TLC7524C, TLC7524E, TLC7524I
8-BIT MULTIPLYING DIGITAL-TO-ANALOG CONVERTERS
SLAS061C – SEPTEMBER 1986 – REVISED NOVEMBER 1998
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Easily Interfaced to Microprocessors
D
On-Chip Data Latches
D
Monotonic Over the Entire A/D Conversion
Range
D
Segmented High-Order Bits Ensure
Low-Glitch Output
D
Interchangeable With Analog Devices
AD7524, PMI PM-7524, and Micro Power
Systems MP7524
D
Fast Control Signaling for Digital
Signal-Processor Applications Including
Interface With TMS320
D
CMOS Technology
KEY PERFORMANCE SPECIFICATIONS
Resolution
Linearity error
Power dissipation at VDD = 5 V
Setting time
Propagation delay time
8 Bits
1/2 LSB Max
5 mW Max
100 ns Max
80 ns Max
description
The TLC7524C, TLC7524E, and TLC7524I are
CMOS, 8-bit, digital-to-analog converters (DACs)
designed for easy interface to most popular
microprocessors.
The devices are 8-bit, multiplying DACs with input latches and load cycles similar to the write cycles of a random
access memory . Segmenting the high-order bits minimizes glitches during changes in the most significant bits,
which produce the highest glitch impulse. The devices provide accuracy to 1/2 LSB without the need for thin-film
resistors or laser trimming, while dissipating less than 5 mW typically.
Featuring operation from a 5-V to 15-V single supply, these devices interface easily to most microprocessor
buses or output ports. The 2- or 4-quadrant multiplying makes these devices an ideal choice for many
microprocessor-controlled gain-setting and signal-control applications.
The TLC7524C is characterized for operation from 0°C to 70°C. The TLC7524I is characterized for operation
from –25°C to 85°C. The TLC7524E is characterized for operation from –40°C to 85°C.
AVAILABLE OPTIONS
PACKAGE
T
A
SMALL OUTLINE
PLASTIC DIP
(D)
PLASTIC CHIP CARRIER
(FN)
PLASTIC DIP
(N)
SMALL OUTLINE
(PW)
0°C to 70°C TLC7524CD TLC7524CFN TLC7524CN TLC7524CPW
–25°C to 85°C TLC7524ID TLC7524IFN TLC7524IN TLC7524IPW
–40°C to 85°C TLC7524ED TLC7524EFN TLC7524EN –
Copyright 1998, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
OUT1
OUT2
GND
DB7
DB6
DB5
DB4
DB3
R
FB
REF
V
DD
WR
CS
DB0
DB1
DB2
3212019
910111213
4
5
6
7
8
18
17
16
15
14
V
DD
WR
NC
CS
DB0
GND
DB7
NC
DB6
DB5
FN PACKAGE
(TOP VIEW)
OUT2
OUT1
NC
DB2
DB1
REF
DB4
DB3
NC
NC–No internal connection
R
FB
D, N, OR PW PACKAGE
(TOP VIEW)