Operates From a Single 5-V Supply or From
a Split ±5-V Supply
D
Complementary Outputs
D
Low Offset Voltage
D
No Minimum Slew Rate Requirement
D
Output Latch Capability
D
Functional Replacement to the LT1016
description
The TL3016 is an ultrafast comparator designed
to interface directly to TTL logic while operating
from either a single 5-V power supply or dual
±5-V supplies. It features extremely tight offset
voltage and high gain for precision applications. It
has complementary outputs that can be latched
using the LATCH ENABLE terminal. Figure 1
shows the positive supply current of this
comparator. The TL3016 only requires 10.6 mA
(typical) to achieve a propagation delay of 7.6 ns.
The TL3016 is a pin-for-pin functional replacement for the LT1016 comparator, offering higher
speed operation but consuming half the power.
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
0°C to 70°CTL3016CDTL3016CPWLETL3016Y
–40°C to 85°CTL3016IDTL3016IPWLE—
†
The PW packages are available left-ended taped and reeled only.
‡
Chip forms are tested at TA = 25°C only.
SMALL
OUTLINE
(D)
†
TSSOP
(PW)
FORM
(Y)
D AND PW PACKAGE
(TOP VIEW)
V
V
CC+
IN+
IN–
CC–
1
2
3
4
Q OUT
8
Q OUT
7
GND
6
LATCH ENABLE
5
symbol (each comparator)
IN+
IN–
POSITIVE SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
15
VCC = ± 5 V
14
13
12
11
10
‡
9
8
– Positive Supply Current – mA
7
CC
I
6
5
– 50 – 250255075100125
TA – Free-Air Temperature – °C
Figure 1
Q OUT
Q
OUT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
This chip displays characteristics similar to the TL3016C. Thermal compression or ultrasonic bonding may be
used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon
preform.
55
(1)
(2)
(3)
(4)
BONDING PAD ASSIGNMENTS
(1)
(1)
63
(5)
(8)
(7)
(6)
(6)
(6)
V
(4)
V
+
–
CC–
CC+
(1)
(8)
(7)
(6)
GND
IN+
IN–
(5)
(2)
(3)
LATCH ENABLE
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJ max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
TERMINALS 1 AND 6 CAN BE
CONNECTED TO MULTIPLE PADS.
Q OUT
Q OUT
COMPONENT COUNT
Bipolars53
MOSFETs49
Resistors46
Capacitors14
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to network ground.
2. Differential voltages are at IN+ with respect to IN–.