PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
This page intentionally left blank
Revision History
Revision History
This data manual revision history highlights the technical changes made to the SPRS241C device-specific data
manual to make it a SPRS241D revision.
Scope: Applicable updates to the C64x device family, specifically relating to the TMS320C6418 device, have
been incorporated.
Added the device-specific information supporting the TMS320C6418 silicon revision 1.1 device, which is now in
the production data (PD) stage of development (see ADDS/CHANGES/DELETES).
OSCV
Changed Description from “Power for crystal oscillator (1.2 V), Do not connect to board power 1.4 V; “ to “Power for crystal
oscillator (1.2 V), Do not connect to board power CVDD; “
D0.13-µm/6-Level Cu Metal Process (CMOS)
D3.3-V I/Os, 1.4-V Internal (-600)
D3.3-V I/Os, 1.2-V Internal (A-500)
VelociTI.2, VelociTI, and TMS320C64x are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
†
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
August 2004 − Revised January 2006SPRS241D
15
Functional Overview
2Functional Overview
2.1GTS and ZTS BGA Packages (Bottom View)
GTS and ZTS 288-PIN BALL GRID ARRAY (BGA) PACKAGES
(BOTTOM VIEW)
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
21
19
17
15
13
11
5431
2
9
10
876
14
12
18
16
22
20
Figure 2−1. GTS and ZTS BGA Packages (Bottom View)
16
August 2004 − Revised January 2006SPRS241D
2.2Description
The TMS320C64x DSPs (including the TMS320C6418 device) are the highest-performance fixed-point
DSP generation in the TMS320C6000 DSP platform. The TMS320C6418 (C6418) device is based on the
second-generation high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture
(VelociTI.2) developed by Texas Instruments (TI). The high-performance, lower-cost C6418 DSP enables
customers to reduce system costs for telecom, software radio, Digital Terrestrial Television Broadcasting
(DTTB), and digital Broadcast Satellite/Communication Satellite (BS/CS) applications. The C64x is a
code-compatible member of the C6000 DSP platform.
With performance of up to 4800 million instructions per second (MIPS) at a clock rate of 600 MHz, the C6418
device offers cost-effective solutions to high-performance DSP programming challenges. The C6418 DSP
possesses the operational flexibility of high-speed controllers and the numerical capability of array
processors. The C64x DSP core processor has 64 general-purpose registers of 32-bit word length and eight
highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs)—
with V elociTI.2 extensions. The VelociTI.2 extensions in the eight functional units include new instructions
to accelerate the performance in video and imaging applications and extend the parallelism of the VelociTI
architecture. The C6418 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of
2400 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4800 MMACS. The C6418
DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar
to the other C6000 DSP platform devices.
The C6418 device has a high-performance embedded coprocessor [Viterbi Decoder Coprocessor (VCP)] that
significantly speed up channel-decoding operations on-chip. The VCP operating at CPU clock divided-by-4
can decode over 500 7.95-Kbps adaptive multi-rate (AMR) [K = 9, R = 1/3] voice channels. The VCP supports
constraint lengths K = 5, 6, 7, 8, and 9, rates R = 1/2, 1/3, and 1/4, and flexible polynomials, while generating
hard decisions or soft decisions. Communications between the VCP and the CPU are carried out through the
EDMA controller.
Description
The C6418 uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The
Level 1 program cache (L1P) is a 128-Kbit direct mapped cache and the Level 1 data cache (L1D) is a 128-Kbit
2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 4-Mbit memory space that is
shared between program and data space. L2 memory can be configured as mapped memory, cache (up to
256K bytes), or combinations of the two. The peripheral set includes: two multichannel buffered audio serial
ports (McASPs); two inter-integrated circuit bus modules (I2Cs) ; two multichannel buffered serial ports
(McBSPs); three 32-bit general-purpose timers; a user-configurable 16-bit or 32-bit host-port interface
(HPI16/HPI32); a 16-pin general-purpose input/output port (GP0) with programmable interrupt/event
generation modes; and a 32-bit glueless external memory interface (EMIFA), which is capable of interfacing
to synchronous and asynchronous memories and peripherals.
Each McASP port supports one transmit and one receive clock zone, with six serial data pins which can be
individually allocated to any of the two zones. The serial port supports time-division multiplexing on each pin
from 2 to 32 time slots. The C6418 has sufficient bandwidth to support all six serial data pins transmitting a
192-kHz stereo signal. Serial data in each zone may be transmitted and received on multiple serial data pins
simultaneously and formatted in a multitude of variations on the Philips Inter-IC Sound (I
2
S) format.
In addition, the McASP transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3, CP-430
encoded data channels simultaneously , with a single RAM containing the full implementation of user data and
channel status fields.
McASP also provides extensive error-checking and recovery features, such as the bad clock detection circuit
for each high-frequency master clock which verifies that the master clock is within a programmed frequency
range.
The I2C ports on the TMS320C6418 allows the DSP to easily control peripheral devices and communicate
with a host processor. In addition, the standard multichannel buffered serial port (McBSP) may be used to
communicate with serial peripheral interface (SPI) mode peripheral devices.
TMS320C6000, and C6000 are trademarks of Texas Instruments.
August 2004 − Revised January 2006SPRS241D
17
Device Characteristics
Not all peripherals pins
Not all peripherals pins
are available at the
Configuration section).
Voltage
The C6418 has a complete set of development tools which includes: a new C compiler, an assembly optimizer
to simplify programming and scheduling, and a Windows debugger interface for visibility into source code
execution.
2.3Device Characteristics
Table 2−1, provides an overview of the C6418 DSP. The tables show significant features of the C6418 device,
including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin
count.
Table 2−1. Characteristics of the C6418 Processor
HARDWARE FEATURESC6418
EMIFA (32-bit bus width)
(clock source = AECLKIN, CLKOUT4, or CLKOUT6)
Peripherals
are available at the
same time (For more
detail, see the Device
CPU ID + CPU Rev IDControl Status Register (CSR.[31:16])0x0C01
JTAG BSDL_IDJTAGID register (address location: 0x01B3F008)0x0007902F
FrequencyMHz
Cycle Timens
Voltage
PLL OptionsCLKIN frequency multiplier
BGA Package23 x 23 mm288-Pin Flip-Chip Plastic BGA (GTS and ZTS)
Process Technologyµm0.13 µm
Product Status
†
On this C64x device, the rated EMIF speed affects only the SDRAM interface on the EMIF. For more detailed information, see the EMIF device
speed portion of this data sheet.
‡
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard
warranty. Production processing does not necessarily include testing of all parameters.
‡
EDMA (64 independent channels)1
McASPs (use Peripheral Clock and AUXCLK)2
I2Cs (use Peripheral Clock)2
HPI (32- or 16-bit user selectable)1 (HPI16 or HPI32)
McBSPs
GP0[15:8] pins are muxed with the HPI HD[15:8] pins and GP0[2:1] pins are muxed with CLKOUT6 and CLKOUT4,
GP0
GP0
‡
OSCILLATOR
and PLL
(x1, x5 − x12, x16,
x18, x19 − x22, x24)
Boot Configuration
Power-Down
Logic
respectively.
Figure 2−2. Functional Block Diagram
August 2004 − Revised January 2006SPRS241D
19
CPU (DSP Core) Description
2.4CPU (DSP Core) Description
The CPU fetches VelociTI advanced very-long instruction words (VLIWs) (256 bits wide) to supply up to
eight 32-bit instructions to the eight functional units during every clock cycle. The V elociTI VLIW architecture
features controls by which all eight units do not have to be supplied with instructions if they are not ready to
execute. The first bit of every 32-bit instruction determines if the next instruction belongs to the same execute
packet as the previous instruction, or whether it should be executed in the following clock as a part of the next
execute packet. Fetch packets are always 256 bits wide; however, the execute packets can vary in size. The
variable-length execute packets are a key memory-saving feature, distinguishing the C64x CPUs from other
VLIW architectures. The C64x VelociTI.2 extensions add enhancements to the TMS320C62x DSP
VelociTI architecture. These enhancements include:
•Register file enhancements
•Data path extensions
•Quad 8-bit and dual 16-bit extensions with data flow enhancements
•Additional functional unit hardware
•Increased orthogonality of the instruction set
•Additional instructions that reduce code size and increase register flexibility
The CPU features two sets of functional units. Each set contains four units and a register file. One set contains
functional units .L1, .S1, .M1, and .D1; the other set contains units .D2, .M2, .S2, and .L2. The two register
files each contain 32 32-bit registers for a total of 64 general-purpose registers. In addition to supporting the
packed 16-bit and 32-/40-bit fixed-point data types found in the C62x VelociTI VLIW architecture, the
C64x register files also support packed 8-bit data and 64-bit fixed-point data types. The two sets of functional
units, along with two register files, compose sides A and B of the CPU [see the functional block and CPU (DSP
core) diagram, and Figure 2−3]. The four functional units on each side of the CPU can freely share the 32
registers belonging to that side. Additionally, each side features a “data cross path”—a single data bus
connected to all the registers on the other side, by which the two sets of functional units can access data from
the register files on the opposite side. The C64x CPU pipelines data-cross-path accesses over multiple clock
cycles. This allows the same register to be used as a data-cross-path operand by multiple functional units in
the same execute packet. All functional units in the C64x CPU can access operands via the data cross path.
Register access by functional units on the same side of the CPU as the register file can service all the units
in a single clock cycle. On the C64x CPU, a delay clock is introduced whenever an instruction attempts to read
a register via a data cross path if that register was updated in the previous clock cycle.
In addition to the C62x DSP fixed-point instructions, the C64x DSP includes a comprehensive collection
of quad 8-bit and dual 16-bit instruction set extensions. These VelociTI.2 extensions allow the C64x CPU
to operate directly on packed data to streamline data flow and increase instruction set efficiency.
Another key feature of the C64x CPU is the load/store architecture, where all instructions operate on registers
(as opposed to data in memory). Two sets of data-addressing units (.D1 and .D2) are responsible for all data
transfers between the register files and the memory. The data address driven by the .D units allows data
addresses generated from one register file to be used to load or store data to or from the other register file.
The C64x .D units can load and store bytes (8 bits), half-words (16 bits), and words (32 bits) with a single
instruction. And with the new data path extensions, the C64x .D unit can load and store doublewords (64 bits)
with a single instruction. Furthermore, the non-aligned load and store instructions allow the .D units to access
words and doublewords on any byte boundary. The C64x CPU supports a variety of indirect addressing modes
using either linear- or circular-addressing with 5- or 15-bit offsets. All instructions are conditional, and most
can access any one of the 64 registers. Some registers, however, are singled out to support specific
addressing modes or to hold the condition for conditional instructions (if the condition is not automatically
“true”).
TMS320C62x and C62x are trademarks of Texas Instruments.
20
August 2004 − Revised January 2006SPRS241D
CPU (DSP Core) Description
The two .M functional units perform all multiplication operations. Each of the C64x .M units can perform two
16 × 16-bit multiplies or four 8 × 8-bit multiplies per clock cycle. The .M unit can also perform 16 × 32-bit multiply
operations, dual 16 × 16-bit multiplies with add/subtract operations, and quad 8 × 8-bit multiplies with add
operations. In addition to standard multiplies, the C64x .M units include bit-count, rotate, Galois field multiplies,
and bidirectional variable shift hardware.
The two .S and .L functional units perform a general set of arithmetic, logical, and branch functions with results
available every clock cycle. The arithmetic and logical functions on the C64x CPU include single 32-bit, dual
16-bit, and quad 8-bit operations.
The processing flow begins when a 256-bit-wide instruction fetch packet is fetched from a program memory.
The 32-bit instructions destined for the individual functional units are “linked” together by “1” bits in the least
significant bit (LSB) position of the instructions. The instructions that are “chained” together for simultaneous
execution (up to eight in total) compose an execute packet. A “0” in the LSB of an instruction breaks the chain,
effectively placing the instructions that follow it in the next execute packet. A C64x DSP device enhancement
now allows execute packets to cross fetch-packet boundaries. In the TMS320C62x/TMS320C67x DSP
devices, if an execute packet crosses the fetch-packet boundary (256 bits wide), the assembler places it in
the next fetch packet, while the remainder of the current fetch packet is padded with NOP instructions. In the
C64x DSP device, the execute boundary restrictions have been removed, thereby, eliminating all of the
NOPs added to pad the fetch packet, and thus, decreasing the overall code size. The number of execute
packets within a fetch packet can vary from one to eight. Execute packets are dispatched to their respective
functional units at the rate of one per clock cycle and the next 256-bit fetch packet is not fetched until all the
execute packets from the current fetch packet have been dispatched. After decoding, the instructions
simultaneously drive all active functional units for a maximum execution rate of eight instructions every clock
cycle. While most results are stored in 32-bit registers, they can be subsequently moved to memory as bytes,
half-words, or doublewords. All load and store instructions are byte-, half-word-, word-, or
doubleword-addressable.
For more details on the C64x CPU functional units enhancements, see the following documents:
•TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189)
•TMS320C64x Technical Overview (literature number SPRU395)
TMS320C67x is a trademark of Texas Instruments.
August 2004 − Revised January 2006SPRS241D
21
CPU (DSP Core) Description
ST1b (Store Data)
ST1a (Store Data)
Data Path A
LD1b (Load Data)
LD1a (Load Data)
DA1 (Address)
32 MSBs
32 LSBs
32 MSBs
32 LSBs
src1
.L1
src2
long dst
long src
long src
long dst
src1
.S1
src2
long dst
long dst
src1
.M1
src2
src2
src1
.D1
src2
dst
dst
dst
dst
dst
8
8
8
8
Register
File A
(A0−A31)
See Note A
See Note A
2X
Data Path B
DA2 (Address)
LD2a (Load Data)
LD2b (Load Data)
ST2a (Store Data)
ST2b (Store Data)
32 LSBs
32 MSBs
32 MSBs
32 LSBs
src2
.D2
src1
src2
src1
.M2
long dst
src2
.S2
src1
long dst
long src
long src
long dst
src2
.L2
src1
dst
dst
dst
dst
1X
See Note A
See Note A
Register
File B
(B0− B31)
8
8
8
8
Control Register
File
NOTE A: For the .M functional units, the long dst is 32 MSBs and the dst is 32 LSBs.
Figure 2−3. TMS320C64x CPU (DSP Core) Data Paths
22
August 2004 − Revised January 2006SPRS241D
2.5Memory Map Summary
Table 2−2 shows the memory map address ranges of the C6418 device. Internal memory is always located
at address 0 and can be used as both program and data memory. The external memory address ranges in
the C6418 device begin at the hex address location 0x8000 0000 for EMIFA.
Table 2−2. TMS320C6418 Memory Map Summary
Memory Map Summary
MEMORY BLOCK DESCRIPTION
Internal RAM (L2) [C6418]512K
Reserved [C6418]512K
Reserved15M
Reserved8M
External Memory Interface A (EMIFA) Registers256K
L2 Registers256K
HPI Registers256K
McBSP 0 Registers256K
McBSP 1 Registers256K
Timer 0 Registers256K
Timer 1 Registers256K
Interrupt Selector Registers256K
EDMA RAM and EDMA Registers256K
Reserved512K
Timer 2 Registers256K
GP0 Registers256K minus 4K
Device Configuration Registers4K
I2C0 Data and Control Registers16K
I2C1 Data and Control Registers16K
Reserved16K
McASP0 Control Registers16K
McASP1 Control Registers16K
Reserved176K
VCP Control Registers128K
Reserved128K
Emulation256K
Reserved528K
Reserved3.5M
QDMA Registers52
Reserved928M minus 52
McBSP 0 Data64M
McBSP 1 Data64M
Reserved64M
McASP0 Data1M
McASP1 Data1M
Reserved62M
Figure 2−4 shows the detail of the L2 architecture on the TMS320C6418 device. For more information on the
L2MODE bits, see the cache configuration (CCFG) register bit field descriptions in the TMS320C64xTwo-Level Internal MemoryReference Guide (literature number SPRU610).
Table 2−3 through Table 2−21 identify the peripheral registers for the C6418 device by their register names,
acronyms, and hex address or hex address range. For more detailed information on the register contents, bit
names and their descriptions, see the specific peripheral reference guide listed in the TMS320C6000 DSPPeripherals Overview Reference Guide (literature number SPRU190).
Table 2−3. EMIFA Registers
HEX ADDRESS RANGEACRONYMREGISTER NAMECOMMENTS
0180 0000GBLCTLEMIFA global control
0180 0004CECTL1EMIFA CE1 space control
0180 0008CECTL0EMIFA CE0 space control
0180 000C−Reserved
0180 0010CECTL2EMIFA CE2 space control
0180 0014CECTL3EMIFA CE3 space control
0180 0018SDCTLEMIFA SDRAM control
0180 001CSDTIMEMIFA SDRAM refresh control
0180 0020SDEXTEMIFA SDRAM extension
0180 0024 − 0180 003C−Reserved
0180 0040PDTCTLPeripheral device transfer (PDT) control
0180 0044CESEC1EMIFA CE1 space secondary control
0180 0048CESEC0EMIFA CE0 space secondary control
0180 004C−Reserved
0180 0050CESEC2EMIFA CE2 space secondary control
0180 0054CESEC3EMIFA CE3 space secondary control
0180 0058 − 0183 FFFF–Reserved
Table 2−4. L2 Cache Registers (C64x)
HEX ADDRESS RANGEACRONYMREGISTER NAMECOMMENTS
0184 0000CCFGCache configuration register
0184 0004 − 0184 0FFC−Reserved
0184 1000EDMAWEIGHTL2 EDMA access control register
01A0 13E0 − 01A0 13F7−Reload/link parameters for Event 148 (6 words)
01A0 13F8 − 01A0 13FF−Scratch pad area (2 words)
01A0 1400 − 01A3 FFFF−Reserved
†
The C6418 device has 213 EDMA parameters total: 64-Event/Reload channels and 149-Reload only parameter sets [six (6) words each] that
can be used to reload/link EDMA transfers.
†
Parameters for Event 0
(6 words) or Reload/Link
Parameters for other Event
Reload/Link Parameters for
other Event 0−15
30
August 2004 − Revised January 2006SPRS241D
Peripheral Register Descriptions
Table 2−8. Interrupt Selector Registers (C64x)
HEX ADDRESS RANGEACRONYMREGISTER NAMECOMMENTS
019C 0000MUXHInterrupt multiplexer high
019C 0004MUXLInterrupt multiplexer low
019C 0008EXTPOLExternal interrupt polarity
019C 000C − 019F FFFF−Reserved
Selects which interrupts drive CPU
interrupts 10−15 (INT10−INT15)
Selects which interrupts drive CPU
interrupts 4−9 (INT04−INT09)
Sets the polarity of the external
interrupts (EXT_INT4−EXT_INT7)
01B4 004801B4 4048I2CPFUNCxI2Cx pin function register
01B4 004C01B4 404CI2CPDIRxI2Cx pin direction register
01B4 005001B4 4050I2CPDINxI2Cx pin data in register
01B4 005401B4 4054I2CPDOUTxI2Cx pin data out register
01B4 005801B4 4058I2CPDSETxI2Cx pin data set register
01B4 005C01B4 405CI2CPDCLRxI2Cx pin data clear register
The C64x EDMA supports up to 64 EDMA channels which service peripheral devices and external memory .
Table 2−22 lists the source of C64x EDMA synchronization events associated with each of the programmable
EDMA channels. For the C6418 device, the association of an event to a channel is fixed; each of the EDMA
channels has one specific event associated with it. These specific events are captured in the EDMA event
registers (ERL, ERH) even if the events are disabled by the EDMA event enable registers (EERL, EERH). The
priority of each event can be specified independently in the transfer parameters stored in the EDMA parameter
RAM. For more detailed information on the EDMA module and how EDMA events are enabled, captured,
processed, linked, chained, and cleared, etc., see the TMS320C6000 DSP Enhanced Direct Memory Access(EDMA) Controller Reference Guide (literature number SPRU234).
In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or alternate transfer
completion events. For more detailed information on EDMA event-transfer chaining, see the TMS320C6000 DSP Enhanced Direct MemoryAccess (EDMA) Controller Reference Guide (literature number SPRU234).
In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or alternate transfer
completion events. For more detailed information on EDMA event-transfer chaining, see the TMS320C6000 DSP Enhanced Direct MemoryAccess (EDMA) Controller Reference Guide (literature number SPRU234).
EVENT DESCRIPTIONEVENT NAME
2.8Interrupt Sources and Interrupt Selector
The C64x DSP core supports 16 prioritized interrupts, which are listed in Table 2−23. The highest-priority
interrupt is INT_00 (dedicated to RESET) while the lowest-priority interrupt is INT_15. The first four interrupts
(INT_00−INT_03) are non-maskable and fixed. The remaining interrupts (INT_04−INT_15) are maskable and
default to the interrupt source specified in Table 2−23. The interrupt source for interrupts 4−15 can be
programmed by modifying the selector value (binary value) in the corresponding fields of the Interrupt Selector
Control registers: MUXH (address 0x019C0000) and MUXL (address 0x019C0004).
40
August 2004 − Revised January 2006SPRS241D
Table 2−23. C6418 DSP Interrupts
Interrupt Sources and Interrupt Selector
CPU
INTERRUPT
NUMBER
†
INT_00
†
INT_01
†
INT_02
†
INT_03
‡
INT_04
‡
INT_05
‡
INT_06
‡
INT_07
‡
INT_08
‡
INT_09
‡
INT_10
‡
INT_11
‡
INT_12
‡
INT_13
‡
INT_14
‡
INT_15
−−01100XINT0McBSP0 transmit interrupt
−−01101RINT0McBSP0 receive interrupt
−−01110XINT1McBSP1 transmit interrupt
−−01111RINT1McBSP1 receive interrupt
−−10000GPINT0GP0 interrupt 0
−−10001ReservedReserved. Do not use.
−−10010ReservedReserved. Do not use.
−−10011TINT2Timer 2 interrupt
−−10100ReservedReserved. Do not use.
−−10101ReservedReserved. Do not use.
−−10110ICINT0I2C0 interrupt
−−10111ICINT1I2C1 interrupt
−−11000AXINT1McASP1 transmit interrupt
−−11001ARINT1McASP1 receive interrupt
−−11010ReservedReserved. Do not use.
−−11011ReservedReserved. Do not use.
−−11100AXINT0McASP0 transmit interrupt
−−11101ARINT0McASP0 receive interrupt
−−11110VCPINTVCP interrupt
−−11111ReservedReserved. Do not use.
†
Interrupts INT_00 through INT_03 are non-maskable and fixed.
‡
Interrupts INT_04 through INT_15 are programmable by modifying the binary selector values in the Interrupt Selector Control registers fields.
Table 2−23 shows the default interrupt sources for Interrupts INT_04 through INT_15. For more detailed information on interrupt sources and
selection, see the TMS320C6000 DSP Interrupt Selector Reference Guide (literature number SPRU646).
INTERRUPT
SELECTOR
CONTROL
REGISTER
−−RESET
−−NMI
−−ReservedReserved. Do not use.
−−ReservedReserved. Do not use.
MUXL[4:0]00100GPINT4/EXT_INT4GP0 interrupt 4/External interrupt pin 4
MUXL[9:5]00101GPINT5/EXT_INT5GP0 interrupt 5/External interrupt pin 5
These pins are muxed with the GP0 pins and by default these signals function as clocks (CLKOUT4 or CLKOUT6). To use these muxed
pins as GPIO signals, the appropriate GPIO register bits (GPxEN and GPxDIR) must be properly enabled and configured. For more
details, see the Device Configurations section of this data sheet.
‡
These pins are GP0 pins that can also function as external interrupt sources (EXT_INT[7:4]). Default after reset is EXT_INTx or GPIO
as input-only.
§
These pins are muxed with the HPI peripheral pins and by default these signals function as HPI. For more details on these muxed pins,
see the Device Configurations section of this data sheet.
These HPI pins are muxed with the McASP1 or GP0 peripherals. By default, these signals function as HPI and no function,
respectively. For more details on these muxed pins, see the Device Configurations section of this data sheet.
Figure 2−6. Peripheral Signals
August 2004 − Revised January 2006SPRS241D
43
Signal Groups Description
CLKX1
FSX1
CLKR1
FSR1
CLKS1
TOUT1/LENDIAN
TINP1
DX1
DR1
McBSP1
Transmit
Receive
Timer 1
Timer 2
Clock
McBSP0
Transmit
Receive
Clock
McBSPs
(Multichannel Buffered
Serial Ports)
Timer 0
Timers
CLKX0
FSX0
DX0
CLKR0
FSR0
DR0
CLKS0
TOUT0
TINP0
SCL1
SDA1
I2C1
I2Cs
I2C0
Figure 2−6. Peripheral Signals (Continued)
SCL0
SDA0
44
August 2004 − Revised January 2006SPRS241D
Signal Groups Description
(Transmit/Receive Data Pins)(Transmit/Receive Data Pins)
AXR0[0]
AXR0[1]
AXR0[2]
AXR0[3]
(Receive Bit Clock)
ACLKR0
AHCLKR0
(Receive Master Clock)(Transmit Master Clock)
AFSR0
(Receive Frame Sync or
Left/Right Clock)
Receive Clock
Generator
Receive Clock
Check Circuit
Receive
Frame Sync
Error Detect
(see Note A)
6-Serial Ports
Flexible
Partitioning
Tx, Rx, OFF
Transmit
Clock
Generator
Transmit
Clock Check
Circuit
Transmit
Frame Sync
Auto Mute
Logic
AXR0[4]
AXR0[5]
(Transmit Bit Clock)
ACLKX0
AHCLKX0
AFSX0
(Transmit Frame Sync or
Left/Right Clock)
AMUTE0
AMUTEIN0
(Multichannel Audio Serial Port 0)
McASP0
NOTES: A. The McASPs’ Error Detect function detects underruns, overruns, early/late frame syncs, DMA errors, and external mute input.
B. Bolded and italicized text within parentheses denotes the function of the pins in an audio system.
Figure 2−6. Peripheral Signals (Continued)
August 2004 − Revised January 2006SPRS241D
45
Signal Groups Description
(Transmit/Receive Data Pins)(Transmit/Receive Data Pins)
HD16/AXR1[0]
HD17/AXR1[1]
HD18/AXR1[2]
HD19/AXR1[3]
(Receive Bit Clock)
AFCMUX[1:0]
(PERCFG[10:9])
HD25/ACLKR1
HAS/ACLKR1[1]
HCS/ACLKR1[2]
HDS1
/ACLKR1[3]
HD26/AHCLKR1
(Receive Master Clock)
HD23/AFSR1
HCNTL0/AFSR1[1]
HHWIL/AFSR1[2]
/AFSR1[3]
HR/W
AFCMUX[1:0]
(PERCFG[10:9])
(Receive Frame Sync or
Left/Right Clock)
Receive Clock
Generator
Receive Clock
Check Circuit
Receive
Frame Sync
Error Detect
(see Note A)
6-Serial Ports
Flexible
Partitioning
Tx, Rx, OFF
Auto Mute
Logic
Transmit
Clock
Generator
Transmit
Clock Check
Circuit
Transmit
Frame Sync
HD20/AXR1[4]
HD21/AXR1[5]
(Transmit Bit Clock)
HD24/ACLKX1
HD27/AHCLKX1
(Transmit Master Clock)
HD22/AFSX1
(Transmit Frame Sync or
Left/Right Clock)
HD28/AMUTE1
HD29/AMUTEIN1
(Multichannel Audio Serial Port 1)
NOTES: A. The McASPs’ Error Detect function detects underruns, overruns, early/late frame syncs, DMA errors, and external mute input.
B. Bolded and italicized text within parentheses denotes the function of the pins in an audio system.
McASP1
Figure 2−6. Peripheral Signals (Continued)
46
August 2004 − Revised January 2006SPRS241D
3Device Configurations
On the C6418 device, bootmode and certain device configurations/peripheral selections are determined at
device reset, while other device configurations/peripheral selections are software-configurable via the
peripheral configurations register (PERCFG) [address location 0x01B3F000] after device reset.
3.1Device Configuration at Device Reset
Table 3−1 describes the C6418 device configuration pins. The logic level of the AEA[22:19],
TOUT1/LENDIAN, TOUT0/HPI_EN
The logic level on the device configuration pins can be set by using external pullup/pulldown resistors or by
using some control device (e.g., FPGA/CPLD) to intelligently drive these pins. When using a control device,
care should be taken to ensure there is no contention on the lines when the device is out of reset. The
CLKINSEL and OSC_DIS configuration pins should remain driven to the correct levels during device operation
and must only be changed when RESET
are driven after the reset is removed. At this time, the control device should ensure it has stopped driving the
device configuration pins of the DSP to again avoid contention.
Note: If a configuration pin must be routed out from the device, the internal pullup/pulldown (IPU/IPD) resistor
should not be relied upon. TI recommends the use of an external pullup/pulldown resistor.
, and HD5 pins is latched at reset to determine the device configuration.
is low. The device configuration pins are sampled during reset and
HPI, McASP1, GP0[15:8] select
Selects whether the HPI peripheral or McASP1 peripheral, and GP0[15:8] pins are
functionally enabled
0 – HPI is enabled and the McASP1 peripheral and GP0 [15:8] pins are disabled
(default mode);
[HPI32, if HD5 = 1; HPI16 if HD5 = 0]
1 − HPI I is disabled and the McASP1 peripheral and GP0 [15:8] pins are enabled
For more detail on the peripherals (McASP1 and GP0[15:8] pins) muxed with HPI, see the
Table 3−2.
HPI peripheral bus width (HPI_WIDTH) select
0 − HPI operates as an HPI16.
(HPI bus is 16 bits wide. HD[15:0] pins are used for HPI and the remaining
HD[31:16] muxed
pins function as McASP1 peripheral pins or are reserved pins in the Hi-Z state.)
1 − HPI operates as an HPI32.
(HPI bus is 32 bits wide. All HD[31:0] pins are used for host-port operations.)
For more detail on the peripherals (McASP1 and GP0[15:8] pins) muxed with HPI, see the
Table 3−2.
PLL input clock source select
Selects whether the PLL input clock is CLKIN [pin high] or directly from the crystal oscillator
(OSCIN and OSCOUT) [pin low]. For proper device operation, this pin must be used in
conjunction with the OSC_DIS pin.
0 − Oscillator pads (OSCIN, OSCOUT directly from the crystal oscillator)
For proper device operation, OSC_DIS must be 0
1 − CLKIN square wave (default)
For proper device operation, OSC_DIS must be 1
FUNCTIONAL DESCRIPTION
pin)
This pin must be pulled to the correct level even after reset.
Oscillator disable
Selects whether the Oscillator is enabled or disabled. For proper device operation, this pin
must follow the CLKINSEL pin operation.
OSC_DISB7IPU
†
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
48
0 − OSC enabled
1 − OSC disabled (default)
This pin must be pulled to the correct level even after reset.
August 2004 − Revised January 2006SPRS241D
3.2Peripheral Configuration at Device Reset
Some C6418 peripherals share the same pins (internally muxed) and are mutually exclusive (i.e., HPI,
general-purpose input/output 0 pins GP0[15:8], and McASP1).
•HPI, McASP1, and GP0 peripherals
Device Configurations
The TOUT0/HPI_EN
(AA2 pin) is latched at reset. This pin selects whether the HPI peripheral or McASP1
peripheral, and GP0[15:8] pins are functionally enabled (see Table 3−2).
T able 3−2. TOUT0/HPI_EN
PERIPHERAL SELECTIONPERIPHERALS SELECTED
HPI_EN
(AA2)
0016-bit HPIAvailableN/A
0132-bit HPIN/A
1xN/A
†
The TOUT0/HPI_EN
pullup resistor or be driven high during reset. The TOUT0/HPI_EN
‡
N/A = Not available
HD5
[HPI_WIDTH]
(Y13)
pin has an internal pulldown that enables the HPI by default. The TOUT0/HPI_EN pin can disable the HPI via an external
and HD5 Peripheral Selection (HPI or McASP1 and Select GP0 Pins)
HPIMcASP1GP0 [15:8]
‡
‡
AvailableAvailable
HPI_EN = 0, HD5 =
‡
‡
N/A
pin is not software-controllable.
HPI16 is enabled and McASP1 peripheral is enabled
and GP0 [15:8] pins are disabled. All multiplexed
HPI/McASP1 pins function as McASP1 pins. All
multiplexed HPI/GP0 are reserved pins in the Hi-Z state.
HPI_EN = 0, HD5 =
HPI32 is enabled and McASP1 peripheral and GP0
[15:8] pins are disabled. All multiplexed HPI/McASP1
and HPI/GP0 pins function as HPI pins.
HPI_EN = "
HPI is disabled and the McASP1 peripheral and GP0
[15:8] pins are enabled. All multiplexed HPI/McASP1
and HPI/GP0 pins function as McASP1 and GP0 pins,
respectively. To use the GP0 pins, the appropriate bits
in the GP0EN and GP0DIR registers need to be set. All
standalone HPI pins are reserved pins in the Hi-Z state
†
DESCRIPTION
August 2004 − Revised January 2006SPRS241D
49
Device Configurations
3.3Peripheral Selection After Device Reset
HPI, McBSP1, McBSP0, McASP1, McASP0, I2C1, and I2C0
The C6418 device has designated registers for peripheral configuration (PERCFG), device status
(DEVSTAT), and JTAG identification (JTAGID). These registers are part of the Device Configuration module
and are mapped to a 4K block memory starting at 0x01B3F000. The CPU accesses these registers via the
CFGBUS.
The peripheral configuration register (PERCFG), allows the user to control the peripheral selection of the
McASP1, McASP0, I2C1, and I2C0 peripherals. For more detailed information on the PERCFG register
control bits, see Figure 3−1 and Table 3−3.
31282724
Reserved
23
1511
†
R-0R-0
Reserved
Reserved
†
R-0R/W-0R/W-0
†
R-0
Reserved
1098
AFCMUX[1:0]MCASP1EN
†
16
76543
I2C1EN
R/W-0R-0R-0R-0R/W-0R-1R-1R/W-0
Legend: R = Read only; R/W = Read/Write; -n = value after reset
†
For proper device operation, all reserved bits have to be written with “0”.
11 = ACLKR1[3], AFSR1[3] pins
[designed for multiple non-simultaneous I2S sources with different clock sources].
Note: The AFCMUX bits can only be changed when the McASP receiver is in reset.
McASP1 select bit.
Selects whether the McASP1 peripheral is enabled or disabled (default).
(This feature allows power savings by disabling the peripheral when not in use.)
0 = McASP1 is disabled and the module is powered down [default].
Selects whether I2C1 peripheral is enabled or disabled (default).
(This feature allows power savings by disabling the peripheral when not in use.)
0 = I2C1 is disabled, and the module is powered down (default).
1 = I2C1 is enabled.
Inter-integrated circuit 0 (I2C0) enable bit.
Selects whether I2C0 peripheral is enabled or disabled (default).
(This feature allows power savings by disabling the peripheral when not in use.)
0 = I2C0 is disabled, and the module is powered down (default).
1 = I2C0 is enabled.
McBSP1 enable bit.
This bit is read-only as a “1” (McBSP1 always enabled).
McBSP0 enable bit .
This bit is read-only as a “1” (McBSP0 always enabled).
McASP0 select bit.
Selects whether the McASP0 peripheral is enabled or disabled.
(This feature allows power savings by disabling the peripheral when not in use.)
0 = McASP0 is disabled.
1 = McASP0 is enabled.
August 2004 − Revised January 2006SPRS241D
51
Device Configurations
3.4Peripheral Configuration Lock
By default, the McASP1, McASP0, I2C1, and I2C0 peripherals are disabled on power up. In order to use these
peripherals on the C6418 device, the peripheral must first be enabled in the Peripheral Configuration register
(PERCFG). Software muxed pins should not be programmed to switch functionalities during run-time.
Care should also be taken to ensure that no accesses are being performed before disabling the
peripherals. To help minimize power consumption in the C6418 device, unused peripherals may be disabled.
Figure 3−2 shows the flow needed to enable (or disable) a given peripheral on the C6418 device.
A 32-bit key (value = 0x10C0010C) must be written to the Peripheral Configuration Lock register
(PCFGLOCK) in order to unlock access to the PERCFG register. Reading the PCFGLOCK register
determines whether the PERCFG register is currently locked (LOCKSTAT bit = 1) or unlocked (LOCKSTAT
bit = 0), see Figure 3−3. A peripheral can only be enabled when the PERCFG register is “unlocked”
(LOCKSTAT bit = 0).
52
August 2004 − Revised January 2006SPRS241D
Device Configurations
Read Accesses
3110
Reserved
R-0R-0R-1
PWRSAVSTATLOCKSTAT
Write Accesses
310
LOCK
W-0
Legend: R = Read only; R/W = Read/Write; -n = value after reset
Table 3−4. PCFGLOCK Register Selection Bit Descriptions − Read Accesses
BITNAMEDESCRIPTION
31:2ReservedReserved. Read-only, writes have no effect.
Power-saver status bit.
1PWRSAVSTAT
0LOCKSTAT
Determines whether the power saver function is enabled or disabled.
0 = Power-saver is enabled [default].
1 = Power-saver is disabled
Lock status bit.
Determines whether the PERCFG register is locked or unlocked.
0 = Unlocked, read accesses to the PERCFG register allowed.
1 = Locked, write accesses to the PERCFG register do not modify the register state [default].
Reads are unaffected by Lock Status.
Table 3−5. PCFGLOCK Register Selection Bit Descriptions − Write Accesses
BITNAMEDESCRIPTION
Lock bits.
31:0LOCK
0x10C0010C = Unlocks PERCFG register accesses.
Any write to the PERCFG register will automatically relock the register. In order to avoid the unnecessary
overhead of multiple unlock/enable sequences, all peripherals should be enabled with a single write to the
PERCFG register with the necessary enable bits set.
Prior to waiting 128 CPU cycles, the PERCFG register should be read. There is no direct correlation between
the CPU issuing a write to the PERCFG register and the write actually occurring. Reading the PERCFG
register after the write is issued forces the CPU to wait for the write to the PERCFG register to occur.
Once a peripheral is enabled, the DSP (or other peripherals such as the HPI) must wait a minimum of 128 CPU
cycles before accessing the enabled peripheral. The user must ensure that no accesses are performed to a
peripheral while it is disabled.
In addition to the normal usage, the PCFGLOCK register can be used to override the power saver settings
specified in the PERCFG register. When the power saver feature is disabled (PCFGLOCK written with
0xC0100C01), all peripherals controlled by PERCFG are enabled. If the power saver is returned to normal
operation (PCFGLOCK written with 0x0C01 C010), then the peripherals return to the operating condition
specified by PERCFG. Turning off the power saver settings will add a worst-case 50 mW of power to the overall
DSP power consumption.
Note: overriding the settings of the PERCFG register will not cause a conflict on the multiplexed pins. For
example, with the HPI and McASP1 peripherals, the HPI will still have control over the multiplexed pins
provided the TOUT0/HPI_EN
pin was “0” at reset.
August 2004 − Revised January 2006SPRS241D
53
Device Configurations
3.5Device Status Register Description
The device status register depicts the status of the device peripheral selection. Once set, these bits will remain
set until a device reset; therefore, these bits should be masked when reading the DEVSTA T register since their
values can change. For the actual register bit names and their associated bit field descriptions, see Figure 3−4
and Table 3−6.
3124
Reserved
R-100x0111
2319
PLLM
R-xxxxxR-1R-xR-x
1514131211
Reserved
R-000R-xR-0R-xR-0R-x
CLKMODE3ReservedHPI-WIDTHReservedHPI_EN
181716
ReservedOSC EXT RESCLKINSEL
1098
76543
CLKMODE2
R-xR-xR-xR-xR-xR-xR-xR-x
Legend: R = Read only; R/W = Read/Write; -n = value after reset
Figure 3−4. Device Status Register (DEVSTAT) Description − 0x01B3 F004
Table 3−6. Device Status (DEVSTAT) Register Selection Bit Descriptions
BITNAMEDESCRIPTION
31:24ReservedReserved. Read-only, writes have no effect.
PLL multiply factor status bits.
23:19PLLM
18ReservedReserved. Read-only, writes have no effect.
17OSC EXT RES
16CLKINSEL
15:13ReservedReserved. Read-only, writes have no effect.
11ReservedReserved. Read-only, writes have no effect.
10HPI_WIDTH
9ReservedReserved. Read-only, writes have no effect.
8HPI_EN
Shows the status of the PLL multiply mode selected; whether the CPU clock frequency equals the input
clock frequency x1 (Bypass), x5, x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x22, or x24.
For more detailed information on the PLL multiply factors, see the Clock PLL section of this data sheet.
Oscillator external resistor status bit.
Shows the status internal or external of the OSC bias resistor.
0 = Normal functional mode with internal bias resistor.
1 = Normal functional mode with external bias resistor [default; internally tied high].
PLL input clock select status bit.
Shows the status of whether the PLL input clock is CLKIN [pin high] or directly from the crystal oscillator
(OSCIN and OSCOUT) [pin low]
HPI bus width control bit.
Shows the status of whether the HPI bus operates in 32-bit mode or in 16-bit mode (default).
0 = HPI operates in 16-bit mode. (default).
1 = HPI operates in 32-bit mode.
HPI_EN pin status bit.
Shows the status at device reset of the HPI_EN
or disabled.
0 = HPI_EN pin is low, meaning the HPI peripheral is enabled. (default).
1 = HPI_EN
pin is high, meaning the HPI peripheral is disabled.
pin, which controls the HPI peripheral as enabled [default]
54
August 2004 − Revised January 2006SPRS241D
Table 3−6. Device Status (DEVSTAT) Register Selection Bit Descriptions (Continued)
Shows the status (”1 or 0”) of the CLKMODE[3:0] select bits:
Clock mode select for CPU clock frequency (CLKMODE[3:0]), for example:
0000–Bypass (x1) (default mode)
00 – No boot (default mode)
00 – AECLKIN (default mode)
12CLKMODE3
7CLKMODE2
Device Configurations
DESCRIPTIONNAMEBIT
Clock mode select status bits
6CLKMODE1
5CLKMODE0
4LENDIAN
3BOOTMODE1
2BOOTMODE0
1AECLKINSEL1
0AECLKINSEL0
0000– Bypass (x1) (default mode)
For more details on the CLKMODE pins and the PLL multiply factors, see the Clock PLL and Oscillator
section of this data sheet.
Device Endian mode (LENDIAN)
Shows the status of whether the system is operating in Big Endian mode or Little Endian mode (default).
0 – System is operating in Big Endian mode
1 − System is operating in Little Endian mode (default)
Bootmode configuration bits (AEA[22:21] pins)
Shows the status of what device bootmode configuration is operational.
Bootmode [1:0]
Shows the status of what clock mode is enabled or disabled for the EMIF.
Clock mode select for EMIFA (AECLKIN_SEL[1:0])
01 − CPU/4 Clock Rate
10 − CPU/6 Clock Rate
11 − Reserved
3.6JTAG ID Register Description
The JT AG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the C6418
device, the JTAG ID register resides at address location 0x01B3 F008. The register hex value for the C6418
device is: 0x0007 902F. For the actual register bit names and their associated bit field descriptions, see
Figure 3−5 and Table 3−7.
31−2827−1211−10
VARIANT (4-Bit)
R-0000R-0000 0000 1000 0100R-0000 0010 111R-1
Legend: R = Read only; -n = value after reset
PART NUMBER (16-Bit)MANUFACTURER (11-Bit)LSB
Figure 3−5. JTAG ID Register Description − TMS320C6418 Register Value − 0x0007 902F
Table 3−7. JTAG ID Register Selection Bit Descriptions
pairs are input to McASP1. For more detailed
section of this data sheet.
t
(McASP1 is disabled).
r
HPI pin
via an external pullup (PU) resistor (1 kΩ) or
HPI pin
32-Bit HPI enabled)
McASP1 pins disabled.
,
McASP1 pins disabled.
McASP1 pin direction is controlled by the
3.7Multiplexed Pins
Multiplexed pins are pins that are shared by more than one peripheral and are internally multiplexed. Some
of these pins are configured by software, and the others are configured by external pullup/pulldown resistors
only at reset. Those muxed pins that are configured by software should not be programmed to switch
functionalities during run-time. Those muxed pins that are configured by external pullup/pulldown resistors
are mutually exclusive; only one peripheral has primary control of the function of these pins after reset.
Table 3−8 identifies the multiplexed pins on the C6418 device; shows the default (primary) function and the
default settings after reset; and describes the pins, registers, etc. necessary to configure specific multiplexed
functions.
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
]
AB13
IPD/IPU
IPD/IPU
NO.NAME
IPU
†
†
DEFAULT
DEFAULT
FUNCTION
FUNCTION
function
DEFAULT
DEFAULT
SETTING
SETTING
GPIO pins disabled.
DESCRIPTION
DESCRIPTION
pins are disabled).
To use GP0[15:9] as GPIO pins, the HPI need
the GPxDIR bits in the GPIO Direction Registe
must be properly configured.
GPxDIR = 1:GPx pin is an output
3.8Debugging Considerations
It is recommended that external connections be provided to device configuration pins, including
TOUT1/LENDIAN, AEA[22:19], TOUT0/HPI_EN
, CLKINSEL, and OSC_DIS. Although internal
pullup/pulldown resistors exist on these pins, providing external connectivity adds convenience to the user
in debugging and flexibility in switching operating modes.
Note: If a configuration pin must be routed out from the device, the internal pullup/pulldown (IPU/IPD) resistor
should not be relied upon. TI recommends the use of an external pullup/pulldown resistor.
3.9Configuration Examples
Figure 3−6 illustrates an example of peripheral selections/options that are configurable on the C6418 device.
The terminal functions table (Table 3−9) identifies the external signal names, the associated pin (ball) numbers
along with the mechanical package designator, the pin type (I, O/Z, or I/O/Z), whether the pin has any internal
pullup/pulldown resistors and a functional pin description. For more detailed information on device
configuration, peripheral selection, multiplexed/shared pins, and debugging considerations, see the Device
Configurations section of this data sheet.
TMSU3IIPUJTAG test-port mode select
TDOT4O/ZIPUJTAG test-port data out
TDIT1IIPUJTAG test-port data in
TCKT2IIPUJTAG test-port clock
TRSTU1IIPD
EMU0R1I/O/ZIPUEmulation pin 0
EMU1T3I/O/ZIPUEmulation pin 1
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
¶
PLLV is not part of external voltage supply. See the Clock PLL and Oscillator section for information on how to connect this pin.
#
The EMU0 and EMU1 pins are internally pulled up with 30-kΩ resistors; therefore, for emulation and normal operation, no external
pullup/pulldown resistors are necessary. However, for boundary scan operation, pull down the EMU1 and EMU0 pins with a dedicated 1-kΩ
resistor.
§
§
A2I/O/ZIPU
B3I/O/ZIPU
C12APLL voltage supply
B6S—
C6GND—
IPD/
‡
IPU
CLOCK/PLL CONFIGURATION
Clock output at 1/4 of the device speed (O/Z) [default] or this pin can be programmed as
a GP0 1 pin (I/O/Z).
Clock output at 1/6 of the device speed (O/Z) [default] or this pin can be programmed as
a GP0 2 pin (I/O/Z).
CLKIN select. Selects whether the PLL input clock is CLKIN [pin high] or directly from
the crystal oscillator (OSCIN and OSCOUT) [pin low].
For proper device operation, this pin must be used in conjunction with the OSC_DIS
pin.
Clock mode selects
• Selects whether the CPU clock frequency = input clock frequency x1 (Bypass), x5,
PLL section of this data sheet.
Power for crystal oscillator (1.2 V), Do not connect to board power CVDD; for optimum
performance, connected internally. If CLKIN is used instead of the oscillator, then this
pin can be left open or connected to CVDD.
Ground for crystal oscillator, Do not connect to board ground; for optimum
performance, connected internally. If CLKIN is used instead of the oscillator, then this
pin can be left open or connected to VSS.
Oscillator disable select.
For proper device operation, this pin must follow the CLKINSEL pin operation.
0 − OSC enabled; CLKINSEL must be 0
1 − OSC disabled (default); CLKINSEL must be 1
JTAG EMULATION
JTAG test-port reset. For IEEE 1149.1 JTAG compatibility, see the IEEE 1149.1 JTAG
compatibility statement portion of this data sheet.
#
#
60
August 2004 − Revised January 2006SPRS241D
Terminal Functions
.
General-purpose input/output (GPIO) pins (I/O/Z) or external interrupts (input only).
When these pins function as External Interrupts [by selecting the corresponding
• When these pins function as External Interrupts [by selecting the corresponding
independently selected via the External Interrupt Polarity Register bits
Clock output at 1/6 of the device speed (O/Z) [default] or this pin can be programmed as
Clock output at 1/4 of the device speed (O/Z) [default] or this pin can be programmed as
a GP0 1 pin (I/O/Z).
Table 3−9. Terminal Functions (Continued)
IPD/
NAMENO.
EMU2R2I/O/ZIPUEmulation pin 2. Reserved for future use, leave unconnected.
EMU3U2I/O/ZIPUEmulation pin 3. Reserved for future use, leave unconnected.
EMU4R3I/O/ZIPUEmulation pin 4. Reserved for future use, leave unconnected.
EMU5P2I/O/ZIPUEmulation pin 5. Reserved for future use, leave unconnected.
EMU6R4I/O/ZIPUEmulation pin 6. Reserved for future use, leave unconnected.
EMU7V2I/O/ZIPUEmulation pin 7. Reserved for future use, leave unconnected.
EMU8V1I/O/ZIPUEmulation pin 8. Reserved for future use, leave unconnected.
EMU9V3I/O/ZIPUEmulation pin 9. Reserved for future use, leave unconnected.
EMU10W3I/O/ZIPUEmulation pin 10. Reserved for future use, leave unconnected.
EMU11W2I/O/ZIPUEmulation pin 11. Reserved for future use, leave unconnected.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
]
AB13
§
§
B3I/O/ZIPU
A2I/O/ZIPU
†
TYPE
RESETS, INTERRUPTS, AND GENERAL-PURPOSE INPUT/OUTPUTS
I/O/ZIPU
‡
IPU
JTAG EMULATION (CONTINUED)
Nonmaskable interrupt, edge-driven (rising edge). Any noise on the NMI pin may
trigger an NMI interrupt; therefore, if the NMI pin is not used, it is recommended that the
NMI pin be grounded versus relying on the IPD.
General-purpose input/output (GPIO) pins (I/O/Z) or external interrupts (input only)
The default after reset setting is GPIO enabled as input-only.
•
interrupt enable register bit (IER.[7:4])], they are edge-driven and the polarity can be
(EXTPOL.[3:0]).
Host-port data pins (I/O/Z) [default] or General-purpose input/output (GP0) [15:8] pin
(I/O/Z)
Clock output at 1/6 of the device speed (O/Z) [default] or this pin can be programmed a
a GP0 2 pin (I/O/Z).
a GP0 1 pin (I/O/Z).
DESCRIPTION
August 2004 − Revised January 2006SPRS241D
61
Terminal Functions
Enabled by bits 28 through 31 of the word address
Only one pin is asserted during any external data access
• Only one pin is asserted during any external data access
EMIFA byte-enable control
enables used depends on the width of external memory.
Byte-write enables for most types of memory
Table 3−9. Terminal Functions (Continued)
IPD/
NAMEDESCRIPTION
ACE3H19O/ZIPU
ACE2N20O/ZIPU
ACE1R20O/ZIPU
ACE0F20O/ZIPU
ABE3AB21O/ZIPU
ABE2P21O/ZIPU
ABE1A22O/ZIPU
ABE0D16O/ZIPU
APDTT19O/ZIPUEMIFA peripheral data transfer, allows direct transfer between external peripherals
AHOLDAJ21OIPUEMIFA hold-request-acknowledge to the host
AHOLDJ22IIPUEMIFA hold request from the host
ABUSREQR19OIPUEMIFA bus request output
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
NO.
EMIFA (32-BIT) − CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
EMIFA (32-BIT) − ASYNCHRONOUS/SYNCHRONOUS MEMORY CONTROL
D20O/ZIPU
E20O/ZIPU
C20O/ZIPU
TYPE
†
‡
IPU
EMIFA memory space enables
•
•
EMIFA byte-enable control
• Decoded from the low-order address bits. The number of address bits or byte
•
•
• Can be directly connected to SDRAM read and write mask signal (SDQM)
EMIFA (32-BIT) − BUS ARBITRATION
EMIFA external input clock. The EMIFA input clock (AECLKIN, CPU/4 clock, or CPU/6
clock) is selected at reset via the pullup/pulldown resistors on the AEA[20:19] pins.
AECLKIN is the default for the EMIFA input clock.
EMIFA output clock 2. Programmable to be EMIFA input clock (AECLKIN, CPU/4 clock,
or CPU/6 clock) frequency divided-by-1, -2, or -4.
• For programmable synchronous interface, the RENEN field in the CE Space
Secondary Control Register (CExSEC) selects between ASADS
If RENEN = 0, then the ASADS
If RENEN = 1, then the ASADS
EMIFA SDRAM clock-enable (used for self-refresh mode).
• If SDRAM is not in system, ASDCKE can be used as a general-purpose output.
/ASRE signal functions as the ASADS signal.
and ASRE:
/ASRE signal functions as the ASRE signal.
62
August 2004 − Revised January 2006SPRS241D
Terminal Functions
EMIFA external address (word address)
Note: EMIF address numbering for the C6418 device starts with AEA3 to maintain
C6416) [see the 64-bit EMIF adressing scheme in the TMS320C6000 DSP External
Memory Interface (EMIF) Reference Guide (literature number SPRU266)].
Memory Interface (EMIF) Reference Guide (literature number SPRU266)].
l
pullup/pulldown (IPU/IPD) resistor should not be relied upon. TI recommends the use of
an external pullup/pulldown resistor.
an external pullup/pulldown resistor.
− Boot mode (AEA[22:21]):
00 – No boot (default mode)
00 – No boot (default mode)
01−HPI boot (based on HPI_EN pin)
11 − EMIFA 8-bit ROM boot
− EMIF clock select
− AEA[20:19]: Clock mode select for EMIFA (AECLKIN_SEL[1:0])
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
NO.
†
TYPE
I/O/ZIPD
O/ZIPD
I/O/ZIPUEMIFA external data
‡
IPU
EMIFA (32-BIT) − ADDRESS
Note: EMIF address numbering for the C6418 device starts with AEA3 to maintain
signal name compatibility with other C64x devices (e.g., C6411, C6414, C6415, and
Note: If a configuration pin must be routed out from the device, the interna
• Also controls initialization of DSP modes at reset (I) via pullup/pulldown resistors
SCL1AA18I/O/Z—I2C1 clock. When the I2C module is used, use an external pullup resistor on this pin.
SDA1AA19I/O/Z—I2C1 data. When I2C is used, ensure there is an external pullup resistors on this pin.
SCL0AB18I/O/Z—I2C0 clock. When I2C is used, ensure there is an external pullup resistors on this pin.
SDA0AB19I/O/Z—I2C0 data. When I2C is used, ensure there is an external pullup resistors on this pin.
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
NO.
−No external pins. The timer 2 peripheral pins are not pinned out as external pins.
†
TYPE
I/O/ZIPUEMIFA external data
‡
IPU
EMIFA (32-BIT) − DATA (CONTINUED)
TIMER 2
TIMER 1
Timer 1 output (O/Z) or device endian mode (I).
Also controls initialization of DSP modes at reset via pullup/pulldown resistors
− Device Endian mode
0 – Big Endian
1 − Little Endian (default)
For more details on LENDIAN, see the Device Configurations section of this data sheet.
TIMER 0
Timer 0 output pin and HPI enable HPI_EN pin function
The HPI_EN
and GP0[15:8] pins are functionally enabled
0 – HPI is enabled and the McASP1 peripheral and GP0 [15:8] pins are disabled
1 − HPI I is disabled and the McASP1 peripheral and GP0 [15:8] pins are
For more details, see the Device Configurations section of this data sheet.
INTER-INTEGRATED CIRCUIT 1 (I2C1)
INTER-INTEGRATED CIRCUIT 0 (I2C0)
pin function selects whether the HPI peripheral or McASP1 peripheral,
(default mode); [HPI32, if HD5 = 1; HPI16 if HD5 = 0]
enabled
64
August 2004 − Revised January 2006SPRS241D
Terminal Functions
Table 3−9. Terminal Functions (Continued)
IPD/
NAMEDESCRIPTION
CLKR1G3I/O/ZIPDMcBSP1 receive clock
FSR1G2I/O/ZIPDMcBSP1 receive frame sync
DR1F1IIPDMcBSP1 receive data
CLKS1G1IIPDMcBSP1 external clock source (as opposed to internal)
DX1H2O/ZIPDMcBSP1 transmit data
FSX1H3I/O/ZIPDMcBSP1 transmit frame sync
CLKX1H1I/O/ZIPDMcBSP1 transmit clock
CLKR0C2I/O/ZIPDMcBSP0 receive clock
FSR0D1I/O/ZIPDMcBSP0 receive frame sync
DR0D2IIPDMcBSP0 receive data
CLKS0D3IIPDMcBSP0 external clock source (as opposed to internal)
DX0E2O/ZIPDMcBSP0 transmit data
FSX0E4I/O/ZIPDMcBSP0 transmit frame sync
CLKX0E3I/O/ZIPDMcBSP0 transmit clock
AHCLKX0N1I/O/ZIPDMcASP0 transmit high-frequency master clock.
AFSX0M2I/O/ZIPDMcASP0 transmit frame sync or left/right clock (LRCLK).
ACLKX0M1I/O/ZIPDMcASP0 transmit bit clock.
AMUTE0K4I/O/ZIPDMcASP0 mute output.
AMUTEIN0J4IIPDMcASP0 mute input.
AHCLKR0L1I/O/ZIPDMcASP0 receive high-frequency master clock.
AFSR0K2I/O/ZIPDMcASP0 receive frame sync or left/right clock (LRCLK).
ACLKR0K1I/O/ZIPDMcASP0 receive bit clock.
AXR0[5]P3McASP0 TX/RX data pin [5].
AXR0[4]N3McASP0 TX/RX data pin [4].
AXR0[3]M3
AXR0[2]L3
AXR0[1]K3McASP0 TX/RX data pin [1].
AXR0[0]L2McASP0 TX/RX data pins[0].
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
NO.
†
TYPE
MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP1)
MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0)
MULTICHANNEL AUDIO SERIAL PORT 0 (McASP0)
I/O/ZIPD
IPU
‡
McASP0 TX/RX data pins [3].
McASP0 TX/RX data pin [2].
August 2004 − Revised January 2006SPRS241D
65
Terminal Functions
I
IPU
I/O/Z
I/O/Z).
I
IPU
Table 3−9. Terminal Functions (Continued)
IPD/
NAMEDESCRIPTION
HCNTL0/AFSR1[1]Y6
HHWIL/AFSR1[2]Y7
HR/W/AFSR1[3]AA5
HAS/ACLKR1[1]Y5Host address strobe (I) [default] or McASP1 receive clock input 1 (I).
HCS/ACLKR1[2]AA11Host chip select (I) [default] or McASP1 receive clock input 2 (I).
HDS1/ACLKR1[3]AB11Host data strobe 1 (I) [default] or McASP1 receive clock input 3 (I).
HD27/AHCLKX1Y4I/O/ZIPU
HD22/AFSX1AB5I/O/ZIPU
HD24/ACLKX1AA4I/O/ZIPUHost-port data pin 24 (I/O/Z) [default] or McASP1 transmit bit clock (I/O/Z).
HD28/AMUTE1W10I/O/ZIPUHost-port data pin 28 (I/O/Z) [default] or McASP1 mute output (I/O/Z).
HD29/AMUTEIN1W11IIPUHost-port data pin 29 (I/O/Z) [default] or McASP1 mute input (I).
HD26/AHCLKR1AB4I/O/ZIPU
HD23/AFSR1AB9I/O/ZIPU
HD25/ACLKR1AA9I/O/ZIPUHost-port data pin 25 (I/O/Z) [default] or McASP1 receive bit clock (I/O/Z).
HINTAA8O/ZIPUHost interrupt from DSP to host (O)
HCNTL1W7IIPUHost control − selects between control, address, or data registers (I)
HCNTL0/AFSR1[1]Y6
HHWIL/AFSR1[2]Y7
HR/W/AFSR1[3]AA5
HAS/ACLKR1[1]Y5Host address strobe (I) [default] or McASP1 receive clock input 1 (I).
HCS/ACLKR1[2]AA11Host chip select (I) [default] or McASP1 receive clock input 2 (I).
HDS1/ACLKR1[3]AB11Host data strobe 1 (I) [default] or McASP1 receive clock input 3 (I).
HDS2AB12IIPUHost data strobe 2 (I)
HRDYY10O/ZIPUHost ready from DSP to host (O)
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
NO.
†
TYPE
I/O/ZIPUHost-port data pins [21:16] (
‡
IPU
MCASP1
Host control − selects between control, address, or data registers (I) [default] or
McASP1 receive frame sync input 1 (I).
Host half-word select − first or second half-word (not necessarily high or low order)
[For HPI16 bus width selection only] (I) [default] oror McASP1 receive frame sync
input 2 (I) .
Host read or write select (I) [default] or McASP1 receive frame sync input 3 (I).
Host-port data pin 27 (I/O/Z) [default] or McASP1 transmit high-frequency master clock
(I/O/Z).
Host-port data pin 22 (I/O/Z) [default] or McASP1 transmit frame sync or left/right clock
(LRCLK) (I/O/Z) .
Host-port data pin 26 (I/O/Z) [default] or McASP1 receive high-frequency master clock
(I/O/Z).
Host-port data pin 23 (I/O/Z) [default] or McASP1 receive frame sync or left/right clock
(LRCLK) (I/O/Z).
HOST-PORT INTERFACE (HPI)
Host control − selects between control, address, or data registers (I) [default] or
McASP1 receive frame sync input 1 (I).
Host half-word select − first or second half-word (not necessarily high or low order)
[For HPI16 bus width selection only] (I) [default] or McASP1 receive frame sync
input 2 (I).
Host read or write select (I) [default] or McASP1 receive frame sync input 3 (I).
) [default] or McASP1 TX/RX data pins [5:0] (
66
August 2004 − Revised January 2006SPRS241D
Terminal Functions
I/O/Z
I/O/Z
Host-port data [15:8] pins (I/O/Z) [default] or General-purpose input/output (GP0) [15:8]
Host-port data [15:8] pins (I/O/Z) [default] or General-purpose input/output (GP0) [15:8]
pins (I/O/Z).
Host-port data [7:0] pins (I/O/Z)
Host-Port bus width user-configurable at device reset via a 1-kΩ pullup/
pulldown resistor on the HD5 pin (I):
pulldown resistor on the HD5 pin (I):
HD5 pin = 0: HPI operates as an HPI16.
(HPI bus is 16 bits wide. HD[15:0] pins are used and the remaining HD[31:16] pins
(HPI bus is 16 bits wide. HD[15:0] pins are used and the remaining HD[31:16] pins
are reserved pins in the high-impedance state.)
HD5 pin = 1: HPI operates as an HPI32.
Table 3−9. Terminal Functions (Continued)
IPD/
NAMEDESCRIPTION
HD31Y8I/O/ZIPUHost-port data pin 31 (I/O/Z)
HD30Y11I/O/ZIPUHost-port data pin 30 (I/O/Z)
HD29/AMUTEIN1W11IIPUHost-port data pin 29 (I/O/Z) [default] or McASP1 mute input (I).
HD28/AMUTE1W10I/O/ZIPUHost-port data pin 28 (I/O/Z) [default] or McASP1 mute output (I/O/Z).
HD27/AHCLKX1Y4I/O/ZIPU
HD26/AHCLKR1AB4I/O/ZIPU
HD25/ACLKR1AA9I/O/ZIPUHost-port data pin 25 (I/O/Z) [default] or McASP1 receive bit clock (I/O/Z).
HD24/ACLKX1AA4I/O/ZIPUHost-port data pin 24 (I/O/Z) [default] or McASP1 transmit bit clock (I/O/Z).
HD23/AFSR1AB9I/O/ZIPU
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
]
NO.
AB13
†
TYPE
I/O/ZIPUHost-port data [21:16] pin (
I/O/ZIPU
I/O/ZIPU
‡
IPU
HOST-PORT INTERFACE (HPI) (CONTINUED)
Host-port data pin 27 (I/O/Z) [default] or McASP1 transmit high-frequency master clock
(I/O/Z).
Host-port data pin 26 (I/O/Z) [default] or McASP1 receive high-frequency master clock
(I/O/Z).
Host-port data pin 23 (I/O/Z) [default] or McASP1 receive frame sync or left/right clock
(LRCLK) (I/O/Z).
Host-port data pin 22 (I/O/Z) [default] or McASP1 transmit frame sync or left/right clock
(LRCLK) (I/O/Z).
pins (I/O/Z).
Host-port data [7:0] pins (I/O/Z)
are reserved pins in the high-impedance state.)
(HPI bus is 32 bits wide. All HD[31:0] pins are used for host-port operations.)
) [default] or McASP1 TX/RX data pins [5:0] (
).
August 2004 − Revised January 2006SPRS241D
67
Terminal Functions
TYPE
†
IPD/
DESCRIPTION
Reserved (leave unconnected, do not connect to power or ground). If the signal must
RSV
be routed from the device, the internal pull−up/down resistance should not be relied
DD
DV
DD
S
(see the Power-Supply Decoupling section of this data manual)
Table 3−9. Terminal Functions (Continued)
SIGNAL
NAMENO.
RSVU4A—Reserved. This pin must be connected directly to CVDD for proper device operation.
RSVF3A—Reserved. This pin must be connected directly to DVDD for proper device operation.
RSVC8IIPDReserved. This pin must be connected directly to VSS for proper device operation.
B11A—
B12I—
RSV
DV
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
C10OIPU
D7O/Z—
D8O/Z—
A3
A5
A8
A9
A14
A17
A20
B1
C22
E1
G22
J1
M22
P1
T22
W1
Y2
Y17
Y19
Y22
AB3
AB10
AB17
AB20
S
IPD/
IPU
‡
RESERVED FOR TEST
be routed from the device, the internal pull−up/down resistance should not be relied
upon and an external pull−up/down should be used.
SUPPLY VOLTAGE PINS
3.3-V supply voltage
68
August 2004 − Revised January 2006SPRS241D
Table 3−9. Terminal Functions (Continued)
1.4-V supply voltage (-600 device)
(see the Power-Supply Decoupling section of this data manual)
Terminal Functions
SIGNAL
NAME
CV
DD
V
SS
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
NO.
D11
D12
D14
D18
E19
F19
L19
M19
V19
W13
W16
W18
A10
B14
B17
B20
D5
D6
D9
G4
H4
M4
N4
V4
W5
W9
A1
B2
B5
B8
C1
C3
C5
C7
TYPE
TYPE
S
GNDGround pins
IPD/
IPD/
†
†
‡
‡
IPU
IPU
SUPPLY VOLTAGE PINS (CONTINUED)
1.2-V supply voltage (A-500 device)
(see the Power-Supply Decoupling section of this data manual)
GROUND PINS
DESCRIPTION
DESCRIPTION
August 2004 − Revised January 2006SPRS241D
69
Terminal Functions
Table 3−9. Terminal Functions (Continued)
SIGNAL
NAME
V
SS
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
NO.
C14
C21
D10
D19
G19
G21
K19
L22
N19
T21
U19
W14
W17
W19
Y18
Y21
AA3
AA10
AA17
AA20
D4
F2
F4
J2
J3
L4
N2
P4
W4
W6
W8
Y3
TYPE
TYPE
GNDGround pins
IPD/
IPD/
†
†
‡
‡
IPU
IPU
GROUND PINS (CONTINUED)
DESCRIPTION
DESCRIPTION
70
August 2004 − Revised January 2006SPRS241D
3.11Development Support
In case the customer would like to develop their own features and software on the TMS320C6418 device, TI
offers an extensive line of development tools for the TMS320C6000 DSP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules. The tool’s support documentation is electronically
available within the Code Composer Studio Integrated Development Environment (IDE).
The following products support development of C6000 DSP-based applications:
Software Development Tools:
Code Composer Studio Integrated Development Environment (IDE): including Editor
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS), which provides the basic run-time target software
needed to support any DSP application.
Hardware Development Tools:
Extended Development System (XDS) Emulator (supports C6000 DSP multiprocessor system debug)
EVM (Evaluation Module)
For a complete listing of development-support tools for the TMS320C6000 DSP platform, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL). For
information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
Development Support
Code Composer Studio, DSP/BIOS, and XDS are trademarks of Texas Instruments.
August 2004 − Revised January 2006SPRS241D
71
Device Support
3.12Device Support
3.12.1Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP
devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or T MS
(e.g., TMS320C6412GDK600). Texas Instruments recommends two of three possible prefix designators for
its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development
from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMXExperimental device that is not necessarily representative of the final device’s electrical
specifications.
TMPFinal silicon die that conforms to the device’s electrical specifications but has not completed quality
and reliability verification.
TMSFully qualified production device.
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS Fully qualified development-support product.
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package
type (for example, GTS), the temperature range (for example, “A” is the extended commercial temperature
range), and the device speed range in megahertz (for example, -500 is 500 MHz). Figure 3−7 provides a
legend for reading the complete device name for any TMS320C6000 DSP platform member.
The ZTS package, like the GTS package, is a 288-ball plastic BGA only with Pb-free balls. For device part
numbers and further ordering information for TMS320C6418 in the GTS and ZTS package types, see the TI
website (http://www.ti.com) or contact your TI sales representative.
TMS320 is a trademark of Texas Instruments.
72
August 2004 − Revised January 2006SPRS241D
Device Support
TMS 320 C6418 GTS500
(A)
PREFIXDEVICE SPEED RANGE
TMX= Experimental device
TMP= Prototype device
TMS= Qualified device
SMX= Experimental device, MIL
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
DEVICE FAMILY
320 = TMS320t DSP family
†
The extended temperature “A version” devices may have different operating conditions than the commercial temperature devices.
For more details, see the recommended operating conditions portion of this data sheet.
‡
BGA =Ball Grid Array
§
The ZTS mechanical package designator represents the version of the GTS package with Pb-free balls. For more detailed
information, see the Mechanical Data section of this document.
¶
For actual device part numbers (P/Ns) and ordering information, see the TI website (www.ti.com).
For additional information, see the TMS320C6418 Digital Signal Processor Silicon Errata (literature number
SPRZ224).
August 2004 − Revised January 2006SPRS241D
73
Device Support
3.12.2Documentation Support
Extensive documentation supports all TMS320 DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data
sheets, such as this document, with design specifications; complete user’s reference guides for all devices
and tools; technical briefs; development-support tools; on-line help; and hardware and software applications.
The following is a brief, descriptive list of support documentation specific to the C6000 DSP devices:
The TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189) describes the
C6000 DSP CPU (core) architecture, instruction set, pipeline, and associated interrupts.
The TMS320C6000 DSP Peripherals Overview Reference Guide (literature number SPRU190) provides an
overview and briefly describes the functionality of the peripherals available on the C6000 DSP platform of
devices. This document also includes a table listing the peripherals available on the C6000 devices along with
literature numbers and hyperlinks to the associated peripheral documents.
The TMS320C64x Technical Overview (literature number SPRU395) gives an introduction to the C64x
digital signal processor, and discusses the application areas that are enhanced by the C64x DSP
VelociTI.2 VLIW architecture.
The TMS320C64x DSP Viterbi-Decoder Coprocessor Reference Guide (literature number SPRU533)
describes the functionality of the Viterbi-Decoder Coprocessor (VCP).
The TMS320C6000 DSP Multichannel Audio Serial Port (McASP) Reference Guide (literature number
SPRU041) describes the functionality of the McASP peripheral.
The TMS320C6000 DSP Inter-Integrated Circuit (I2C) Module Reference Guide (literature number SPRU175)
describes the functionality of the I2C peripherals available on the C6418 device except for the additional
interrupt and new GPIO capability. For more detailed information on the additional interrupt and GPIO
capability, see the I2C section of this data manual and the TMS320C6410/C6413/C6418 DSP Inter-IntegratedCircuit (I2C) Module Reference Guide (literature number SPRZ221).
The TMS320C6418 Digital Signal Processor Silicon Errata (literature number SPRZ224) describes the known
exceptions to the functional specifications for particular silicon revisions of the TMS320C6418 device.
The Using IBIS Models for T iming Analysis application report (literature number SPRA839) describes how to
properly use IBIS models to attain accurate timing analysis for a given system.
The tools support documentation is electronically available within the Code Composer Studio Integrated
Development Environment (IDE). For a complete listing of C6000 DSP latest documentation, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL).
Most of the internal C64x DSP clocks are generated from a single source through the CLKIN pin. This source
clock either drives the PLL, which multiplies the source clock frequency to generate the internal CPU clock,
or bypasses the PLL to become the internal CPU clock.
To use the PLL to generate the CPU clock, the external PLL filter circuit must be properly designed. Figure 4−1
shows the external PLL circuitry for either x1 (PLL bypass) or other PLL multiply modes.
To minimize the clock jitter, a single clean power supply should power both the C64x DSP device and the
external clock oscillator circuit. The minimum CLKIN rise and fall times should also be observed. For the input
clock timing requirements, see the input and output clocks electricals section.
Rise/fall times, duty cycles (high/low pulse durations), and the load capacitance of the external clock source
must meet the DSP requirements in this data sheet (see the electrical characteristics over recommendedranges of supply voltage and operating case temperature table and the input and output clocks electricals
section).
August 2004 − Revised January 2006SPRS241D
75
Clock PLL and Oscillator
‡
CLKMODE0
CLKMODE1
CLKMODE2
CLKMODE3
C5
470 pF
†
C7
†
C8
3.3 V
†
R
C6
470 pF
CPU Clock
EMI
Filter
†
S
†
R
B
10 µF 0.1 µF
CLKINSEL
CLKIN
OSCV
OSCIN
OSCOUT
OSCV
OSC_DIS
C2C1
PLLV
PLLMULT
PLL
x5, x6−x12, x16,
x18−x22, x24
PLLCLK
‡
DD
‡
SS
Osc.
/2
/8
/4
/6
1
0
1
0
00 01 10
EMIF00 01 10
Peripheral Bus, EDMA
Clock
Timer Internal Clock
CLKOUT4, Peripheral Clock
CLKOUT6
/4
/2
EK2RATE
(GBLCTL.[19,18])
AUXCLK
for McASPs
AECLKIN
AEA[20:19]
(For the PLL options, CLKMODE pins setup, and PLL clock frequency ranges,
see Table 4−1.)
†
Exact values for these components depend on choice of crystal. For recommended crystal and component values, see Table 4−3.
‡
Do not connect any of these nodes to board power or ground if the oscillator is used. They are internally connected for proper operation.
If CLKIN is being used instead of the oscillator, then OSCVDD and OSCVSS may either be left open, or OSCVDD may be tied to CVDD and
OSCVSS may be tied to ground.
NOTES: A. Place all PLL external components (C1, C2, and the EMI Filter) as close to the C6000 DSP device as possible. For the best
performance, TI recommends that all the PLL external components be on a single side of the board without jumpers, switches, or
components other than the ones shown.
B. For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (C1, C2, and the EMI
Filter).
C. The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DVDD.
D. EMI filter manufacturer TDK part number ACF451832-333, -223, -153, -103. Panasonic part number EXCCET103U.
E. If CLKIN is used instead of OSCIN, tie OSCIN to Ground to minimize noise and current. (Do not leave OSCIN floating.)
ECLKOUT2ECLKOUT1
Internal to C6418
Figure 4−1. External PLL Circuitry for Either PLL Multiply Modes or x1 (Bypass) Mode
76
August 2004 − Revised January 2006SPRS241D
Clock PLL and Oscillator
75
For proper C6418 device operation, the CLKINSEL pin must be used in conjunction with the OSC_DIS pin.
The OSC_DIS pin must follow the CLKINSEL pin operation. For more details on these two configuration pins,
see the Device Configuration at Device Reset section of this data sheet.
Table 4−1. TMS320C6418 PLL Multiply Factor Options, Clock Frequency Ranges,
Use external pullup resistors on the CLKMODE pins (CLKMODE1 and CLKMODE0) to set the C6418 device to one of the valid PLL multiply clock
modes (x5, x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x22, or x24). With internal pulldown resistors on the CLKMODE pins
(CLKMODE3, CLKMODE2, CLKMODE1, CLKMODE0), the default clock mode is x1 (bypass).
‡
Under some operating conditions, the maximum PLL lock time may vary by as much as 150% from the specified typical value. For example, if
the typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
(PLL MULTIPLY FACTORS)
CLKMODE
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE
(MHz)
†
OSCIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE
(MHz)
TYPICAL
LOCK TIME
‡
(µs)
75
August 2004 − Revised January 2006SPRS241D
77
Clock PLL and Oscillator
75
Table 4−2. TMS320C6418 PLL Multiply Factor Options, Clock Frequency Ranges,
Use external pullup resistors on the CLKMODE pins (CLKMODE1 and CLKMODE0) to set the C6418 device to one of the valid PLL multiply clock
modes (x5, x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x22, or x24). With internal pulldown resistors on the CLKMODE pins
(CLKMODE3, CLKMODE2, CLKMODE1, CLKMODE0), the default clock mode is x1 (bypass).
‡
Under some operating conditions, the maximum PLL lock time may vary by as much as 150% from the specified typical value. For example, if
the typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
(PLL MULTIPLY FACTORS)
CLKMODE
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE
(MHz)
†
OSCIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE
(MHz)
TYPICAL
LOCK TIME
‡
(µs)
75
For the lowest jitter on the oscillator circuit, it is recommended that a pair of 470-pF capacitors be connected
between isolated (not directly connected to the board supply) OSCV
and OSCVSS pins. This helps to cancel
DD
out switching noise from other circuits on the DSP device.
Table 4−3 shows a recommended crystal and tank circuit values for the C6418 PLL circuitry.
Table 4−3. Crystal and Tank Circuit Recommendations
ComponentsRECOMMENDED PART NUMBERS or VALUESMANUFACTURER
1AS245766AHA (SMD-49)
1AF245766AAA (AT-49)
1AS225796AG (SMD-49)
1AF225796A (AT-49)
1 MΩ—
0 Ω—
8 pF—
KDS Diashinku Corp.
Crystal
R
B
R
S
C7
C8
24.576 MHz
22.5792 MHz
78
August 2004 − Revised January 2006SPRS241D
4.2Host-Port Interface (HPI) Peripheral
The TMS320C6418 device includes a user-configurable 16-bit or 32-bit Host-port interface (HPI16/HPI32).
On the C6418 device the HPI peripheral pins are muxed with the McASP1 and GP0 peripheral pins. By default,
the HPI peripheral pin functions are enabled. For more detailed information on the C6418 device pin muxing,
see the Device Configurations section of this data sheet.
The HPI peripheral can be disabled or enabled at reset through the HPI enable function of the TOUT0/HPI_EN
pin. The HPI is enabled when the TOUT0/HPI_EN pin is sampled low at reset and it is disabled if the pin is
sample high at reset. The TOUT0/HPI_EN
However, the HPI can be disabled via an external pullup resistor or by having an external device such as an
FPGA/CPLD drive that pin high at reset. In the latter case, the external device should ensure it has stopped
driving this pin to avoid contention. The HPI enable function can only be set a reset and cannot be changed
via software.
The HD5 pin controls the HPI_WIDTH, allowing the user to configure the HPI as a 16-bit or 32-bit peripheral.
For more details on HPI peripheral configuration and the associated pins, see the Device Configurations
section of this data sheet.
Host-Port Interface (HPI) Peripheral
pin has an internal pulldown that enables the HPI by default.
August 2004 − Revised January 2006SPRS241D
79
Multichannel Audio Serial Port (McASP) Peripheral
4.3Multichannel Audio Serial Port (McASP) Peripheral
The TMS320C6418 device includes two multichannel audio serial port (McASP) interface peripheral
(McASP0 and McASP1). On the C6418 device the McASP1 peripheral pins are muxed with the HPI peripheral
pins. By default, the HPI peripheral pin functions are enabled. For the C6418 device McASP1 is a standalone
peripheral, not muxed. For more detailed information on the C6418 device pin muxing, see the Device
Configurations section of this data sheet.
The McASP is a serial port optimized for the needs of multichannel audio applications.
The McASP consists of a transmit and receive section. These sections can operate completely independently
with different data formats, separate master clocks, bit clocks, and frame syncs or alternatively, the transmit
and receive sections may be synchronized. The McASP module also includes a pool of 16 shift registers that
may be configured to operate as either transmit data, receive data, or general-purpose I/O (GPIO).
The transmit section of the McASP can transmit data in either a time-division-multiplexed (TDM) synchronous
serial format or in a digital audio interface (DIT) format where the bit stream is encoded for S/PDIF, AES-3,
IEC-60958, CP-430 transmission. The receive section of the McASP supports the TDM synchronous serial
format.
The McASP can support one transmit data format (either a TDM format or DIT format) and one receive format
at a time. All transmit shift registers use the same format and all receive shift registers use the same format.
However, the transmit and receive formats need not be the same.
Both the transmit and receive sections of the McASP also support burst mode which is useful for non-audio
data (for example, passing control information between two DSPs).
The McASP peripheral has additional capability for flexible clock generation, and error detection/handling, as
well as error management.
For more detailed information on and the functionality of the McASP peripheral, see the TMS320C6000 DSPMultichannel Audio Serial Port (McASP) Reference Guide (literature number SPRU041).
4.3.1McASP Block Diagram
Figure 4−2 illustrates the major blocks along with external signals of the TMS320C6418 McASP peripheral;
and shows the 6 serial data [AXRx] pins. The McASP also includes full general-purpose I/O (GPIO) control,
so any pins not needed for serial transfers can be used for general-purpose I/O.
On the C6418 device, the McASP1 peripheral has some additional pins muxed with AFSR1 and with ACLKR1 pins (i.e., AFSR1[1],
AFSR1[2], AFSR1[3] and ACLKR1[1]. ACLKR1[2], ACLKR1[3], respectively).
‡
On the C6418 device, the McASP0 peripheral is standalone, not muxed and the McASP1 peripheral is muxed with the HPI peripheral.
For more detailed information on multiplexed pins, see the Device Configurations section of this data sheet.
GPIO
Control
Figure 4−2. McASP0 and McASP1‡ Configuration
August 2004 − Revised January 2006SPRS241D
81
I2C
4.4I2C
The TMS320C6418 device includes two I2C peripheral modules (I2C0 and I2C1). NOTE: when using the I2C
modules (any mode), ensure there are external pullup resistors on the SDAx and SCLx pins.
One of the I2C modules on the TMS320C6418 may be used by the DSP to control local peripherals ICs (DACs,
ADCs, etc.) while the other module may be used to communicate with other controllers in a system or to
implement a user interface.
The I2Cx port supports:
•Compatible with Philips I2C Specification Revision 2.1 (January 2000)
•Fast Mode up to 400 Kbps (no fail-safe I/O buffers)
•Noise Filter to remove noise 50 ns or less
•7- and 10-Bit Device Addressing Modes
•Multi-Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality
•Events: DMA, Interrupt, or Polling
•Slew-Rate Limited Open-Drain Output Buffers
•General-purpose input and output (GPIO) functionality for I2C pins
For more detailed information on C6418 I2C additional features, such as GPIO capability, etc., see the
TMS320C6000 DSP Inter−Integrated Circuit (I2C) Module Reference Guide (literature number SPRU175)
and the TMS320C6410/C6413/C6418 DSP Inter−Integrated Circuit (I2C) Module Reference Guide (literature
number SPRZ221) addendum.
82
August 2004 − Revised January 2006SPRS241D
Figure 4−3 is a block diagram of the I2C0 and I2C1 modules.
Viterbi-Decoder Coprocessor (VCP)
I2C Clock
I2C Data
SCL
SDA
I2Cx Module
GPIO Control
I2CPFUNCx
I2CPDIRx
I2CPDINx
I2CPDOUTx
I2CPDSETx
I2CPDCLRx
Noise
Filter
Pin
Function
Pin
Direction
Pin Data
In
Pin Data
Out
Pin Data
Set
Pin Data
Clear
Noise
Filter
Clock
Prescale
I2CPSCx
Bit Clock
Generator
I2CCLKHx
I2CCLKLx
Transmit
I2CXSRx
I2CDXRx
Receive
I2CDRRx
I2CRSRx
Transmit
Shift
Transmit
Buffer
Receive
Buffer
Receive
Shift
Peripheral Clock
(CPU/4)
Control
I2COARx
I2CSARx
I2CMDRx
I2CCNTx
I2CEMDRx
Interrupt/DMA
I2CIERx
I2CSTRx
I2CISRCx
Own
Address
Slave
Address
Mode
Data
Count
Extended
Mode
Interrupt
Enable
Interrupt
Status
Interrupt
Source
NOTE A: Shading denotes control/status registers.
Figure 4−3. I2Cx Module Block Diagram
4.5Viterbi-Decoder Coprocessor (VCP)
The C6418 device has a high-performance embedded coprocessor [Viterbi-Decoder Coprocessor (VCP) that
significantly speeds up channel-decoding operations on-chip. The VCP operating at CPU clock divided-by-4
can decode over 500 7.95-Kbps adaptive multi-rate (AMR) [K = 9, R = 1/3] voice channels. The VCP supports
constraint lengths K = 5, 6, 7, 8, and 9, rates R = 1/2, 1/3, and 1/4, and flexible polynomials, while generating
hard decisions or soft decisions. Communications between the VCP and the CPU are carried out through the
EDMA controller.
For more detailed information on the VCP, see the TMS320C64x DSP Viterbi-Decoder CoprocessorReference Guide (literature number SPRU533).
4.6General-Purpose Input/Output (GPIO)
On the C6418 device the GPIO peripheral pins GP0[15:9] are muxed with the HPI peripheral pins HD[15:9],
respectively . B y default, the HPI peripheral pin functions are enabled [T OUT0/HPI_EN
For more detailed information on device/peripheral configuration and the C6418 device pin muxing, see the
Device Configurations section of this data sheet.
August 2004 − Revised January 2006SPRS241D
pin internall pulled low].
83
General-Purpose Input/Output (GPIO)
To use the GP0[15:0] software-configurable GPIO pins, the GPxEN bits in the GP Enable (GPEN) Register
and the GPxDIR bits in the GP Direction (GPDIR) Register must be properly configured.
GPxEN = 1GP[x] pin is enabled
GPxDIR =0GP[x] pin is an input
GPxDIR =1GP[x] pin is an output
where “x” represents one of the 15 through 0 GPIO pins
Figure 4−4 shows the GPIO enable bits in the GPEN register for the C6418 device. To use any of the GPx
pins as general-purpose input/output functions, the corresponding GPxEN bit must be set to “1” (enabled).
Default values are device-specific, so refer to Figure 4−4 for the C6418 default configuration.
Figure 4−5 shows the GPIO direction bits in the GPDIR register. This register determines if a given GPIO pin
is an input or an output providing the corresponding GPxEN bit is enabled (set to “1”) in the GPEN register.
By default, all the GPIO pins are configured as input pins.
R/W = Readable/Writeable; -n = value after reset, -x = undefined value after reset
DIR
GP13
DIR
GP12
DIR
GP11
DIR
10
GP10
DIR
98
GP9
DIR
GP8
DIR
7
GP7
DIR
6
GP6
DIR
5
GP5
DIR
43
GP4
DIR
GP3
DIR
2
GP2
DIR
10
GP1
DIR
GP0
DIR
Figure 4−5. GPIO Direction Register (GPDIR) [Hex Address: 01B0 0004]
For more detailed information on general-purpose inputs/outputs (GPIOs), see the TMS320C6000 DSP
General-Purpose Input/Output (GPIO) Reference Guide (literature number SPRU584).
August 2004 − Revised January 2006SPRS241D
85
Power-Down Modes Logic
4.7Power-Down Modes Logic
Figure 4−6 shows the power-down mode logic on the C6418.
CLKOUT4
Internal Clock Tree
Clock
Distribution
and Dividers
PD1
PD2
CPU
IFR
IER
CSR
Internal
Peripherals
PD3
Power-
Down
Logic
PWRD
Clock
PLL
CLKINRESET
†
External input clocks, with the exception of CLKIN, are not gated by the power-down mode logic.
CLKOUT6
TMS320C6418
Figure 4−6. Power-Down Mode Logic
Note: to further save power, the PERCFG register can be used to disable unused peripherals. For more
detailed information on disabling peripherals using the PERCFG register, see the Device Configurations
section of this data sheet.
4.7.1Triggering, Wake-up, and Effects
The power-down modes and their wake-up methods are programmed by setting the PWRD field (bits 15−10)
of the control status register (CSR). The PWRD field of the CSR is shown in Figure 4−7 and described in
Table 4−4. When writing to the CSR, all bits of the PWRD field should be set at the same time. Logic 0 should
be used when writing to the reserved bit (bit 15) of the PWRD field. The CSR is discussed in detail in the
TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189).
†
86
August 2004 − Revised January 2006SPRS241D
Power-Down Modes Logic
Power-down mode blocks the internal clock inputs at the
3116
15141312111098
Enable or
Reserved
R/W-0R/W-0R/W-0R/W-0R/W-0R/W-0
70
Legend: R/W−x = Read/write reset value
NOTE: The shadowed bits are not part of the power-down logic discussion and therefore are not covered here. For information on these other
bit fields in the CSR register, see the TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189).
Non-Enabled
Interrupt Wake
Enabled
Interrupt Wake
PD3PD2PD1
Figure 4−7. PWRD Field of the CSR Register
A delay of u p t o n ine c lock c ycles m ay o ccur a fter t he i nstruction t hat s ets the P WRD b its i n t he C SR b efore t he
PD mode takes effect. As best practice, NOPs should be padded after the PWRD bits are set in the CSR to
account for this delay.
If PD1 mode is terminated by a non-enabled interrupt, the program execution returns to the instruction where
PD1 took e f fect. I f P D1 m ode i s t erminated b y a n e nabled i nterrupt, t he i nterrupt service routine will b e e xecuted
first, then the program execution returns to the instruction where PD1 took effect. In the case with an enabled
interrupt, the GIE b it i n t he C SR a nd t he N MIE b it i n t he i nterrupt e nable r egister ( IER) m ust a lso b e s et i n o rder
for the i nterrupt s ervice routine to execute; o therwise, e xecution r eturns to the instruction w here P D1 t ook e f fect
upon PD1 mode termination by an enabled interrupt.
PD2 and PD3 modes can only be aborted by device reset. T able 4−4 summarizes all the power-down modes.
Table 4−4. Characteristics of the Power-Down Modes
PRWD FIELD
(BITS 15−10)
000000No power-down——
001001PD1Wake by an enabled interrupt
010001PD1
011010PD2
011100PD3
All othersReserved——
†
When entering PD2 and PD3, all functional I/O remains in the previous state. However, for peripherals which are asynchronous in nature or
peripherals with an external clock source, output signals may transition in response to stimulus on the inputs. Under these conditions,
peripherals will not operate according to specifications.
POWER-DOWN
MODE
†
†
WAKE-UP METHODEFFECT ON CHIP’S OPERATION
CPU halted (except for the interrupt logic)
Power-down mode blocks the internal clock inputs at the
Wake by an enabled or
non-enabled interrupt
Wake by a device reset
Wake by a device reset
boundary of the CPU, preventing most of the CPU’s logic from
switching. During PD1, EDMA transactions can proceed between
peripherals and internal memory.
Output clock from PLL is halted, stopping the internal clock
structure from switching and resulting in the entire chip being
halted. All register and internal RAM contents are preserved. All
functional I/O “freeze” in the last state when the PLL clock is
turned off.
Input clock to the PLL stops generating clocks. All register and
internal RAM contents are preserved. All functional I/O “freeze” in
the last state when the PLL clock i s t urned off. Following reset, the
PLL needs time to re-lock, just as it does following power-up.
Wake-up from PD3 takes longer than wake-up from PD2 because
the PLL needs to be re-locked, just as it does following power-up.
August 2004 − Revised January 2006SPRS241D
87
Power-Supply Sequencing
4.7.2C64x Power-Down Mode with an Emulator
If user power-down modes are programmed, and an emulator is attached, the modes will be masked to allow
the emulator access to the system. This condition prevails until the emulator is reset or the cable is removed
from the header . If power measurements are to be performed when in a power-down mode, the emulator cable
should be removed.
When the DSP is in power-down mode PD2 or PD3, emulation logic will force any emulation execution
command (such as Step or Run) to spin in IDLE. For this reason, PC writes (such as loading code) will fail.
A DSP reset will be required to get the DSP out of PD2/PD3.
4.8Power-Supply Sequencing
TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However,
systems should be designed to ensure that neither supply is powered up for extended periods of time
(>1 second) if the other supply is below the proper operating voltage.
4.8.1Power-Supply Design Considerations
A dual-power supply with simultaneous sequencing can be used to eliminate the delay between core and I/O
power up. A Schottky diode can also be used to tie the core rail to the I/O rail (see Figure 4−8).
I/O Supply
DV
DD
Schottky
Diode
Core Supply
CV
V
GND
C6000
DSP
DD
SS
Figure 4−8. Schottky Diode Diagram
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the C6000 platform of DSPs, the PC board should include separate power planes for
core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors.
TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However,
systems should be designed to ensure that neither supply is powered up for extended periods of time if the
other supply is below the proper operating voltage.
88
August 2004 − Revised January 2006SPRS241D
4.9Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. Assuming 0603 caps, the user should be able to fit a total of 60 caps, 30 for the
core supply and 30 for the I/O supply. These caps need to be close to the DSP power pins, no more than
1.25 cm maximum distance to be effective. Physically smaller caps, such as 0402, are better because of their
lower parasitic inductance. Proper capacitance values are also important. Small bypass caps (near 560 pF)
should be closest to the power pins. Medium bypass caps (220 nF or as large as can be obtained in a small
package) should be next closest. TI recommends no less than 8 small and 8 medium caps per supply (32 total)
be placed immediately next to the BGA vias, using the “interior” BGA space and at least the corners of the
“exterior”.
Eight larger caps (4 for each supply) can be placed further away for bulk decoupling. Large bulk caps (on the
order of 100 µF) should be furthest away (but still as close as possible). No less than 4 large caps per supply
(8 total) should be placed outside of the BGA.
Any cap selection needs to be evaluated from a yield/manufacturing point-of-view. As with the selection of any
component, verification of capacitor availability over the product’s production lifetime should be considered.
4.10Peripheral Power-Down Operation
The C6418 device can be powered down in two ways:
•Power-down due to software configuration − relates to the default state of the peripheral configuration bits
in the PERCFG register.
•Power-down during run-time via software configuration
Power-Supply Decoupling
On the C6418 device, the HPI, McASP1, and GP0 peripherals pin muxing is controlled (selected) at the pin
level during chip reset (e.g., HPI_EN and HD5 pins). If McASP1 pin muxing is selected, then the McASP1
peripheral configuration register bit must be configured properly to enable the McASP1 peripheral.
The McASP1, McASP0, I2C1, and I2C0 peripheral functions are selected via the peripheral configuration
(PERCFG) register bits.
For more detailed information on the peripheral configuration pins and the PERCFG register bits, see the
Device Configurations section of this document.
August 2004 − Revised January 2006SPRS241D
89
IEEE 1149.1 JTAG Compatibility Statement
4.11IEEE 1149.1 JTAG Compatibility Statement
The TMS320C6418 DSP requires that both TRST and RESET be asserted upon power up to be properly
initialized. While RESET
required for proper operation.
initializes the DSP core, TRST initializes the DSP’s emulation logic. Both resets are
Note: TRST
after TRST
While both TRST
DSP to boot properly. TRST
and DSP’s emulation logic in the reset state. TRST
JTAG controller to debug the DSP or exercise the DSP’s boundary scan functionality. RESET
is synchronous and must be clocked by TCLK; otherwise, BSCAN may not respond as expected
is asserted.
and RESET need to be asserted upon power up, only RESET needs to be released for the
may be asserted indefinitely for normal operation, keeping the JT AG port interface
only needs to be released when it is necessary to use a
must be
released in order for boundary-scan JTAG to read the variant field of IDCODE correctly. Other boundary-scan
instructions work correctly independent of current state of RESET
The TMS320C6418 DSP includes an internal pulldown (IPD) on the TRST
.
pin to ensure that TRST will always
be asserted upon power up and the DSP’s internal emulation logic will always be properly initialized when this
pin is not routed out. JTAG controllers from Texas Instruments actively drive TRST
third-party JTAG controllers may not drive TRST
When using this type of JTAG controller, assert TRST
TRST
high before attempting any emulation or boundary scan operations.
Following the release of RESET
, the low-to-high transition of TRST must occur to latch the state of EMU1 and
high but expect the use of an external pullup resistor on TRST.
to initialize the DSP after powerup and externally drive
high. However, some
EMU0. The EMU[1:0] pins configure the device for either Boundary Scan mode or Normal/Emulation mode.
For more detailed information, see the terminal functions section of this data sheet.
Note: The DESIGN_WARNING section of the TMS320C6418 BSDL file contains information and constraints
regarding proper device operation while in Boundary Scan Mode.
For more detailed information on the C6418 JT AG emulation, see the TMS320C6000 DSP Designing for JTAGEmulation Reference Guide (literature number SPRU641).
4.12EMIF Device Speed
The rated EMIF speed of these devices only applies to the SDRAM interface when in a system that meets the
following requirements:
•1 chip-enable (CE) space (maximum of 2 chips) of SDRAM connected to EMIF
•up to 1 CE space of buffers connected to EMIF
•EMIF trace lengths between 1 and 3 inches
•166-MHz SDRAM for 133-MHz operation
•143-MHz SDRAM for 100-MHz operation
Other configurations may be possible, but timing analysis must be done to verify all AC timings are met.
Verification of AC timings is mandatory when using configurations other than those specified above. TI
recommends utilizing I/O buffer information specification (IBIS) to analyze all AC timings.
To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS Modelsfor Timing Analysis application report (literature number SPRA839).
To maintain signal integrity, serial termination resistors should be inserted into all EMIF output signal lines (see
the Terminal Functions table for the EMIF output signals).
For more detailed information on the C6418 EMIF peripheral, see the TMS320C6000 DSP External MemoryInterface (EMIF) Reference Guide (literature number SPRU266).
90
August 2004 − Revised January 2006SPRS241D
4.13Bootmode
The C6418 device resets using the active-low signal RESET. While RESET is low, the device is held in reset
and is initialized to the prescribed reset state. Refer to reset timing for reset timing characteristics and states
of device pins during reset. The release of RESET
configuration and boot mode.
The C6418 has three types of boot modes:
•Host boot
Bootmode
starts the processor running with the prescribed device
If host boot is selected, upon release of RESET
, the CPU is internally “stalled” while the remainder of the
device is released. During this period, an external host can initialize the CPU’s memory space as
necessary through the host interface, including internal configuration registers, such as those that control
the EMIF or other peripherals. For the C6418 device, the HPI peripheral is used for host boot providing the
TOUT0/HPI_EN
pin is low, enabling the HPI peripheral [default]. Once the host is finished with all
necessary initialization, it must set the DSPINT bit in the HPIC register to complete the boot process. This
transition causes the boot configuration logic to bring the CPU out of the “stalled” state. The CPU then
begins execution from address 0. The DSPINT condition is not latched by the CPU, because it occurs
while the CPU is still internally “stalled”. Also, DSPINT brings the CPU out of the “stalled” state only if the
host boot process is selected. All memory may be written to and read by the host. This allows for the host to
verify what it sends to the DSP if required. After the CPU is out of the “stalled” state, the CPU needs to clear
the DSPINT, otherwise, no more DSPINTs can be received.
•EMIF boot (using default ROM timings)
Upon the release of RESET
, the 1K-Byte ROM code located in the beginning of CE1 is copied to address 0
by the EDMA using the default ROM timings, while the CPU is internally “stalled”. The data should be
stored in the endian format that the system is using. In this case, the EMIF automatically assembles
consecutive 8-bit bytes to form the 32-bit instruction words to be copied. The transfer is automatically done
by the EDMA as a single-frame block transfer from the ROM to address 0. After completion of the block
transfer, the CPU is released from the “stalled” state and starts running from address 0.
•No boot
With no boot, the CPU begins direct execution from the memory located at address 0. Note: operation is
undefined if invalid code is located at address 0.
4.14Reset
A hardware reset (RESET) is required to place the DSP into a known good state out of power-up. The RESET
signal can be asserted (pulled low) prior to ramping the core and I/O voltages or after the core and I/O voltages
have reached their proper operating conditions. As a best practice, reset should be held low during power-up.
Prior to deasserting RESET
operating conditions and CLKIN should also be running at the correct frequency.
August 2004 − Revised January 2006SPRS241D
(low-to-high transition), the core and I/O voltages should be at their proper
91
Device Electrical Specifications
5Device Electrical Specifications
5.1Absolute Maximum Ratings Over Operating Case Temperature Range (Unless Otherwise
†
Noted)
Supply voltage ranges:CV
Input voltage range:V
Output voltage range:V
Operating case temperature range, T
Number of Cycles (GTS and GTSA)1000. . . . . . . . . . . . . . . . . . . . . . .
Number of Cycles (ZTS and ZTSA)500. . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to V
SS
.
5.2Recommended Operating Conditions
MINNOMMAXUNIT
CV
DV
V
SS
V
IH
V
IL
V
OS
VusMinimum voltage during undershoot−1.0
T
C
‡
Future variants of the C64x DSPs may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system power/performance options.
TI highly recommends that users design-in a supply that can handle multiple voltages within this range (i.e., 1.2 V, 1.25 V, 1.3 V, 1.35 V, 1.4 V
with ± 3% tolerances) by implementing simple board changes such as reference resistor values or input pin configuration modifications. Examples
of such supplies include the PT4660, PT5500, PT5520, PT6440, and PT6930 series from Power Trends, a subsidiary of Texas Instruments. Not
incorporating a flexible supply may limit the system’s ability to easily adapt to future versions of C64x devices.
§
The absolute maximum ratings should not be exceeded for more than 30% of the cycle period.
Supply ground000V
High-level input voltage2V
Low-level input voltage0.8V
Maximum voltage during overshoot4.3
Operating case temperature
‡
‡
Commercial temperature device (GTS and ZTS)090_C
Extended temperature device (GTSA and
ZTSA)
1.141.21.26V
1.361.41.44V
§
§
−40105_C
V
V
92
August 2004 − Revised January 2006SPRS241D
Device Electrical Specifications
OL
IOLLow-level output current
§
§
5.3Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating
Case Temperature (Unless Otherwise Noted)
PARAMETERTEST CONDITIONS
V
V
I
I
I
OH
I
I
OZ
I
CDD
I
DDD
C
C
†
For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
‡
Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
§
Measured with average activity (50% high/50% low power) at 25°C case temperature and 133-MHz EMIF for -600 speed and 100-MHz EMIF
for -500 speed. This model represents a device performing high-DSP-activity operations 50% of the time, and the remainder performing
low-DSP-activity operations. The high/low-DSP-activity models are defined as follows:
High-DSP-Activity Model:
Low-DSP-Activity Model:
The actual current draw is highly application-dependent. For more details on core and I/O activity, refer to the TMS320C6418 Power ConsumptionSummary application report (literature number SPRAA60).
High-level output voltageDV
OH
Low-level output voltageDV
OL
Input current
High-level output current
Low-level output current
Off-state output currentV
Core supply current
I/O supply current
Input capacitance10pF
i
Output capacitance10pF
o
CPU: 8 instructions/cycle with 2 LDDW instructions [L1 Data Memory: 128 bits/cycle via LDDW instructions;
L1 Program Memory: 256 bits/cycle; L2/EMIF EDMA: 50% writes, 50% reads to/from SDRAM (50% bit-switching)]
McBSP: 2 channels at E1 rate
Timers: 2 timers at maximum rate
CPU: 2 instructions/cycle with 1 LDH instruction [L1 Data Memory: 16 bits/cycle; L1 Program Memory: 256 bits per 4 cycles;
L2/EMIF EDMA: None]
McBSP: 2 channels at E1 rate
Timers: 2 timers at maximum rate
= 1.4 V, CPU clock = 600 MHz828mA= 1.2 V, CPU clock = 500 MHz568mA= 3.3 V, CPU clock = 600 MHz167mA= 3.3 V, CPU clock = 500 MHz140mA
†
= MAX2.4V
OH
= MAX0.4V
OL
MINTYPMAXUNIT
±10uA
50100150uA
−150−100−50uA
−8mA
8mA
5.4Recommended Clock and Control Signal Transition Behavior
August 2004 − Revised January 2006SPRS241D
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
93
Parameter Information
6Parameter Information
Tester Pin Electronics
42 Ω3.5 nH
4.0 pF1.85 pF
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects
must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect.
The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from
the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Transmission Line
Z0 = 50 Ω
(see note)
Data Sheet Timing Reference Point
Output
Under
Test
Device Pin
(see note)
Figure 6−1. Test Load Circuit for AC Timing Measurements
The load capacitance value stated is only for characterization and measurement of AC timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
6.1Signal Transition Levels
All input and output timing parameters are referenced to 1.5 V for both “0” and “1” logic levels.
Figure 6−2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to V
and V
MIN for output clocks.
OH
Figure 6−3. Rise and Fall Transition Time Voltage Reference Levels
6.2Signal Transition Rates
All timings are tested with an input edge rate of 4 Volts per nanosecond (4 V/ns).
V
= 1.5 V
ref
MAX and VIH MIN for input clocks, V
IL
V
= VIH MIN (or VOH MIN)
ref
V
= VIL MAX (or VOL MAX)
ref
OL
MAX
94
August 2004 − Revised January 2006SPRS241D
Parameter Information
PARAMETER MEASUREMENT INFORMATION (CONTINUED)
6.3AC transient rise/fall time specifications
Figure 6−4 and Figure 6−5 show the AC transient specifications for Rise and Fall Time. For device-specific
information on these values, refer to the Recommended Operating Conditions section of this Data Sheet.
Ground
†
tc = the peripheral cycle time.
t = 0.3 tc (max)
Figure 6−4. AC Transient Specification Rise Time
†
Minimum
Risetime
Waveform
Valid Region
t = 0.3 tc(max)
VIH (min)
†
VOS (max)
VIL (max)
VUS (max)
Ground
†
tc = the peripheral cycle time.
Figure 6−5. AC Transient Specification Fall Time
August 2004 − Revised January 2006SPRS241D
95
Parameter Information
6.4Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data sheet do not include delays by board routings. As a good
board design practice, such delays must always be taken into account. Timing values may be adjusted by
increasing/decreasing such delays. TI recommends utilizing the available I/O buffer information specification
(IBIS) models to analyze the timing characteristics correctly. To properly use IBIS models to attain accurate
timing analysis for a given system, see the Using IBIS Models for Timing Analysis application report (literature
number SPRA839). If needed, external logic hardware such as buffers may be used to compensate any timing
differences.
For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external device
and from the external device to the DSP. This round-trip delay tends to negatively impact the input setup time
margin, but also tends to improve the input hold time margins (see Table 6−1 and Figure 6−6).
Figure 6−6 represents a general transfer between the DSP and an external device. The figure also represents
board route delays and how they are perceived by the DSP and the external device.
Table 6−1. Board-Level Timing Example (see Figure 6−6)
NO.DESCRIPTION
1Clock route delay
2Minimum DSP hold time
3Minimum DSP setup time
4External device hold time requirement
5External device setup time requirement
6Control signal route delay
7External device hold time
8External device access time
9DSP hold time requirement
10DSP setup time requirement
11Data route delay
96
ECLKOUTx
(Output from DSP)
1
(Input to External Device)
(Input to External Device)
(Output from External Device)
†Control signals include data for Writes.
‡Data signals are generated during Reads from an external device.
ECLKOUTx
Control Signals†
(Output from DSP)
Control Signals
Data Signals‡
Data Signals‡
(Input to DSP)
3
6
8
2
4
5
11
Figure 6−6. Board-Level Input/Output Timings
10
7
9
August 2004 − Revised January 2006SPRS241D
Peripheral Electrical Specifications
NO.
UNIT
NO.
UNIT
.
1
7Peripheral Electrical Specifications
7.1Input and Output Clocks
Table 7−1. Timing Requirements for External Crystal Oscillator Input (OSCIN and OSCOUT)
−500
−600
MINMAX
1f
OSC
†
The PLL multiplier factors (x5, x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x24) further limit the MIN and MAX values for CLKIN and
OSCIN. For more details on these limitations, see Table 4−1 of the Clock PLL and Oscillator section of this data sheet.
NO
1t
c(CLKIN)
2t
w(CLKINH)
3t
w(CLKINL)
4t
t(CLKIN)
5t
J(CLKIN)
†
The PLL multiplier factors (x5, x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x24) further limit the MIN and MAX values for CLKIN and
OSCIN. For more details on these limitations, see Table 4−1 of the Clock PLL and Oscillator section of this data sheet.
‡
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
§
C = CLKIN cycle time in ns. For example, when CLKIN frequency is 50 MHz, use C = 20 ns.
Input oscillator frequency1230MHz
Table 7−2. Timing Requirements for CLKIN
Cycle time, CLKIN10
Pulse duration, CLKIN high0.45C0.45Cns
Pulse duration, CLKIN low0.45C0.45Cns
Transition time, CLKIN51ns
Period jitter, CLKIN0.02C0.02Cns
†‡§
(see Figure 7−1)
−500
−600
PLL MULT MODEx1 (BYPASS)
MINMAXMINMAX
†
83.310
†
UNIT
83.3ns
CLKIN
5
2
3
4
4
Figure 7−1. CLKIN Timing
August 2004 − Revised January 2006SPRS241D
97
Input and Output Clocks
NO.
PARAMETER
UNIT
NO.
PARAMETER
UNIT
4
NO.
PARAMETER
UNIT
NO.
PARAMETER
UNIT
4
Table 7−3. Switching Characteristics Over Recommended Operating Conditions for CLKOUT4
(see Figure 7−2)
−500
−600
MINMAX
1t
c(CKO4)
2t
w(CKO4H)
3t
w(CKO4L)
4t
†
‡
§
t(CKO4)
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
PH is the high period of CLKIN in ns and PL is the low period of CLKIN in ns.
P = 1/CPU clock frequency in nanoseconds (ns)
Table 7−4. Switching Characteristics Over Recommended Operating Conditions for CLKOUT6
(see Figure 7−3)
†‡§
†‡§
1t
c(CKO6)
2t
w(CKO6H)
3t
w(CKO6L)
4t
†
‡
§
t(CKO6)
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
PH is the high period of CLKIN in ns and PL is the low period of CLKIN in ns.
P = 1/CPU clock frequency in nanoseconds (ns)
Table 7−5. Timing Requirements for AECLKIN for EMIFA
1t
c(EKI)
2t
w(EKIH)
3t
w(EKIL)
4t
t(EKI)
5t
J(EKI)
†
P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
‡
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
§
E = the EMIF input clock (AECLKIN, CPU/4 clock, or CPU/6 clock) period in ns.
¶
Minimum AECLKIN cycle times must be met, even when AECLKIN is generated by an internal clock source. Minimum AECLKIN times are based
on internal logic speed; the maximum useable speed of the EMIF may be lower due to AC timing requirements. 133-MHz and 100-MHz operations
are achievable if the requirements of the EMIF Device Speed section are met.
AECLKIN
Cycle time, AECLKIN6
Pulse duration, AECLKIN high2.7ns
Pulse duration, AECLKIN low2.7ns
Transition time, AECLKIN3ns
Period jitter, AECLKIN0.02Ens
5
2
3
†‡§
(see Figure 7−4)
4
4
−500
−600
MINMAX
¶
16Pns
Figure 7−4. AECLKIN Timing for EMIFA
Table 7−6. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT1 for the
EMIFA Module
1t
c(EKO1)
2t
w(EKO1H)
3t
w(EKO1L)
4t
t(EKO1)
5t
d(EKIH-EKO1H)
6t
d(EKIL-EKO1L)
§
E = the EMIF input clock (AECLKIN, CPU/4 clock, or CPU/6 clock) period in ns.
#
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
||
EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns for EMIFA.
AECLKIN
AECLKOUT1
Cycle time, AECLKOUT1E − 0.7E + 0.7ns
Pulse duration, AECLKOUT1 highEH − 0.7EH + 0.7ns
Pulse duration, AECLKOUT1 lowEL − 0.7EL + 0.7ns
Transition time, AECLKOUT11ns
Delay time, AECLKIN high to AECLKOUT1 high18ns
Delay time, AECLKIN low to AECLKOUT1 low18ns
1
5
§#||
(see Figure 7−5)
6
−500
−600
MINMAX
2
3
4
4
Figure 7−5. AECLKOUT1 Timing for the EMIFA Module
August 2004 − Revised January 2006SPRS241D
99
Input and Output Clocks
NO.
PARAMETER
UNIT
NO.
PARAMETER
UNIT
5
Table 7−7. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT2 for the
EMIFA Module
1t
c(EKO2)
2t
w(EKO2H)
3t
w(EKO2L)
4t
t(EKO2)
5t
d(EKIH-EKO2H)
6t
d(EKIL-EKO2L)
†
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
‡
E = the EMIF input clock (AECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA.
N = the EMIF input clock divider; N = 1, 2, or 4.
AECLKIN
CLKOUT2
Cycle time, AECLKOUT2NE − 0.7NE + 0.7ns
Pulse duration, AECLKOUT2 high0.5NE − 0.70.5NE + 0.7ns
Pulse duration, AECLKOUT2 low0.5NE − 0.70.5NE + 0.7ns
Transition time, AECLKOUT21ns
Delay time, ECLKIN high to AECLKOUT2 high18ns
Delay time, ECLKIN low to AECLKOUT2 low18ns
1
†‡
(see Figure 7−6)
6
−500
−600
MINMAX
3
2
4
4
Figure 7−6. AECLKOUT2 Timing for the EMIFA Module
100
August 2004 − Revised January 2006SPRS241D
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