The TL V2211 is a single operational amplifier manufactured using the T exas Instruments Advanced LinCMOS
process. These devices are optimized and fully specified for single-supply 3-V and 5-V operation. For this
low-voltage operation combined with micropower dissipation levels, the input noise voltage performance has
been dramatically improved using optimized design techniques for CMOS-type amplifiers. Another added
benefit is that these amplifiers exhibit rail-to-rail output swing. The output dynamic range can be extended using
the TL V221 1 with loads referenced midway between the rails. The common-mode input voltage range is wider
than typical standard CMOS-type amplifiers. To take advantage of this improvement in performance and to
make this device available for a wider range of applications, V
voltage test limit of ± 5 mV , allowing a minimum of 0 to 2-V common-mode input voltage range for a 3-V power
supply .
is specified with a larger maximum input offset
ICR
AVAILABLE OPTIONS
PACKAGED DEVICES
A
0°C to 70°C3 mVTLV2211CDBVVACC
–40°C to 85°C3 mVTLV2211IDBVVACI
†
The DBV package available in tape and reel only.
°
SOT-23 (DBV)
†
CHIP FORM
(Y)
The Advanced LinCMOS process uses a silicon-gate technology to obtain input offset voltage stability with
temperature and time that far exceeds that obtainable using metal-gate technology . This technology also makes
possible input-impedance levels that meet or exceed levels offered by top-gate JFET and expensive
dielectric-isolated devices.
The TLV2211, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for
high-impedance sources such as piezoelectric transducers. Because of the low power dissipation levels
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output feature with single or split supplies makes these devices excellent
choices when interfacing directly to analog-to-digital converters (ADCs). All of these features combined with its
temperature performance make the TLV2211 ideal for remote pressure sensors, temperature control, active
voltage-resistive (VR) sensors, accelerometers, hand-held metering, and many other applications.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Advanced LinCMOS is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1997, Texas Instruments Incorporated
1
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
description (continued)
The device inputs and outputs are designed to withstand a 100-mA surge current without sustaining latch-up.
In addition, internal ESD-protection circuits prevent functional failures up to 2000 V as tested under
MIL-PRF-38535; however, care should be exercised when handling these devices as exposure to ESD may
result in degradation of the device parametric performance. Additional care should be exercised to prevent
V
supply-line transients under powered conditions. Transients of greater than 20 V can trigger the
DD +
ESD-protection structure, inducing a low-impedance path to V
sustained current supplied to the device must be limited to 100 mA or less. Failure to do so could result in a
latched condition and device failure.
/GND. Should this condition occur, the
DD –
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TLV2211Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2211C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
40
(2)
(1)
(3)
(5)
(4)
V
DD+
V
+
–
DD–
(5)
(2)
/GND
(4)
OUT
(1)
IN+
(3)
IN–
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (2) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
32
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
T
l
R
l
D
7
11
94
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
equivalent schematic
IN+
V
DD+
Q3Q6Q9Q12Q14Q16
R7
C2
R6
C1
OUT
TLV2211, TLV2211Y
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUARY 1997
Advanced LinCMOSRAIL-TO-RAIL
emp
ate
e
ease
ate:
–
–
IN–
Q4Q1
•
Q2Q5Q7Q8Q10Q11
R3
R4
COMPONENT COUNT
Transistors
Diodes
Resistors
Capacitors
†
Includes both amplifiers and all
ESD, bias, and trim circuitry
23
6
11
2
†
R5
V
DD–/GND
R1
R2
Q17Q15Q13
D1
D2
PACKAGE
A
UNIT
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
Differential input voltage, V
Input voltage range, V
Input current, I
Output current, I
Total current into V
Total current out of V
Operating free-air temperature range, T
Storage temperature range, T
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: DBV package 260°C. . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to V
2. Differential voltages are at the noninverting input with respect to the inverting input. Excessive current flows when input is brought
below V
3. The output may be shorted to either supply. Temperature and /or supply voltages must be limited to ensure that the maximum