– Active...158 mW Worst Case
– Standby...1.4 mW Worst Case
(CMOS Input Levels)
•PEP4 Version Available With 168-Hour
Burn-In and Choices of Operating
T emperature Ranges
•128K EPROM Available With MIL-STD-883C
Class B High-Reliability Processing
(SMJ27C128)
description
The TMS27C128 series are 131 072-bit,
ultraviolet-light erasable, electrically
programmable read-only memories.
The TMS27PC128 series are 131 072-bit, one
time electrically programmable read-only
memories.
J AND N PACKAGES
(TOP VIEW)
V
1
PP
A12
2
A7
3
A6
4
A5
5
A4
6
A3
7
A2
8
A1
9
A0
10
DQ0
11
DQ1
12
DQ2
13
GND
A6
A5
A4
A3
A2
A1
A0
NC
DQ0
A0–A13Address Inputs
E
G
GNDGround
NCNo Connection
NUMake No External Connection
PGM
DQ0–DQ7Inputs (programming)/Outputs
V
CC
V
PP
14
FM PACKAGE
(TOP VIEW)
PP
A7
A12VNUVPGM
3213231
430
5
6
7
8
9
10
11
12
13
14
15 16 17 18 19
SS
V
DQ1
DQ2
PIN NOMENCLATURE
Chip Enable/Powerdown
Output Enable
Program
5-V Power Supply
12-13 V Programming Power Supply
28
27
26
25
24
23
22
21
20
19
18
17
16
15
NU
CC
DQ3
V
CC
PGM
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
20
DQ4
A13
29
28
27
26
25
24
23
22
21
DQ5
A8
A9
A1 1
NC
G
A10
E
DQ7
DQ6
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
These devices are fabricated using power-saving CMOS technology for high speed and simple interface with
MOS and bipolar circuits. All inputs (including program data inputs) can be driven by Series 74 TTL circuits
without the use of external pull-up resistors. Each output can drive one Series 74 TTL circuit without external
resistors.
The data outputs are three-state for connecting multiple devices to a common bus. The TMS27C128 and the
TMS27PC128 are pin compatible with 28-pin 128K MOS ROMs, PROMs, and EPROMs.
The TMS27C128 EPROM is offered in a dual-in-line ceramic package (J suffix) designed for insertion in
mounting hole rows on 15,2-mm (600-mil) centers. The TMS27C128 is offered with two operating temperature
ranges of 0°C to 70°C (JL suffix) and – 40°C to 85°C (JE suffix). The TMS27C128 is also offered with 168-hour
burn-in temperature ranges (JL4 and JE4 suffixes). (See table below).
The TMS27PC128 PROM is offered in a dual-in-line plastic package (N suffix) designed for insertion in mounting
hole rows on 15,2-mm (600-mil) centers. The TMS27PC128 is also supplied in a 32-lead plastic leaded chip
carrier package using 1,25-mm (50-mil) lead spacing (FM suffix). The TMS27PC128 is also offered with two
operating temperature ranges of 0°C to 70°C (NL and FML suffixes) and –40°C to 85°C (NE and FME suffixes).
The TMS27PC128 is also offered with 168 hour burn-in temperature ranges (NL4, FML4, NE4, and FME4
suffixes). (See table below).
SUFFIX FOR OPERATING
TEMPERATURE RANGES
WITHOUT PEP4 BURN-IN
0°C TO 70°C–40 °C TO 85°C0°C TO 70°C–40 °C TO 85°C
SUFFIX FOR OPERATING
TEMPERATURE RANGES WITH
PEP4 168 HR. BURN-IN
These EPROMs and PROMs operate from a single 5-V supply (in the read mode), thus are ideal for use in
microprocessor-based systems. One other 12-13-V supply is needed for programming . All programming
signals are TTL level. These devices are programmable by using the SNAP! Pulse programming algorithm.The
SNAP! Pulse programming algorithm uses a V
of 13.0 V and a VCC of 6.5 V for a nominal programming time
PP
of two seconds. For programming outside the system, existing EPROM programmers can be used. Locations
may be programmed singly, in blocks, or at random.
When the outputs of two or more TMS27C128s or TMS27PC128s are connected in parallel on the same bus,
the output of any particular device in the circuit can be read with no interference from the competing outputs
of the other devices. To read the output of a single device, a low-level signal is applied to the E
All other devices in the circuit should have their outputs disabled by applying a high-level signal to one of these
pins. Output data is accessed at pins DQ0 through DQ7.
latchup immunity
Latchup immunity on the TMS27C128 and TMS27PC128 is a minimum of 250 mA on all inputs and outputs.
This feature provides latchup immunity beyond any potential transients at the P .C. board level when the devices
are interfaced to industry-standard TTL or MOS logic devices. Input/output layout approach controls latchup
without compromising performance or packing density.
power down
Active ICC supply current can be reduced from 30 mA to 500 µA (TTL-level inputs) or 250 µA (CMOS-level inputs)
by applying a high TTL or CMOS signal to the E
pin. In this mode all outputs are in the high-impedance state.
erasure (TMS27C128)
Before programming, the TMS27C128 EPROM is erased by exposing the chip through the transparent lid to
a high intensity ultraviolet light (wavelength 2537 Å). EPROM erasure before programming is necessary to
assure that all bits are at the logic high level. Logic lows are programmed into the desired locations. A
programmed logic low can be erased only by ultraviolet light. The recommended minimum ultraviolet light
2
exposure dose (UV intensity × exposure time) is 15-W⋅s/cm
. A typical 12-mW/cm2, filterless UV lamp will
erase the device in 21 minutes. The lamp should be located about 2.5 cm above the chip during erasure. It
should be noted that normal ambient light contains the correct wavelength for erasure. Therefore, when
using the TMS27C128, the window should be covered with an opaque label.
and G pins.
initializing (TMS27PC128)
The one-time programmable TMS27PC128 PROM is provided with all bits at the logic high level. The logic lows
are programmed into the desired locations. Logic lows programmed into a PROM cannot be erased.
SNAP! Pulse programming
The 128K EPROM and PROM are programmed using the TI SNAP! Pulse programming algorithm, illustrated
by the flowchart in Figure 1, which programs in a nominal time of two seconds. Actual programming time will
vary as a function of the programmer used.
Data is presented in parallel (eight bits) on pins DQ0 to DQ7. Once addresses and data are stable, PGM
pulsed.
The SNAP! Pulse programming algorithm uses initial pulses of 100 microseconds (µs) followed by a byte
verification to determine when the addressed byte has been successfully programmed. Up to 10 (ten) 100-µs
pulses per byte are provided before a failure is recognized.
The programming mode is achieved when V
= 13 V, VCC = 6.5 V, G = VIH, and E = VIL. More than
PP
one device can be programmed when the devices are connected in parallel. Locations can be
programmed in any order. When the SNAP! Pulse programming routine is complete, all bits are verified
with V
= VPP = 5 V.
CC
program inhibit
Programming may be inhibited by maintaining a high level input on the E
The signature mode provides access to a binary code identifying the manufacturer and type. This mode
is activated when A9 is forced to 12 V ± 0.5 V. Two identifier bytes are accessed by A0; i.e., A0 = V
accesses the manufacturer code, which is output on DQ0–DQ7; A0 = VIH accesses the device code, which
is output on DQ0–DQ7. All other addresses must be held at V
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: Under absolute maximum ratings, voltage values are with respect to GND.
switching characteristics over full ranges of recommended operating conditions (see Notes 3 and 4)
’27C128-12’27C/PC128-15
MINMAXMINMAX
120150ns
5575ns
045060ns
00ns
t
a(A)
t
a(E)
t
en(G)
t
dis
t
v(A)
TEST CONDITIONS
(SEE NOTES 3 AND 4)
Access time from address120150ns
Access time from chip enable
Output enable time from G
Output disable time from G or E, whichever occurs first
Output data valid time after change of address,
E
, or G, whichever occurs first
†
1 Series 74 TTL Load,
†
Input tr ≤ 20 ns,
p
=
≤ 20
p
,
TEST CONDITIONS
(SEE NOTES 3 AND 4)
t
a(A)
t
a(E)
t
en(G)
t
dis
t
v(A)
†
Value calculated from 0.5 V delta to measured level. This parameter is only sampled and not 100% tested.
Access time from address200250ns
Access time from chip enable
Output enable time from G
Output disable time from Go r E, whichever occurs first
Output data valid time after change of address, E, or G,
whichever occurs first
†
1 Series 74 TTL Load,
†
Input tr ≤ 20 ns,
p
=
≤ 20
p
,
’27C/PC128-20′27C/PC128-25
MINMAXMINMAX
200250ns
75100ns
060060ns
00ns
switching characteristics for programming:VCC = 6.5 V and VPP = 13 V (SNAP! Pulse), TA = 25°C (see
Note 3)
PARAMETERMINNOMMAXUNIT
t
dis(G)
t
en(G)
recommended timing requirements for programming: VCC = 6.5 V and V
Pulse), T
t
w(IPGM)
t
su(A)
t
su(E)
t
su(G)
t
su(D)
t
su(VPP)
t
su(VCC)
t
h(A)
t
h(D)
NOTES: 3. For all switching characteristics the input pulse levels are 0.4 V to 2.4 V. Timing measurements are made at 2 V for logic high
Output disable time from G0130ns
Output enable time from G150ns
=13 V(SNAP!
= 25°C (see Note 3)
A
Initial program pulse duration SNAP! Pulse programming algorithm95100105µs
Address setup time2µs
E setup time2µs
G setup time2µs
Data setup time2µs
VPP setup time2µs
VCC setup time2µs
Address hold time0µs
Data hold time2µs
AC testing inputs are driven at 2.4 V for logic high and 0.4 V for logic low. Timing measurements are made at
2 V for logic high and 0.8 V for logic low for both inputs and outputs.
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
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In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
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