User's Guide
SNAU232–July 2018
BOOSTXL-TLC2543 EVM User Guide
The TLC2543-Q1 BoosterPack™ Plug-in Module (BOOSTXL-TLC2543) allows users to evaluate the
functionality of Texas Instruments' TLC2543-Q1 SAR ADC. The TLC2543-Q1 is a 12-bit, 11-channel,
automotive qualified SAR ADC. This user’s guide describes both the hardware platform with an TLC2543Q1 device and the graphical user interface (GUI) software used to configure the various modes of
operation of this device.
Contents
1 Introduction ................................................................................................................... 2
2 BOOSTXL-TLC2543 EVM Overview...................................................................................... 3
3 BOOSTXL-TLC2543 EVM Setup .......................................................................................... 5
4 BOOSTXL-TLC2543 EVM GUI Operation .............................................................................. 13
5 Bill of Materials, Printed-Circuit Board Layout, and Schematics..................................................... 17
List of Figures
1 BOOSTXL-TLC2543 EVM Block Diagram ............................................................................... 2
2 BOOSTXL-TLC2543EVM Top Level Overview.......................................................................... 3
3 BOOSTXL-TLC2543 EVM GUI Installation .............................................................................. 5
4 BOOSTXL-TLC2543 EVM Driver Installation ............................................................................ 6
5 TM4C1294 LaunchPad™ Development Kit Stellaris Virtual Serial Port and ICDI Driver .......................... 7
6 TM4C1294 LaunchPad™ Development Kit Software Programming Setup.......................................... 8
7 TM4C1294 LaunchPad™ Development Kit Selection in Configuration Tab......................................... 9
8 TM4C1294 LaunchPad™ Development Kit Programming Using LM Flash Programmer ........................ 10
9 TMC1294 LaunchPad™ Development Kit VIA BoosterPack™ Plug-in Module Driver ........................... 11
10 BOOSTXL-TLC2543 EVM stacked on TM4C1294 LaunchPad™ Development Kit .............................. 12
11 BOOSTXL-TLC2543 GUI Landing Page................................................................................ 13
12 AIN0 (Channel0) Voltage.................................................................................................. 14
13 Frequency Domain Analysis Page....................................................................................... 15
14 BOOSTXL-TLC2543 Top Layer Routing................................................................................ 18
15 BOOSTXL-TLC2543 Ground Layer...................................................................................... 19
16 BOOSTXL-TLC2543 Power Layer ....................................................................................... 20
17 BOOSTXL-TLC2543 Bottom Layer Routing............................................................................ 21
18 BOOSTXL-TLC2543 EVM Schematic Diagram ........................................................................ 22
1 Input Connector and Channel Configuration............................................................................. 3
2 Bill of Materials ............................................................................................................. 17
Trademarks
BoosterPack, LaunchPad are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
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List of Tables
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BOOSTXL-TLC2543 EVM User Guide
1
Launchpad
Connectors
TLC2543
(U8)
Input
Connector
(J10)
5.5V
5V
11 Inputs
(AIN0 t AIN10)
OPA2320-Q1 (U7)
SPI
5V
REG71055-Q1
(U1)
TPS79901-Q1
(U2)
I2C
BR24G32FVT
-3AGE2
(EEPROM U4)
VCC
SMA
(J8)
SMA
(J13)
Two channels with
optional SMA input
REF5040A-Q1 (U9)
4.5V Reference
VREF
4.5V
AIN0
AIN1
EOC
Introduction
1 Introduction
The BOOSTXL-TLC2543 is a fully-assembled evaluation platform designed to highlight the TLC2543-Q1
device features and its various modes of operations.
The BOOSTXL-TLC2543 EVM interfaces to the TM4C1294 LaunchPad™ Development Kit (EK-
TM4C1294XL). The Tiva C Series TM4C1294 MCU on the TM4C1294 LaunchPad Development Kit
communicates with the TLC2543-Q1 through its SPI interface and acts as a USB-to-PC GUI
communication bridge.
NOTE: The BOOSTXL-TLC2543 requires an external master controller to evaluate the TLC2543-
Q1.
The TM4C1294 LaunchPad Development Kit is controlled by commands received from the BOOSTXLTLC2543 EVM GUI, and the kit returns the data to the GUI for display and analysis. If the TM4C1294
LaunchPad Development Kit is not used, the BoosterPack™ Plug-in Module format of the BOOSTXLTLC2543 board allows an alternative external host to communicate with the TLC2543-Q1.
The BOOSTXL-TLC2543 EVM incorporates all required circuitry and components with the following
features:
• The TLC2543-Q1 12-bit, 11-channel, automotive qualified SAR ADC with SPI interface
• The REF5045A optional low power voltage reference to generate a 4.5-V reference for the TLC2543Q1 VREF pin when using 5.0 V from TM4C1294 LaunchPad Development Kit
• The OPA2320 optional precision, low noise, dual operational amplifier to generate buffered input for
the TLC2543-Q1 AIN0 and AIN1 pins
• The TPS79901 optional adjustable linear regulator to generate stable 5V output voltage to power the
TLC2543-Q1 VCC pin when using the USB power from the TM4C1294 LaunchPad Development Kit
• SPI interface for communication and configuration of modes available on the TLC2543-Q1
Figure 1 shows the BOOSTXL-TLC2543 EVM architecture along with the key components and blocks
listed in the features.
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Figure 1. BOOSTXL-TLC2543 EVM Block Diagram
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2 BOOSTXL-TLC2543 EVM Overview
Section 2 lists various onboard components that are used to interface analog input, digital interface, and
provide power supply to BOOSTXL-TLC2543 EVM. Figure 2 shows a BOOSTXL-TLC2543 EVM overview.
BOOSTXL-TLC2543 EVM Overview
Figure 2. BOOSTXL-TLC2543EVM Top Level Overview
2.1 Connectors for Analog Input
The BOOSTXL-TLC2543 EVM is designed for easy interface-to-analog sources through a 100-mil header.
Connector J10 allows analog source connectivity. Table 1 lists the analog input connector and input
channel configuration.
Table 1. Input Connector and Channel Configuration
J10 Connector Pin Description
J10:1 Analog input for channel 0 of ADC
J10:2 Analog input for channel 1 of ADC
J10:3 Analog input for channel 2 of ADC
J10:4 Analog input for channel 3 of ADC
J10:5 and J10:6 BoosterPack™ Plug-in Module ground
J10:7 Analog input for channel 4 of ADC
J10:8 Analog input for channel 5 of ADC
J10:9 Analog input for channel 6 of ADC
J10:10 Analog input for channel 7 of ADC
J10:11 Analog input for channel 8 of ADC
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BOOSTXL-TLC2543 EVM Overview
Table 1. Input Connector and Channel Configuration (continued)
J10 Connector Pin Description
J10:12 Analog input for channel 9 of ADC
J10:13 Analog input for channel 10 of ADC
J10:15 and J10:16 BoosterPack™ Plug-in Module ground
J10:14, 17, 18, 19, 20 No Connection
The analog input range is from GND to +VREF. A maximum of 11 single-ended inputs may be applied to
J10 using pins J10:1 to J10:4 and J10:7 to J10:13.
The user can configure the input to channel 0 to use the OPA2320 buffer through a 100-Ω resistor with an
1000-pF capacitor to GND. Jumper J7 can be placed on pins 1-2 to select this unity gain buffer
configuration of the OPA2320. In this case, the channel 0 input is provided through the SMA connector J8.
The user can also place Jumper J12 on pins 1-2 to create a similar configuration for a channel 1 input
provided through the SMA connector J13.
2.2 Voltage Reference
The BOOSTXL-TLC2543 EVM has two sources for the reference voltage. Jumper J11 can select the
VREF voltage from either the REF5045A (U9) or from 5-V VCC. The EVM is factory-configured for use
with the REF5045A 4.5-V reference (J11 pins 2-3).
2.3 Digital Interface
As noted in Section 1, the BOOSTXL-TLC2543 EVM interfaces with the TM4C1294 LaunchPad
Development Kit, which in turn communicates with the computer over USB. The two devices on the
booster pack that the TM4C1294 communicates with are the TLC2543-Q1 ADC (over SPI) and the
EEPROM (over I2C). The EEPROM comes preprogrammed with the information required to configure and
initialize the BOOSTXL- TLC2543 EVM platform every time on power up.
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2.4 BOOSTXL-TLC2543 Digital I/O Interface
The BOOSTXL-TLC2543 EVM supports the SPI digital interface and functional modes as detailed in the
TLC2543-Q1 data sheet. The TM4C1294 LaunchPad Development Kit is operating at a 3.3-V logic level
and is connected to the 5-V digital I/O lines of the ADC through level shifters (SN74LVC1T45QDCURQ1
and SN74LVC2T45QDCURQ1).
2.5 Power Supply
The device supports a single power supply with a wide range of operation. The VCC can operate from 2.7
V to 5 V. The available onboard TPS79901 adjustable voltage regulator is configured to supply 5 V to the
TLC2543-Q1 VCC pin on the BOOSTXL-TLC2543 EVM.
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BOOSTXL-TLC2543 EVM Setup
3 BOOSTXL-TLC2543 EVM Setup
3.1 BOOSTXL-TLC2543 EVM Graphical User Interface Software Installation
The following steps describe the BOOSTXL-TLC2543 EVM GUI software installation:
1. Download the latest version of the EVM graphical user interface (GUI) installer from the Tools and
Software folder of the device, and run the GUI installer to install the EVM GUI software on your
windows PC.
2. Accept the License Agreements and follow the on-screen instructions to complete the installation (see
Figure 3).
Figure 3. BOOSTXL-TLC2543 EVM GUI Installation
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BOOSTXL-TLC2543 EVM Setup
3. Click the Next button when the Device Driver Installation Wizard prompt appears on the screen to start
the installation process (see Figure 4). Click the Finish button when the install is complete.
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Figure 4. BOOSTXL-TLC2543 EVM Driver Installation
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4. Open the computer's "Device Manager". You must be able to see the "Stellaris Virtual Serial Port" and
BOOSTXL-TLC2543 EVM Setup
"Stellaris In-Circuit Debug Interface" as shown in Figure 5.
Figure 5. TM4C1294 LaunchPad™ Development Kit Stellaris Virtual Serial Port and ICDI Driver
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BOOSTXL-TLC2543 EVM Setup
3.2 LM Flash Programmer for TM4C1294 LaunchPad™ Development Kit Software
Programming
The TM4C1294 LaunchPad Development Kit ships with a default firmware program flashed on its
memory. When a TM4C1294 LaunchPad Development Kit is connected to the PC for the first time, its
firmware needs to be updated for communications with the BOOSTXL-TLC2543 EVM. The following steps
describe the programming of this firmware on the flash memory:
1. Download the latest version of LM Flash Programmer. The LM Flash Programmer is also included as
part of the BOOSTXL-TLC2543 EVM GUI installation in the following folder: C:\Program Files
(x86)\Texas Instruments\TLC2543\Firmware
2. Make sure the power select JP1 jumper on the TM4C1294 LaunchPad Development Kit is on ICDI.
Connect the Debug USB port on the TM4C1294 LaunchPad Development Kit to the PC with a micro
USB cable as shown in Figure 6. This must light the green power LED D0 on the TM4C1294
LaunchPad Development Kit.
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Figure 6. TM4C1294 LaunchPad™ Development Kit Software Programming Setup
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3. Launch the LM Flash Programmer. In the Configuration tab select TM4C1294XL LaunchPad from the
BOOSTXL-TLC2543 EVM Setup
drop-down menu as shown in Figure 7.
Figure 7. TM4C1294 LaunchPad™ Development Kit Selection in Configuration Tab
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BOOSTXL-TLC2543 EVM Setup
4. Program the TM4C1294 with the BOOSTXL-TLC2543 EVM firmware from the Program tab as shown
in Figure 8.
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Figure 8. TM4C1294 LaunchPad™ Development Kit Programming Using LM Flash Programmer
5. Disconnect the micro USB cable from the TM4C1294 LaunchPad Development Kit debug port after
programming and verification is successful. Switch the power select JP1 jumper position from ICDI to
the OTG location.
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3.3 BOOSTXL-TLC2543 EVM Stack Up
The following steps are the instructions to set up the BOOSTXL-TLC2543 EVM for evaluation:
1. Stack the BOOSTXL-TLC2543 EVM on the TM4C1294 LaunchPad Development Kit. Make sure the
20-pin connector (J1, J3) on BOOSTXL-TLC2543 EVM is mapped against connector X6 and connector
(J4, J2), and that the BOOSTXL-TLC2543 EVM is mapped against connector X7 on the TM4C1294
LaunchPad Development Kit. Pin 1 of BOOSTXL-TLC2543 EVM must align with pin 1 of connector X6
on the TM4C1294 LaunchPad Development Kit.
2. Position the power select JP1 jumper on the TM4C1294 LaunchPad Development Kit on pins that
correspond to the OTG.
3. Connect the TM4C1294 LaunchPad Development Kit USB port U7 to the PC with the micro USB
cable. This must light the green power LED D0 on the TM4C1294 Development Kit
4. Open computer's "Device Manager". You must see under ports “VIA USB BoosterPack” and “VIA USB
BoosterPack Console” as shown in Figure 9
BOOSTXL-TLC2543 EVM Setup
Figure 9. TMC1294 LaunchPad™ Development Kit VIA BoosterPack™ Plug-in Module Driver
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BOOSTXL-TLC2543 EVM Setup
5. Figure 10 shows the assembled BOOSTXL-TLC2543 EVM and TM4C1294 LaunchPad Development
Kit configuration.
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Figure 10. BOOSTXL-TLC2543 EVM stacked on TM4C1294 LaunchPad™ Development Kit
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4 BOOSTXL-TLC2543 EVM GUI Operation
4.1 Description
Figure 11 shows the landing page of the BOOSTXL-TLC2543 EVM GUI. This page provides a high-level
overview of the TLC2543-Q1 device. The left corner shows the tabs required to navigate to the
BOOSTXL-TLC2543 EVM GUI Home and Analysis pages. When the TM4C1294 LaunchPad Development
Kit with the stacked BOOSTXL-TLC254 EVM is connected to the PC with the micro USB cable, the GUI
reads the onboard EEPROM to detect the BoosterPack Plug-in Module. Once the BoosterPack Plug-in
Module is detected and connected, the GUI indicates this status at the bottom left corner of the GUI.
BOOSTXL-TLC2543 EVM GUI Operation
Figure 11. BOOSTXL-TLC2543 GUI Landing Page
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BOOSTXL-TLC2543 EVM GUI Operation
4.2 Time Domain Analysis
Go to Analysis page, and select the Time Domain Analysis. Time Domain Analysis displays the acquired
data versus time for the selected channel as shown in Figure 12. Note default reference voltage for ADC
measurement REF Volt (V) is set as 4.5 V.
4.2.1 Measure AIN0 (Channel0) Voltage
This section describes the steps involved in selecting and measuring AIN0 (Channel0) voltage:
1. Make sure following shunt is in place on the BOOSTXL-TLC2543 EVM: J11 between 2 and 3 (select
VREF = 4.5 V)
2. Connect J10.1 to J1.1 (3.3 V) by a jumper wire.
3. Select "Samples" as 4096, set "SCLK" as 1000 (KHz), and set "Sample Rate" as 10 (KHz).
4. Make sure "Selected Channel" is Channel0 as shown in Figure 12 below.
5. Press “Collect”.
6. Make sure the Min Code, Max Code, Min Volt (V), and Max Volt (V) read outs are shown. See
Figure 12 for an example.
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Figure 12. AIN0 (Channel0) Voltage
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4.3 Frequency Domain Analysis
The Frequency Domain page in the GUI performs the fast fourier transform (FFT) of the captured data and
shows the resulting frequency domain plots of the selected channel of TLC2543-Q1. This page also
calculates key ADC dynamic performance parameters, such as signal-to-noise ratio (SNR), total harmonic
distortion (THD), signal-to-noise and distortion ratio (SINAD), spurious-free dynamic range (SFDR), and
effective number of bits (ENOB). Figure 13 shows the Frequency Domain analysis display for a 2-kHz
sinusoidal input generated by PSIEVM.
BOOSTXL-TLC2543 EVM GUI Operation
Figure 13. Frequency Domain Analysis Page
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BOOSTXL-TLC2543 EVM GUI Operation
4.3.1 FFT Analysis Settings and Controls
Sample Rate - This field indicates the sampling frequency of the ADC data (kHz)
Samples - The FFT requires a time domain record with a number of samples that is a power of 2. The
Samples drop-down menu provides a list of values that satisfy this requirement.
Fund Freq (kHz) - This field displays the frequency of the largest amplitude input signal computed from
the FFT data, typically the fundamental frequency.
Window - The window function is a mathematical function that reduces the signal to zero at the end
points of the data block.
In applications where coherent sampling cannot be achieved, a window-weighing function can be applied
to the data to minimize spectral leakage. The following options are available:
• Rectangular
• Hamming
• Hann
• Blackman
• 7-Term Blackman-Harris
For a more thorough discussion of windowing, refer to IEEE1241-2000
Harmonics - This field sets the number of harmonics that are included in the FFT performance
calculations.
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4.4 Histogram Analysis
The Histogram Analysis page creates a histogram of the captured channel data and displays it. A
histogram is merely a count of the number of times a code has occurred in a particular data set. The
following parameters of the captured data set are displayed:
• The Std Dev [σ] displays the standard deviation of the data set. This value is equivalent to the RMS
noise of the signal when analyzing a dc data set.
• The Mean displays the average value of the data set.
• The Median displays the median value of the data set.
• The Code Spread displays the peak-to-peak spread of the codes in the data set; for a dc data set, this
range would be the peak-to-peak noise.
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Bill of Materials, Printed-Circuit Board Layout, and Schematics
5 Bill of Materials, Printed-Circuit Board Layout, and Schematics
This section contains the BOOSTXL-TLC2543 EVM bill of materials (BOM), printed-circuit board (PCB)
layout, and schematics.
5.1 Bill of Materials
Table 2 lists the bill of materials (BOM) for the BOOSTXL-TLC2543 EVM.
Table 2. Bill of Materials
Designator Quantity Description Manufacturer Part Number Manufacturer
PCB 1 Printed Circuit Board DC012 Any
C1 1 CAP, CERM, 0.22 µF, 25 V, +/- 5%, X7R, 0603 C0603C224J3RAC7867 Kemet
C2, C4, C5 3 CAP, CERM, 2.2 µF, 16 V, +/- 10%, X7R, 0805 C0805C225K4RACTU Kemet
C3 1 CAP, CERM, 180 pF, 50 V, +/- 1%, C0G/NP0, 0402 04025A181FAT2A AVX
C6 1 CAP, CERM, 10 µF, 16 V, +/- 20%, X5R, 0805 0805YD106MAT2A AVX
C7, C16, C23, C27,
C28, C29
C9, C10, C12, C13,
C17, C19, C21
C11, C15 2 CAP, CERM, 0.1 µF, 16 V, +/- 10%, X7R, 0603 GRM188R71C104KA01D MuRata
C18, C30 2 CAP, CERM, 1000 pF, 50 V, +/- 5%, C0G/NP0, 0603 C0603C102J5GACTU Kemet
C22, C25 2 CAP, CERM, 0.1 uF, 25 V, +/- 10%, X5R, 0603 06033D104KAT2A AVX
C26 1 CAP, CERM, 10 uF, 25 V, +/- 10%, X5R, 0805 C2012X5R1E106K125AB TDK
C31 1 CAP, TA, 10 uF, 10 V, +/- 20%, 3 ohm, SMD TAJA106M010RNJ AVX
J1/J3, J2/J4 2 Receptacle, 2.54mm, 10x2, Tin, TH SSQ-110-03-T-D Samtec
J5, J7, J12 3 Header, 100mil, 2x1, Tin, TH PEC02SAAN Sullins Connector Solutions
J10 1 Header, 100mil, 10x2, Gold, TH TSW-110-07-G-D Samtec
J11 1 Header, 100mil, 3x1, Tin, TH PEC03SAAN Sullins Connector Solutions
R1, R3, R5, R6, R7,
R8, R9, R15, R19,
R28, R30
R2 1 RES, 10.0, 1%, 0.1 W, 0603 RC0603FR-0710RL Yageo America
R4 1 RES, 100 k, 0.1%, 0.063 W, 0402 RG1005P-104-B-T5 Susumu Co Ltd
R10 1 RES, 31.6 k, 1%, 0.063 W, 0402 CRCW040231K6FKED Vishay-Dale
R11, R14 2 RES, 10.0 k, 1%, 0.063 W, 0402 CRCW040210K0FKED Vishay-Dale
R12, R13 2 RES, 1.00 k, 1%, 0.0625 W, 0402 RC0402FR-071KL Yageo America
R16, R26 2 RES, 100 k, 5%, 0.063 W, 0402 CRCW0402100KJNED Vishay-Dale
R18, R29 2 RES, 100, 1%, 0.063 W, 0402 CRCW0402100RFKED Vishay-Dale
R20, R31 2 RES, 1.0 M, 5%, 0.063 W, 0402 CRCW04021M00JNED Vishay-Dale
R21, R22, R23, R24 4 RES, 49.9, 1%, 0.063 W, 0402 RC0402FR-0749R9L Yageo America
SH-J1 1 Shunt, 100mil, Gold plated, Black 382811-6 AMP
TP4, TP5, TP6, TP7 4 Test Point, Miniature, Black, TH 5001 Keystone
U1 1 5.5 V, Buck-Boost Charge Pump Regulator, 60 mA, 3 to
U2 1 Single Output High PSRR LDO, 200 mA, Adjustable 1.2
U3, U6 2 Automotive Catalog Dual-Bit Dual Supply Transceiver
U4 1 I2C BUS EEPROM (2-Wire), TSSOP-B8 BR24G32FVT-3AGE2 Rohm
U5 1 Automotive Catalog Single-Bit Dual-Supply Bus
U7 1 Automotive, Precision, 20MHz, 0.9pA Ib, RRIO, CMOS
6 CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0603 C0603C105K3RACTU Kemet
7 CAP, CERM, 0.01 µF, 16 V, +/- 10%, X7R, 0603 GRM188R71C103KA01D MuRata
11 RES, 0, 5%, 0.1 W, 0603 CRCW06030000Z0EA Vishay-Dale
REG71055IDDCRQ1 Texas Instruments
5.5 V Input, -40 to 85 degC, 6-pin SOT23 (DDC6),
Green (RoHS & no Sb/Br)
TPS79901QDRVRQ1 Texas Instruments
to 6.5 V Output, 2.7 to 6.5 V Input, with Low IQ, 6-pin
SON (DRV), -40 to 125 degC, Green (RoHS & no
Sb/Br)
SN74LVC2T45QDCURQ1 Texas Instruments
with Configurable Voltage Translation, DCU0008A
SN74LVC1T45QDCKRQ1 Texas Instruments
Transceiver with Configurable Voltage Translation and,
DCK0006A
OPA2320AQDGKRQ1 Texas Instruments
Operational Amplifier, DGK0008A (VSSOP-8)
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Bill of Materials, Printed-Circuit Board Layout, and Schematics
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Table 2. Bill of Materials (continued)
Designator Quantity Description Manufacturer Part Number Manufacturer
U8 1 Automotive 12-Bit Analog-to-Digital Converter With
U9 1 Automotive Catalog, Low Noise, Very Low Drift,
C8, C14, C20, C24,
C32
J6, J9, J14 0 Header, 100mil, 2x1, Tin, TH PEC02SAAN Sullins Connector Solutions
J8, J13 0 SMA Straight PCB Socket Die Cast, 50 Ohm, TH 5-1814832-1 TE Connectivity
R17, R27 0 RES, 1.0 k, 5%, 0.063 W, 0402 CRCW04021K00JNED Vishay-Dale
R25, R32 0 RES, 330 k, 5%, 0.063 W, 0402 CRCW0402330KJNED Vishay-Dale
TP1, TP2, TP3,
TP4, TP5, TP6, TP7
0 CAP, CERM, 0.01 µF, 16 V, +/- 10%, X7R, 0603 GRM188R71C103KA01D MuRata
0 Test Point, Multipurpose, Black, TH 5011 Keystone
Serial Control and 11 Analog Inputs, DB0020A (SSOP-
20)
Precision Voltage Reference, -40 to125 degC, 8-pin
SOIC (D), Green (RoHS & no Sb/Br)
TLC2543IDBRQ1 Texas Instruments
REF5045AQDRQ1 Texas Instruments
5.2 PCB Layout
Figure 14 to Figure 17 show the EVM PCB layout.
Figure 14. BOOSTXL-TLC2543 Top Layer Routing
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Bill of Materials, Printed-Circuit Board Layout, and Schematics
Figure 15. BOOSTXL-TLC2543 Ground Layer
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Bill of Materials, Printed-Circuit Board Layout, and Schematics
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Figure 16. BOOSTXL-TLC2543 Power Layer
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Bill of Materials, Printed-Circuit Board Layout, and Schematics
Figure 17. BOOSTXL-TLC2543 Bottom Layer Routing
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21
0.22uF
C1
GND
GND GND
10uF
C6
GND
180pF
C3
GND
GND
GND
GND
GND
1uF
C16
GND GND
GND
31.6k
R10
SCLK
SDO
CS
GND
GND
0
R15
0.01uF
C17
0.01uF
C8
SCLK_TIVA
ID_SDA
ID_SCL
WP
10.0k
R11
10.0k
R14
A0
1
A1
2
A2
3
VSS4SDA
5
SCL
6
WP
7
VCC
8
U4
EEPROM_8P
GNDGND GND
0
R1 CS_TIVA
0.1uF
C11
3V3
3V3
3V3
5V 5V5
5V
VDD
SDO_TIVA
0
R6
0
R5
ID_SCL
ID_SDA
0
R8
0
R9
100k
R4
AIN0
1
AIN1
2
AIN2
3
AIN3
4
AIN4
5
AIN5
6
AIN6
7
AIN7
8
AIN8
9
GND
10
AIN9
11
AIN10
12
REF-
13
REF+
14
CS
15
DATA OUT
16
DATA INPUT
17
I/O CLOCK
18
EOC
19
VCC
20
U8
TLC2543
TPS79901QDRVRQ1
GND
OUT
1
FB
2
3
EN
4
NC
5
IN
6
7
U2
0
R3 SDI_TIVA
AIN9
AIN8
AIN6
AIN5
AIN4
AIN3
AIN1
AIN0
AIN2
AIN7
AIN10
1
2
J12
AIN1
1
2
J6
SDI
TP4 TP5
IDD
CS SCLK SDI SDO
TP6 TP7
GND GND GND GND
GND GND GND GND
VDD5.5V5V
TP1
1
2
3
J11
10uF
C26
0.1uF
C25
GND
GND
GND GND GND GND
GND
VDD
VDD
0
R28
VREF
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
AIN8
AIN9
AIN10
TP2 TP3
1uF
C7
0
R7 EOC_TIVA
EOC
EOC
0.1uF
C22
GND GND
GND
VDD
0.01uF
C9
0.01uF
C10
GND
3V3
SCLK
CS
GND
SCLK_TIVA
CS_TIVA
GND
SDI
GND
GND
VDD
0.01uF
C12
0.01uF
C13
GND
3V3
GND
SDI_TIVA
GND GND
GND
3V3
0.01uF
C19
0.01uF
C21
GND
VDD
SDO_TIVA
EOC_TIVA
SDO
EOC
VIN
2
TEMP3GND
4
TRIM/NR
5
VOUT
6
U9A
TI-REF5045A-Q1D8
DNC
1
NC
7
DNC
8
U9B
TI-REF5045A-Q1D8
GND GND
GND GND
AIN10
AIN9AIN8
AIN7AIN6
AIN5AIN4
AIN3AIN2
AIN1AIN0
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15
17
19
16
18
20
J10
GND
100k
R26
GND
1
234
5
J13
0
R30
330k
R32
1.0M
R31
1.0k
R27
0.01uF
C24
0.01uF
C32
1
2
J14
GND
VDD
1
2
J7
AIN0
GND
100k
R16
GND
1
234
5
J8
0
R19
0.1uF
C15
330k
R25
1.0M
R20
1.0k
R17
0.01uF
C14
0.01uF
C20
1
2
J9
GND
VDD
VDD
2.2uF
C2
2.2uF
C5
2.2uF
C4
10.0
R2
1.00k
R12
1.00k
R13
49.9
R21
49.9
R22
49.9
R23
49.9
R24
10uF
C31
GND
GND
1uF
C27
1uF
C29 1uF
C28
1uF
C23
100
R18
100
R29
1000pF
C18
1000pF
C30
TP8
+3.3V
1
Analog_In
2
LP_UART_RX
3
LP_UART_TX
4
GPIO !
5
Analog In
6
SPI_CLK
7
GPIO !
8
I2C_SCL
9
I2C_SDA
10
+5V
21
GND
22
Analog_In
23
Analog_In
24
Analog_In
25
Analog_In
26
Analog_In/I2S_WS
27
Analog_In/I2S_SCLK
28
Analog_Out/I2S_SDout
29
Analog_Out/I2S_SDin
30
J1/J3
REG71055IDDCRQ1
VOUT
1
GND
2
ENABLE
3
CPUMP-
4
VIN
5
CPUMP+
6
U1
TP9
TP10
TP11
TP12
TP13
TP14
TP15
TP16
TP17
TP18 T19 T20 T21 T22 T23
T24
GPIO !
31
GPIO !
32
GPIO !
33
GPIO !
34
Timer_Cap/GPIO !
35
Timer_Cap/GPIO !
36
PWM/GPIO !
37
PWM/GPIO !
38
PWM/GPIO !
39
PWM/GPIO !
40
GPIO !
11
SPI_CS/GPIO !
12
SPI_CS/GPIO !
13
SPI_MISO
14
SPI_MOSI
15
RST
16
GPIO
17
GPIO !
18
PWM/GPIO !
19
GND
20
J2/J4
VDD
GND GND
2
3
1
A
OPA2320AQDGKRQ1
U7A
5
6
7
B
OPA2320AQDGKRQ1
U7B
V+8V-
4
OPA2320AQDGKRQ1
U7C
1
2
J5
GND
4
B2
6
B1
7
DIR
5
A1
2
A2
3
VCCA1VCCB
8
SN74LVC2T45QDCURQ1
U3
VCCA
1
GND
2
A
3
B
4
DIR
5
VCCB
6
U5
SN74LVC1T45QDCKRQ1
GND
4
B2
6
B1
7
DIR
5
A1
2
A2
3
VCCA1VCCB
8
SN74LVC2T45QDCURQ1
U6
Bill of Materials, Printed-Circuit Board Layout, and Schematics
www.ti.com
22
SNAU232– July 2018
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
BOOSTXL-TLC2543 EVM User Guide
5.3 Schematics
Figure 18. BOOSTXL-TLC2543 EVM Schematic Diagram
STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2 Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3 Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
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