Texas Instruments TL331IDBV, TL331KDBV Schematic [ru]

DBV PACKAGE

(TOP VIEW)

1
2
3

5

4

IN−

V

CC−

/GND

IN+

V

CC

OUT

TL331

www.ti.com

......................................................................................................................................................... SLVS238F – AUGUST 1999 – REVISED JULY 2008

SINGLE DIFFERENTIAL COMPARATOR

1

FEATURES

• Single Supply or Dual Supplies

• Wide Range of Supply Voltage . . . 2 V to 36 V

• Low Supply-Current Drain Independent of

Supply Voltage . . . 0.4 mA Typ

• Low Input Bias Current . . . 25 nA Typ

• Low Input Offset Voltage . . . 2 mV Typ

• Common-Mode Input Voltage Range Includes

Ground

• Differential Input Voltage Range Equal to

Maximum-Rated Supply Voltage . . . ± 36 V

• Low Output Saturation Voltage

• Output Compatible With TTL, MOS, and CMOS

DESCRIPTION/ORDERING INFORMATION

This device consists of a single voltage comparator that is designed to operate from a single power supply over a
wide range of voltages. Operation from dual supplies also is possible if the difference between the two supplies
is 2 V to 36 V and V
independent of the supply voltage. The output can be connected to other open-collector outputs to achieve
wired-AND relationships.

is at least 1.5 V more positive than the input common-mode voltage. Current drain is

CC

ORDERING INFORMATION

T

A

– 40 ° C to 85 ° C 5 mV SOT-23 – DBV T1I_

– 40 ° C to 105 ° C 5 mV SOT-23 – DBV T1K_

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) The actual top-side marking has one additional character that designates the wafer fab/assembly site.

VIO(max)

AT 25 ° C

PACKAGE

Reel of 3000 TL331IDBVR
Reel of 250 TL331IDBVT
Reel of 3000 TL331KDBVR
Reel of 250 TL331KDBVT

(2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

(1)

(3)

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 1999 – 2008, Texas Instruments Incorporated

IN+
IN−

OUT

80-µA
Current Regulator

80 µA

60 µA 10 µA

V

CC

10 µA

OUT

GND

IN+

IN−

Epi-FET
Diodes
Resistors
Transistors

COMPONENT COUNT

1
2
1
20

TL331

SLVS238F – AUGUST 1999 – REVISED JULY 2008 .........................................................................................................................................................

www.ti.com

LOGIC DIAGRAM

SCHEMATIC

Note: Current values shown are nominal.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

V
V
V
V
I

Supply voltage

CC

Differential input voltage

ID

Input voltage range (either input) – 0.3 V to 36 V

I

Output voltage 36 V

O

Output current 20 mA

O

Duration of output short-circuit to ground

θ

T
T

Package thermal impedance

JA

Operating virtual junction temperature 150 ° C

J

Storage temperature range – 65 ° C to 150 ° C

stg

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground.
(3) Differential voltages are at IN+ with respect to IN – .
(4) Short circuits from outputs to V
(5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD= (TJ(max) – TA)/ θJA. Operating at the absolute maximum TJof 150 ° C can impact reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.

(2)

(3)

CC

(4)

(5) (6)

can cause excessive heating and eventual destruction.

36 V

± 36 V

Unlimited
206 ° C/W

2 Submit Documentation Feedback Copyright © 1999 – 2008, Texas Instruments Incorporated

Product Folder Link(s): TL331

TL331

www.ti.com

......................................................................................................................................................... SLVS238F – AUGUST 1999 – REVISED JULY 2008

ELECTRICAL CHARACTERISTICS

at specified free-air temperature, V

PARAMETER TEST CONDITIONS

V

I

I

V

A

I

V

I
I

(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2) Full range TAis – 40 ° C to 85 ° C for I-suffix devices and – 40 ° C to 105 ° C for K-suffix devices.
(3) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the

Input offset voltage mV

IO

Input offset current VO= 1.4 V nA

IO

Input bias current VO= 1.4 V nA

IB

Common-mode input voltage

ICR

VD

OH

OL

OL
CC

(3)

range

Large-signal differential voltage V
amplification RL≥ 15 k Ω to V

High-level output current

Low-level output voltage IOL= 4 mA, VID= – 1 V mV

Low-level output current V
Supply current RL= ∞ , V

common-mode voltage range is V

= 5 V (unless otherwise noted)

CC

(1)

V

= 5 V to 30 V, VO= 1.4 V,

CC

VIC= V

IC(min)

= 15 V, VO= 1.4 V to 11.4 V,

CC

V

= 5 V, VID= 1 V 25 ° C 0.1 50 nA

OH

V

= 30 V, VID= 1 V Full range 1 µ A

OH

= 1.5 V, VID= 1 V 25 ° C 6 mA

OL

– 1.5 V, but either or both inputs can go to 30 V without damage.

CC+

CC

= 5 V 25 ° C 0.4 0.7 mA

CC

(2)

T

A

MIN TYP MAX UNIT

25 ° C 2 5

Full range 9

25 ° C 5 50

Full range 250

25 ° C – 25 – 250

Full range – 400

25 ° C

Full range

0 to

V

– 1.5

CC

0 to

V

– 1.5

CC

25 ° C 50 200 V/mV

25 ° C 150 400

Full range 700

V

SWITCHING CHARACTERISTICS

V

= 5 V, TA= 25 ° C

CC

PARAMETER TEST CONDITIONS TYP UNIT

Response time RLconnected to 5 V through 5.1 k Ω , CL= 15 pF

(1) (2)

(1) CLincludes probe and jig capacitance.
(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.

100-mV input step with 5-mV overdrive 1.3
TTL-level input step 0.3

µ s

Copyright © 1999 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Link(s): TL331

PACKAGE OPTION ADDENDUM

www.ti.com

26-Mar-2013

PACKAGING INFORMATION

Orderable Device Status

TL331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS

TL331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS

TL331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS

TL331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS

TL331IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS

TL331IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS

TL331KDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS

TL331KDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS

TL331KDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS

TL331KDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~

T1IL ~ T1IS)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~

T1IL ~ T1IS)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~

T1IL ~ T1IS)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~

T1IL ~ T1IU)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~

T1IL ~ T1IU)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~

T1IL ~ T1IU)

CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL)

CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL)

CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL)

CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL)

(4)

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

Samples

Addendum-Page 1