Voltage Output Range ... 2x the
Reference V oltage
D
Monotonic Over Temperature
DW OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DV
D2
D3
D4
D5
D6
D7
A1
A0
SPD
DD
D1
D0
CS
WE
LDAC
PWR
AGND
OUT
REF
AV
DD
applications
D
Digital Servo Control Loops
D
Digital Offset and Gain Adjustment
D
Industrial Process Control
D
Machine and Motion Control Devices
D
Mass Storage Devices
description
The TLV5633 is a 12-bit voltage output digital-to-analog converter (DAC) with an 8-bit microcontroller
compatible parallel interface. The 8 LSBs, the 4 MSBs, and 5 control bits are written using three different
addresses. Developed for a wide range of supply voltages, the TL V5633 can be operated from 2.7 V to 5.5 V.
The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer . The buffer features a Class A
(slow mode: AB) output stage to improve stability and reduce settling time. The programmable settling time of
the DAC allows the designer to optimize speed versus power dissipation. With its on-chip programmable
precision voltage reference, the TL V5633 simplifies overall system design. Because of its ability to source up
to 1 mA, the internal reference can also be used as a system reference. The settling time and the reference
voltage can be chosen by a control register.
Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It
is available in 20-pin SOIC and TSSOP packages in standard commercial and industrial temperature ranges.
AVAILABLE OPTIONS
PACKAGE
T
A
0°C to 70°CTLV5633CDWTLV5633CPW
–40°C to 85°CTLV5633IDWTLV5633IPW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SOIC
(DW)
TSSOP
(PW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1999, Texas Instruments Incorporated
1
TLV5633C, TLV5633I
I/O/P
DESCRIPTION
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
functional block diagram
SPD
PWR
A(0,1)
CS
WE
2
Power-On
Reset
Interface
Control
5
5-Bit
Control
Latch
4
4-Bit
DAC MSW
Holding
Latch
88
8-Bit
DAC LSW
Holding
Latch
Voltage
Bandgap
Powerdown
and Speed
Control
2
4
REFAGNDDV
PGA With
Output Enable
1212
12-Bit
DAC
Register
DD
x2
AV
DD
OUT
D(0–7)
LDAC
Terminal Functions
TERMINAL
NAMENO.
A1, A07, 8IAddress input
AGND14PGround
AV
DD
CS18IChip select. Digital input active low, used to enable/disable inputs
D0 – D119, 20IData input
D2 – D71–6IData input
DV
DD
LDAC16ILoad DAC. Digital input active low, used to load DAC output
OUT13ODAC analog voltage output
PWR15IPower down. Digital input active low
REF12I/OAnalog reference voltage input/output
SPD9ISpeed select. Digital input
WE17IWrite enable. Digital input active low , used to latch data
11PPositive power supply (analog part)
10PPositive power supply (digital part)
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Suppl
oltage, DV
AV
Operating free-air temperature, T
°C
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Supply voltage difference, ∆VDD = AVDD – DV
Power on reset voltage, POR0.552V
High-level digital input voltage, V
Low-level digital input voltage, V
Reference voltage, V
Reference voltage, V
Load resistance, R
Load capacitance, C
p
NOTE 1: Due to the x2 output buffer , a reference input voltage ≥ AV
reference must be disabled, if an external reference is used.
,
DD
DD
DD
IH
IL
to REF terminal (5-V supply), See Note 1AGND2.048 AVDD–1.5V
ref
to REF terminal (3-V supply), See Note 1AGND1.024 AVDD–1.5V
ref
L
L
p
A
5-V operation4.555.5V
3-V operation2.733.3V
000V
2 DV
DD
00.8V
2kΩ
100pF
TLV5633C070
TLV5633I–4085
causes clipping of the transfer function. The output buffer of the internal
DD/2
V
°
†
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3
TLV5633C, TLV5633I
REF on
DD
,
REF off
IDDPower supply current
All inputs
AGND or DV
REF on
DD
,
REF off
PSRR
Power supply rejection ratio
dB
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
electrical characteristics over recommended operating free-air temperature range, V
= 1.024 V (unless otherwise noted)
V
ref
= 2.048 V,
ref
power supply
PARAMETERTEST CONDITIONSMINTYPMAX
AV
= 5 V,
DVDD = 5 V
No load,
p
pp
DAC latch = 0x800
Power down supply current0.011µA
pp
NOTES: 2. Power supply rejection ratio at zero scale is measured by varying AVDD and is given by:
3. Power supply rejection ratio at full scale is measured by varying AVDD and is given by:
PSRR = 20 log [(EG(AVDDmax) – EG(AVDDmin))/AVDDmax]
Zero scale, external reference, See Note 2–60
Full scale, external reference, See Note 3–60
=
DD
,
AV
= 3 V,
DVDD = 3 V
Fast2.32.8mA
Slow1.31.6mA
Fast1.92.4mA
Slow0.91.2mA
Fast2.12.6mA
Slow1.21.5mA
Fast1.82.3mA
Slow0.91.1mA
UNIT
static DAC specifications
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Resolution12bits
INLIntegral nonlinearity, end point adjustedRL = 10 kΩ, CL = 100 pF, See Note 4±1.2±3LSB
DNLDifferential nonlinearityRL = 10 kΩ, CL = 100 pF, See Note 5±0.3±0.5LSB
E
ZS
EZS TC Zero-scale-error temperature coefficientSee Note 720ppm/°C
E
G
EG TCGain error temperature coefficientSee Note 920ppm/°C
NOTES: 4. The relative accuracy or integral nonlinearity (INL) sometimes referred to as linearity error, is the maximum deviation of the output
Zero-scale error (offset error at zero scale)See Note 6±12mV
min
% full
scale V
).
Gain errorSee Note 8±0.3
from the line between zero and full scale excluding the effects of zero code and full-scale errors (see text).
5. The differential nonlinearity (DNL) sometimes referred to as differential error, is the difference between the measured and ideal 1
LSB amplitude change of any two adjacent codes. Monotonic means the output voltage changes in the same direction (or remains
constant) as a change in the digital input code.
6. Zero-scale error is the deviation from zero voltage output when the digital input code is zero (see text).
7. Zero-scale-error temperature coefficient is given by: EZSTC = [EZS(T
8. Gain error is the deviation from the ideal output (2V
9. Gain temperature coefficient is given by: EGTC = [EG(T
– 1 LSB) with an output load of 10 kΩ excluding the effects of the zero-error .
NOTES: 11. Settling time is the time for the output signal to remain within ±0.5 LSB of the final measured value for a digital input code change
p
p
Glitch energy
of 0x020 to 0xFDF or 0xFDF to 0x020 respectively.
12. Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change
of one count.
13. Slew rate determines the time it takes for a change of the DAC output from 10% to 90% full-scale voltage.
Setup time, CS low before negative WE edge15ns
Setup time, data ready before positive WE edge10ns
Setup time, addresses ready before positive WE edge20ns
Hold time, data and addresses held valid after positive WE edge5ns
Setup time, positive WE edge before LDAC low5ns
Pulse duration, WE high20ns
Pulse duration, LDAC low23ns
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
PARAMETER MEASUREMENT INFORMATION
D(0–7)
A(0,1)
CS
WE
LDAC
D(0–7)
XDataX
XAddressX
t
su(D)
t
su(CS-WE)
t
su(A)
t
su(WE-LD)
t
h(DA)
t
wH(WE)
t
w(LD)
Figure 1. Timing Diagram
MSWXXLSWX
A(0,1)
CS
WE
LDAC
0XX1X
Figure 2. Example of a Complete Write Cycle (MSW, LSW) Using LDAC for Update
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7
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
PARAMETER MEASUREMENT INFORMATION
D(0–7)
A(0,1)
CS
WE
LDAC
MSWXXLSWControlXX
0XX13XX
Figure 3. Example of a Complete Write Cycle (MSW, LSW, Control)
8
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
TYPICAL CHARACTERISTICS
DIFFERENTIAL NONLINEARITY ERROR
1
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
05121024153620482560
DNL – Differential Nonlinearity – LSB
Digital Code
Figure 4
INTEGRAL NONLINEARITY ERROR
3
307235844096
2
1
0
–1
–2
INL – Intergral Nonlinearity – LSB
–3
05121024153620482560
Digital Code
Figure 5
307235844096
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9
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
TYPICAL CHARACTERISTICS
MAXIMUM OUTPUT VOLTAGE
LOAD CURRENT
2.04
2.0395
2.039
2.0385
2.038
2.0375
2.037
– Output Voltage – V
O
V
2.0365
2.036
2.0355
Slow Mode, Source
00.511.522.53
Fast Mode, Source
Load Current – mA
Figure 6
MINIMUM OUTPUT VOLTAGE
LOAD CURRENT
0.25
vs
AVDD = 3 V,
V
= Int. 1 V,
ref
Input Code = 0xFFF
vs
3.544.5
4.08
4.0795
4.079
4.0785
4.078
4.0775
4.077
– Output Voltage – V
O
V
4.0765
4.076
4.0755
0.25
MAXIMUM OUTPUT VOLTAGE
vs
LOAD CURRENT
AVDD = 5 V,
V
= Int. 2 V,
ref
Input Code = 0xFFF
Fast Mode, Source
Slow Mode, Source
00.511.522.53
Load Current – mA
Figure 7
MINIMUM OUTPUT VOLTAGE
vs
LOAD CURRENT
3.544.5
0.2
0.15
0.1
– Output Voltage – V
O
V
0.05
0
00.511.522.53
Load Current – mA
Figure 8
Fast Mode, Sink
Slow Mode, Sink
AVDD = 5 V,
V
= Int. 2 V,
ref
Input Code = 0x000
3.544.5
Fast Mode, Sink
0.2
0.15
0.1
– Output Voltage – V
O
V
0.05
0
00.511.522.53
Load Current – mA
Slow Mode, Sink
AVDD = 3 V,
V
= Int. 1 V,
ref
Input Code = 0x000
3.544.5
Figure 9
10
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION
FREQUENCY
0
AVDD = 5 V,
REF = 1 V dc + 1 V pp Sinewave,
–10
Output Full Scale
–20
–30
–40
–50
–60
–70
–80
THD – Total Harmonic Distortion – dB
–90
–100
1001000
f – Frequency – Hz
Figure 10
vs
Slow Mode
Fast Mode
10000100000
1
TOTAL HARMONIC DISTORTION AND NOISE
0
AVDD = 5 V,
REF = 1 V dc + 1 V pp Sinewave,
–10
Output Full Scale
–20
–30
–40
–50
–60
–70
–80
–90
–100
THD+N – Total Harmonic Distortion and Noise – dB
1001000
POWER DOWN SUPPLY CURRENT
vs
TIME
vs
FREQUENCY
Slow Mode
Fast Mode
10000100000
f – Frequency – Hz
Figure 11
0.9
0.8
0.7
0.6
0.5
0.4
– Supply Current – mA
0.3
DD
I
0.2
0.1
0
0102030405060
t – Time – µs
Figure 12
708090
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11
TLV5633C, TLV5633I
MODE
POWER
LATCH
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
APPLICATION INFORMATION
general function
The TLV5633 is a 12-bit, single supply DAC, based on a resistor string architecture. It consists of a parallel
interface, a speed and power down control logic, a programmable internal reference, a resistor string, and a
rail-to-rail output buffer. The output voltage (full scale determined by reference) is given by:
2REF
CODE
01000
[V]
Where REF is the reference voltage and CODE is the digital input value in the range 0x000 to 0xFFF. A power
on reset initially puts the internal latches to a defined state (all bits zero).
parallel interface
The device latches data on the positive edge of WE. It must be enabled with CS low. Whether the data is written
to one of the DAC holding latches (MSW, LSW) or the control register depends on the address bits A1 and A0.
LDAC
low updates the DAC with the value in the holding latch. LDAC is an asynchronous input and can be held
low, if a separate update is not necessary. However, to control the DAC using the load feature, there should be
approximately a 5 ns delay after the positive WE edge before driving LDAC low . Two more asynchronous inputs,
SPD and PWR control the settling times and the power-down mode:
SPD:Speed control1 → fast mode0 → slow mode
PWR:Power control1 → normal operation0 → power down
It is also possible to program the different modes (fast, slow , power down) and the DAC update latch using the
control register. The following tables list the possible combinations of control signals and control bits.
PINBIT
SPDSPD
00Slow
01Fast
10Fast
11Fast
12
PINBIT
PWRPWD
00Down
01Down
10Normal
11Down
PINBIT
LDACRLDAC
00Transparent
01Transparent
10Hold
11Transparent
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
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APPLICATION INFORMATION
data format
The TLV5633 writes data either to one of the DAC holding latches or to the control register depending on the
address bits A1 and A0.
The following table lists the meaning of the bits within the control register.
D7D6D5D4D3D2D1D0
XXXREF1REF0RLDACPWRSPD
†
X
†
Default values
X: don’t care
SPD: Speed control bit1 → fast mode0 → slow mode
PWR: Power control bit1 → power down0 → normal operation
RLDAC: Load DAC latch1 → latch transparent0 → DAC latch controlled by LDAC
†
X
†
X
A0REGISTER
†
0
†
0
pin
†
0
†
0
†
0
REF1 and REF0 determine the reference source and the reference voltage.
REFERENCE BITS
REF1
REF0REFERENCE
00External
012.048 V
101.024 V
11External
If an external reference voltage is applied to the REF pin, external reference must be selected.
layout considerations
T o achieve the best performance, it is recommended to have separate power planes for GND, A VDD, and DVDD.
Figure 13 shows how to lay out the power planes for the TL V5633. As a general rule, digital and analog signals
should be separated as wide as possible. To avoid crosstalk, analog and digital traces must not be routed in
parallel. The two positive power planes ( AV
ferrite bead.
A 100-nF ceramic low series inductance capacitor between DVDD and GND and a 1-µF tantalum capacitor
between AVDD and GND placed as close as possible to the supply pins are recommended for optimal
performance.
and DVDD) should be connected together at one point with a
DD
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
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APPLICATION INFORMATION
layout considerations (continued)
DV
DD
AV
DD
Figure 13. TLV5633 Board Layout
linearity, offset, and gain error using single end supplies
When an amplifier is operated from a single supply , the voltage offset can still be either positive or negative. With
a positive offset, the output voltage changes on the first code change. With a negative offset the output voltage
may not change with the first code, depending on the magnitude of the offset voltage.
The output amplifier attempts to drive the output to a negative voltage. However, because the most negative
supply rail is ground, the output cannot drive below ground and clamps the output at 0 V.
The output voltage remains at zero until the input code value produces a sufficient positive output voltage to
overcome the negative offset voltage, resulting in the transfer function shown in Figure 14.
Output
Voltage
0 V
Negative
Offset
DAC Code
14
Figure 14. Effect of Negative Offset (Single Supply)
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2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
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APPLICATION INFORMATION
The offset error , not the linearity error , produces this breakpoint. The transfer function would have followed the
dotted line if the output buffer could drive below the ground rail.
For a DAC, linearity is measured between zero input code (all inputs 0) and full scale code (all inputs 1) after
offset and full scale are adjusted out or accounted for in some way . However , single supply operation does not
allow for adjustment when the offset is negative due to the breakpoint in the transfer function. So the linearity
is measured between full scale code and the lowest code that produces a positive output voltage.
TLV5633 interfaced to an Intel MCS51 controller
The circuit in Figure 15 shows how to interface the TL V5633 to an Intel MCS51 microcontroller. The address
bus and the data bus of the controller are multiplexed on port 0 (non page mode) to save port pins. T o separate
the address bits and the data bits, the controller provides a dedicated signal, address latch enable (ALE), which
is connected to a latch at port 0.
An address decoder is required to generate the chip select signal for the TLV5633. In this example, a simple
3-to-8 decoder (74AC138) is used for the interface as shown in Figure 15. The DAC is memory mapped at
addresses 0x8000/1/2/3 within the data memory address space and mirrored every 32 address locations
(0x8020/1/2/3, 0x8040/1/2/3, etc.). In a typical microcontroller system, programmable logic should be used to
generate the chip select signals for the entire system.
The data pins and the WE
pin of the TL V5633 can be connected directly to the multiplexed address and data
bus and the WR signal of the controller.
The application uses the TL V5633 device’s internal reference at 2.048 V. The LDAC pin is connected to P3.5
and is used to update the DAC after both data bytes have been written.
8xC51
P2 A(15–8)
P0 AD(7–0)
ALE
WR
P3.5
8
8
D(7–0)
LEOE
8
74AC373
Q(7–0)
A2
A3
A4
DV
A15
DD
74AC138
Y(7–0)
A
B
C
G1
G2A
G2B
2
A(1–0)
D(7–0)
CS
WE
LDAC
8
8
TLV5633
G2A
16
SPD
PWR
OUT
DV
A(15–0)
AD(7–0)
CS(7–0)
DD
R
L
Figure 15. TLV5633 Interfaced to an Intel MCS51 Controller
MCS is a registered trademark of Intel Corporation.
To Other Devices Requiring
Voltage Reference
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REF
15
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
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APPLICATION INFORMATION
software
In the following example, the code generates a waveform at 20 KSPS with 32 samples stored in a table within
the program memory space of the microcontroller.
The waveform data is located in the program memory space at segment SINTBL beginning with the MSW of
the first 16-bit word (the 4 MSBs are ignored), followed by the LSW. T wo bytes are required for each DAC word
(the table is not shown in the code example).
The program consists of two parts:
D
A main routine, which is executed after reset and which initializes the timer and the interrupt system of the
microcontroller.
D
An interrupt service routine, which reads a new value from the waveform table and writes it to the DAC.
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; File:WAVE.A51
; Function:wave generation with TLV5633
; Processors: 80C51 family (running at 12MHz)
; Software:ASM51 assembler, Keil BL51 code–banking linker
; (C) 1999 Texas Instruments
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Program function declaration
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
NAMEWAVE
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Code start at address 0, jump to start
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSEG AT 0
LJMPstart; Execution starts at address 0 on power–up.
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Code in the timer0 interrupt vector
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSEG AT 0BH
LJMPtimer0isr ; Jump vector for timer 0 interrupt is 000Bh
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Interrupt service routine for timer 0 interrupts
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
RSEG ISR
timer0isr:
PUSHPSW
PUSHACC
; The signal to be output on the dac is stored in a table
; as 32 samples of msb, lsb pairs (64 bytes).
; The pointer, rolling_ptr, rolls round the table of samples
; incrementing by 2 bytes (1 sample) on each interrupt
; (at the end of this routine).
MOVDPTR, #wavetable ; set DPTR to the start of the table
MOVR0, #001H ; R0 selects DAC MSW
MOVA,rolling_ptr ; ACC loaded with the pointer into the wave table
MOVCA,@A+DPTR ; get msb from the table
MOVX@R0, A ; write DAC MSW
MOVR0, #000H ; R0 selects DAC LSW
MOVA,rolling_ptr ; move rolling pointer back in to ACC
INCA ; increment ACC holding the rolling pointer
MOVCA,@A+DPTR ; which is the lsb of this sample, now in ACC
MOVX@R0, A ; write DAC LSW
MOV A,rolling_ptr ; load ACC with rolling pointer again
INCA ; increment the ACC twice, to get next sample
INC A
ANLA,#003FH ; wrap back round to 0 if >64
MOV rolling_ptr,A ; move value held in ACC back to the rolling pointer
CLRT1 ; set LDACB = 0 (update DAC)
SETBT1 ; set LDACB = 1
POPACC
POPPSW
RETI
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Set up stack
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
RSEGSTACK
DS 10h; 16 Byte Stack!
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Main Program
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
RSEGMAIN
start:
MOVSP,#STACK–1; first set Stack Pointer
CLRA
MOVrolling_ptr,A; set rolling pointer to 0
MOVTMOD,#002H; set timer 0 to mode 2 – auto–reload
MOVTH0,#0CEH; set timer 2 re–load value for 20 kHz interrupts
MOVP2, #080H; set A15 of address bus high to ’memory map’
; device up beyond used address space
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
APPLICATION INFORMATION
SETBT1; set LDACB = 1 (on P3.5)
; TLV5633 setup
MOVR0, #003H; R0 selects control register
MOVA, #011H; LOAD ACC with control register value:
; REF1=1, REF0=0 –> 2.048V internal reference
; RLDAC=0 –> use LDACB pin to control DAC
; PD=0–> DAC enabled
; SPD=1 –> FAST mode
; write control word:
MOVX@R0, A; write DAC control word
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Table of 32 wave samples used as DAC data
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
RSEG WAVTBL
wavetable:
;...insert 32 samples here...
.END
18
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
APPLICATION INFORMATION
definitions of specifications and terminology
integral nonlinearity (INL)
The relative accuracy or integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum
deviation of the output from the line between zero and full scale excluding the effects of zero code and full-scale
errors.
differential nonlinearity (DNL)
The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the
measured and ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage
changes in the same direction (or remains constant) as a change in the digital input code.
zero-scale error (E
Zero-scale error is defined as the deviation of the output from 0 V at a digital input value of 0.
gain error (EG)
Gain error is the error in slope of the DAC transfer function.
signal-to-noise ratio + distortion (SINAD)
Signal-to-noise ratio + distortion is the ratio of the rms value of the output signal to the rms sum of all other
spectral components below the Nyquist frequency , including harmonics but excluding dc. The value for SINAD
is expressed in decibels.
spurious free dynamic range (SFDR)
Spurious free dynamic range is the difference between the rms value of the output signal and the rms value of
the spurious signal within a specified bandwidth. The value for SFDR is expressed in decibels.
total harmonic distortion (THD)
T otal harmonic distortion is the ratio of the rms sum of the first six harmonic components to the rms value of the
fundamental signal and is expressed in decibels.
ZS
)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
19
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
MECHANICAL DATA
DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
16 PIN SHOWN
0.050 (1,27)
16
1
0.020 (0,51)
0.014 (0,35)
9
0.299 (7,59)
0.293 (7,45)
8
A
0.010 (0,25)
0.419 (10,65)
0.400 (10,15)
M
0.010 (0,25) NOM
0°–8°
Gage Plane
0.010 (0,25)
0.050 (1,27)
0.016 (0,40)
0.104 (2,65) MAX
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-013
0.012 (0,30)
0.004 (0,10)
PINS **
DIM
A MAX
A MIN
Seating Plane
0.004 (0,10)
16
0.410
(10,41)
0.400
(10,16)
20
0.510
(12,95)
0.500
(12,70)
24
0.610
(15,49)
0.600
(15,24)
4040000/D 02/98
20
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
MECHANICAL DATA
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0,65
14
1
1,20 MAX
A
7
0,05 MIN
0,30
0,19
8
6,60
4,50
4,30
6,20
M
0,10
Seating Plane
0,10
0,15 NOM
Gage Plane
0,25
0°–8°
0,75
0,50
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
8
3,10
2,90
14
5,10
4,90
16
5,10
20
6,60
6,404,90
24
7,90
7,70
28
9,80
9,60
4040064/E 08/96
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
21
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any product or service without notice, and advise customers to obtain the latest version of relevant information
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accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
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CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
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party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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