These programmable array logic devices feature high speed and functional equivalency when compared with
currently available devices. These IMPACT-X circuits combine the latest Advanced Low-Power Schottky
technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for
conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically
results in a more compact circuit board.
The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for
operation over the full military temperature range of –55°C to 125°C.
These devices are covered by U.S. Patent 4,410,987.
IMPACT-X is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.
This document contains information on products in more than one phase
of development. The status of each device is indicated on the page(s)
specifying its electrical characteristics.
NOTE 1: These ratings apply except for programming pins during a programming cycle or during a preload cycle.
recommended operating conditions
MINNOMMAXUNIT
V
CC
V
IH
V
IL
I
OH
I
OL
T
A
NOTE 2: These are absolute voltage levels with respect to the ground pin of the device and include all overshoots due to system and/or tester
Supply voltage4.7555.25V
High-level input voltage (see Note 2)25.5V
Low-level input voltage (see Note 2)0.8V
High-level output current–3.2mA
Low-level output current24mA
Operating free-air temperature02575°C
noise. Testing these parameters should not be attempted without suitable equipment.
CIRCUITS
electrical characteristics over recommended operating free-air temperature range
PARAMETERTEST CONDITIONSMIN TYP†MAXUNIT
V
IK
V
OH
V
OL
‡
I
OZH
‡
I
OZL
I
I
‡
I
IH
‡
I
IL
§
I
OS
I
CC
C
i
C
o
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
I/O leakage is the worst case of I
§
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. VO is set at 0.5 V to
avoid test problems caused by test equipment ground degradation.
switching characteristicsover recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
FROM
(INPUT)
I, I/OO, I/O
t
pd
t
en
t
dis
I, I/OO, I/O
I, I/OO, I/O2727ns
I, I/OO, I/O2727ns
TO
(OUTPUT)
with up to 4 outputs
switching
with more than 4
outputs switching
TEST
CONDITIONS
R1 = 200 Ω,
R2 = 200 Ω,
See Figure 8
TIBPAL16L8-5CFN
MINMAXMINMAX
1.551.55
1.551.55.5
TIBPAL16L8-5CJ
TIBPAL16L8-5CN
UNITPARAMETER
ns
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
9
TIBPAL16R4-5C, TIBPAL16R6-5C
HIGH-PERFORMANCE IMPACT-X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
NOTE 1: These ratings apply except for programming pins during a programming cycle or during a preload cycle.
recommended operating conditions
V
CC
V
IH
V
IL
I
OH
I
OL
f
clock
w
t
su
t
h
T
A
NOTE 2: These are absolute voltage levels with respect to the ground pin of the device and include all overshoots due to system and/or tester
Supply voltage4.7555.25V
High-level input voltage (see Note 2)25.5V
Low-level input voltage (see Note 2)0.8V
High-level output current–3.2mA
Low-level output current24mA
Clock frequency0125MHz
Pulse duration, clockt
Setup time, input or feedback before clock↑4.5ns
Hold time, input or feedback after clock↑0ns
Operating free-air temperature02575°C
noise. Testing these parameters should not be attempted without suitable equipment.
CIRCUITS
High4
Low4
MINNOMMAXUNIT
ns
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TIBPAL16R4-5C, TIBPAL16R6-5C
HIGH-PERFORMANCE IMPACT -X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
electrical characteristics over recommended operating free-air temperature range
switching characteristicsover recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
TIBPAL16R4-5CJ
FROM
(INPUT)
without feedback125125
¶
f
max
t
pd
t
pd
t
pd
t
en
t
dis
t
en
t
dis
t
r
t
f
t
sk(o)
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
I/O leakage is the worst case of I
§
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. VO is set at 0.5 V to
avoid test problems caused by test equipment ground degradation.
¶
See ’f
max
#
t
is the skew time between registered outputs.
sk(o)
with internal feedback (counter configuration)125125MHz
with external feedback117111
CLK↑Q1.541.54.5ns
CLK↑Internal feedbackR1 = 200 Ω,3.53.5ns
I, I/OI/OR2 = 200 Ω,1.551.55ns
OE↓QSee Figure 81.561.56ns
OE↑Q16.517ns
I, I/OI/O2727ns
I, I/OI/O2727ns
#
Specification’ near the end of this data sheet.
Skew between registered outputs0.50.5ns
and IIL or I
OZL
TO
(OUTPUT)
and IIH, respectively.
OZH
TEST
CONDITIONS
TIBPAL16R4-5CFN
TIBPAL16R6-5CFN
MIN TYP†MAXMIN TYP†MAX
1.51.5ns
1.51.5ns
TIBPAL16R6-5CJ
TIBPAL16R4-5CN
TIBPAL16R6-5CN
UNITPARAMETER
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
TIBPAL16R8-5C
HIGH-PERFORMANCE IMPACT-X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
NOTE 1: These ratings apply except for programming pins during a programming cycle or during a preload cycle.
recommended operating conditions
V
CC
V
IH
V
IL
I
OH
I
OL
f
clock
w
t
su
t
h
T
A
NOTE 2: These are absolute voltage levels with respect to the ground pin of the device and include all overshoots due to system and/or tester
Supply voltage4.7555.25V
High-level input voltage (see Note 2)25.5V
Low-level input voltage (see Note 2)0.8V
High-level output current–3.2mA
Low-level output current24mA
Clock frequency0125MHz
Pulse duration, clockt
Setup time, input or feedback before clock↑4.5ns
Hold time, input or feedback after clock↑0ns
Operating free-air temperature02575°C
noise. Testing these parameters should not be attempted without suitable equipment.
CIRCUITS
High4
Low4
MINNOMMAXUNIT
ns
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TIBPAL16R8-5C
HIGH-PERFORMANCE IMPACT-X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
electrical characteristics over recommended operating free-air temperature range
switching characteristicsover recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
FROM
(INPUT)
without feedback125125
§
f
max
t
pd
¶
t
pd
t
en
t
dis
t
r
t
f
t
sk(o)
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. VO is set at 0.5 V to
avoid test problems caused by test equipment ground degradation.
§
See ’f
max
¶
This parameter is calculated from the measured f
#
t
is the skew time between registered outputs.
sk(o)
with internal feedback (counter configuration)125125MHz
with external feedback117111
CLK↑Q
CLK↑Q
CLK↑Internal feedback3.53.5ns
OE↓Q1.561.56ns
OE↑Q16.517ns
#
Specification’ near the end of this data sheet.
Skew between outputs0.50.5ns
TO
(OUTPUT)
with up to 4 outputs
switching
with more than 4
outputs switching
with internal feedback in a counter configuration (see Figure 2 for illustration).
max
TEST
CONDITIONS
R1 = 200 Ω,
R2 = 200 Ω,
See Figure 8
TIBPAL16R8-5CFN
MIN TYP†MAXMIN TYP†MAX
1.541.54
1.541.54.5
1.51.5ns
1.51.5ns
TIBPAL16R8-5CJ
TIBPAL16R8-5CN
UNITPARAMETER
ns
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
13
TIBPAL16L8-7M, TIBPAL16R4-7M, TIBPAL16R6-7M, TIBPAL16R8-7M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
NOTE 1: These ratings apply except for programming pins during a programming cycle or during a preload cycle.
recommended operating conditions
V
CC
V
IH
V
IL
I
OH
I
OL
f
clock
†
w
†
t
su
†
t
h
T
A
†
f
clock
NOTE 2: These are absolute voltage levels with respect to the ground pin of the device and include all overshoots due to system and/or tester
Supply voltage4.555.5V
High-level input voltage (see Note 2)25.5V
Low-level input voltage (see Note 2)0.8V
High-level output current–2mA
Low-level output current12mA
†
Clock frequency0100MHz
Pulse duration, clockt
Setup time, input or feedback before clock↑7ns
Hold time, input or feedback after clock↑0ns
Operating free-air temperature–5525125°C
, tw, tsu, and th do not apply to TIBPAL16L8’
noise. Testing these parameters should not be attempted without suitable equipment.
CIRCUITS
High5
Low5
MINNOMMAXUNIT
ns
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other specifications
are design goals. Texas Instruments reserves the right to change or
discontinue these products without notice.
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
electrical characteristics over recommended operating free-air temperature range
PARAMETERTEST CONDITIONSMIN TYP†MAXUNIT
V
IK
V
OH
V
OL
I
OZH
I
OZL
I
I
I
IH
I
IL
I
OS
I
CC
i
C
o
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. VO is set at 0.5 V to
avoid test problems caused by test equipment ground degradation.
switching characteristicsover recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER
§
f
max
t
pd
t
pd
t
en
t
dis
t
en
t
dis
§
See ’f
and is calculated from the equation located in the f
Specification’ near the end of this data sheet. f
max
FROM
(INPUT)
without feedback100
with internal feedback
(counter configuration)
with external feedbackR1 = 390 Ω,74
I, I/OO, I/OR2 = 750 Ω,17ns
CLKQSee Figure 817ns
OE↓Q18ns
OE↑Q110ns
I, I/OO, I/O19ns
I, I/OO, I/O110ns
TO
(OUTPUT)
does not apply for TIBPAL16L8’. f
max
specifications section.
max
TEST CONDITIONMINMAXUNIT
100MHz
with external feedback is not production tested
max
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other specifications
are design goals. Texas Instruments reserves the right to change or
discontinue these products without notice.
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
programming information
Texas Instruments programmable logic devices can be programmed using widely available software and
inexpensive device programmers.
Complete programming specifications, algorithms, and the latest information on hardware, software, and
firmware are available upon request. Information on programmers capable of programming T exas Instruments
programmable logic is also available, upon request, from the nearest TI field sales office, local authorized TI
distributor, or by calling Texas Instruments at (214) 997-5666.
CIRCUITS
asynchronous preload procedure for registered outputs (see Figure 1 and Note 3)
†
The output registers can be preloaded to any desired state during device testing. This permits any state to be
tested without having to step through the entire state-machine sequence. Each register is preloaded individually
by following the steps given below.
Step 1.With V
at 5 volts and Pin 1 at VIL, raise Pin 11 to V
CC
IHH
.
Step 2.Apply either VIL or VIH to the output corresponding to the register to be preloaded.
Step 3.Lower Pin 11 to 5 V.
Step 4.Remove output voltage, then lower Pin 11 to VIL. Preload can be verified by observing the
voltage level at the output pin.
Pin 11
t
d
Registered Output
Figure 1. Asynchronous Preload Waveforms
†
Not applicable for TIBPAL16L8-5C and TIBPAL16L8-7M.
NOTE 3: td = tsu = th = 100 ns to 1000 ns
V
= 10.25 V to 10.75 V
IHH
tsu + t
t
h
d
V
IH
OutputInput
V
IL
†
V
5 V
V
V
V
IHH
IL
OH
OL
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TIBPAL16R4-5C, TIBPAL16R6-5C, TIBPAL16R8-5C
TIBPAL16R4-7M, TIBPAL16R6-7M, TIBPAL16R8-7M
1.5 V
CIRCUITS
HIGH-PERFORMANCE IMPACT-X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
power-up reset (see Figure 2)
Following power up, all registers are reset to zero. This feature provides extra flexibility to the system designer
and is especially valuable in simplifying state-machine initialization. To ensure a valid power-up reset, it is
important that the rise of VCC be monotonic. Following power-up reset, a low-to-high clock transition must not
occur until all applicable input and feedback setup times are met.
V
CC
Active Low
Registered Output
CLK
4 V
†
t
pd
(600 ns TYP, 1000 ns MAX)
1.5 V
1.5 V
t
w
‡
t
su
5 V
V
V
V
V
OH
OL
IH
IL
†
This is the power-up reset time and applies to registered outputs only. The values shown are from characterization data.
‡
This is the setup time for input or feedback.
Figure 2. Power-Up Reset Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
17
TIBPAL16R4-5C, TIBPAL16R6-5C, TIBPAL16R8-5C
TIBPAL16R4-7M, TIBPAL16R6-7M, TIBPAL16R8-7M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
without feedback (see Figure 3)
f
max
In this mode, data is presented at the input to the flip-flop and clocked through to the Q output with no feedback.
Under this condition, the clock period is limited by the sum of the data setup time and the data hold time (t
However, the minimum fmax is determined by the minimum clock period (t
f
Thus,
without feedback
max
+
(twhigh
CIRCUITS
f
SPECIFICATIONS
max
1
)
twlow)
CLK
or
1
(tsu)
th)
high + tw low).
w
.
su
+ th).
f
with internal feedback (see Figure 4)
max
Logic
Array
tsu + t
tw high + tw low
Figure 3. f
h
or
Without Feedback
max
C1
1D
This configuration is most popular in counters and on-chip state-machine designs. The flip-flop inputs are
defined by the device inputs and flip-flop outputs. Under this condition, the period is limited by the internal delay
from the flip-flop outputs through the internal feedback and logic array to the inputs of the next flip-flop.
Thus,
f
with internal feedback
max
+
(tsu)
1
tpdCLK*to*FB)
.
Where tpd CLK-to-FB is the deduced value of the delay from CLK to the input of the logic array.
CLK
Logic
Array
C1
18
1D
t
su
Figure 4. f
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
With Internal Feedback
max
tpd CLK-to-FB
TIBPAL16R4-5C, TIBPAL16R6-5C, TIBPAL16R8-5C
TIBPAL16R4-7M, TIBPAL16R6-7M, TIBPAL16R8-7M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
f
SPECIFICATIONS
max
with external feedback (see Figure 5)
f
max
This configuration is a typical state-machine design with feedback signals sent off-chip. This external feedback
could go back to the device inputs or to a second device in a multi-chip state machine. The slowest path defining
the period is the sum of the clock-to-output time and the input setup time for the external signals
+ tpd CLK-to-Q).
(t
su
Thus,
f
with external feedback
max
+
CLK
(tsu)
1
tpdCLK*to*Q)
.
CIRCUITS
Logic
Array
t
su
Figure 5. f
C1
1D
tpd CLK-to-Qt
With External Feedback
max
Next Device
su
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
19
TIBPAL16R8-5C
HIGH-PERFORMANCE IMPACT-X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
THERMAL INFORMATION
thermal management of the TIBPAL16R8-5C
Thermal management of the TIBP AL16R8-5CN and TIBPAL16R8-5CFN is necessary when operating at certain
conditions of frequency, output loading, and outputs switching simultaneously. The device and system
application will determine the appropriate level of management.
CIRCUITS
Determining the level of thermal management is based on factors such as power dissipation (P
), ambient
D
temperature (TA), and transverse airflow (FPM). Figures 6 (a) and 6 (b) show the relationship between ambient
temperature and transverse airflow at given power dissipation levels. The required transverse airflow can be
determined at a particular ambient temperature and device power dissipation level in order to ensure the device
specifications.
Figure 7 illustrates how power dissipation varies as a function of frequency and the number of outputs switching
simultaneously . It should be noted that all outputs are fully loaded (C
= 50 pF). Since the condition of eight fully
L
loaded outputs represents the worst-case condition, each application must be evaluated accordingly.
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CIRCUITS
5 V
S1
R1
Test
Point
Timing
Input
Data
Input
Input
In-Phase
Output
Out-of-Phase
Output
(see Note D)
1.5 V
t
su
1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
1.5 V1.5 V
t
pd
80 %
20 %
t
pd
20 %
80 %
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
1.5 V
1.5 V1.5 V
1.5 V
t
r
t
f
(see Note A)
t
h
t
pd
1.5 V
t
t
pd
t
C
L
3 V
0
3 V
0
(see Note B)
3 V
0
V
OH
V
OL
f
V
OH
V
OL
r
R2
LOAD CIRCUIT FOR
3-STATE OUTPUTS
High-Level
Low-Level
Output
Control
(low-level
enabling)
Waveform 1
S1 Closed
(see Note C)
Waveform 2
S1 Open
(see Note C)
Pulse
Pulse
VOLTAGE WAVEFORMS
PULSE DURATIONS
1.5 V1.5 V
t
en
t
en
1.5 V1.5 V
t
w
1.5 V1.5 V
t
dis
1.5 V
t
dis
1.5 V
3 V
0
3 V
0
(see Note B)
3 V
0
(see Note B)
≈ 2.7 V
V
OL
VOL + 0.5 V
V
OH
VOH – 0.5 V
≈ 0 V
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance and is 50 pF for tpd and ten, 5 pF for t
B. All input pulses have the following characteristics: For C suffix, PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%; For M suffix,
PRR ≤ 10 MHz, tr = tf ≤ 2 ns, duty cycle = 50%
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. W aveform 2
is for an output with internal conditions such that the output is high except when disabled by the output control.
D. When measuring propagation delay times of 3-state outputs, switch S1 is closed.
E. Equivalent loads may be used for testing.
Figure 8. Load Circuit and Voltage Waveforms
22
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
VOLTAGE WAVEFORMS
.
dis
TIBPAL16R4-5C, TIBPAL16R6-5C, TIBPAL16R8-5C
C1
CIRCUITS
HIGH-PERFORMANCE IMPACT -X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
metastable characteristics of TIBPAL16R4-5C, TIBPAL16R6-5C, and TIBPAL16R8-5C
At some point a system designer is faced with the problem of synchronizing two digital signals operating at two
different frequencies. This problem is typically overcome by synchronizing one of the signals to the local clock
through use of a flip-flop. However, this solution presents an awkward dilemma since the setup and hold time
specifications associated with the flip-flop are sure to be violated. The metastable characteristics of the flip-flop
can influence overall system reliability.
Whenever the setup and hold times of a flip-flop are violated, its output response becomes uncertain and is said
to be in the metastable state if the output hangs up in the region between V
lasts until the flip-flop falls into one of its two stable states, which takes longer than the specified maximum
propagation delay time (CLK to Q max).
From a system engineering standpoint, a designer cannot use the specified data sheet maximum for
propagation delay time when using the flip-flop as a data synchronizer – how long to wait after the specified data
sheet maximum must be known before using the data in order to guarantee reliable system operation.
The circuit shown in Figure 9 can be used to evaluate MTBF (Mean Time Between Failure) and ∆t for a selected
flip-flop. Whenever the Q output of the DUT is between 0.8 V and 2 V , the comparators are in opposite states.
When the Q output of the DUT is higher than 2 V or lower than 0.8 V , the comparators are at the same logic level.
The outputs of the two comparators are sampled a selected time (∆t) after system clock (SCLK). The exclusive
OR gate detects the occurrence of a failure and increments the failure counter.
1D
DUT
C1
V
IH
Comparator
V
IL
Comparator
1D
C1
1D
C1
Noise
Generator
Data in
SCLK
and VIH. This metastable condition
IL
1D
MTBF
Counter
+
SCLK + ∆t
Figure 9. Metastable Evaluation Test Circuit
In order to maximize the possibility of forcing the DUT into a metastable state, the input data signal is applied
so that it always violates the setup and hold time. This condition is illustrated in the timing diagram in Figure 10.
Any other relationship of SCLK to data will provide less chance for the device to enter into the metastable state.
Data in
SCLK
SCLK + ∆t
MTBF
t
rec
Time (sec)
+
# Failures
= ∆t – CLK to Q (max)
∆t
∆t
Figure 10. Timing Diagram
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
23
TIBPAL16R4-5C, TIBPAL16R6-5C, TIBPAL16R8-5C
HIGH-PERFORMANCE IMPACT -X PAL
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
By using the described test circuit, MTBF can be determined for several different values of ∆t (see Figure 9).
Plotting this information on semilog scale demonstrates the metastable characteristics of the selected flip-flop.
Figure 11 shows the results for the TIBPAL16’-5C operating at 1 MHz.
9
10
10
10
10
10
10
10
10
10
MTBF – Mean Time Between Failures – s
10 yr
8
1 yr
7
1 mo
6
1 wk
5
1 day
4
1 hr
3
2
1 min
10 s
1
0 10203040506070
CIRCUITS
f
= 1 MHz
clk
f
data
∆t – Time Difference – ns
= 500 kHz
Figure 11. Metastable Characteristics
From the data taken in the above experiment, an equation can be derived for the metastable characteristics at
other clock frequencies.
The metastable equation:
1
MTBF
+
f
SCLK
xf
data
xC1e
(*C2 xDt)
The constants C1 and C2 describe the metastable characteristics of the device. From the experimental data,
these constants can be solved for: C1 = 4.37 X 10–3 and C2 = 2.01
Therefore
MTBF
1
+
f
SCLK
xf
x4.37x10
data
*
3e(*2.01 xDt)
definition of variables
DUT (Device Under Test): The DUT is a 5-ns registered PLD programmed with the equation Q : = D.
MTBF (Mean Time Between Failures): The average time (s) between metastable occurrences that cause a
violation of the device specifications.
f
(system clock frequency): Actual clock frequency for the DUT.
SCLK
f
(data frequency): Actual data frequency for a specified input to the DUT.
data
C1: Calculated constant that defines the magnitude of the curve.
C2: Calculated constant that defines the slope of the curve.
t
(metastability recovery time): Minimum time required to guarantee recovery from metastability , at a given
rec
MTBF failure rate. t
∆t: The time difference (ns) from when the synchronizing flip-flop is clocked to when its output is sampled.
= ∆t – tpd (CLK to Q, max)
rec
The test described above has shown the metastable characteristics of the TIBP AL16R4/R6/R8-5C series. For
additional information on metastable characteristics of Texas Instruments logic circuits, please refer to TI
Applications publication SDAA004, ”Metastable Characteristics, Design Considerations for ALS, AS, and LS
Circuits.’’
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Lead/Ball Finish MSL Peak Temp
(3)
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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