TheTMP512(dual-channel)andTMP513
(triple-channel) are system monitors that include
remote sensors, a local temperature sensor, and a
high-side current shunt monitor. These system
monitors have the capability of measuring remote
voltage/power/current consumption.
The remote temperature sensor diode-connected
transistors are typically low-cost, NPN- or PNP-type
transistors or diodes that are an integral part of
microcontrollers,microprocessors,orFPGAs.
manufacturers, with no calibration needed. The
two-wireserialinterfaceacceptsSMBus™or
two-wire write and read commands.
The onboard current shunt monitor is a high-side
current shunt and power monitor. It monitors both the
shunt drop and supply voltage. A programmable
calibration value (along with the TMP512/TMP513
internal digital multiplier) enables direct readout in
amps; an additional multiplication calculates power in
watts. The TMP512 and TMP513 both feature two
separate onboard watchdog capabilities: an over-limit
comparator and a lower-limit comparator.
These devices use a single +3V to +26V supply,
drawing a maximum of 1.4mA of supply current, and
they are specified for operation from –40°C to
+125°C.
1
2DLP is a registered trademark of Texas Instruments.
3SMBus is a trademark of Intel Corporation.
4All other trademarks are the property of their respective owners.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
TMP512/TMP513 product folder at www.ti.com.
(2) Product preview device.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
TMP512, TMP513UNIT
Supply Voltage, V+26V
Filter C
Analog Inputs, V
IN+
, V
IN–
Open-Drain Digital OutputsGND – 0.3 to +6V
GPIO, DXP, DXNGND – 0.3 to V+ + 0.3V
Input Current Into Any Pin5mA
Open-Drain Digital Output Current10mA
Storage Temperature–65 to +150°C
Junction Temperature+150°C
ESD RatingsCharged-Device Model (CDM)1000V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) V
IN+
+26V.
and V
may have a differential voltage of –26V to +26V; however, the voltage at these pins must not exceed the range –0.3V to
IN–
VoltageGND – 0.3 to +6V
Current10mA
Differential (V
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, yJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Boldface limits apply over the specified temperature range, TA= –40°C to +125°C.
At TA= +25°C, V+ = 12V, V
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
INPUT
Current Sense (Input) Voltage RangePGA = ÷ 10±40mV
Bus Voltage (Input Voltage) Range
Common-Mode RejectionCMRRV
Offset Voltage, RTI
vs Temperature0.2mV/°C
vs Power SupplyPSRR
Current Sense Gain Error±0.04%
vs Temperature0.0025%
Input ImpedanceActive Mode
V
IN+
V
IN–
Input LeakagePower-Down Mode
V
IN+
V
IN–
DC ACCURACY
ADC Basic Resolution12Bits
1 LSB Step Size
Shunt Voltage10mV
Bus Voltage4mV
Current Measurement Error±0.2±0.5%
over Temperature±1%
Bus Voltage Measurement Error±0.2±0.5%
over Temperature±1%
Differential Nonlinearity±0.1LSB
ADC TIMING
ADC Conversion Time12-Bit665733ms
(1) BRNG is bit 13 of Configuration Register 1.
(2) This parameter only expresses the full-scale range of the ADC scaling. In no event should more than 26V be applied to this device.
(3) Referred-to-input (RTI).
(4) See Subregulator section.
Boldface limits apply over the specified temperature range, TA= –40°C to +125°C.
At TA= +25°C, V+ = 12V, V
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
TEMPERATURE ERROR
Local Temperature SensorTE
Remote Temperature Sensor
vs Supply, LocalV+ = 3V to 5.5V, Configuration 3
vs Supply, Remote
TEMPERATURE MEASUREMENT
Conversion Time (per channel)100115130ms
Resolution
Local Temperature Sensor13Bits
Remote Temperature Sensor13Bits
Remote Sensor Source CurrentsSeries Resistance 3kΩ max
High120mA
Medium High60mA
Medium Low12mA
Low6mA
Default Non-Ideality FactornTMP512/12 Optimized Ideality Factor1.008
(5) Tested with one-shot measurements, and with less than 5Ω effective series resistance, and with 100pF differential input capacitance.
(6) See Subregulator section.
(7) SMBus timeout in the TMP512/13 resets the interface any time SCL or SDA is low for over 28ms.
1Filter CSubregulator output and filter capacitor pin.
2V+Positive supply voltage (3V to 26V) See Figure 20.
3V
4V
IN+
IN-
5SDASerial bus data line for SMBus, open-drain; requires pull-up resistor.
6SCLSerial bus clock line for SMBus, open-drain; requires pull-up resistor.
7A0Address pin
8DXP1Channel 1 positive connection to remote temperature sensor.
9DXN1Channel 1 negative connection to remote temperature sensor.
10DXP2Channel 2 positive connection to remote temperature sensor.
11DXN2Channel 2 negative connection to remote temperature sensor.
12GPIO
13ALERTOpen-drain SMBus alert output. Controlled in SMBus Alert Mask Register. Default state is disabled.
14GNDGround
Positive differential shunt voltage. Connect to positive side of shunt resistor.
Negative differential shunt voltage. Connect to negative side of shunt resistor. Bus voltage is measured
from this pin to ground.
General-purpose, user-programmable input/output. Totem-pole output. Connect to ground or supply
through a resistor if not used. Default state is as an input.
115Filter CSubregulator output and filter capacitor pin.
216V+Positive supply voltage (3V to 26V) See Figure 20.
31V
42V
53SDASerial bus data line for SMBus, open-drain; requires pull-up resistor.
64SCLSerial bus clock line for SMBus, open-drain; requires pull-up resistor.
75A0Address pin
86DXP1Channel 1 positive connection to remote temperature sensor.
97DXN1Channel 1 negative connection to remote temperature sensor.
108DXP2Channel 2 positive connection to remote temperature sensor.
119DXN2Channel 2 negative connection to remote temperature sensor.
1210DXP3Channel 3 positive connection to remote temperature sensor.
1311DXN3Channel 3 negative connection to remote temperature sensor.
1412GPIO
1513ALERT
1614GNDGround
RSA
IN+
IN-
Positive differential shunt voltage. Connect to positive side of shunt resistor.
Negative differential shunt voltage. Connect to negative side of shunt resistor. Bus voltage is
measured from this pin to ground.
General-purpose, user-programmable input/output. Totem-pole output. Connect to ground or
supply through a resistor if not used. Default state is as an input.
Open-drain SMBus alert output. Controlled in SMBus Alert Mask Register. Default state is
disabled.
should be less than 2200pF; see Filtering section.
DIFF
Figure 19.
Product Folder Link(s): TMP512 TMP513
Configuration 1Configuration 2Configuration 3
GND
ADC
Subregulator
3.3V
Subregulator
3.3V
V+ = 4.5V to 26V
Filter C
Load
470nF
Bus Voltage Range = 4.5V to 26V
Shunt
R
SHUNT
V
IN+
V
IN-
GND
ADC
V+ = 4.5V to 26V
Load
Filter C
470nF
Bus Voltage Range = 0V to 26V
Shunt
R
SHUNT
V
IN+
V
IN-
GND
ADC
Subregulator
3.3V
V+ = 3V to 5.5V
Load
Filter C
100nF
Bus Voltage Range = 0V to 26V
Shunt
R
SHUNT
V
IN+
V
IN-
TMP512
TMP513
www.ti.com
SBOS491 –JUNE 2010
APPLICATION INFORMATION
between the two systems is being addressed. Two
DESCRIPTION
The TMP512/13 are digital temperature sensors with
a digital current-shunt monitor that combine a local
die temperature measurement channel and remote
junction temperature measurement channels: two for
the TMP512 and three for the TMP513. The
TMP512/13 contain multiple registers for holdingThe subregulator can be configured to three different
configuration information, temperature, and voltagemodes of operation. Each mode has its advantage
measurement results. These devices provide digitalandlimitation.Figure20showsthethree
current, voltage, and power readings necessary forconfigurationarrangements.Theminimum
accuratedecision-makinginprecisely-controlledcapacitance on the Filter C pin for Configurations 1
systems.Programmableregistersallowflexibleand 2 is 470nF. The minimum capacitance on the
configuration for setting warning limits, measurementFilter C pin for Configuration 3 is 100nF.
resolution,andcontinuous-versus-triggered
operation. Detailed register information appears at
the end of this data sheet, beginning with Table 3.
For proper remote temperature sensing operation, theV+ supply range of 4.5V to 26V connected to the
TMP512 requires transistors connected betweenshunt voltage, the bus voltage range cannot go to
DXP1 and DXN1 and between DXP2 and DXN2, andzero and is limited to 4.5V to 26V.
for the TMP513, between DXP3 and DXN3 as well.
Unused channels on the TMP512/13 must be
connected to GND.
The TMP512/13 offer compatibility with two-wire andis not limited to 4.5V as in Configuration 1.
SMBusinterfaces.Thetwo-wireandSMBus
protocols are essentially compatible with each other.
Two-wire is used throughout this data sheet, with
SMBus being specified only when a difference
bi-directional lines, SCL and SDA, connect the
TMP512/13 to the bus. SDA is an open-drain
connection. See Figure 21 for a typical application
circuit.
SUBREGULATOR
Configuration 1 has V+ and V
supplies the subregulator, which in turn supplies the
3.3V to the Filter C pin and the internal die. With the
Configuration 2 has V+ to the subregulator without
any other connections. Under this configuration, the
bus voltage range can go from 0V to 26V, because it
Configuration 3 has the subregulator V+ and Filter C
pins shorted together. V+ is limited to 3V to 5.5V
because the Filter C pin supplies the internal die; it
cannot exceed this voltage range. The bus voltage
range can go from 0V to 26V, because it is not limited
to 4.5V as in Configuration 1.
SERIES RESISTANCE CANCELLATIONLocal Temperature Result Register and the Remote
Series resistance in an application circuit that typically
results from printed circuitboard (PCB) trace
resistance and remote line length is automatically
cancelled by the TMP512/13, preventing what would
otherwise result in a temperature offset. A total of up
to 3kΩ of series line resistance is cancelled by the
TMP512/13, eliminating the need for additional
characterization and temperature offset correction.
See the Remote Temperature Error vs SeriesResistance typical characteristic curves (Figure 15 )
for details on the effects of series resistance and
power-supply voltage on sensed remote temperature
error.
Temperature Result Registers. Note that byte 1 is the
most significant byte, followed by byte 2, the least
significant byte. The first 13 bits are used to indicate
temperature. The least significant byte does not have
to be read if that information is not needed. The data
format for temperature is summarized in Table 10.
One LSB equals 0.0625°C. Negative numbers are
represented in binary twos complement format.
Following power-uporreset,theTemperature
Register will read 0°C until the first conversion is
complete. Unused bits in the Temperature Register
always read '0'.
REGISTER INFORMATION
DIFFERENTIAL INPUT CAPACITANCEThe TMP512/13 contain multiple registers for holding
TheTMP512/13cantoleratedifferentialinput
capacitance of up to 2200pF with minimal change in
temperature error. The effect of capacitance on
sensed remote temperature error is illustrated in
Figure 16, Remote Temperature Error vs Differential
Capacitance. See the Filtering section for suggested
component values where filtering unwanted coupled
signals is needed.
configuration information, temperature and voltage
measurement results, and status information. These
registers are described in Table 3.
POINTER REGISTER
The 8-bit Pointer Register is used to address a given
data register. The Pointer Register identifies which of
the data registers should respond to a read or write
command on the two-wire bus. This register is set
TEMPERATURE MEASUREMENT DATAwith every write command. A write command must be
Temperature measurement data may be taken over
an operating range of –40°C to +125°C for both local
and remote locations.
The Temperature Register of the TMP512/13 is
configured as a 13-bit, read-only register that stores
the output of the most recent conversion. Two bytes
must be read to obtain data, and are described in the
issued to set the proper value in the Pointer Register
before executing a read command. Table 3 describes
the pointer address of the TMP512/13 registers. The
power-on reset (POR) value of the Pointer Register is
00h (0000 0000b).
n-FACTOR CORRECTION REGISTERtwos-complement format, yielding an effective data
The TMP512/13 allow for a different n-factor value to
beusedforconvertingremotechannel
measurements to temperature. The remote channel
uses sequential current excitation to extract a
differential VBEvoltage measurement to determine
the temperature of the remote transistor. Equation 1
describes this voltage and temperature.
(1)
The value n in Equation 1 is a characteristic of the
particular transistor used for the remote channel. The
power-on reset value for the TMP512/13 is n = 1.008.
The value in the n-Factor Correction Register may be
used to adjust the effective n-factor according to
Equation 2 and Equation 3.
(2)
(3)
Then-factorvaluemustbestoredinAcknowledge and pulling SDA LOW.
range from –128 to +127. The n-factor value may be
written to and read from pointer address 16h for
remote channel 1, pointer address 17h for remote
channel 2, and pointer address 18h for remote
channel 3. The register power-on reset value is 00h,
thus having no effect unless the register is written to.
BUS OVERVIEW
The device that initiates the transfer is called a
master, and the devices controlled by the master are
slaves. The bus must be controlled by a master
device that generates the serial clock (SCL), controls
the bus access, and generates START and STOP
conditions.
To address a specific device, the master initiates a
START condition by pulling the data signal line (SDA)
from a HIGH to a LOW logic level while SCL is HIGH.
All slaves on the bus shift in the slave address byte
on the rising edge of SCL, with the last bit indicating
whether a read or write operation is intended. During
the ninth clock pulse, the slave being addressed
respondstothemasterbygeneratingan
Data transfer is then initiated and eight bits of dataWRITING TO/READING FROM THE
are sent, followed by an Acknowledge bit. DuringTMP512/13
data transfer, SDA must remain stable while SCL is
HIGH. Any change in SDA while SCL is HIGH is
interpreted as a START or STOP condition.
Accessing a particular register on the TMP512/13 is
accomplished by writing the appropriate value to the
register pointer. Refer to Table 3 for a complete list of
Once all data have been transferred, the masterregisters and corresponding addresses. The value for
generates a STOP condition, indicated by pullingthe register pointer as shown in Figure 24 is the first
SDA from LOW to HIGH while SCL is HIGH. Thebyte transferred after the slave address byte with the
TMP512/13 includes a 28ms timeout on its interfaceR/W bitLOW.Every writeoperationto the
to prevent locking up an SMBus.TMP512/13 requires a value for the register pointer.
SERIAL BUS ADDRESS
To communicate with the TMP512/13, the master
must first address slave devices via a slave address
byte. The slave address byte consists of seven
address bits, and a direction bit indicating the intent
of executing a read or write operation.
The TMP512/13 feature an address pin to allow up to
four devices to be addressed on a single bus. Table 1
describes the pin logic levels used to properly
connect up to four devices. The state of the A0 pin is
sampled on every bus communication and should be
set before any activity on the interface occurs. The
addresspinisreadatthestartofeach
communication event.
Writing to a register begins with the first byte
transmitted by the master. This byte is the slave
address, with the R/W bit LOW. The TMP512/13 then
acknowledge receipt of a valid address. The next
byte transmitted by the master is the address of the
register to which data will be written. This register
address value updates the register pointer to the
desired register. The next two bytes are written to the
register addressed by the register pointer. The
TMP512/13 acknowledge receipt of each data byte.
Themastermayterminatedatatransferby
generating a START or STOP condition.
When reading from the TMP512/13, the last value
stored in the register pointer by a write operation
determines which register is read during a read
operation. To change the register pointer for a read
Table 1. TMP512/13 Address Pins and
operation, a new value must be written to the register
Slave Addressespointer. This write is accomplished by issuing a slave
DEVICE TWO-WIRE
ADDRESSA0 PIN CONNECTION
1011100Ground
1011101V+
1011110SDA
1011111SCL
address byte with the R/W bit LOW, followed by the
register pointer byte. No additional data are required.
The master then generates a START condition and
sends the slave address byte with the R/W bit HIGH
to initiate the read command. The next byte is
transmitted by the slave and is the most significant
byte of the register indicated by the register pointer.
This byte is followed by an Acknowledge from the
SERIAL INTERFACE
master; then the slave transmits the least significant
byte. The master acknowledges receipt of the data
The TMP512/13 operate only as slave devices on thebyte. The master may terminate data transfer by
two-wire bus and SMBus. SCL is an input only, andgenerating a Not-Acknowledge after receiving any
TMP512/13 cannot drive it. Connections to the busdata byte, or generating a START or STOP condition.
are made via the open-drain I/O lines SDA and SCL.If repeated reads from the same register are desired,
The SDA and SCL pins feature integrated spikeit is not necessary to continually send the register
suppression filters and Schmitt triggers to minimizepointer bytes; the TMP512/13 retain the register
the effects of input spikes and bus noise. Thepointer value until it is changed by the next write
TMP512/13 support the transmission protocol for fastoperation.
(1kHz to 400kHz) and high-speed (1kHz to 3.4MHz)
modes. All data bytes are transmitted MSB first.
Figure 22 and Figure 23 show read and write
operation timing diagrams, respectively. Note that
register bytes are sent most-significant byte first,
followed by the least significant byte. See Figure 25
TIMING DIAGRAMSData Transfer: The number of data bytes transferred
Figure 26 describes the timing operations on the
TMP512/13. Parameters for Figure 26 are defined in
Table 2. Bus definitions are:
Bus Idle: Both SDA and SCL lines remain high.
Start Data Transfer: A change in the state of the
SDA line, from high to low, while the SCL line is high,
defines a START condition. Each data transfer
initiates with a START condition. Denoted as S in
Figure 26.
Stop Data Transfer: A change in the state of the
SDA line from low to high while the SCL line is high
defines a STOP condition. Each data transfer
terminates witharepeatedSTARTorSTOP
condition. Denoted as P in Figure 26.
between a START and a STOP condition is not
limited and is determined by the master device. The
receiver acknowledges data transfer.
Acknowledge:Eachreceivingdevice,when
addressed, is obliged to generate an Acknowledge
bit. A device that acknowledges must pull down the
SDA line during the Acknowledge clock pulse in such
a way that the SDA line is stable low during the high
period of the Acknowledge clock pulse. Setup and
hold times must be taken into account. On a master
receive, data transfer termination can be signaled by
the master generating a Not-Acknowledge on the last
byte that has been transmitted by the slave.
Figure 26. Two-Wire Timing Diagram
Table 2. Timing Characteristics for Figure 26
FAST MODEHIGH-SPEED MODE
PARAMETERMINMAXMINMAXUNIT
SCL Operating Frequencyf
Bus Free Time Between STOP and START Conditiont
Hold time after repeated START condition. After this period, the first clock
is generated.
Repeated START Condition Setup Timet
STOP Condition Setup Timet
Data Hold Timet
Data Setup Timet
SCL Clock LOW Periodt
SCL Clock HIGH Periodt
Clock/Data Fall Timet
Clock/Data Rise Timet
for SCL ≤ 100kHzt
(SCL)
(BUF)
t
(HDSTA)
(SUSTA)
(SUSTO)
(HDDAT)
(SUDAT)
(LOW)
(HIGH)
(1) For cases with fall time of SCL less than 20ns and/or the rise or fall time of SDA less than 20ns, the hold time should be greater than
20ns.
(2) For cases with a fall time of SCL less than 10ns and/or the rise or fall time of SDA less than 10ns, the hold time should be greater than
In order for the two-wire bus to operate at frequenciesTheTMP512/13cansenseanopencircuit.
above 400kHz, the master device must issue aShort-circuit conditions return a value of –256°C. The
High-Speed mode (Hs-mode) master code (0000detection circuitry consists of a voltage comparator
1xxx) as the first byte after a START condition tothat trips when the voltage at DXP exceeds (V+) –
switchthebustohigh-speedoperation.The0.6V (typical). The comparator output is continuously
TMP512/13 do not acknowledge this byte, but switchchecked during a conversion. If a fault is detected,
the input filters on SDA and SCL and the output filterthe OPEN bit (bit 0) in the temperature result register
on SDA to operate in Hs-mode, allowing transfers atis set to '1' and the rest of the register bits should be
up to 3.4MHz. After the Hs-mode master code hasignored.
been issued, the master transmits a START condition
to a two-wire slave address that initiates a data
transfer operation. The bus continues to operate in
Hs-mode until a STOP condition occurs on the bus.
Upon receiving the STOP condition, the TMP512/13
switch the input and output filters back to Fast mode
operation.
POWER-UP CONDITIONS
Power-up conditions apply to a software reset via the
RST bit (bit 15) in the Configuration Register, or the
two-wire bus General Call Reset. At device power up,
all Status bits are masked, and the SMBus Alert
function is disabled. All watchdog outputs default to
active low and transparent (non-latched) modes.
SHUTDOWN MODE
The TMP512/13 shutdown mode of operation allows
the user flexibility to shut down the shunt/bus voltage
measurement and the temperature measurement
functions individually.TEMPERATURE AVERAGING
When not usingthe remotesensor with the
TMP512/13, the DXP and DXN inputs must be
connected together to prevent meaningless fault
warnings.
UNDERVOLTAGE LOCKOUT
The TMP512/13 sense when the power-supply
voltage has reached a minimum voltage level for the
ADC to function. The detection circuitry consists of a
voltage comparator that enables the ADC after the
power supply (V+) exceeds 2.7V (typical). The
comparator output is continuously checked during a
conversion. The TMP512/13 do not perform a
temperature conversion if the power supply is not
valid. The PVLD bit (see Status Register; Local
Temperature Reset Register; Remote Temperature
Reset 1, 2 and 3 Registers) of the individual
Local/Remote Temperature Result Registers are set
to '1' and the temperature result may be incorrect.
To shut down the shunt/bus voltage measurementThe TMP512/13 average the input diode voltages
function immediately, set bits 2 through 0 inthat determine the remote temperature by sampling
Configuration Register 1 (00h) to '000' respectively.multipletimesthroughoutaconversion.The
To shut down the shunt/bus voltage measurementtemperature result can be extracted from four
after the end of the current conversion, set bits 2different VBEreadings and is sampled 600 times in
through 0 in Configuration Resister 1 (00h) to '100'130ms (max). Each VBEvoltage is sampled 150 times
respectively.through integration capacitors that average the
To shut down the temperature measurement function
immediately, set bits 15 through 11 in Configuration
Register 2 (01h) to '00000' respectively. To shut
down the temperature measurement after the end of
the current conversion, set bit 15 in Configuration
Register 2 (01h) to '0'.
ONE-SHOT COMMAND
For the TMP512/13, when the temperature core is in
shutdown and the voltage core is in triggered mode, a
single conversion is started on all enabled channels
by writing a '1' to the OS bit in Configuration Register
1. This write operation starts one conversion; the
TMP512/13 returns to shutdown mode when that
conversion completes. At the end of the conversion,
the Conversion Ready flags (bit 6 and bit 5) in the
Status Register are set to indicate end of conversion.
results throughout the conversion time. A delta-sigma
(ΔΣ) modulator and digital filter integrate the V
voltages and create a sync filter averaging system. In
addition, a low-pass filter is present at the input of the
converter with a cutoff frequency of 65kHz. This
integrating topology offers superior noise immunity.
BE
FILTERING
Remote junction temperature sensors are usually
implemented in a noisy environment. Noise is
frequently generated by fast digital signals and if not
filtered properly will induce errors that can corrupt
temperature measurements. The TMP512/13 have a
built-in 65kHz filter on the inputs of DXP and DXN to
minimize the effects of noise. However, a bypass
capacitor placed differentially across the inputs of the
remote temperature sensor is recommended to make
theapplicationmorerobustagainstunwanted
coupled signals. The value of this capacitor should beWhere:
between 100pF and 1nF. Some applications attain
betteroverallaccuracywithadditionalseries
resistance; however, this increased accuracy is
application-specific. When series resistance is added,
the total value should not be greater than 3kΩ. If
filtering is needed, suggested component values are
100pF and 50Ω on each input; exact values are
application-specific.
n = ideality factor of remote temperature sensor.
T(°C) = actual temperature.
T
Degree delta is the same for °C and K.
For n = 1.004 and T(°C) = 100°C:
GENERAL CALL RESET
The TMP512/13 support reset via the two-wire
General Call address 00h (0000 0000b). The
TMP512/13 acknowledge the General Call address
and respond to the second byte. If the second byte is
06h (0000 0110b), the TMP512/13 execute a
software reset state to all TMP512/13 registers, and
abort any conversion in progress. The TMP512/13
take no action in response to other values in the
second byte.
REMOTE SENSING
The TMP512/13 are designed to be used with either
discrete transistors or substrate transistors built into
processor chips and ASICs. Either NPN or PNP
transistors can be used, as long as the base-emitter
junction is used as the remote temperature sense.
NPN transistors must be diode-connected. PNP
transistorscaneitherbetransistor-or
diode-connected, as Figure 18 and Figure 19 show.
Errors in remote temperature sensor readings are
typically the consequence of the ideality factor and
current excitation used by the TMP512/13 versus the
manufacturer-specified operating current for a given
transistor. Some manufacturers specify a high-level
and low-level current for the temperature-sensing
substrate transistors. The TMP512/13 use 6mA for
I
and 120mA for I
LOW
The ideality factor (n) is a measured characteristic of
a remote temperature sensor diode as compared to
an ideal diode. The TMP512/13 allow for different
n-factor values; see the n-Factor Correction Register
section.
The ideality factor for the TMP512/13 is trimmed to
be 1.008. For transistors that have an ideality factor
that does not match the TMP512/13, Equation 4 can
be used to calculate the temperature error. Note that
for the equation to be used correctly, actual
temperature (°C) must be converted to kelvins (K).
space
HIGH
.
(4)
If a discrete transistor is used as the remote
temperature sensor with the TMP512/13, the best
accuracy can be achieved by selecting the transistor
according to the following criteria:
1. Base-emitter voltage > 0.25V at 6mA, at the
highest sensed temperature.
2. Base-emitter voltage < 0.95V at 120mA, at the
lowest sensed temperature.
3. Base resistance < 100Ω.
4. Tight control of VBEcharacteristics indicated by
small variations in hFE(that is, 50 to 150).
Basedonthesecriteria,tworecommended
small-signal transistors are the 2N3904 (NPN) or
2N3906 (PNP).
BASIC ADC FUNCTIONS
The two analog inputs to the TMP512/13, V
V
, connect to a shunt resistor in the bus of interest.
IN–
TheTMP512/13arepoweredbyaninternal
subregulator, which has a typical output of 3.3V. The
bus being sensed can vary from 0V to 26V. There are
nospecialconsiderationsforpower-supply
sequencing (for example, a bus voltage can be
present with the supply voltage off, and vice-versa).
The TMP512/13 sense the small drop across the
shunt for shunt voltage, and sense the voltage with
respect to ground from V
Figure 27 for an illustration of this operation.
When the TMP512/13 are in the normal operating
mode (that is, MODE bits of Configuration Register 1
are set to '111'), the devices continuously convert the
shunt voltage up to the number set in the shunt
voltage averaging function (Configuration Register 1,
SADC bits). The devices then convert the bus voltage
up to the number set in the bus voltage averaging
(Configuration Register 1, BADC bits). The Mode
control in Configuration Register 1 also permits
selecting modes to convert only voltage or current,
either continuously or in response to a two-wire
command.
Figure 27. TMP512/13 Configured for Shunt and Bus Voltage Measurement
All current and power calculations are performed in
the background and do not contribute to conversion
time; conversion times shown in the Electrical
Characteristics table can be used to determine the
actual conversion time.
Power-Down mode reduces the quiescent current
and turns off current into the TMP512/13 inputs,
avoiding any supply drain. Full recovery from
Power-Down requires 40ms. ADC Off mode (set by
Configuration Register 1, MODE bits) stops all
conversions.
Although the TMP512/13 can be read at any time,
and the data from the last conversion remain
available,theConversionReadybit andthe
Conversion Ready Temperature bit (Status Register,
CVR and CRT) are provided to help co-ordinate
one-shot or triggered conversions. The Conversion
Ready bit and the Conversion Ready Temperature bit
aresetafterallconversions,averaging,and
multiplication operations are complete.
The Conversion Ready bit and the Conversion Ready
Temperature bit clear when reading the Status
Register or triggering a single-shot conversion.
POWER MEASUREMENT
Current and bus voltage are converted at different
points in time, depending on the resolution and
averagingmodesettings.Forinstance,when
configured for 12-bit and 128 sample averaging, up to
81ms in time between sampling these two values is
possible. Again, these calculations are performed in
the background and do not add to the overall
conversion time.
PGA FUNCTION
If larger full-scale shunt voltages are desired, the
TMP512/13 provide a PGA function that increases
the full-scale range up to 2, 4, or 8 times (320mV).
Additionally, the bus voltage measurement has two
full-scale ranges: 16V or 32V.
COMPATIBILITY WITH TI HOT-SWAPThis architecture has good inherent noise rejection;
CONTROLLERShowever, transients that occur at or very close to the
The TMP512/13 are designed for compatibility with
hot-swap controllers such the TI TPS2490. The
TPS2490 uses a high-side shunt with a limit at 50mV;
the TMP512/13 full-scale range of 40mV enables the
use of the same shunt for current sensing below this
limit. When sensing is required at (or through) the
50mV sense point of the TPS2490, the PGA of the
TMP512/13 can be set to ÷2 to provide an 80mV
full-scale range.Overload conditions are another consideration for the
FILTERING AND INPUT CONSIDERATIONS
Measuring current is often noisy, and such noise can
be difficult to define. The TMP512/13 offer several
options for filtering by choosing resolution and
averaging in Configuration Register 1. These filtering
options can be set independently for either voltage or
current measurement.
The internal ADC is based on a delta-sigma (ΔΣ)
front-end with a 500kHz (±10%) typical sampling rate.
sampling rate harmonicscan causeproblems.
Because these signals are at 1MHz and higher, they
can be dealt with by incorporating filtering at the input
of the TMP512/13. The high frequency enables the
use of low-value series resistors on the filter for
negligibleeffectsonmeasurementaccuracy.
Figure 28 shows the TMP512/13 with an additional
filter added at the input.
TMP512/13 inputs. The TMP512/13 inputs are
specified to tolerate 26V across the inputs. A large
differential scenario might be a short to ground on the
load side of the shunt. This type of event can result in
full power-supply voltage across the shunt (as long
the power supply or energy storage capacitors
support it). It must be remembered that removing a
short to ground can result in inductive kickbacks that
could exceed the 26V differential and common-mode
rating of the TMP512/13. Inductive kickback voltages
are best dealt with by zener-type transient-absorbing
devices (commonly called transzorbs) combined with
sufficient energy storage capacitance.
In applications that do not have large energy storagenot generate an Acknowledge and continues to hold
electrolytics on one or both sides of the shunt, anthe ALERT line low until the interrupt is cleared.
input overstress condition may result from anSuccessful completion of the read alert response
excessive dV/dt of the voltage applied to the input. Aprotocol clears the SMBus ALERT pin, provided that
hard physical short is the most likely cause of thisthe condition causing the alert no longer exists. The
event, particularly in applications with no largeSMBus Alert flag is cleared separately by either
electrolytics present. This problem occurs because anreading the Status Register or by disabling the
excessive dV/dt can activate the ESD protection inSMBus Alert function.
the TMP512/13 in systems where large currents are
available. Testing has demonstrated that the addition
of 10Ω resistors in series with each input of the
TMP512/13 sufficiently protects the inputs against
dV/dt failure up to the 26V rating of the TMP512/13.
These resistorshavenosignificanteffecton
accuracy.
SMBus ALERT RESPONSE
The SMBus alert response functions only when the
Alert pin is active and in latch mode (03h, bit 0 = 1);
see Figure 24. The ALERT interrupt output signal is
latched and can be cleared only by either reading the
Status Register or by successfully responding to an
alert response address. If the fault is still present, the
ALERT pin re-asserts. Asserting the ALERT pin does
not halt automatic conversions that are already in
progress. The ALERT output pin is open-drain,
allowing multiple devices to share a common interrupt
line.
The TMP512/13respondto theSMBusalert
response address, an interrupt pointer return-address
feature. The SMBus alert response interrupt pointer
provides quick fault identification for simple slave
devices. When an ALERT occurs, the master can
broadcast the alert response slave address (0001
100). Following this alert response, any slave devices
that generated interrupts identify themselves by
putting the respective addresses on the bus.
The alert response can activate several different
The Status Register flags indicate which (if any) of
the watchdogs have been activated. After power-on
reset (POR), the normal state of all flag bits is '0',
assuming that no alarm conditions exist.
EXTERNAL CIRCUITRY FOR ADDITIONAL
V
INPUT
BUS
The TMP512/13 GPIO can be used to control an
external circuit to switch the V
alternate location. Switching is most often done to
perform bus voltage measurements on the opposite
side of a MOSFET switch in series with the shunt
resistor.
Consideration must be given to the typical 20mA input
current of each TMP512/13 input, along with the
320kΩ impedance present at the V
bus voltage is measured. These effects can create
errors throughthe resistanceof anyexternal
switching method used. The easiest way to avoid
these errors is by reducing this resistance to a
minimum; select switching MOSFETs with the lowest
possible R
DS(on)
values.
The circuit shown in Figure 29 uses MOSFET pairs to
reduce package count. Back-to-back MOSFETs must
be used in each leg because of the built-in back
diodes from source-to-drain. In this circuit, the normal
connection for V
is at the shunt, with the optional
IN–
voltage measurement at the output of the control
FET.
measurement to an
BUS
input where the
IN–
slave devices simultaneously, similar to the two-wire
General Call. If more than one slave attempts to
respond, bus arbitration rules apply; the device with
the lower address code wins. The losing device does
PROGRAMMING THE TMP512/13 POWER MEASUREMENT ENGINE
Calibration Register and Scaling
The Calibration Register makes it possible to set the scaling of the Current and Power Registers to whatever
values are most useful for a given application. One strategy may be to set the Calibration Register such that the
largest possible number is generated in the Current Register or Power Register at the expected full-scale point;
this approach yields the highest resolution. The Calibration Register can also be selected to provide values in the
Current and Power Registers that either provide direct decimal equivalents of the values being measured, or
yield a round LSB number. After these choices have been made, the Calibration Register also offers possibilities
for end user system-level calibration, where the value is adjusted slightly to cancel total system error.
This section presents two examples for configuring the TMP512/13 calibration. Both examples are written so the
information relates directly to the calibration setup found in the TMP512/13EVM software.
Calibration Example 1: Calibrating the TMP512/13 with no possibility for overflow.
NOTE
The numbers used in this example are the same used with the TMP512/13EVM software
as shown in Figure 30.
1. Establish the following parameters:
V
BUS_MAX
V
SHUNT_MAX
R
SHUNT
2. Use Equation 6 to determine the maximum possible current .
= 32
= 0.32
= 0.5
(6)
3. Choose the desired maximum current value. This value is selected based on system expectations.
Max_Expected_I = 0.6
4. Calculate the possible range of current LSBs. To calculate this range, first compute a range of LSBs that is
appropriate for the design. Next, select an LSB within this range. Note that the results will have the most
resolution when the minimum LSB is selected. Typically, an LSB is selected to be the nearest round number
to the minimum LSB value.
(7)
(8)
Choose an LSB in the range: Minimum_LSB < Selected_LSB < Maximum_LSB
Current_LSB = 20 × 10
–6
Note:
This value was selected to be a round number near the Minimum_LSB. This selection allows for
good resolution with a rounded LSB.
5. Compute the Calibration Register value using Equation 9:
6. Calculate the Power LSB with Equation 10. Equation 10 shows a general formula; because the bus voltage
measurement LSB is always 4mV, the power formula reduces to the calculated result.
(10)
7. Compute the maximum current and shunt voltage values (before overflow), as shown by Equation 11 and
Equation 12. Note that both Equation 11 and Equation 12 involve an If - then condition:
(11)
If Max_Current ≥ MaxPossible_I then
Max_Current_Before_Overflow = MaxPossible_I
Else
Max_Current_Before_Overflow = Max_Current
End If
(Note that Max_Current is greater than MaxPossible_I in this example.)
Max_Current_Before_Overflow = 0.64
(12)
If Max_ShuntVoltage ≥ V
Max_ShuntVoltage_Before_Overflow = V
SHUNT_MAX
SHUNT_MAX
Else
Max_ShuntVoltage_Before_Overflow= Max_ShuntVoltage
End If
(Note that Max_ShuntVoltage is greater than V
SHUNT_MAX
in this example.)
Max_ShuntVoltage_Before_Overflow = 0.32
8. Compute the maximum power with Equation 13.
9. (Optional second Calibration step.) Compute corrected full-scale calibration value based on measured
current.
TMP513_Current = 0.63484
MeaShuntCurrent = 0.55
Figure 30 illustrates how to perform the same procedure discussed in this example using the automated
TMP512/13EVM software. Note that the same numbers used in this nine-step example are used in the software
example. Note also that Figure 30 illustrates which results correspond to which step (for example, the information
entered in Step 1 is enclosed in a box in Figure 30 and labeled).
This design example uses the nine-step procedure for calibrating the TMP512/13 where overflow is possible.
Figure 31 illustrates how the same procedure is performed using the automated TMP512/13EVN software. The
same numbers used in the nine-step example are used in the software example shown in Figure 31. Note also
that Figure 31 illustrates which results correspond to which step (for example, the information entered in Step 1
is circled in Figure 31 and labeled).
1. Establish the following parameters:
V
BUS_MAX
V
SHUNT_MAX
R
SHUNT
2. Determine the maximum possible current using Equation 15:
3. Choose the desired maximum current value: Max_Expected_I, ≤ MaxPossible_I. This value is selected
based on system expectations.
Max_Expected_I = 0.06
4. Calculate the possible range of current LSBs. This calculation is done by first computing a range of LSB's
that is appropriate for the design. Next, select an LSB withing this range. Note that the results will have the
most resolution when the minimum LSB is selected. Typically, an LSB is selected to be the nearest round
number to the minimum LSB.
= 32
= 0.32
= 5
(15)
(16)
(17)
Choose an LSB in the range: Minimum_LSB < Selected_LSB < Maximum_LSB
Current_LSB = 1.9 × 10
–6
Note:
This value was selected to be a round number near the Minimum_LSB. This section allows for good
resolution with a rounded LSB.
5. Compute the calibration register using Equation 18:
(18)
6. Calculate the Power LSB using Equation 19. Equation 19 shows a general formula; because the bus voltage
measurement LSB is always 4mV, the power formula reduces to calculate the result.
7. Compute the maximum current and shunt voltage values (before overflow), as shown by Equation 20 and
Equation 21. Note that both Equation 20 and Equation 21 involve an If - then condition.
(20)
If Max_Current ≥ MaxPossible_I then
Max_Current_Before_Overflow = MaxPossible_I
Else
Max_Current_Before_Overflow = Max_Current
End If
(Note that Max_Current is less than MaxPossible_I in this example.)
Max_Current_Before_Overflow = 0.06226
(21)
If Max_ShuntVoltage ≥ V
Max_ShuntVoltage_Before_Overflow = V
SHUNT_MAX
SHUNT_MAX
Else
Max_ShuntVoltage_Before_Overflow= Max_ShuntVoltage
End If
(Note that Max_ShuntVoltage is less than V
SHUNT_MAX
in this example.)
Max_ShuntVoltage_Before_Overflow = 0.3113
8. Compute the maximum power with Equation 22.
(22)
9. (Optional second calibration step.) Compute the corrected full-scale calibration value based on measured
current.
The TMP512/13 uses a bank of registers for holdingthe write command. Therefore, a 4ms delay is
configurationsettings,measurementresults,required between the completion of a write to a given
maximum/minimum limits, and status information.register and a subsequent read of that register
Table 3 summarizes the TMP512/13 registers.(without changing the pointer) when using SCL
Register contents are updated 4ms after completion offrequencies in excess of 1MHz.
01Channels enable, Local Channel enable, resistance correction1011111110000x00BF80/BF84R/W
01Channels enable, Local Channel enable, resistance correction11111111 10000x00FF80/FF84R/W
02Status RegisterContains the alert and conversion ready flags.00000000 000000000000R
03Contains masks to enable/disable the alert functions.00000000 000000000000R/W
04Shunt Voltage ResultShunt voltage measurement result.00000000 000000000000R
05Bus Voltage ResultBus voltage measurement result.00000000 000000000000R
06Power ResultPower measurement result.00000000 000000000000R
07Shunt Current Result
08Local Temperature Result Contains local temperature measurement result.00000000 000000000000R
09Contains remote temperature measurement result.00000000 000000000000R
0AContains remote temperature measurement result.00000000 000000000000R
0B
0CContains the positive limit for Shunt Voltage.00000000 000000000000R/W
0DContains the negative limit for Shunt Voltage.00000000 000000000000R/W
0EBus Voltage Positive Limit Contains the positive limit for Bus Voltage.00000000000000000000R/W
0FBus Voltage Negative Limit Contains the negative limit for Bus Voltage.00000000 000000000000R/W
10Power LimitContains the positive limit for Power.00000000 000000000000R/W
11Local Temperature LimitContains positive limit for local temperature.00101010 100000002A80R/W
Configuration Register 2
Configuration Register 2
SMBus Alert Mask/Enable
Control Register
Remote Temperature
Remote Temperature
(3)
Remote Temperature
Shunt Voltage Positive
Shunt Voltage Negative
TMP512
TMP513
Result 1
Result 2
Result 3
Limit
Limit
All-register reset, settings for bus voltage range, PGA Gain, Bus
one-shot, Operation Mode.
Settings for Temperature Continuous conversion, Remote
enable, Conversion rate bits, and GPIO mode bit and readback.
Settings for Temperature Continuous conversion, Remote
enable, Conversion rate bits, and GPIO mode bit and readback.
Contains the value of the current flowing through the shunt
(2)
resistor.
Contains remote temperature measurement result.00000000 000000000000R
00000000 000000000000R
(1) Type: R = Read-Only, R/W = Read/Write.
(2) Current Register defaults to '0' because the Calibration Register defaults to '0', yielding a zero current value until the Calibration Register
Bits 10–7These bits adjust the Bus ADC resolution (9-, 10-, 11-, or 12-bit) or set the number of samples used when
averaging results for the Bus Voltage Register (05h).
SADC:SADC Shunt ADC Resolution/Averaging
Bits 6–3These bits adjust the Shunt ADC resolution (9-, 10-, 11-, or 12-bit) or set the number of samples used when
averaging results for the Shunt Voltage Register (04h).
BADC (Bus) and SADC (Shunt) ADC resolution/averaging and conversion time settings are shown in Table 5.
(1) Shaded values are default.
(2) X = Don't care.
www.ti.com
MODE:Operating Mode
Bits 2–0Selects continuous, triggered, or power-down mode of operation. These bits default to continuous shunt and bus
measurement mode. The mode settings are shown in Table 6.
Table 6. Mode Settings
MODE3MODE2MODE1MODE
000Power-Down
001Shunt Voltage, Triggered
010Bus Voltage, Triggered
011Shunt and Bus, Triggered
100ADC Off (disabled)
101Shunt Voltage, Continuous
110Bus Voltage, Continuous
111Shunt and Bus, Continuous
(1)
(2)
(3)
(3)
(3)
(4)
(1) Shaded values are default.
(2) Combination '000' stops converter immediately.
(3) In triggered modes the converter goes to power down. It can be triggered by a write of '1' to bit 14
(One-Shot) in Configuration Register 1 or by the delay scheme of the temperature sensor core. See
Table 7.
(4) Combination '100' stops the converter at conversion end.
Bit 150: When all bits 14 to 11 are '0', the temp sensor core goes immediately to shutdown mode. When all bits 14 to 11
REN3:Remote Channel 3 Enable (TMP513 only)
Bit 140: Remote channel 3 disabled.
REN2:Remote Channel 2 Enable
Bit 130: Remote channel 2 disabled.
REN1:Remote Channel 1 Enable
Bit 120: Remote channel 1 disabled.
LEN:Local Temperature Enable
Bit 110: Local temperature disabled.
RC:Resistance Correction
Bit 100: Resistance correction disabled.
R2, R1, R0:Conversion Rate
Bits 9-7These bits set the conversion rate as shown in Table 7.
CONTREN3REN2REN1LENRCR2R1R0————GPGPM1GPM0
are not '0', the temp sensor core stops when all enabled conversions are done. When this bit is '0', a one-shot
command can be triggered by writing a "1" to bit 14 of Configuration Register 1.
1: Continuous temperature conversion mode.
When all of the following conditions are met, the temperature sensor core triggers a single conversion of the
voltage measurement core at the same rate as the conversion rate shown by bits R2 to R0.
•The conversion rate is different than '111';
•There is at least one enabled temperature channel; and
•The voltage measurement core is in triggered mode of operation.
The temperature sensor core triggers a single conversion of the ADC core at the same rate as the conversion
rate shown by R2 to R0.
GP:GPIO Read-Back
Bit 2Shows the state of the GPIO pin.
GPM:GPIO Mode
Bits 1-0The GPIO mode settings are shown in Table 8. GPIO should not be left floating at start-up.
Table 8. GPIO Mode Settings
GPM[1]GPM[0]GPIO PINDESCRIPTION
00Hi-Z
01Hi-Z
100Use to output 0 to GPIO pin
111Use to output 1 to GPIO pin
The Status Register flags activate whenever any limit is violated, and latch if the alert is in latch mode. In latch
mode, these flags are cleared when the Status Register is read (if the limit is exceeded, then at next conversion
end, the flag sets again). In transparent mode, these flags are cleared when any corresponding limit is not
violated any longer.
After power-up and initial setup, the Status Register should be read once to clear any flags set as a result of
power-up values prior to setup.
Bit Descriptions
SHP:Shunt Positive Over-Voltage
Bit 15This bit is set to '1' when the result in the Shunt Voltage Register (04h) exceeds the level set in the Shunt Positive
SHN:Shunt Negative Under-Voltage
Bit 14This bit is set to '1' when the result in the Shunt Voltage Register (04h) goes below the level set in the Shunt
BVP:Bus Positive Over-Voltage
Bit 13This bit is set to '1' when the result in the Bus Voltage Register (05h) exceeds the level set in the Bus Voltage
BVN:Bus Negative Under-Voltage
Bit 12This bit is set to '1' when the result in the Bus Voltage Register (05h) goes below the level set in the Bus Voltage
PWR:Power Over–Limit
Bit 11This bit is set to '1' when the result in the Power Register (06h) exceeds the level set in the Power Limit Register
LCL:Local Temperature Over-Limit
Bit 10This bit is set to '1' when the result in the Local Temperature Result Register (08h) exceeds the level set in the
RM1:Remote Temperature 1 Over-Limit
Bit 9This bit is set to '1' when the result in the Remote Temperature Result 1 Register (09h) exceeds the level set in the
RM2:Remote Temperature 2 Over-Limit
Bit 8This bit is set to '1' when the result in the Remote Temperature Result 2 Register (0Ah) exceeds the level set in the
Limit Register (0Ch).
Negative Limit Register (0Dh).
Positive Limit Register (0Eh).
Negative Limit Register (0Fh).
(10h).
Local Temperature Limit Register (11h) plus half of the temperature hysteresis. It clears in transparent mode when
the result in the Local Temperature Result Register (08h) is below the level set in the Local Temperature Limit
Register (11h) minus half of the temperature hysteresis.
Remote Temperature Limit 1 Register (12h) plus half of the temperature hysteresis. It also sets if, during conversion
of remote channel 1, an open diode condition was detected. It clears in transparent mode when the result in the
Remote Temperature Result 1 Register (09h) is below the level set in the Remote Temperature Limit 1 Register
(12h) minus half of the temperature hysteresis, and the last conversion of channel 1 was done without open-diode
detection.
Remote Temperature Limit 2 Register (13h) plus half of the temperature hysteresis. It also sets if, during conversion
of remote channel 2, an open diode condition was detected. It clears in transparent mode when the result in the
Remote Temperature Result 2 Register (0Ah) is below the level set in the Remote Temperature Limit 2 Register
(13h) minus half of the temperature hysteresis, and the last conversion of channel 2 was done without open-diode
detection.
Bit 7This bit is set to '1' when the result in the Remote Temperature Result 3 Register (0Bh) exceeds the level set in the
CVR:Conversion Ready
Bit 6The Conversion Ready line is provided to help coordinate one-shot conversions for shunt voltage, bus voltage,
CRT:Conversion Ready Temperature
Bit 5The Conversion Ready Temperature line is provided to help coordinate one-shot conversions for local and remote
PVLD:Power Valid Error
Bit 4In latch mode, this bit is set to '1' when the brown-out detect fires during a conversion. The flag sets to '1' at the
SMBA:SMBus Alert
Bit 3This bit is set when the Alert pin is active. When in latch mode, it clears only on reading the Status Register,
OVF:Math Overflow
Bit 2This bit is set to '1' if an arithmetic operation resulted in an overflow error. It indicates that current and power data
Remote Temperature Limit 3 Register (14h) plus half of the temperature hysteresis. It sets also if during conversion
of remote channel 3 an open diode condition was detected. It clears in transparent mode when the result in the
Remote Temperature Result 3Register (0Bh) is below the level set in the Remote Temperature Limit 3 Register
(14h) minus half of the temperature hysteresis and the last conversion of channel 3 was done without open-diode
detection.
current and power measurements. The Conversion bit is set after all conversions, averaging, and multiplication
events are complete. Conversion Ready clears under the following conditions:
1. Writing to the One-Shot bit in Configuration Register 1.
2. Reading the Status Register.
temperature measurements. The Conversion bit is set after all enabled channels complete the respective
conversions. Conversion Ready Temperature clears under the following conditions:
1. Writing to the One-Shot bit in Configuration Register 1.
2. Reading the Status Register.
conversion end. It clears by reading the Status Register.
disabling the SMBus Alert function, or using SMBus Alert Response. In transparent mode, it clears when the
triggering condition is not present.
may be meaningless. It does not set the Alert pin.
Bits D4–D15 of the SMBus Alert Register mask correspond to bits D4 to D15 of the Status Register to prevent
them from initiating an SMBus Alert. It does not prevent the Status Register bit from setting. Writing a '0' to an
SMBus Alert Mask bit masks it from activating the SMBus Alert. All default values are '0'.
Bit Descriptions
SHPM:Shunt Positive Over-Voltage Mask
Bit 150: SHP flag in Status Register cannot activate Alert pin.
1: SHP flag (when set to '1') in Status Register activates Alert pin.
SHNM:Shunt Negative Under-Voltage Mask
Bit 140: SHN flag in Status Register cannot activate Alert pin.
1: SHN flag (when set to '1') in Status Register activates Alert pin.
BVPM:Bus Voltage Positive Over-Voltage Mask
Bit 130: BVP flag in Status Register cannot activate Alert pin.
1: BVP flag (when set to '1') in Status Register activates Alert pin.
BVNM:Bus Voltage Negative Under-Voltage Mask
Bit 120: BVN flag in Status Register cannot activate Alert pin.
1: BVN flag (when set to '1') in Status Register activates Alert pin.
PWRM:Power Over-Limit Mask
Bit 110: PWR flag in Status Register cannot activate Alert pin.
1: PWR flag (when set to '1') in Status Register activates Alert pin.
LCLM:Local Temperature Over-Limit Mask
Bit 100: LCL flag in Status Register cannot activate Alert pin.
1: LCL flag (when set to '1') in Status Register activates Alert pin.
R1M:Remote Temperature1 Over-Limit Mask
Bit 90: RM1 flag in Status Register cannot activate Alert pin.
1: RM1 flag (when set to '1') in Status Register activates Alert pin.
R2M:Remote Temperature2 Over-Limit Mask
Bit 80: RM2 flag in Status Register cannot activate Alert pin.
1: RM2 flag (when set to '1') in Status Register activates Alert pin.
The Fault Count Control Bits affect flags in SMBus Alert Register bits D15-D7.
Bit 3, 200: These flags are activated after the first conversion result with a violated limit.
01: These flags are activated after the second consecutive conversion result with a violated limit.
10: These flags are activated after the fourth consecutive conversion result with a violated limit.
11: These flags are activated after the eighth consecutive conversion result with a violated limit.
POL:Alert Polarity
Bit 10: Alert pin is active low.
1: Alert pin is active high.
LATCH:Alert Mode of Operation
Bit 00: Alert pin works in transparent mode. The SMB alert response function does not function. Alert is deasserted
when the triggering condition goes away.
1: Alert pin works in latch mode. The SMB alert response function functions when Alert pin is active. Alert will
remain asserted even if the triggering condition goes away. Alert can be deasserted by reading the Status register
(02h), using the SMBus Alert response function, resetting the part, or by disabling the alert function using the mask
bits.
The Shunt Voltage Register stores the current shunt voltage reading, V
. Shunt Voltage Register bits are
SHUNT
shifted according to the PGA setting selected in Configuration Register 1 (00h). When multiple sign bits are
present, they will all be the same value. Negative numbers are represented in twos complement format.
Generate the twos complement of a negative number by complementing the absolute value binary number and
adding 1. Extend the sign, denoting a negative number by setting the MSB = '1'. Extend the sign to any
additional sign bits to form the 16-bit word.
Example: For a value of V
SHUNT
= –320mV:
1. Take the absolute value (include accuracy to 0.01mV)==> 320.00
2. Translate this number to a whole decimal number ==> 32000
3. Convert it to binary==> 111 1101 0000 0000
4. Complement the binary result : 000 0010 1111 1111
5. Add 1 to the Complement to create the twos complement formatted result ==> 000 0011 0000 0000
6. Extend the sign and create the 16-bit word: 1000 0011 0000 0000 = 8300h (Remember to extend the sign to
all sign-bits, as necessary based on the PGA setting.)
At PGA = ÷8, full-scale range = ±320mV (decimal = 32000, positive value hex = 7D00, negative value hex =
The value of the Current Register is calculated by multiplying the value in the Shunt Voltage Register with the
value in the Calibration Register according to the equation:
For positive temperatures (for example, +50°C):
Twos complement is not performed on positive numbers. Therefore, simply convert the number to binary code
with the 13-bit, left-justified format, and MSB = 0 to denote a positive sign.
Example: (+50°C)/(0.0625°C/count) = 800 = 320h = 0011 0010 0000
For negative temperatures (for example, –25°C):
Generate the twos complement of a negative number by complementing the absolute value binary number and
Local Temperature Limit Register 11h, Remote Temperature Limit 1 Register 12h, Remote Temperature
Limit 2 Register 13h, Remote Temperature Limit 3 Register 14h (TMP513 Only) (Read/Write)
BIT #D15D14D13D12D11D10D9D8D7D6D5D4D3D2D1D0
BIT
NAME
POR
VALUE
TH12TH11TH10TH9TH8TH7TH6TH5TH4TH3TH2TH1TH0———
0010101010000000
The data format is 13 bits.
TH12–TH0:Temperature Limit
Bits 15-3Shows the temperature limit.
Shunt Calibration Register 15h (Read/Write)
Current and power calibration are set in the Calibration Register. Note that bit D0 is not used in the calculation.
This register sets the current that corresponds to a full-scale drop across the shunt. Full-scale range and the LSB
of the current and power measurement depend on the value entered in this register. See the Programming the
TMP512/13 Power Measurement Engine section. This register is suitable for use in overall system calibration.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Status
(1)
Package Type Package
Drawing
PinsPackage Qty
Eco Plan
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
(2)
Lead/
Ball Finish
CU NIPDAU Level-2-260C-1 YEARPurchase Samples
CU NIPDAU Level-2-260C-1 YEARRequest Free Samples
CU NIPDAU Level-2-260C-1 YEARPurchase Samples
CU NIPDAU Level-2-260C-1 YEARRequest Free Samples
MSL Peak Temp
(3)
Samples
(Requires Login)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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