TLV821IDBVR — —
–40°C to 85°C
8-pin SOIC — TLV822ID —
8-pin TSSOP — TLV822IPWR —
14-pin SOIC — — TLV824ID
14-pin TSSOP — — TLV824IPWR
The D package is available taped and reeled. Add the suffix R to the device type (e.g., TL V824IDR).
The DCK, DBV, and PW packages are only available left-end taped and reeled.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
†
Supply voltage, VCC (see Note 1) 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, V
ID
(see Note 2) ±5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (either input) 0 to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short circuit (one amplifier) to ground at (or below) T
A
= 25°C,
VCC ≤ 5.5 V (see Note 3) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θ
JA
(see Notes 4 and 5): D (8-pin) package 97°C/W. . . . . . . . . . . . . . . . . . . . . .
D (14-pin) package 86°C/W. . . . . . . . . . . . . . . . . . . .
DBV package 347°C/W. . . . . . . . . . . . . . . . . . . . . . . .
DCK package 389°C/W. . . . . . . . . . . . . . . . . . . . . . . .
PW (8-pin) package 149°C/W. . . . . . . . . . . . . . . . . . .
PW (14-pin) package 113°C/W. . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or PW package 260°C. . . . . . . . . . . . . .
Storage temperature range, T
stg
–65 to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
2. Differential voltages are at IN+ with respect to IN–.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51.
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