This User’s Guide describes the usage and construction of the TLK3134 evaluation module
(EVM). This document provides guidance on proper use by showing some de
and test modes. In addition, design, layout and schematic information is provided to the
customer. Information in this guide can be used to assist the customer in choosing the optimal
design methods and materials in designing a complete system.
vice configurations
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy
and has not bee
designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments
may cause interference with radio communications, in which case the user at own expense will be required to take whatever
measures may be required to correct this interference.
n tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are
Power .............................................................................................................................................................. 6
Power Monitoring LEDs ................................................................................................................................ 9
Control Signals ............................................................................................................................................ 12
The Texas Instruments (TI™) TLK3134 SerDes evaluation module (EVM) board is used to
evaluate the functionality and the performance of TLK3134 XAUI Transceiver/4 Channel MultiRate Transceiver device (289-ball BGA). The TLK3134 is a flexible four channel independently
configurable serial transceiver that can be configured to be compliant with the 10Gbps Ethernet
XAUI Specification, the 1000Base-X 1Gbps Ethernet Specification and will also support
1X/2X/10X Fibre Channel (FC), CPRI (x1/x2/x3), OBSAI (x1/x2/x4) data rates. Many common
applications may be enabled by way of externally available control pins and detailed control of
the TLK3134 on a per channel basis is available by way of accessing a register space of control
bits available through a two-wire access port called the Management Data Input/Output (MDIO)
interface.
1
EVM PCB and High-speed Design Considerations
The board can be used to evaluate device parameters in addition to acting as a guide for highspeed board layout. As the frequency of op
special care to ensure that the highest signal integrity is maintained. To achieve this, the board's
impedance is controlled to 50 Ω for both the high-speed differential serial and low-speed parallel
data and clock connections. Vias are minimized and, when necessary, are designed to minimize
impedance discontinuities along the transmission line. Since the board contains both, serial and
parallel transmission lines, care was taken also to control trace length mismatch (board skew) to
less than +/- 1MIL.
Overall, the board layout is designed and optimized to support high-speed operation. Thus,
understanding impedance control and transmission line eff
speed boards. Some of the advanced features offered by this board include:
• PCB (printed circuit board) is designed for optimal high-speed signal integrity.
• SMP and parallel header fixtures are easily connected to test equipment.
• All input/output signals are accessible for rapid prototyping.
• The entire board can be powered from a single 5V power supply where the power planes
can be supplied through on-board regulators or t
• On-board capacitors provide AC coupling of high-speed receive signals.
• External parallel loop-back function can be achieved easily using simple 0.1 inch jumpers.
eration increases, the board designer must take
ects are crucial when designing high-
hrough separate banana jacks for isolation.
• Entire Board can operate from a single 5V power supply, or from individual power supplies.
•
Voltage Monitoring LED circuits provide quick indication that the voltage is within
specification.
1
The MDIO register map is located within the TLK3134 XAUI Transceiver/4 Channel Multi-Rate Transceiver datasheet.
The TLK3134 EVM can be operated off of a single 5V Power Supply utilizing the on-board
voltage regulators to generate the voltages required to correctly operate the TLK3134, off of
individual 1.2V, 1.5V or 1.8V, 2.5V, and 5V Power supplies, or a combination of both regulators
and separate individual supplies.
To modify your power supply configuration between either all Individual Supplies, all on-board
regulators, or a combinat
supply headers (JMP37, JMP40, and JMP50) selecting either the “BANANA” or the “REG” pin in
combination with the center pin. The following figure shows how to use the on-board regulators
for the 1.5V or 1.8V and 2.5V supply rails, and an individual power supply connected to the 1.2V
Banana Jack (P21). The 5V power supply is required for operation of the LEDs on this board
even if you are not using the on-board voltage regulators.
ion of both, simply change the jumper position on the appropriate power
Figure 1. TLK3134 EVM Power Source Selection Example
The MDIO power supply VDDM can be operated off of either 1.2V or 2.5V depending upon your
specific setup. If
you are using the supplied MDIO controller board that came with this
EVM kit, the 2.5V setting should be selected on the VDDM Power Select Header (JMP43).
Figure 2. TLK3134 EVM VDDM Voltage Source Selection
The PTH05010WAS voltage regulators included on the TLK3134 EVM are adjustable and are
SLLU104A - September 2007
set with a single external resistor. Separate regulators have been provided and set to output
1.2V and 2.5V because both voltages are required simultaneously. However, since 1.5V and
1.8V are not necessarily required simultaneously, a single regulator has been configured to
provide both of those voltages, although not at the same time depending upon the jumper
position on JMP115 shown in the following figure. JMP115 selects between the 1.5V set resistor
and the 1.8V set resistor and connects one or the other to the Voltage Adjust pin of the regulator.
Figure 3. TLK3134 EVM VDDM Voltage Source Selection
.
JMP115
1P8V
SELECTED
1P5V
VOLTAGE SELECT
1P8V
JMP115
1P5V
VOLTAGE SELECT
1P8V
1P5V
SELECTED
The PTH05010WAS voltage regulators are also equipped with a +/- 5% selectable Margin
Control allowing easy t
esting of the device near the
min/max voltage limits specified in the
datasheet. Place the jumper position to either the “UP 5%”, “DN 5%”, or “NOM” positions
keeping the center pin in common as demonstrated in the following figure.
When the on-board regulators are not being used and independent power supplies are being
used instead, i.e. the case of a voltage tolerance test, the on-board regulators should be disabled
to prevent the regulator’s voltage sense line from trying to regulate the voltage supplied through
the banana jack and not from its own output. This is accomplished by placing a short on the
headers (JMP108, JMP110, and JMP114) labeled “DISABLE”. The remote sense feature is not
designed to compensate for the forward drop of non-linear or frequency dependent components
that may be placed in series with the converter output. Examples include OR-ing diodes, filter
inductors, ferrite beads, and fuses. When these components are enclosed by the remote sense
connection they are effectively placed inside the regulation control loop, which can adversely
affect the stability of the regulator. A large 0 ohm resistor has been installed at the voltage
entrance point of each power plane and can be replaced with a ferrite bead of desired. In this
situation, the 0 ohm resistors on the sense lines can be interchanged to connect the sense line
directly to its output and eliminate the additional components that could otherwise create
instability on the regulator’s output. For the 1.2V regulator, the R223 0 ohm resistor should be
removed and the R222 populated with a 0 ohm resistor. For the 1.5V or 1.8V regulator, R221
should be removed and placed on R220, and similarly R223 should be moved to R222 for the
2.5V regulator.
The VREF plane is sourced through a Voltage Divider providing half of the voltage on the 1P5/8V
plane. The VDDQ and VDDR power
pins of the TLK3134 can both be operated off of either 1.5V
or 1.8V with VREF being half of whatever voltage is on the VDDQ pins. The VREF plane can be
powered through the plane monitoring header (JMP3) and removing the 0 ohm resistor (R71)
although this is not recommended. A separate VDDR plane has been added as there is no
relationship between the VDDR pin and the VDDQ pins, however, the VDDR plane is sourced
through a 0 ohm resistor (R67) from the voltage on the 1P5/8V plane that provides power the
VDDQ pins. This resistor can be replaced with a ferrite bead or removed completely and an
external supply can be connected to the VDDR Header (JMP5) in the case different voltages are
desired on the two planes.
Furthermore, for more accurate current readings the PULLUP_EN Jumpers on all control pin
headers can be removed quickly disconnecting the pullu
p resistors from the voltage plane.
However, the removal of the PULLUP_EN jumpers will also require manual high/low control of
the control pins.
Better Performance can be achieved when the Jitter Cleaner is enabled by using an external
power supply on the 1.2
V Banana Jack. A dedicated LDO 1.2V Regulator powering the Jitter
Cleaner Power Plane should be considered for the end application.
Each plane of the TLK3134 EVM has been equipped with a Voltage Monitoring circuit that will
monitor the voltage on the plane and light the LEDs when the voltage is within the min/max
datasheet limits for that power supply. A precision TI Voltage Reference chip is used along with
0.1% precision resistors setting min and max reference levels providing a detection circuit that is
accurate to approximately +/- 10mV. The LEDs should be used as a basic indication of the
status of power on the board being within the acceptable min/max limits given in the datasheet,
and not as a precise measurement tool as some LED circuits may turn off at slightly different
voltages when approaching the limits due to the manufacturing tolerances and available
component values.
The voltage monitor circuits can also be bypassed and the LEDs driven directly from the voltage
on the individual planes such as when performing voltage tolerance tests. Inste
only when the voltage on the plane is within the min/max range, the LED will be lit when the
voltage is greater than the voltage needed to turn on the LED drive circuit’s NPN transistor,
allowing current to flow, and the LED to be lit from the 5V source. In the Direct Connect mode,
the base resistors has been given extra margin to allow the LEDs to light when the voltage on
the plane is a little below the minimum limit of that supply in order to provide a LED indicator of
power on the plane during voltage tolerance tests near the lower supply limits.
.
ad of being lit
Figure 5. TLK3134 EVM Voltage Monitor LED Enabled Example
Placing the jumper on the ENABLE side of the Voltage Monitor Enable/Disable header connects
the power plane to the input of the voltage moni
toring circuit. This input is high impedance and
will not load down the power source providing the voltage to the plane.
Placing the header on the MONITOR side of the LED Monitor/Direct Connect selection header
connects the LED drive circui
t to the output of the Voltage Monitor circuit causing the LED to be
lit only when the voltage is within the acceptable range.
Figure 6. TLK3134 EVM Voltage Monitor LED Disabled Example
Placing the jumper on the DISABLE side of the Voltage Monitor Enable/Disable header
disconnects the power plane to the input of the voltage monitoring cir
cuit and instead ties the
input to GND. This prevents the output of the Voltage Monitoring Circuit from floating and
possibly causing the LED to flicker during contact with the board.
Placing the jumper on the MONITOR side of the LED Monitor/Direct Connect selection header
connects the LED drive circui
t to the output of the Voltage Monitor circuit causing the LED to be
off since the voltage monitor circuit will sense that the plane voltage is GND which is less than
the acceptable plane voltage.
Figure 7. TLK3134 EVM Voltage Monitor LED Connected Directly to Plane Example
Placing the jumper on the DIRECT side of the LED Monitor/Direct Connect selection header
SLLU104A - September 2007
connects the LED drive circuit to the power plane itself causing the LED to be lit when the
voltage is great enough to cause current to flow through the LED drive circuit. This LED
configuration has been designed to be used when pushing the lower limits of the acceptable
voltage range to continue to provide an indicator that power is on the plane, however without
regards to what that voltage may actually be.
The jumper on the Voltage Monitor Enable/Disable header does not matter as this is only the
input to the voltage monitor circuit which has been bypassed when the LED dri
All of the external control pins on the TLK3134 EVM have been consolidated to a single location
on the board and broken out into several header blocks for easier reference. LEDs have been
added to the GPO[4:0] lines in addition to the headers for scope probes, to allow easy monitoring
of the High/Low value on the line. The LED will be ON when the line is a Logic High, and the
LED will be OFF when the line is a Logic Low.
Figure 8. Control Connectors (JMP13, JMP15, JMP20, JMP21, JMP25, JMP26)
VCO_TL_TST: This pin is the VCO Testability Input and should be grounded in the
application.
TST_OUT: This is the Jitter Cleaner Testability Pin. This signal should be left open
(unconnected) in the System Application.
GPO[4:0]:
These are General Purpose Outputs and must be left open (unconnected) in the
System Application.
GPI1: This is the General Purpose I
ST: This is the MDIO
Select pin and used to select Clause 22 (ST =1) or Clause 45 (ST=0)
nput and must be Grounded in the System Application.
operation.
AMU
X0: This is the SERDES Analog Mux 0 TX pin and must be open (unconnected) in the
System Application.
AMUX1:
This is the SERDES Analog Mux 1 RX pin and must be open (unconnected) in the
System Application.
TESTEN:
This is the Test Mode Enable Input pin and must be Grounded in the System
Application.
CODE
: This is the Code Enable pin. Th
is signal selects different functionality based on the
setting of the ST primary chip input pin.
: This signal is logically OR’d with the XAUI_ORDER register bit (Register
ST=0
Bit 32809.15). XAUI applications can either tie this input signal high (preferred)
or tie this signal low (must program the XAUI_ORDER register bit after device
reset to high if CODE is tied off low). 10GFC applications MUST tie this signal
low.
ST=1
: This signal is logically OR’d with the PCS_EN register bit (Register Bit
17.3). RGMII/GMII applications can either tie this input signal high (preferred) or
tie this signal low (must program the PCS_EN 17.3 register bit after device reset
to high if CODE is tied off low). Nom RGMII/GMII applications MUST tie this
input signal low.
PRBS_EN: This is th
e PRBS Enable Pin. When this pin is asserted HIGH, the internal PRBS
generator and comparator circuits are enabled on the transmit and receive data paths of all
channels. The PRBS results for each channel can be read through MDIO counters. Primary
chip output signals GPO3/GPO2/GPO2/GPO0 remain low during PRBS testing when the input
serial stream PRBS pattern is correct, and pulse high when PRBS errors are detected on the
input serial stream on a per channel basis.
GPO3
GPO2
GPO1
GPO0
: Contains the Channel 3 PRBS currently passing (when low) indication.
: Contains the Channel 2 PRBS currently passing (when low) indication.
: Contains the Channel 1 PRBS currently passing (when low) indication.
: Contains the Channel 0 PRBS currently passing (when low) indication.
An external loopback connection (via external cables) is required during PRBS
testing.
ST=0: PRBS 223-1 is transmitted on each transmit channel serial output, and
compared on each receive channel serial input.
: PRBS 27-1 is transmitted on each transmit channel serial output, and
ST=1
compared on each receive channel serial input.
SLOOP: This pin is the Serial Loop Enable pin. When SLOOP is asserted HIGH, the serial
input from each channel is internally looped back to that
channel’s serial output, making that
channel a serial repeater. In device configurations where clock tolerance compensation is not
performed in the transmit direction, there are two options for error free serial loopback operation:
1) Frequency lock (0 ppm) the incoming serial data rate to the local reference
clock device
input.
2) Provision the TX SERDES REFCLK to run from
a jitter cleaned version of the
RX SERDES RXBCLK (Receive Byte Clock).
PLOOP: This pin is the Parallel Loop Enable pin. When PLOOP is asserted HIGH, the serial
output for each channel is internally looped back to its serial input so t
hat the transmit parallel
interface input data is output onto the receive parallel interface.
SPEED[1:0]: These are the Speed Selection Pins and put all four channels of the TLK3134 into
one of the three supported (full/half/
quarter) channel operation speeds.
00 – All Four Channels in Full Rate mode
01 – All Four Channels in Half Rate mode
10 – All Four Channels in Quarter Rate mode
11 – Software Selectable Rate
In the Software selectable rate mode, the rate for each channel may be
configured independently by the
The SPEED[1:0] inputs
control both RX and TX directions for all four channels
(Including XAUI and 10GFC
MDIO interface.
modes).
Please see Appendix A of the TLK3134 Datasheet for further information on
speed selection (full/half/quarter) for proper settings as a function
of the
application mode and reference clock frequency.
Please note that if these pins are not configured on the application board to
select “Software Selectable Rate”, then th
cannot be used to control the rate settings, and the full/half/quarter rate
selection is fixed.
ENABLE: This is the Device Enable pin. When ENABLE is held low, the device is in a low
power state. When ENABLE is high the device operates normally. A hard or soft reset muc
be applied after a change of state occurs on this input signal.
PRTAD[4:0]: These are the Port Address Assignment Pins and are used to select the Device
SLLU104A - September 2007
ID/Port ID in Clause 22/Clause 45 MDIO modes.
.
ST=0 (Clause 45 Mode)
:
If PRTAD[0] is a 0, then a PHY device is selected for XAUI/10GFC register
accesses (4.x
xxxx.x).
If PRTAD[0] is a 1, then a DTE device is selected for XAUI/10GFC register
accesses (5.x
xxxx.x).
PRTAD[4:1] selects the Clause 45 port address (TLK3134 must be located on
even boundaries since the lowest port address bit determines DTE/PHY, and is
used as a d
ST=1 (Clause 22 Mode)
evice address instead of port address).
:
PRTAD[4:2] selects a block of four sequential Clause 22 port addresses. Each
channel is implemented as a different port address, and can be accessed by
setting the a
ppropriate port address field within the Clause 22 MDIO transaction.
PRTAD[1:0] pins are not used in Clause 22 mode.
Channel 0 responds to port address 0 within the block of four port addresses.
Channel 1 responds to port address 1 within the block of four port addresses.
Channel 2 responds to port address 2 within the block of four port addresses.
Channel 3 responds to port address 3 within the block of four port addresses.
The TLK3134 supports the Management Data Input/Output (MDIO) Interface as defined in Clauses 22
and 45 of the IEEE 802.3ae Ethernet Specification. The MDIO allows register-based management and
control of the serial links. Normal operation of the TLK3134 is possible without the use of this interface,
however, some additional features are accessible only through this interface.
The MDIO Management Interface consists of a bi-directional data path (MDI
O) and a clock reference
(MDC). The device ID and port address are determined by control pins PRTAD[4:0]. The ST pin
controls whether the device responds as a Clause 22 or Clause 45 device.
In Clause 45 (ST=0), the top 4 control pins PRTAD[4:1] determine the device port address. In Clause
45 mode the TLK3134 can be accessed only through even port addresses. In th
is mode, the TLK3134
will respond if the PHY address field on the MDIO protocol (PA[4:0]) matches {PRTAD[4:1], 1’b0}. The
PRTAD[0] pin acts as a device ID pin where it determines whether the TLK3134 is a DTE or PHY
device and is required to be either 4 (PHY) or 5 (DTE), so only one bit is required to differentiate. If
PRTAD[0] is a 0, then a PHY device is selected for the XGXS. If PRTAD[0] is a 1, then a DTE device is
selected for the XGXS. In this mode, TLK3134 will respond as PHY if the Device address field
(DA[4:0]) on the MDIO protocol is 5’b00100 and as DTE if it is 5’b00101. Note, each register is
accessed as either DTE or PHY devices in the TLK3134, although physically there is only one register
accessed two different ways.
In Clause 22 (ST=1), the top 3 control pins PRTAD[4:2] determine the device port address. In this
mode the 4 individual channels in TLK3134 are classif
ied as 4 different ports. So for any PRTAD[4:2]
value there will be 4 ports per TLK3134. The TLK3134 will respond if the 3 MSB’s of PHY address field
on MDIO protocol (PA[4:2]) matches PRTAD[4:2]. The 2 LSB’s of PHY address field (PA[1:0]) will
determine which channel/port within the TLK3134 to respond.
If PA[1:0] = 2’b00, TLK3134’s Channel 0 will respond.
If PA[1:0] = 2’b01, TLK3134’s Channel 1 will respond.
If PA[1:0] = 2’b10, TLK3134’s Channel 2 will respond.
If PA[1:0] = 2’b11, TLK3134’s Channel 3 will respond.
Write transactions to invalid registers or read only registers will be ignored. Read transactions of invalid
registers will return a “0”.
The bi-directional MDIO pin is pulled up to 1.2V or 2.5V (VDDM) with a 1.5k Ω re
The EVM also provides a separate connector to support the full five-pin JTAG interface of the TLK3134
as defined in IEEE 1149.1 for manufacturing tests.
.
TDI: This pin is the JTAG Input Data pin and is used
to serially shift test data and test
instructions into the device during the operation of the test port.
TDO: This pin is the JTAG Outp
ut Data pin and is used to serially shift test data and test
instructions out of the device during operation of the test port. When JTAG port is not in use,
TDO is in a high impedance state.
TMS: This pin is the JTAG Mode Select pin and is used to control the state of the internal testport controller.
TCK: This is the JTAG Clock pin and is used to clock stat
e information and test data into and
out of the device during the operation of the test port.
TRST_N: This is the JTAG Test Reset pin and is used to reset the JTAG logic into system
operational mode. NOTE
: TRST_N should be tied low when the JTAG port is not in use and
during normal operation of the port as shown in the following figure.
The TLK3134 EVM comes configured for Manual Reset operations involving the Pushbutton
Reset Switch (SW1). When switch SW1 is pressed, the TLK3134 device RESET pin (RST_N)
goes LOW and the entire TLK3134 device is reinitialized. A TI TPS3125J18 Ultra Low Voltage
Processor Supervisory Circuit is used to control the Reset line. During power-on, /RESET pin of
U2 is asserted when the supply voltage becomes higher than 0.75V. Thereafter, the supply
voltage supervisor monitors the voltage and keeps /RESET output active as long as the Voltage
remains below the threshold voltage (V
inactive state (high) to ensure proper system reset. The delay time, t
voltage has risen above the threshold voltage (V
There is also a manual reset input to the supervisory circuit, /MR, which accepts the input from
the pushbutton switch SW
the TLK3134 device whenever the pushbutton RESET is pressed. By placing a jumper on
JMP11, the Manual Reset (/MR) is tied hard to ground causing the TLK3134 to be held in a
constant state of Reset without the need to continually hold the Reset Pushbutton SW1. The
Supervisory circuit will release the Reset line to a HIGH 180mS (t
becomes greater than the threshold voltage (V
By removing the jumper from JMP10, the Supervised Reset Circuit is disconnected from the
RST_N line. Reset control from an external controller or piec
directly to pin 2 (RST_N) of JMP10 and a ground pin GND has been added to the JMP10 header
next to the RST_N pin to allow easy access for the return current on that cable.
). An internal timer delays the return of the output to the
IT
=180ms, starts after the
d
).
IT
1. A low level at /MR causes /RESET to become active, thus resetting
) from the time the /MR line
d
).
IT
e of equipment can be connected
Figure 11. RESET Switch (SW1, JMP10, or JMP11)
NOTE: The Jumper on JMP10 connecting RESET SW to RST_N must be connected as shown
in order to cause the TLK3134 to be reset and reinitialized If switch
SW1 is pressed, the device
RESET pin (RST_N) goes LOW, the entire TLK3134 device is reinitialized.
The parallel signals have on the TLK3134 EVM have been routed to a 0.1” header block that is
configured like the following figure. All RXD pins on all 4 header blocks (RXD[7:0], RXD[15:8],
RXD[23:16], RXD[31:24]), as well as all TXD pins on all 4 header blocks (TXD[7:0], TXD[15:8],
TXD[23:16], TXD[31:24]), have matched trace lengths to themselves +/- 1MIL. Due to routing
constraints RXD[31:0] and TXD[31:0] trace lengths are not matched to each other, but only to
themselves.
.
Figure 12. Parallel Signal Header Block Example
Parallel Loop back, shown in the following figure, can be easily implemented by placing Jumper
s
on the RX/TX pins of the header. For example, placing a jumper on pins 2 and 3 of JMP30 will
loop back TXD7 to RXD7.
Additional GND and VDD pins have been added into the header block for several reasons. The
GND pins next to the RXD and TXD pins provide a convenient ground reference for a scope
probe or coax cables. The additional TXD row and VDD pins allow a static pattern to be driven
into the TXD bus by placing jumpers across either the TXD and VDD pins for a HIGH, or TXD
and GND pins for a LOW eliminating the need for cables during quick tests. The extra row of
TXD can also be used to monitor the signals on the TXD pins while simultaneously looping back
into the RXD pins. The following figure shows a clock pattern (01010101) on TXD[7:0] being
looped back onto the RXD[7:0] pins.
Figure 14. Parallel Loop Back with Static Data Pattern Example
TXD 7:0
12
6
JMP30
7
1
RXD 7:0
484218 24 3036
VDD
TX
GND
TX
RX
GND
433713 19 2531
PARALLEL
LOOPBACK
The Transmit Data Clocks and Receive Data Clocks (XGMII) are located in header blocks
JMP32 and JMP33 with the clock pins next to
each other. These four signals are the parallel
(XGMII) side input and output clocks per channel. In XAUI/10GFC mode, TXCLK_1 and
RXCLK_1 are used. During Parallel Loopback, the clocks can be jumpered together as shown in
the following diagram.
Figure 15. Parallel Loop Back with Static Data Pattern Example
The device reset requirements and setup procedure to configure the TLK3134 for XAUII Mode
(XGMII) is as follows:
REFCLK frequency = 156.25 MHz, Serdes Data Rate = Full Rate, Mode = Transceiver,
Edge Mode = Source Centered, RX_CLK out = TXBCLK, Jitter Cleaner PLL Multiplier Ratio = 1X or Off
•Device Pin Setting(s) – Pin settings allow for maximum software configurability.
Ensure ST input pin is Low.
o
o Ensure CODE input pin is Low.
o Ensure PLOOP input pin is Low.
o Ensure SLOOP input pin is Low.
o Ensure SPEED [1:0] input pins are both High.
o Ensure ENABLE input pin is High.
o Ensure PRBS_EN input pin is Low.
• Reset Device
Issue a hard or soft reset (RST_N asserted for at least 10 us -or- Write 1’b1 to 4/5.0.15)
o
• Clock Configuration
If using JCPLL (JCPLL 1X)
o
JCPLL Mux Settings (Figure 3
Select REFCLK input (Default = Differential)
• If Single Ended REFCLK used – Write 2’b01 to 4/5.37120.15:14
• If Differential REFCLK used – Write 2’b00 to 4/5.37120.15:14
Write 2’b11 to 4/5.37120.13:12 to select differential REFCLKP/N as RXBYTECLK
Write 4’b0000 to 4/5.37120.11:8 to select jitter clean
Write 2’b00 to 4/5.37120.5:4 to select jitter clean
Write 2’b00 to 4/5.32810.15:14 to select SERDES TX clock as RX_CLK output
Write 16’h0081 to 4/5.37126 to set Charge pump control
Write 16’h0080 to 4/5.37128 to set TXRX output divider
Write 7’b1000000 to 4/5.37124.14:8 to set REF_DIV to value of 1
Write 1’b1 to 4/5.37124.15 REFDIV_EN to enable reference clock divider
Write 7’h14 to 4/5.37124.6:0 to set FB
Write 1’b1 to 4/5.37124.7 FBDIV_EN to enable feedback divider
Write 7’h14 to 4/5.37125.6:0 to set RXTX_DIV to value of 20
Write 1’b1 to 4/5.37125.7 OUTDIV_EN to enable output divider
Write 7’h0D to 4/5.37121.14:8 to set HSTL_DIV to value of 13
Write 7’h06 to 4/5.37121.6:0 to set HSTL_DIV2 to value
Write 15’h1515 to 4/5.36864.14:0 SERDES_PLL_CONFIG to set MPY RX/T
Write 16’h0000 to 4/5.36865 SERDES_RATE_CONFIG_TX_RX to set Full Rate
Write 1’b1 to 4/5.37127.15 to enable Jitter Cleaner
Wait 2 ms in order for JCPLL to lock
Select REFCLK input (Default = Differential)
• If Single Ended REFCLK used – Write 2’b01 to 4/5.37120.15:14
• If Differential REFCLK used – Write 2’b00 to 4/5.37120.15:14
Select RXBYTE_CLK (Default = Differential)
• If Single Ended REFCLK used – Write 2’b10 to 4/5.37120.13:12
• If Differential REFCLK used – Write 2’b11 to 4/5.37120.13:12
• If Single Ended REFCLK used – Write 2’b10 to 4/5.37120.9:8
• If Differential REFCLK used – W
Select HSTL_2X_CLK (Default = Differential)
• If Single Ended REFCLK used – Write 2’b10 to 4/5.37120.5:4
• If Differential REFCLK used – W
of the TLK3134 Datasheet)
of theTLK3134 Datasheet)
_DIV to value of 20
of theTLK3134 Datasheet)
ite 2’b11 to 4/5.37120.9:8
r
ite 2’b11 to 4/5.37120.5:4
r
ed clock
ed clock for HSTL VTP 2x
for SERDES TX/RX.
of 6
.
X multiplier factor to 10
SLLU104A - September 2007
Write 2’b00 to 4/5.32810.15:14 to select SERDES TX clock as RX_CLK output
Write 6’h04 to 4/5.37121.6:0 to set HSTL_DIV2 to value of 4.
Write 16’h0000 to 4/5.36865 SERDES_RATE_CONFIG_TX_RX to set Full Rate
• Mode Control (Table 2
o Write 1’b1 to 4/5.32809.15
o Write 1’b0 to 4/5.32808.15 to set source centered data for TX side
o Write 1’b0 to 4/5.32808.11 to set source centered data for RX side
o Write 1’b0 to 4/5.32792.1 to disable XAUI data loop back
o Write 1’b0 to 4/5.32792.0 to disable XGMII data loop back
o Write 1’b0 to 4/5.0.14 to disable loop back mode
o Write 3’b110 to 4/5.36874.11:9 to set lane 0 TX swing setting amplitude to 1250 mVdfpp
o Write 3’b110 to 4/5.36876.11:9 to set lane 1 TX
o Write 3’b110 to 4/5.36878.11:9 to set lane 2 TX
o Write 3’b110 to 4/5.36880.11:9 to set lane 3 TX
• Poll Serdes PLL Status for Locked State
o Read 4/5.36891.4,0 SERDES_PLL_STAT
o Keep polling until both bits are high.
•
Issue Data path Reset
Write 1’b1 to 4/5.32800.15
o
•Clear Latched Registers
o
Read 4/5.1 XS_STATUS_1 to clear
o Read 4/5.8 XS_STATUS_2 to clear
o Read 4/5.32770 TX_FIFO_STATUS to clear
o Read 4/5.32771 TX_FIFO_DROP_COUNT to clear
o Read 4/5.32772 TX_FIFO_INSERT_COUNT to clear
o Read 4/5.32773 TX_CODEGEN_STATUS to clear
o Read 4/5.(32780,1,2,3) LANE_0~3_EOP_E
o Read 4/5.(32784,5,6,7) LANE_0~3_CODE_ERROR
o Read 4/5.32789 RX_LANE_ALIGN_STATUS to clear
o Read 4/5.32790 RX_CHANNEL_SYNC_STATUS to clear
o Read 4/5.32794 RX_CTC_STATUS to clear
o Read 4/5.32795 RX_CTC_INSERT_COUNT to clear
o Read 4/5.32796 RX_CTC_DELETE_COUNT to clear
o Read 4/5.32797 DATA_DOWN to clear
o Read 4/5.32799 CLOCK_DOWN_STATUS to clear
o Read 4/5.36891 SERDES_PLL_STATUS to clear
• Operational Mode Status
o Read Verify 4/5.1.7 XS_STATUS_1 – Fault (1’b0)
o Read Verify 4/5.1.2 XS_STATUS_1 – XS Transmit Link Status (1’b1)
o Read Verify 4/5.8.11 XS_STATUS_2 – Transmit fault (1’b0)
o Read Verify 4/5.8.10 XS_STATUS_2 – Receive fault (1’b0)
o Read Verify 4/5.24.12 XS_LANE_STAT
o Read Verify 4/5.24.3:0 XS_LANE_STAT
o Read Verify 4/5.32773.6:0 TX_CODEGEN_STATUS (6’b000000)
o Read Verify 4/5.36891.4 SERDES_PLL_STATUS – PLL_LOCK_RX (1’b1)
o Read Verify 4/5.36891.0 SERDES_PLL_STATUS – PLL_LOCK_TX (1’b1)
of theTLK3134 Datasheet)
XAUI_ORDER
swing setting amplitude to 1250 mVdfpp
swing setting amplitude to 1250 mVdfpp
swing setting amplitude to 1250 mVdfpp
Gigabit Ethernet Mode (RGMII) Test and Setup Configuration
The device reset requirements and setup procedure to configure the TLK3134 for Gigabit
Ethernet Mode (RGMII) is as follows:
*Note: All global registers must be accessed indirectly through Clause 22.
REFCLK frequency = 125 MHz, Serdes Data Rate = Half Rate, Mode = Tr
RX_CLK[n] out = TXBCLK[n], Jitter Cleaner PLL Multiplier Ratio = 1X or Off
•Device Pin Setting(s) – Pin settings allow for maximum software configurability.
o Ensure ST input pin is high.
o Ensure CODE input pin is Low.
o Ensure PLOOP input pin is Low.
o Ensure SLOOP input pin is Low.
o Ensure SPEED [1:0] input pins are both High.
o Ensure ENABLE input pin is High.
o Ensure PRBS_EN input pin is Low.
• Reset Device
Issue a hard or soft reset (RST_N asserted for at least 10 us -or- W
o
• Clock Configuration
oIf using JCPLL (JCPLL 1X)
JCPLL Mux Settings (
Select REFCLK input (Default = Differential)
• If Single Ended REFCLK used – Write 2’b01 to 4/5.37120.15:14
• If Differential REFCLK used – Write 2’b00 to 4/5.37120.15:14
Write 2’b11 to 4/5.37120.13:12 to select differential REFCLKP/N as RXBYTECLK
Write 4’b0000 to 4/5.37120.11:8 to select jitter cleaned clock
Write 2’b11 to 4/5.37120.7:6 to select differential REFC
Write 2’b00 to 4/5.37120.5:4 to select jitter clean
Write 2’b00 to 16.10:9 to select SERDES TX clock as RX_CLK output (per channel)
Write 16’h0081 to 4/5.37126 to set Charge pump control
Write 16’h0080 to 4/5.37128 to set TXRX output divider
Clock Divid
Write 7’b1000000 to 4/5.37124.14:8 to set REF_DIV to value of 1
Write 1’b1 to 4/5.37124.15 REFDIV_EN to enable reference clock divider
Write 7’h18 to 4/5.37124.6:0 to set FB_DIV to value of 24
Write 1’b1 to 4/5.37124.7 FBDIV_EN to enable feedback divider
Write 7’h18 to 4/5.37125.6:0 to set RXTX_DIV to value of 24
Write 1’b1 to 4/5.37125.7 OUTDIV_EN to enable RXTX_DIV output divider
Write 7’h0D to 4/5.37121.14:8 to set HSTL_DIV to value of 13
Write 7’h06 to 4/5.37121.6:0 to set HSTL_DIV2 to value
Write 15’h1515 to 4/5.36864.14:0 SERDES_PLL_CONFIG to set MPY RX/T
Write 16’h5555 to 4/5.36865 SERDES_RATE_CONFIG_TX_RX to set Half Rate
Write 1’b1 to 4/5.37127.15 to enable Jitter Cleaner
Wait 2 ms in order for JCPLL to lock
Else if using clock bypass mode (JCPLL Off)
o
JCPLL Mux Settings (
Select REFCLK input (Default = Differential)
• If Single Ended REFCLK used – Write 2’b01 to 4/5.37120.15:14
• If Differential REFCLK used – Write 2’b00 to 4/5.37120.15:14
Select RXBYTE_CLK (Default = Differential)
• If Single Ended REFCLK used – Write 2’b10 to 4/5.37120.13:12
• If Differential REFCLK used – Write 2’b11 to 4/5.37120.13:12
• If Single Ended REFCLK used – Write 2’b10 to 4/5.37120.9:8
SLLU104A - September 2007
• If Differential REFCLK used – Write 2’b11 to 4/5.37120.9:8
Select DELAY_CLK (Default = Differential)
• If Single Ended REFCLK used – Write 2’b10 to 4/5.37120.7:6
• If Differential REFCLK used – Write 2’b11 to 4/5.37120.7:6
Select HSTL_2X_CLK (Default = Differential)
• If Single Ended REFCLK used – Write 2’b10 to 4/5.37120.5:4
• If Differential REFCLK used – W
Write 2’b00 to 16.10:9 to select SERDES TX clock as RX_CLK output (per channel)
Write 6’h04 to 4/5.37121.6:0 to set HSTL_DIV2 to value of 4.
Write 15’h1515 to 4/5.36864.14:0 SERDES_PLL_CONFIG to set MPY RX/T
Write 16’h5555 to 4/5.36865 SERDES_RATE_CONFIG_TX_RX to set Half Rate
• Mode Control (Table 2
o Write 1’b0 to 17.0 for RX source centered mode (per channel)
o Write 1’b0 to 17.1 for TX source centered mode (per channel)
o Write 1’b1 to 17.2 to enable 8B/10B encode decode functions (per channel)
o Write 1’b1 to 17.3 to enable 1000Base-X PCS TX & PCS RX functions (per channel)
o Write 1’b1 to 17.4 to set nibble order, LSB on rising edge, MSB on falling edge (per channel)
o Write 1’b1 to 17.5 to enable DDR data on TX/RX directions (per channel)
o Write 1’b0 to 17.6 to disable FC_PH overlay detection (per channel)
o Write 1’b1 to 17.7 to enable comma detection (per channel)
o Write 1’b0 to 17.9 to disable full DDR mode (per channel)
o Write 1’b0 to 16.8 to disable Farend Loop back (per channel)
o Write 1’b0 to 0.14 to disable loop back mode (per channel)
o Write 3’b111 to 4/5.36874.11:9 to set channel 0 TX swing setting amplitude to 1375 mVdfpp
o Write 3’b111 to 4/5.36876.11:9 to set channel 1 TX s
o Write 3’b111 to 4/5.36878.11:9 to set channel 2 TX s
o Write 3’b111 to 4/5.36880.11:9 to set channel 3 TX s
• Poll Serdes PLL Status for Locked State
o
Read 4/5.36891.4,0 SERDES_PLL_STAT
oKeep polling until both bits are high.
•Issue Data path Reset
Write 1’b1 to 16.11 (per channel)
o
•Clear Latched Registers
Read 1 PHY_STATUS_1 to clear (per channel)
o
o Read 18 PHY_RX_CTC_FIFO_STATUS to clear (per channel)
o Read 19 PHY_TX_CTC_FIFO_STATUS to clear (per channel)
o Read 28 PHY_CHANNEL_STATUS to clear (per channel)
o Read 4/5.36891 SERDES_PLL_STATUS to clear
• Operational Mode Status
o
Read Verify 1.2 PHY_STATUS_1 – Link Status (1’b1) (per channel)
o Read Verify 18.15 PHY_RX_CTC_FIFO_STATUS – RX_CTC_Reset (1’b0) (per channel)
o Read Verify 19.15 PHY_TX_CTC_FIFO_STATUS – TX_FIFO_Reset_1Gx (1’b0) (per channel)
o Read Verify 28.13:12 PHY_CHANNEL_STATUS – Enc/Dec Invalid Code Word (2’b00) (per channel)
o Read Verify 4/5.36891.4 SERDES_PLL_STATUS – PLL_LOCK_RX (1’b1)
**NOTE: The Impedance is set to 48.6 on the external signal traces (Top and Bottom) to
compensate for our manufacturer’s etching process. The end impedance after etching
should result in a 50 ohm Impedance. Always consult with your board manufacturer for
their process/design requirements to ensure the desired impedance is achieved.
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