This user's guide describes the characteristics, operation, and use of the TMP75BEVM evaluation board.
This user's guide discusses how to set up and configure the software, discusses the hardware, and
reviews various aspects of the software operation. Throughout this document, the terms evaluation board,
evaluation module, and EVM are synonymous with the TMP75BEVM. This user's guide also provides
information on the operating procedure, input and output connections, an electrical schematic, printedcircuit board (PCB) layout drawings, and a parts list for the EVM.
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2Overview
The TMP75BEVM allows users to evaluate the performance of the TMP75B digital temperature sensor.
The EVM comes in a USB stick form factor, with an onboard MSP430F5528 microcontroller that interfaces
with both the host computer and the TMP75B device using an I2C interface. The module is designed with
perforations between the sensor and host controller on the EVM board. The perforation allows the user
flexibility in their evaluation:
•The user can connect the TMP75B to the user's system/host.
•The user can connect the EVM host and software to the user's system with TMP75B devices.
•Small individual boards allow the user to place sensors in the user's system.
•Hole spacing is compatible with common 0.1" prototyping breadboards.
2.1EVM Kit Contents
Table 1 details the contents of the EVM kit. Contact the Texas Instruments Product Information Center
nearest you if any components are missing. TI highly recommends that users check the TI website at
http://www.ti.com to verify that they have the latest versions of the related software.
Overview
Table 1. EVM Kit Contents
ItemQuantity
TMP75BEVM1
3EVM Hardware
3.1Perforations
The perforation between the USB controller and TMP75B sensor is labeled on both sides for pin
connections.
3.2Subregulator
The switch S1 enables and disables the on-board 1.8-V regulator: U1. When the subregulator is enabled,
the green LED D3 illuminates. The subregulator must be enabled for normal operation of TMP75BEVM.
3.3Logic Level Translator
The translator U3 separates the MSP430 I2C host from the TMP75B device. This is not required for end
applications, but the translator is provided on the EVM as a courtesy. When the subregulator is disabled, a
voltage between 1.4 V and 3.6 V can be applied at the 1P8V net, which is the 1.8-V pin on the perforation.
This external voltage will illuminate the green LED D3 and power the TMP75B device.
3.4Programming Header
The TMP75BEVM comes pre-loaded with firmware that is necessary for the correct operation of the USB
interface and PC GUI software. The unpopulated header, J2, is provided for Spy-Bi-Wire access to the
MSP430F5528. TI does not recommend that users access this header or reprogram the device.
3.5BSL Button
The TMP75BEVM features push-button SW1 for entering USB BSL mode. This can be used for firmware
updates.
The PC GUI Software for TMP75BEVM runs on TI's GUI Composer framework. The software is available
as a live version which runs in your browser, and it is available as a download for offline use. The software
is compatible with Windows, Mac, and Linux operating systems.
4.1Live Software on dev.ti.com
The live software currently works on Chrome, Firefox, and Safari browsers. Internet Explorer is not
supported. Users can access the live version through one of the following actions:
•Go to the EVM tool page and click on the View button
•Go to dev.ti.com/gallery and search for TMP75BEVM
Click on the application icon within the gallery to launch the software. Click on the prompt to install the TI
Cloud Agent Bridge browser plugin.
4.2Offline Software
4.2.1Download from dev.ti.com
Users can access the latest version of the offline software by navigating to the live version as noted
above. Look for the download iconand download both the application and runtime for the operating
The Home Tab is shown at software launch. The Learn More link displays Features and Functional
Diagram for the TMP75B device. The icons are shortcuts to the tabs shown on te left side of the screen.