TEXAS INSTRUMENTS TMP141 Technical data

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments

查询TMP141供应商

TMP141

SBAS347 − MARCH 2005

Digital Out Temperature Sensor with

Single-Wire SensorPath Bus

FEATURES

D SensorPath INTERFACE
D FOUR ADDRESSES
D RESOLUTION: +0.25°C (10-bit)
D WIDE TEMPERATURE RANGE:

−40°C to +125°C

D LOW QUIESCENT CURRENT: 110µA (typ)
D TEMPERATURE ACCURACY: ±2°C (max)
D EXTENDED SUPPLY RANGE: +2.7V to +5.5V
D MICRO-SIZE PACKAGES:

SOT23-6 or MSOP-8

APPLICATIONS

D MOTHERBOARDS
D VIDEO CARDS
D BASE STATIONS
D ROUTERS

Temperature

DESCRIPTION

The TMP141 is a digital output temperature sensor that
utilizes the single-wire SensorPath interface. The TMP141
is capable of measuring temperatures within 2°C of
accuracy over a temperature range of −25°C to +85°C and
3°C of accuracy over −40°C to +125°C. Low supply
current, and a supply range from 2.7V to 5.5V, make the
TMP141 an excellent candidate for a wide range of
low-power applications. The TMP141 is available in
SOT23-6 and MSOP-8 packages.

The TMP141 provides a simple, low-cost way to do
temperature measurement/monitoring and is ideal as a
part of an overall hardware health monitoring system. Up
to four TMP141s can be attached to a SensorPath bus. A
master configures the TMP141s and reads the
temperature output from all devices. No external sensing
components are needed for the TMP141 to measure and
report temperature.

Diode
Temp.

Sensor

V+

GND

semiconductor products and disclaimers thereto appears at the end of this data sheet.

SensorPath is a trademark of National Semiconductor. All other trademarks are the property of their respective owners.

         
          
 !     !   

∆Σ

A/D

Converter

OSC

TMP141

www.ti.com

Control

Logic

Serial

Interface

Config.

and Temp.

Register

ADD0

ADD1

SWD

Copyright  2005, Texas Instruments Incorporated

"#$#

TMP141

SOT23-6

DBV

−40°C to +125°C

T141

TMP141

MSOP-8

DGK

−40°C to +125°C

T14G

SBAS347 − MARCH 2005

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1)

Supply Voltage +7V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Signal Input Terminals, Voltage
Signal Input Terminals, Current

(2)

(V−) −0.5V to (V+) + 0.5V. . . .

(2)

10mA. . . . . . . . . . . . . . . . . . . . .

Maximum Output Current (SWD low) 10mA. . . . . . . . . . . . . . . . . . .

Operating Temperature −55°C to +127°C. . . . . . . . . . . . . . . . . . . . .

Storage Temperature −60°C to +150°C. . . . . . . . . . . . . . . . . . . . . . .

proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more
susceptible t o damage because very small parametric changes could
cause the device not to meet its published specifications.

This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe

Junction Temperature +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead Temperature (infrared 15s, vapor 60s) +300°C. . . . . . . . . . . .

ESD Rating:

Human Body Model (HBM) 4000V. . . . . . . . . . . . . . . . . . . . . . .

Charged-Device Model 1000V. . . . . . . . . . . . . . . . . . . . . . . . . .

(1)

Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only , an d
functional operation of the device at these or any other conditions
beyond those specified is not supported.

(2)

Input terminals should not be driven beyond the power-supply
rails. Input signals that can swing more than 0.5V beyond the
supply rails should be current-limited to 10mA or less.

ORDERING INFORMATION

PRODUCT PACKAGE-LEAD

(1)

PACKAGE

DESIGNATOR

SPECIFIED

TEMPERATURE

RANGE

PACKAGE

MARKING

ORDERING

NUMBER

TRANSPORT

MEDIA, QUANTITY

TMP141AIDBVT Tape and Reel, 250
TMP141AIDBVR Tape and Reel, 3000
TMP141AIDGKT Tape and Reel, 250
TMP141AIDGKR Tape and Reel, 3000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www .ti.com.

PIN CONFIGURATIONS

Top View

1

ADD0

2

GND

(1)

3

NC

NOTE: Pin 1 is determined by orienting the package marking as indicated in the diagram.
(1) NC = no connection. NC pins must be tied to ground.

2

T141

SOT23−6

1

6

ADD1

5

SWD

4

V+

NC
NC
NC

V+

(1)

(1)

(1)

T14G

2
3
4

MSOP−8

8

SWD

7

ADD1

6

ADD0

5

GND

"#$#

www.ti.com

SBAS347 − MARCH 2005

ELECTRICAL CHARACTERISTICS

At TA = −40°C to +125°C and VS = +3.0V to +3.6V , unless otherwise noted.

PARAMETER CONDITIONS MIN TYP MAX UNIT

TEMPERATURE INPUT

Range −40 +125 °C
Error T

ERROR

T = −25°C to +85°C ±0.2 ±2 °C

T = −40°C to +125°C ±3 °C

vs Supply ±0.2 ±0.5 °C/V

Resolution 10 Bits

Default Conversion Time t

CONV

See Table 4 for conversion time settings. 162 190 218 ms

DIGIT AL INPUT/OUTPUT PINS (SWD and ADD pins)

Input/Output Capacitance C

IN/OUT

SWD PIN

Input Leakage Current I

Input Logic Level Voltage (High) V

L

I

L

IH

GND < VIN < 5.5V and VS = GND/OPEN 0.005 µA

VS = 2.7V to 5.5V 0.6 × V

Input Logic Level Voltage (Low) V

IL

VS = 2.7V to 5.5V −0.5 0.25 × V
Input Hysteresis V
Output Logic Level Voltage (Low) V

Output OFF Current I

HYST
OL

OH

ADD0 and ADD1 PINS

Input Leakage Current I

Input Logic Level Voltage (High) V
Input Logic Level Voltage (Low) V

L

IH
IL

SensorPath CHARACTERISTICS

SWD Fall Time t
SWD Rise Time t
Min. Inactive Time Between SWD Signals t
Master or TMP141 Reset Drive Time t
TMP141 Detects Bus Activity t

f
r
INACT
RST
SFEdet

R

PULL-UP

R

PULL-UP

= 1.25kΩ ± 30%, CL = 400pF 300 ns
= 1.25kΩ ± 30%, CL = 400pF 1000 ns

Bus at High Level 11 µs

Master Drive Time

Data Bit 0 Write, Data Bit 0 Read t
Data Bit 1 Write t
Start Bit t

Mtr0
Mtr1
MtrS

TMP141 Drive Time

Data Bit 0−1 Read t
Attention Request t
Reset t

SLout1
SLoutA
RST_MA X

After VS is Above 2.6V 95 500 ms

POWER SUPPLY

Specified Voltage Range 3.0 3.6 V
Operating Voltage Range 2.7 5.5 V
Quiescent Current I

Q

While Converting

Power-On Reset Voltage 1.5 2.6 V

TEMPERATURE RANGE

Specified Range −40 +125 °C
Operating Range −55 +127 °C
Storage Range −60 +150 °C
Thermal Resistance q

JA

MSOP-8 150 °C/W
SOT23-6 200 °C/W

(1)

SensorPath activity only has a slight effect on quiescent current.

TMP141

0.25 °C

3 pF

GND < VIN < V

S

0.005 10 µA

2.1 VS + 0.5 V

S

VS + 0.5 V

−0.5 0.8 V

300 mV

S

IOL = 4mA 0.4 V

IOL = 50µA 0.2 V

0.005 10 µA

GND < VIN < V

S

0.9 × V

−0.5 0.1 × V

0.005 10 µA

S

VS + 0.5 V

S

354 µs

9.6 µs

11.8 17 µs

35.4 48.9 µs
80 109 µs

28.3 38.3 µs

165 228 µs

Standby 80 120 µA

(1)

110 170 µA

V

V

3

"#$#

SBAS347 − MARCH 2005

TYPICAL CHARACTERISTICS

At TA = −40°C to +125°C and VS = +3.0V to +3.6V , unless otherwise noted.

200
180
160
140

A)

µ

120

(

Q

I

100

80
60
40

QUIESCENT CURRENT vsTEMPERATURE

5.5V

3.3V

2.7V

−55−35−

155 25456585105125

Temperature (_C)

200
180
160
140

A)

µ

(

120

STBY

I

100

80
60
40

2.7V

−55−35−

www.ti.com

I

vs TEMPERATURE

STBY

5.5V

3.3V

155 25456585105125

Temperature (_C)

1.0

0.8

0.6

0.4

C)

_

0.2

Error (

0

−

0.2

−

0.4

−

0.6

TYPICAL PERFORMANCE FOR THREE UNITS

−55−35−

155 25456585105125

Temperature (_C)

120

110

100

A)

µ

90

(

Q

I

80

220

210

200

190

180

170

Conversion Time −Default Setting (ms)

160

QUIESCENT CURRENT vs CONVERSION TIME

Peak Current

Average Current

TYPICAL CONVERSION TIME vs TEMPERATURE

−55−35−

3.3V

155 25456585105125

Temperature (_C)

2.7V

5.5V

70

60

0 200 400 600 800 1000 1200 1400 1600

Conversion Time (ms)

4

www.ti.com

"#$#

SBAS347 − MARCH 2005

0µs50

t

INACT

t

INACT

t

Mtr0

µ

s 100µs

DetectStart

t

MtrS

Master Write Start

Master Write 0

t

INACT

t

Mtr1

SlvDetectData1

Master Write 1

1a: Master Write timing and slave detection of the data placed on the SWD bus by the master .

t

INACT

t

Mtr0

Masterstartsa bit

SlvDetect_st

(1)

Slave detects bus activity and

doesnothing,leaving the bit a 0.

t

SFEdet

Master Read 0

1b: To place a ‘0’ on the bus, the slave does not drive the bus.

t

INACT

t

Mtr0

Master starts a bit

SlvDetect_st

(1)

Slave pulls Bus low to send back a 1

t

SFEdet

MstDetect_1

Master Read 1

1c: To place a ‘1’ on the bus, the slave holds the bus low after detecting that the master has started a data bit.

NOTE: (1) Margin from t

SFEdet

to t

Mtr0

is 2.2µs.

Figure 1. TMP141 Read and Write Signal Timing

5

"#$#

SBAS347 − MARCH 2005

www.ti.com

Master Write 0

Master Write 1

Master Read 0

Master Read 1

Master Write Start

Sout_Attention

0µs50

µ

s 100µs150µs 200µs250µs300µs 350µs 400µs450µs

t

INACT

t

MtrS

t

INACT

t

SLoutA

Attention

Mout_Reset

Sout_Reset

Reset

Attention

t

INACT

Detect

t

RST

t

RST

Reset Detect

t

RST

Figure 2. Relationship of the Five Types of Signals on SWD

6