DBV PACKAGE
(TOP VIEW)
1
2
3
5
4
IN−
V
CC−
/GND
IN+
V
CC
OUT
TL331
www.ti.com
......................................................................................................................................................... SLVS238F – AUGUST 1999 – REVISED JULY 2008
SINGLE DIFFERENTIAL COMPARATOR
1
FEATURES
• Single Supply or Dual Supplies
• Wide Range of Supply Voltage . . . 2 V to 36 V
• Low Supply-Current Drain Independent of
Supply Voltage . . . 0.4 mA Typ
• Low Input Bias Current . . . 25 nA Typ
• Low Input Offset Voltage . . . 2 mV Typ
• Common-Mode Input Voltage Range Includes
Ground
• Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . ± 36 V
• Low Output Saturation Voltage
• Output Compatible With TTL, MOS, and CMOS
DESCRIPTION/ORDERING INFORMATION
This device consists of a single voltage comparator that is designed to operate from a single power supply over a
wide range of voltages. Operation from dual supplies also is possible if the difference between the two supplies
is 2 V to 36 V and V
independent of the supply voltage. The output can be connected to other open-collector outputs to achieve
wired-AND relationships.
is at least 1.5 V more positive than the input common-mode voltage. Current drain is
CC
ORDERING INFORMATION
T
A
– 40 ° C to 85 ° C 5 mV SOT-23 – DBV T1I_
– 40 ° C to 105 ° C 5 mV SOT-23 – DBV T1K_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) The actual top-side marking has one additional character that designates the wafer fab/assembly site.
VIO(max)
AT 25 ° C
PACKAGE
Reel of 3000 TL331IDBVR
Reel of 250 TL331IDBVT
Reel of 3000 TL331KDBVR
Reel of 250 TL331KDBVT
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(1)
(3)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 1999 – 2008, Texas Instruments Incorporated
IN+
IN−
OUT
80-µA
Current Regulator
80 µA
60 µA 10 µA
V
CC
10 µA
OUT
GND
IN+
IN−
Epi-FET
Diodes
Resistors
Transistors
COMPONENT COUNT
1
2
1
20
TL331
SLVS238F – AUGUST 1999 – REVISED JULY 2008 .........................................................................................................................................................
www.ti.com
LOGIC DIAGRAM
SCHEMATIC
Note: Current values shown are nominal.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
V
V
V
V
I
Supply voltage
CC
Differential input voltage
ID
Input voltage range (either input) – 0.3 V to 36 V
I
Output voltage 36 V
O
Output current 20 mA
O
Duration of output short-circuit to ground
θ
T
T
Package thermal impedance
JA
Operating virtual junction temperature 150 ° C
J
Storage temperature range – 65 ° C to 150 ° C
stg
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground.
(3) Differential voltages are at IN+ with respect to IN – .
(4) Short circuits from outputs to V
(5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA)/ θJA. Operating at the absolute maximum TJof 150 ° C can impact reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
(2)
(3)
CC
(4)
(5) (6)
can cause excessive heating and eventual destruction.
36 V
± 36 V
Unlimited
206 ° C/W
2 Submit Documentation Feedback Copyright © 1999 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TL331
TL331
www.ti.com
......................................................................................................................................................... SLVS238F – AUGUST 1999 – REVISED JULY 2008
ELECTRICAL CHARACTERISTICS
at specified free-air temperature, V
PARAMETER TEST CONDITIONS
V
I
I
V
A
I
V
I
I
(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2) Full range TAis – 40 ° C to 85 ° C for I-suffix devices and – 40 ° C to 105 ° C for K-suffix devices.
(3) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the
Input offset voltage mV
IO
Input offset current VO= 1.4 V nA
IO
Input bias current VO= 1.4 V nA
IB
Common-mode input voltage
ICR
VD
OH
OL
OL
CC
(3)
range
Large-signal differential voltage V
amplification RL≥ 15 k Ω to V
High-level output current
Low-level output voltage IOL= 4 mA, VID= – 1 V mV
Low-level output current V
Supply current RL= ∞ , V
common-mode voltage range is V
= 5 V (unless otherwise noted)
CC
(1)
V
= 5 V to 30 V, VO= 1.4 V,
CC
VIC= V
IC(min)
= 15 V, VO= 1.4 V to 11.4 V,
CC
V
= 5 V, VID= 1 V 25 ° C 0.1 50 nA
OH
V
= 30 V, VID= 1 V Full range 1 µ A
OH
= 1.5 V, VID= 1 V 25 ° C 6 mA
OL
– 1.5 V, but either or both inputs can go to 30 V without damage.
CC+
CC
= 5 V 25 ° C 0.4 0.7 mA
CC
(2)
T
A
MIN TYP MAX UNIT
25 ° C 2 5
Full range 9
25 ° C 5 50
Full range 250
25 ° C – 25 – 250
Full range – 400
25 ° C
Full range
0 to
V
– 1.5
CC
0 to
V
– 1.5
CC
25 ° C 50 200 V/mV
25 ° C 150 400
Full range 700
V
SWITCHING CHARACTERISTICS
V
= 5 V, TA= 25 ° C
CC
PARAMETER TEST CONDITIONS TYP UNIT
Response time RLconnected to 5 V through 5.1 k Ω , CL= 15 pF
(1) (2)
(1) CLincludes probe and jig capacitance.
(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
100-mV input step with 5-mV overdrive 1.3
TTL-level input step 0.3
µ s
Copyright © 1999 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TL331
PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2013
PACKAGING INFORMATION
Orderable Device Status
TL331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
TL331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
TL331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
TL331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
TL331IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
TL331IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
TL331KDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
TL331KDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
TL331KDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
TL331KDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~
T1IL ~ T1IS)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~
T1IL ~ T1IS)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~
T1IL ~ T1IS)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~
T1IL ~ T1IU)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~
T1IL ~ T1IU)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~
T1IL ~ T1IU)
CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL)
CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL)
CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL)
CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL)
(4)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2013
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL331 :
Automotive: TL331-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
TL331IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TL331IDBVR SOT-23 DBV 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TL331IDBVT SOT-23 DBV 5 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TL331KDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TL331KDBVR SOT-23 DBV 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)B0(mm)K0(mm)P1(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jan-2013
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TL331IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TL331IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
TL331IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0
TL331KDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TL331KDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
Pack Materials-Page 2
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