pins at the EVM inputs to provide a return path for the current. The input
signal and ground wires should be twisted to reduce inductance and noise
pickup if the lead lengths are long and the cable is not shielded.

3.5.3 Output Connections

The right speaker should be connected between the Rout+ and the Rout–
module pins, and the left speaker should be connected between the Lout+ and
the Lout– module pins to comply with the isolated output requirements for BTL
operation.

Using the TPA032D04 Class-D EVM Stand-Alone

3.5.4 Controls and Indicators

The mute and shutdown functions may be controlled externally via the module
Mute and SD pins. An active-low input mutes the selected amplifier or shuts
down the device. A signal of 2 V or higher, or a float condition, allows normal
operation.

The mode control selects which amplifier is active and can be controlled in
either of two ways. The mode circuit is set to logic low for normal operation
(class-D amplifier is active), and the insertion of a headphone plug into the

EVM

headphone jack (J1), switches over to the headphone amplifier (the

platform headphone jack is not used in conjunction with the class-D EVM).
When the module Mode control input pin is used, the signal must be low for

class-D operation and greater than 2 V for headphone amplifier operation.
Note that the mute, mode, and shutdown signals applied to the EVM control

input pins must be able to supply enough current to overcome the pullup
resistor on the module (100 kΩ).

The fault indicator circuit can be monitored at FAULT0 (TP5) and FAULT1
(TP4). These are open-drain outputs with 100-kΩ resistors connected to VDD
(5 V). A fault table is shown in Section 3.2.5 and in the device data sheet.

Details

3-19

TPA032D04 Class-D EVM Performance Characteristics

3.6 TPA032D04 Class-D EVM Performance Characteristics

The TP A032D04 class-D stereo audio power amplifier EVM was tested using
an Audio Precision System II, model 2322, a 12-V regulated dc power supply ,
and the TI PNP audio power amplifier evaluation platform set up as described
in Chapter 2. Class-D results were obtained with 4-Ω and 8-Ω speaker loads
and headphone amplifier results were obtained with 32-Ω loads. The results
are shown in Figures 3–11 through 3–21.

The frequency response shown in Figure 3–1 1is a relatively flat 25 dB over the
20 Hz to 100 kHz frequency range. The lower and upper frequency corners can
be adjusted to extend the frequency response.

Figure 3–11. Class-D Amplifier Frequency Response at 4

VOLTAGE AMPLIFICATION

30

25

20

15

10

Voltage Amplification – dB

VDD = 12 V

5

RL = 4 Ω
TA = 25° C

0

10 100 1k

FREQUENCY

f – Frequency – Hz

Ω

vs

10k 100k

Total harmonic distortion plus noise (THD+N) versus output power and
frequency is shown in Figures 3–12 through 3–15 below. Figures 3–12 and
3–13 show power sweeps at a fixed frequency of 1 kHz. Switching and input
noise begins to dominate at low power, while the distortion at the mid to upper
power levels is a function of the class-D amplifier and the inductor. The lower
frequency noise may be improved by either increasing the order of the filter or
by increasing the amplifier switching frequency , which will further attenuate the
switching noise in the audio band.

Midrange distortion is a combination of the switching noise of the output power
transistors in the IC and the magnetic field created by the inductors. This
distortion is minimized by good separation of the output filter inductors for each
channel and through good EMI-reduction layout techniques.

3-20

Details

TPA032D04 Class-D EVM Performance Characteristics

Figure 3–12. Class-D Amplifier Distortion versus Output Power at 4

TOTAL HARMONIC DISTORTION PLUS NOISE

vs

1

0.1

VDD = 12 V
RL = 4 Ω

THD+N – Total Harmonic Distortion Plus Noise – (%)

TA = 25° C

0.02

0.01 0.1 1 10

OUTPUT POWER

PO – Output Power – W

Figure 3–13. Class-D Amplifier Distortion versus Output Power at 8

Ω

Ω

TOTAL HARMONIC DISTORTION PLUS NOISE

vs

1

0.1

VDD = 12 V
RL = 8 Ω

THD+N – Total Harmonic Distortion Plus Noise – (%)

TA = 25° C

0.02

0.01 0.1 1 10

OUTPUT POWER

PO – Output Power – W

Details

3-21

TPA032D04 Class-D EVM Performance Characteristics

Figures 3–14 and 3–15 show a frequency sweep for a 1-W output. The lower
frequency distortion of the graphs is dominated by noise, while the distortion
at higher frequencies is due primarily to the fast-changing duty cycle of the
PWM output.

Figure 3–14. Class-D Amplifier Distortion versus Frequency at 1 W Into 4

TOTAL HARMONIC DISTORTION PLUS NOISE

vs

1

VDD = 12 V
RL = 4 Ω
PO = 1 W
TA = 25° C

0.1

THD+N – Total Harmonic Distortion Plus Noise – (%)

0.02
20 100 1k

FREQUENCY

f – Frequency – Hz

Ω

10k 20k

Figure 3–15. Class-D Amplifier Distortion versus Frequency at 1 W Into 8

TOTAL HARMONIC DISTORTION PLUS NOISE

vs

1

VDD = 12 V
RL = 8 Ω
PO = 1 W
TA = 25° C

0.1

THD+N – Total Harmonic Distortion Plus Noise – (%)

0.02
20 100 1k

FREQUENCY

f – Frequency – Hz

Ω

10k 20k

3-22

Details

TPA032D04 Class-D EVM Performance Characteristics

EVM crosstalk is shown in Figures 3–16 and 3–17. The frequency is swept
from 20 Hz to 20 kHz for a constant 10-W, 7.5-W, and 5-W output. Several
factors affect crosstalk, such as component selection (especially the inductor),
filter layout, grounding, and power supply decoupling.

Figure 3–16. Class-D Amplifier Crosstalk versus Frequency Into 4

CROSSTALK

vs

–10

VDD = 12 V
RL = 4 Ω

–20

TA = 25° C

–30

–40

–50

–60

Crosstalk – dB

–70

–80

–90

–100

20 100 1k

FREQUENCY

10 W L–R

10 W R–L

7.5 W R–L

f – Frequency – Hz

Ω

7.5 W L–R

10k 20k

Figure 3–17. Class-D Amplifier Crosstalk versus Frequency Into 8

CROSSTALK

vs

–10

VDD = 12 V
RL = 8 Ω

–20

TA = 25° C

–30

–40

–50

–60

Crosstalk – dB

–70

–80

–90

–100

20 100 1k

5 W L–R

FREQUENCY

7.5 W L–R

f – Frequency – Hz

Ω

5 W R–L

7.5 W R–L
10k 20k

Details

3-23

TPA032D04 Class-D EVM Performance Characteristics

Headphone amplifier graphs are shown in Figures 3–18 through 3–21 below.
The frequency response shown in Figure 3–18 is 0 dB over most of the 20 Hz
– 20 kHz frequency range. The sharp rolloff at low frequencies is due to the
combination of the two high-pass filters of the circuit (input and output corner
frequencies), and can be improved by changing the value of the input filter.

Figure 3–18. Class AB Headphone Amplifier Frequency Response

VOLTAGE AMPLIFICATION

vs

5

VDD = 12 V

2.5
RL = 32 Ω

0

PO = 30 mW

–2.5

–7.5

–12.5

Voltage Amplification – dB

–17.5

–22.5

TA = 25° C

–5

–10

–15

–20

–25

20 100 1k

FREQUENCY

f – Frequency – Hz

10k 20k

T otal harmonic distortion plus noise (THD+N) versus output power and versus
frequency are shown in Figures 3–19 and 3–20. Figure 3–19 shows a power
sweep at fixed frequencies of 1 kHz, and 20 kHz. The increase in THD for the
low frequency sweep is due to noise, and the decrease in THD for the upper
frequency sweep is caused by a decrease in harmonics measured.

3-24

Details

TPA032D04 Class-D EVM Performance Characteristics

Figure 3–19. Class AB Headphone Amplifier Distortion versus Output Power

TOTAL HARMONIC DISTORTION PLUS NOISE

vs

OUTPUT POWER

1

VDD = 12 V
RL = 32 Ω
TA = 25° C

0.1

1 kHz

THD+N – Total Harmonic Distortion Plus Noise – (%)

0.01
1 5 10 20

PO – Output Power – mW

20 kHz

Figure 3–20 shows frequency sweeps for 10-mW, 30-mW, and 50-mW
outputs. The lower frequency distortion shown in the graphs is dominated by
noise, while the distortion at higher frequencies is caused by inductance in the
filter capacitor and trace lengths.

Figure 3–20. Class AB Headphone Amplifier Distortion versus Frequency

TOTAL HARMONIC DISTORTION PLUS NOISE

vs

FREQUENCY

1

VDD = 12 V
RL = 32 Ω
TA = 25° C

50

0.1

30 mW

THD+N – Total Harmonic Distortion Plus Noise – (%)

0.01
20 100 1k

f – Frequency – Hz

50 mW

10 mW

10k 20k

Details

3-25

TPA032D04 Class-D EVM Performance Characteristics

EVM crosstalk is shown in Figure 3–21 for an output power of 50 mW.

Figure 3–21. Class AB Headphone Amplifier Crosstalk versus Frequency

CROSSTALK

vs

0

VDD = 12 V

–10

RL = 32 Ω
PO = 30 mW

–20

TA = 25° C

–30

–40

–50
–60
–70

Crosstalk – dB

–80
–90

–100
–110
–120

20 100 1k

FREQUENCY

f – Frequency – Hz

10k 20k

3-26

Details

TPA032D04 Class-D EVM Power Supply Decoupling Data

3.7 TPA032D04 Class-D EVM Power Supply Decoupling Data

The decoupling capacitance required will depend upon the application. Pads
and through-holes have been provided on the EVM for the addition of bulk
capacitance (see the schematic). A plot showing the impact of various levels
of bulk capacitance on the voltage ripple on the power supply line is shown in
Figure 3–22. This ripple is maximum at higher frequency. The figure shows
worst-case voltage ripple for a 20-kHz, 10-W output into a 4-Ω load. In all
cases, two 10-µF and one 1-µF ceramic chip capacitors were decoupling the
power supply signal from the EVM. The 1-µF unit was placed immediately
adjacent to the IC power pins, and the 10-µF units were placed adjacent to
each other a little farther out.

The upper trace shows the ripple when only these capacitors are used. The
middle trace shows the impact of an additional 330-µF aluminum electrolytic
capacitor rated at 25 V , 90 mΩ, and for 755 mA at 100 kHz. In the bottom trace,
the 330-µF capacitor was replaced by a 390-µF aluminum electrolytic
capacitor rated at 35 V, 65 mΩ, and for 1.2 A of 100 kHz ripple current.

The results indicate that for sensitive circuits where minimum voltage ripple is
required, a larger bulk capacitance with low ESR should be used. For systems
that are contained and EMI is controlled, less capacitance may be used. The
difference in the level of distortion in the output signal was very small between
each level of decoupling, with the 20-µF bulk capacitance providing the least
distortion. This is attributed to the low ESR of the capacitor, which is only a few
milliohms at the switching frequency of 250 kHz. The distortion is made lower
still by the parallel combination. Distortion of the output signal when only one
10-µF capacitor is used is the same as for 20 µF. The difference is more
noticeable on the power supply line, though the distortion is increased only
slightly more than with the 20-µF capacitor .

Figure 3–22. Power Supply Decoupling

cc

V Ripple Voltage (2 V per division)

RIPPLE VOLTAGE

Time (10 µsec per division)

Details

3-27

TPA032D04 Class-D EVM Interconnects

3.8 TPA032D04 Class-D EVM Interconnects

T able 3–4 shows the correlation between the TP A032D04 class-D amplifier IC
pins, the EVM pins, and the plug-n-play (PNP) platform sockets.

Table 3–4.TPA032D04 Class-D EVM/Plug-N-Play Platform Interconnects

CLASS-D EVM PLUG-N-PLAY PLATFORM

IC PIN EVM PIN FUNCTION ON EVM PNP SOCKET FUNCTION ON PLATFORM

8, 9 16, 21, 28,

33, 40

7, 12, 13, 20, 27,

36, 37, 46, 47

44 RIN+ Class-D right channel positive input Right In (line) Right channel input from J3 or J4
45 RIN– Class-D right channel inverted input GND Ground for platform from J1, J2

38, 39 Rout+ Class-D right channel positive

34,35 Rout– Class-D right channel inverted

5 LIN+ Class-D left channel positive input Left In (line) Left channel input from J4 or J5
4 LIN– Class-D left channel inverted input GND Ground for platform from J1, J2

10, 11 Lout+ Class-D left channel positive output Left Out + Left channel positive output to J8

14, 15 Lout– Class-D left channel inverted output Left Out – Left channel negative output to J8

30 RHP Headphone right channel input Right In (HP) Headphone right channel input

19 LHP Headphone left channel input Left In (HP) Headphone left channel input from

18, 31 J1 Headphone stereo output jack, left

3 Mode Mode control external input pin:

2 Mute Mute control external input pin:

1 SD Shutdown control external input pin:

41 TP4 Fault–1: Logic level fault–1 output

42 TP3 Fault–0: Logic level fault–0 output

– VDD Power for EVM TTL logic control

VCC Power for left channel, right channel,

GND Analog and power ground for EVM,

input, and headphone circuits

all pins

output

output

and right

class-D active when low, HP active
when held > 2 V

active low — selected amplifier
active when held > 2 V

active low — normal operation when
held > 2 V

signal. MSB. Open drain.

signal. LSB. Open drain.

inputs

VCC Power from J1 or J2

GND Ground for platform from J1 or J2

Right Out + Right channel positive output to J7

Right Out – Right channel negative output to

NA Not applicable

N/C No connect

N/C No connect

Mute Mute control from JP6 for use

N/C No connect

N/C No connect

VDD Power from J6 or power regulator

or J8

J7 or J8

or J9

or J9

from J3 or J4

J4 or J5

when testing a headphone amplifi­er in socket U5 in conjunction with
an EVM in U2/U3/U4

installed in platform socket U6

3-28

Details

TPA032D04 Class-D EVM Bill of Materials

3.9 TPA032D04 Class-D EVM Bill of Materials

The components in the bill of materials (Table 3–5) were selected for their
common values, availability, and the smallest size available to meet these
criteria.

Table 3–5.TPA032D04 Class-D EVM Bill of Materials

Reference Description Size

C2, C3, C20 Capacitor, Ceramic Chip, 0.1 µF, ±10%,

50 V, X7R

C1, C4, C5, C6,
C10, C12, C13,
C17, C18, C19

C21 Capacitor, Ceramic Chip, 47 nF, ±10%,

C7, C8, C9 Capacitor, Ceramic Chip, 1 nF, ±5%,

C22†, C23

C11, C14 Capacitor, Ceramic Chip, 10 µF, +80%–20%,

C15†, C16

C24, C25 Capacitor,Aluminum Electrolytic, Radial Lead,

C26, C27, C28,
C29

C30, C31 Capacitor, Ceramic Chip, 1 µF, ±10%,

L1, L2, L3, L4 Inductor, SMT, 15 µH, ±20%, 2.2 ADC, 47.2 mΩ

R1 – R7,
R10 – R12

R8, R9 Resistor, Thick Film Chip, SMD, 1 kΩ, ±5%,

R13 Resistor, Thick Film Chip, SMD, 500 kΩ, ±5%,

R14 Resistor, Thick Film Chip, SMD, 150 kΩ, ±5%,

TP1 – TP5 Test Point, Red 10 Farnell 240–345
S1, S2 Switch, Momentary, Push Button, 12 VDC,

J1 Mini Phone Jack, 3.5 mm, N/C, Stereo 0.512” × 0.472” 1 Mouser

U1 IC, Audio Amplifier, Class-D,

†

Capacitors C15 and C16are optional (not assembled) and locations for them on the EVM PCB have been provided to increase
design flexibility and allow decoupling capacitance to be added (Section 3.7
C23 are required only when the headphone amplifier gain is set greater than 10 V/V .

†

†

Capacitor, Ceramic Chip, 1 µF, ±10%,
25 V, X7R

50 V, X7R

50 V, C0G,
Capacitor, Ceramic Chip, 5.6 pF, ±°%,

50 V, COG

25 V, Y5V
Not assembled 0.492” ×

33 µF, ±20%, 35 V, FC Series, 80 mΩ @
100 kHz, 175 mA ripple, –55 to +105°C

Capacitor, Ceramic Chip, 0.22 µF, ±10%,
50 V, X7R

50 V, X7R

@ 1 kHz, –20 to +90°C
Resistor, Thick Film Chip, SMD, 100 kΩ, ±5%,

1/10 W, 100 V, –50 to 150°C, ±200 ppm/°C

1/16 W, 150 V, –50 to 150°C, ±200 ppm/°C

1/16 W, 150 V, –50 to 150°C, ±200 ppm/°C

1/16 W, 150 V, –50 to 150°C, ±200 ppm/°C
Header Pins, Gold, Single, 0.5” Long, 0.25”

Wide, 0.100” centers

50 mA

32 W, 48 pin, DCA pkg

0805 3 Kemet

1206 10 Kemet

0805 1 Kemet

0805 3 Kemet

0603 2 Kemet

1210 2 muRata

0.0236” ×

0.197”

0.197” ×

0.0197” ×

0.078”
1206 4 Kemet

1812 2 Kemet

0.398” × 0.398”
× 0.236”

0603 10 Vishay/Dale

0603 2 Vishay/Dale

0603 1 Vishay/Dale

0603 1 Vishay/Dale

0.5”, 0.25”,

0.1”

0.291” × 0.138”
× 0.134”

TSSOP48 1 TI

Power Supply Decoupling

EVM

Qty.

2

2 Panasonic

4 TDK

19 Samtec

2 Panasonic

Manufacturer/

Part Number

C0805C104J5RAC

C1206C105K3RAC

C0805V473K5RAC

C0805C102J5GAC

C0603C569J5GAC

GRM235Y5V106Z25

EEUFC1V330

C1206C224K5RAC

C1812C105K5RAC

SLF10145T–150M2R2

CRCW0603104J

CRCW0603102J

CRCW0603500K

CRCW0603153J

TSW–19–8–G–S

EVQ-PJS04K

161–3504

TPA032D04DCA

). Capacitors C22 and

Details

3-29

TPA032D04 Class-D EVM Schematic

3.10 TPA032D04 Class-D EVM Schematic

The TPA032D04 class-D EVM schematic is shown in Figure 3–23.

Figure 3–23. TPA032D04 Class-D EVM Schematic Diagram

SD
Mute

Mode
LIN–
LIN+

VCC

LOUT+

LOUT–

TIP

HPDL

LHP

Mode

C16

VDD

†

C3

0.1µF

R3
100k

R1

100k

C14 C13

10µF

C30

1µF

C25

33µF

R2

100k

1µF

0.22µF

0.22µF

R10
100k

VCC

R5
100k

S2
Mute

C27

C26

C18

HPDL

C23

5.6pF

1µF

C20

0.1µF

C10

15µH

15µH

†

R6
100k

S1
SD

C4
C5
C8

L2

L4

1µF
1µF

1000pF

1µF

HPVCC

1

SHUTDOWN

2

MUTE

3

MODE

4

LINN

5

LINP

6

LCOMP

7

AGND

8

VDD

9

LPVDD

10

LOUTP

11

LOUTP

12

PGND

13

PGND

14

LOUTN

15

LOUTN

16

LPVDD

17

HPREG

18

HPLOUT

19

HPLIN

20

AGND

21

PVDD

22

VCP

23

HPDL

24

CP1

5V
12V

TPA032D04

RCOMP

FAULT_0

FAULT_1

RPVDD
ROUTP
ROUTP

ROUTN
ROUTN
RPVDD
HPVCC

HPROUT

0.047µF

C21

COSC

AGND

AGND

RINN
RINP

PGND
PGND

HPRIN

V2P5

PVDD

PGND

HPDR

CP2

VDD

VCC

48
47
46

1µF

45

1µF

44

1000pF

43
42

R11 100k

41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25

Ring

TP5

R12 100k

TP4

15µH

15µH

C17
1µF

C1
C6
C9

L1

L3

R8

1 k

C22

5.6pF

TIP

C7

1000pF

VDD

C28

0.22µF
C29

0.22µF

†

C19
1µF

Mode

R9
1 k

1µF

R7

100k

HPDR

R14

150k

C11C12

10µF

C31

1µF

R4

100k

3
B
A

2

1

C24

33µF

VCC

500k

0.1µF

R13

C15

C2

J1

RIN–
RIN+

†

VCC

ROUT+

ROUT–

RING

HPDR

RHP

HPVCC

†

Capacitors C15 and C16are optional (not assembled) and locations for them on the EVM PCB have been provided to increase
design flexibility and allow decoupling capacitance to be added (Section 3.7
C23 are required only when the headphone amplifier gain is set greater than 10 V/V .

3-30

Power Supply Decoupling

). Capacitors C22 and

Details

3.11 TPA032D04 Class-D EVM PCB Layers

The following illustrations depict the TP A032D04 class-D EVM PCB assembly
and layers. These drawings are not to scale. Gerber plots can be obtained from
any TI Sales Office.

Figure 3–24. TPA032D04 Class-D EVM Top Assembly

TPA032D04 Class-D EVM PCB Layers

Figure 3–25. TPA032D04 Class-D EVM Bottom Assembly

Details

3-31

TPA032D04 Class-D EVM PCB Layers

Figure 3–26. TPA032D04 Class-D EVM Top Layer

Figure 3–27. TPA032D04 Class-D EVM Second Layer

3-32

Details

Figure 3–28. TPA032D04 Class-D EVM Third Layer

TPA032D04 Class-D EVM PCB Layers

Figure 3–29. TPA032D04 Class-D EVM Bottom Layer

Details

3-33

3-34

Details