The TLV1393 and the TLV2393 are dual differential comparators built using a new Texas Instruments
low-voltage, high-speed bipolar process. These devices have been specifically developed for low-voltage,
single-supply applications. Their enhanced performance makes them excellent replacements for the LM393 in
today’s improved 3-V and 5-V system designs.
The TLV1393, with its typical supply current of only 0.16 mA, is ideal for low-power systems. Response time
has also been improved to 0.7 µs. For higher-speed applications, the TLV2393 features excellent ac
performance with a response time of just 0.45 µs, three times that of the LM393.
Package availability for these devices includes the TSSOP (thin-shrink small-outline package). With a
maximum thickness of 1.1 mm and a package area that is 25% smaller than the standard surface-mount
package, the TSSOP is ideal for high-density circuits, particularly in hand-held and portable equipment.
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
°
–
†
The PW packages are only available left-ended taped and reeled (e.g., TLV1393IPWLE).
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
This chip, when properly assembled, displays characteristics similar to the TL V1393. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
CC
+
–
GND
(8)
(4)
(1)
(5)
+
(6)
–
38
(8)
(6)(7)
(5)
1IN+
1IN–
2OUT
(3)
(2)
(7)
1OUT
2IN+
2IN–
(1)
(2)
32
(4)
(3)
CHIP THICKNESS: 13 TYPICAL
BONDING PADS: 3.54 × 3.54 MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1393, TLV1393Y, TLV2393, TLV2393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS121A – AUGUST 1993 – REVISED APRIL 1994
TLV2393Y chip information
This chip, when properly assembled, displays characteristics similar to the TL V2393. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
CC
+
–
GND
(8)
(4)
(1)
(5)
+
(6)
–
38
(8)
(6)(7)
(5)
1IN+
1IN–
2OUT
(3)
(2)
(7)
1OUT
2IN+
2IN–
(1)
(2)
32
(4)
(3)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 3.6 × 3.6 MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the network GND.
2. Differential voltages are at the noninverting input with respect to the inverting input.
3. Short circuits from the outputs to VCC can cause excessive heating and eventual destruction of the chip.
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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