Operates From a Single 5-V Supply or From
a Split ±5-V Supply
D
Complementary Outputs
D
Input Common-Mode Voltage Includes
Negative Rail
D
Low Offset Voltage
D
No Minimum Slew Rate Requirement
D
Output Latch Capability
D
Functional Replacement to the LT1116
description
The TL31 16 is an ultra-fast comparator designed
to interface directly to TTL logic while operating
from either a single 5-V power supply or dual
±5-V supplies. The input common-mode voltage
extends to the negative rail for ground sensing
applications. It features extremely tight offset
voltage and high gain for precision applications. It
has complementary outputs that can be latched
using the LATCH ENABLE terminal. Figure 1
shows the positive supply current of the
comparator. The TL3116 only requires 12.7 mA
(typical) to achieve a propagation delay of 10 ns.
The TL3116 is a pin-for-pin functional replacement for the LT1116 comparator, offering
high-speed operation but consuming much less
power.
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
0°C to 70°CTL3116CDTL3116CPWLETL3116Y
–40°C to 85°CTL3116IDTL3116IPWLE—
†
The PW packages are available left-ended taped and reeled only.
‡
Chip forms are tested at TA = 25°C only.
SMALL
OUTLINE
(D)
†
TSSOP
(PW)
FORM
(Y)
PRECISION COMPARATORS
SLCS132B – MARCH 1997 – REVISED APRIL 1997
V
CC+
IN+
IN–
V
CC–
symbol (each comparator)
IN+
IN–
POSITIVE SUPPLY CURRENT
FREE-AIR TEMPERATURE
15
VCC = ± 5 V
14
13
12
11
10
9
8
– Positive Supply Current – mA
7
CC
I
‡
6
5
–50–250255075100125
TA – Free-Air Temperature – °C
TL3116, TL3116Y
ULTRA-FAST LOW-POWER
D AND PW PACKAGE
(TOP VIEW)
1
2
3
4
Figure 1
Q OUT
8
Q OUT
7
GND
6
LATCH ENABLE
5
Q OUT
OUT
Q
vs
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
This chip, when properly assembled, displays characteristics similar to the TL31 16C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
(4)
V
+
–
CC–
CC+
GND
(1)
(6)
(8)
(7)
Q OUT
Q OUT
55
(1)
(2)
(3)
(4)
(1)
(1)
63
(5)
(8)
(7)
(6)
(6)
(6)
IN+
IN–
(5)
(2)
(3)
LATCH ENABLE
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJ max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
TERMINALS 1 AND 6 CAN BE
CONNECTED TO MULTIPLE PADS.
COMPONENT COUNT
Bipolars53
MOSFETs49
Resistors46
Capacitors14
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL3116, TL3116Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS132B – MARCH 1997 – REVISED APRIL 1997
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to network ground.
2. Differential voltages are at IN+ with respect to IN–.