Texas Instruments TIBPAL16R8-30MWB, TIBPAL16R8-30MJB, TIBPAL16R8-30MJ, TIBPAL16R8-30MFKB, TIBPAL16R8-25CN Datasheet

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TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
TIBPAL16L8-30M, TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT PAL
CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
1
D
High-Performance Operation: Propagation Delay C Suffix . . . 25 ns Max M Suffix . . . 30 ns Max
D
Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A
D
Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pins Go Low)
D
Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
D
Dependable Texas Instruments Quality and Reliability
DEVICE
I
INPUTS
3-STATE
O
OUTPUTS
REGISTERED
Q
OUTPUTS
I/O
PORTS
PAL16L8 10 2 0 6 PAL16R4 8 0
4 (3-state
buffers)
4
PAL16R6 8 0
6 (3-state
buffers)
2
PAL16R8 8 0
8 (3-state
buffers)
0
description
These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMP ACT circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.
The TIBP AL16’ C series is characterized from 0°C to 75°C. The TIBP AL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
These devices are covered by U.S. Patent 4,410,987. IMPACT is a trademark of Texas Instruments. PAL is a registered trademark of Advanced Micro Devices Inc.
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
I I I I I I I I I
GND
V
CC
O I/O I/O I/O I/O I/O I/O O I
TIBPAL16L8’
C SUFFIX ...J OR N PACKAGE
M SUFFIX ...J OR W PACKAGE
(TOP VIEW)
4 5 6 7 8
18 17 16 15 14
I/O I/O I/O I/O I/O
I I I I I
TIBPAL16L8’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
I
O
I/O
O
I
GND
I
V
CC
3212019
910111213
TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M LOW-POWER HIGH-PERFORMANCE IMPACT PAL
CIRCUITS
SRPS059 FEBRUARY 1984 – REVISED APRIL 2000
2
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
CLK
I I I I I I I I
GND
V
CC
I/O I/O Q Q Q Q I/O I/O OE
TIBPAL16R4’
C SUFFIX ...J OR N PACKAGE
M SUFFIX ...J OR W PACKAGE
(TOP VIEW)
CLK
I I I I I I I I
GND
V
CC
I/O Q Q Q Q Q Q I/O OE
TIBPAL16R6’
C SUFFIX ...J OR N PACKAGE
M SUFFIX ...J OR W PACKAGE
(TOP VIEW)
CLK
I I I I I I I I
GND
V
CC
Q Q Q Q Q Q Q Q OE
TIBPAL16R8’
C SUFFIX ...J OR N PACKAGE
M SUFFIX ...J OR W PACKAGE
(TOP VIEW)
I
I
CLK
I/O
I/O
I/O
I
GND
V
CC
OE
I/O Q Q Q Q
I I I I I
TIBPAL16R4’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
CLK
I/O
Q
I/O
I
GND
V
CC
Q Q Q Q Q
I I I I I
OE
TIBPAL16R6’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
CLK
Q
Q
Q
I
GND
V
CC
OE
Q Q Q Q Q
I I I I I
TIBPAL16R8’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE
(TOP VIEW)
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
4 5 6 7 8
18 17 16 15 14
3212019
910111213
4 5 6 7 8
18 17 16 15 14
3212019
910111213
4 5 6 7 8
18 17 16 15 14
3212019
910111213
TIBPAL16L8-25C, TIBPAL16R4-25C
TIBPAL16L8-30M, TIBPAL16R4-30M
LOW-POWER HIGH-PERFORMANCE IMPACT PAL
CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
3
functional block diagrams (positive logic)
denotes fused inputs
TIBPAL16L8
TIBPAL16R4
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I
EN
1
&
32 × 64
10 16
166
7
7
7
7
7
7
7
7
6
Q
I/O
I/O
I/O
I/O
I
EN
816
164
7
7
7
8
8
8
7
4
1
1
8
Q
Q
Q
4
1D
I = 1
2
CLK
C1
EN 2
OE
4
16 ×
16 ×
&
32 × 64
TIBPAL16R6-25C, TIBPAL16R8-25C TIBPAL16R6-30M, TIBPAL16R8-30M LOW-POWER HIGH-PERFORMANCE IMPACT PAL
CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
4
functional block diagrams (positive logic)
denotes fused inputs
TIBPAL16R6
TIBPAL16R8
Q
I/O
I/O
I
EN
816
162
7
8
8
8
7
2
1
1
8
Q
Q
Q
6
1D
I = 1
2
CLK
C1
EN 2
OE
6
8
Q
8
Q
Q
I
816
168
8
8
8
8
8
Q
Q
Q
1D
I = 1
2
CLK
C1
EN 2
8
Q
8
Q
1
OE
8
Q
8
Q
16 ×
16 ×
&
32 × 64
&
32 × 64
TIBPAL16L8-25C
TIBPAL16L8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT PAL
CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
5
logic diagram (positive logic)
0 4 8 12 16 20 24 28 31
I
2
I
3
4
I
5
I
6
I
7
I
8
I
9
O
19
I/O
18
I/O
17
I/O
16
I/O
15
I/O
14
I/O
13
O
12
I
11
Increment
I
1
Fuse number = First fuse number + Increment
0 32 64 96
128 160 192 224
256 288 320 352 384 416 448 480
512 544 576 608 640 672 704 736
768 800 832 864 896 928 960 992
1024 1056 1088 1120 1152 1184 1216 1248
1280 1312 1344 1376 1408 1440 1472 1504
1536 1568 1600 1632 1664 1696 1728 1760
1792 1824 1856 1888 1920 1952 1984 2016
First
Fuse
Numbers
I
TIBPAL16R4-25C TIBPAL16R4-30M LOW-POWER HIGH-PERFORMANCE IMPACT PAL
CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
6
logic diagram (positive logic)
2016
0 4 8 12 16 20 24 28 31
I
2
I
3
I
4
I
5
I
6
I
7
I
8
I
9
I/O
19
I/O
18
Q
17
Q
16
Q
15
Q
14
I/O
13
I/O
12
11
Increment
CLK
1
Fuse number = First fuse number + Increment
0 32 64 96
128 160 192 224
256 288 320 352 384 416 448 480
512 544 576 608 640 672 704 736
768 800 832 864 896 928 960 992
1024 1056 1088 1120 1152 1184 1216 1248
1280 1312 1344 1376 1408 1440 1472 1504
1536 1568 1600 1632 1664 1696 1728 1760
1792 1824 1856 1888 1920 1952 1984
First
Fuse
Numbers
C1
1D
I = 1
C1
1D
I = 1
C1
1D
I = 1
C1
1D
I = 1
OE
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