查询TLV1393供应商
TLV1393, TLV1393Y, TLV2393, TLV2393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS121A – AUGUST 1993 – REVISED APRIL 1994
D
Low-Voltage and Single-Supply Operation
V
= 2 V to 7 V
CC
D
Common-Mode Voltage Range Includes
Ground
D
Fast Response Time
450 ns Typ (TLV2393)
D
Low Supply Current
D, P, OR PW PACKAGE
(TOP VIEW)
1OUT
1IN–
GND
1IN+
1
8
2
7
3
6
4
5
V
CC
2OUT
2IN–
2IN+
0.16 mA Typ (TLV1393)
D
Fully Specified at 3-V and 5-V Supply
Voltages
description
The TLV1393 and the TLV2393 are dual differential comparators built using a new Texas Instruments
low-voltage, high-speed bipolar process. These devices have been specifically developed for low-voltage,
single-supply applications. Their enhanced performance makes them excellent replacements for the LM393 in
today’s improved 3-V and 5-V system designs.
The TLV1393, with its typical supply current of only 0.16 mA, is ideal for low-power systems. Response time
has also been improved to 0.7 µs. For higher-speed applications, the TLV2393 features excellent ac
performance with a response time of just 0.45 µs, three times that of the LM393.
Package availability for these devices includes the TSSOP (thin-shrink small-outline package). With a
maximum thickness of 1.1 mm and a package area that is 25% smaller than the standard surface-mount
package, the TSSOP is ideal for high-density circuits, particularly in hand-held and portable equipment.
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
°
–
†
The PW packages are only available left-ended taped and reeled (e.g., TLV1393IPWLE).
SUPPLY CURRENT
°
0.16 mA 0.7 µs TLV1393ID TLV1393IP TLV1393IPWLE TLV1393Y
(TYP)
1.1 mA
RESPONSE TIME
(TYP)
0.45 µs TLV2393ID TLV2393IP TLV2393IPWLE TLV2393Y
SMALL OUTLINE
(D)
symbol (each comparator)
IN+
IN–
PLASTIC DIP
(P)
OUT
TSSOP
(PW)
†
(Y)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1994, Texas Instruments Incorporated
1
TLV1393, TLV1393Y, TLV2393, TLV2393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS121A – AUGUST 1993 – REVISED APRIL 1994
TLV1393, TLV1393Y equivalent schematic (each comparator)
V
CC
IN +
IN –
GND OUT
COMPONENT COUNT
Transistors 44
Resistors 1
Diodes
Epi-FET 2
7
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1393, TLV1393Y, TLV2393, TLV2393Y
DUAL DIFFERENTIAL COMPARATORS
TLV2393, TLV2393Y equivalent schematic (each comparator)
V
CC
SLCS121A – AUGUST 1993 – REVISED APRIL 1994
IN +
IN –
COMPONENT COUNT
Transistors 44
Resistors 1
Diodes
Epi-FET 2
GND OUT
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
TLV1393, TLV1393Y, TLV2393, TLV2393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS121A – AUGUST 1993 – REVISED APRIL 1994
TLV1393Y chip information
This chip, when properly assembled, displays characteristics similar to the TL V1393. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
CC
+
–
GND
(8)
(4)
(1)
(5)
+
(6)
–
38
(8)
(6)(7)
(5)
1IN+
1IN–
2OUT
(3)
(2)
(7)
1OUT
2IN+
2IN–
(1)
(2)
32
(4)
(3)
CHIP THICKNESS: 13 TYPICAL
BONDING PADS: 3.54 × 3.54 MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1393, TLV1393Y, TLV2393, TLV2393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS121A – AUGUST 1993 – REVISED APRIL 1994
TLV2393Y chip information
This chip, when properly assembled, displays characteristics similar to the TL V2393. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
CC
+
–
GND
(8)
(4)
(1)
(5)
+
(6)
–
38
(8)
(6)(7)
(5)
1IN+
1IN–
2OUT
(3)
(2)
(7)
1OUT
2IN+
2IN–
(1)
(2)
32
(4)
(3)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 3.6 × 3.6 MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5