Texas Instruments THS7002 User Manual

THS7002 ProgrammableĆGain Amplifier Evaluation Module
User’s Guide
July 1999 Mixed-Signal Products
SLOU037
IMPORTANT NOTICE
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
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In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
Related Documentation From Texas Instruments
J
THS7002 PROGRAMMABLE-GAIN AMPLIFIER
number SLOS214) This is the data sheet for the THS7002 amplifier integrated circuit used on the EVM.
J
THS4001 HIGH-SPEED LOW-POWER OPERATIONAL AMPLIFIER
for the THS4001 amplifier integrated circuit used on the EVM.
J
PowerPAD Thermally Enhanced Package
SLMA002) This is the technical brief for the special PowerPAD package in which the THS7002 amplifier IC is supplied.
(literature number SLOS206) This is the data sheet
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.
Preface
(literature
(literature number
Trademarks
TI is a trademark of Texas Instruments Incorporated. PowerPAD is a trademark of Texas Instruments Incorporated.
Chapter Title—Attribute Reference
iii
iv
Running Title—Attribute Reference
Contents
1 General Information 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Programmable Gain Amplifier Gain Control 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 EVM DIP Switch Functionality 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 EVM Circuit Configuration 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Using the THS7002 EVM 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 THS7002 EVM Performance 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.8 General High-Speed Amplifier Design Considerations 1-16. . . . . . . . . . . . . . . . . . . . . . . . . .
1.9 General PowerP ADt Design Considerations 1-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.10 THS7002 EVM Specifications 1-20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Reference 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 THS7002 Programmable-Gain Amplifier EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . . . . .
2.2 THS7002 EVM Board Layouts 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter Title—Attribute Reference
v
Running Title—Attribute Reference
Figures
1–1 THS7002 Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–2 THS7002 EVM Power Conditioning Schematic Diagram 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–3 THS7002 EVM Schematic Diagram 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–4 Simplified PGA Section of the THS7002 1-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–5 THS7002 Evaluation Module Block Diagram 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–6 THS7002 EVM Preamplifier Frequency Response 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–7 THS7002 EVM Preamplifier Phase Response 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–8 THS7002 EVM PGA Frequency Response 1-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–9 THS7002 EVM PGA Phase Response 1-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–10 THS7002 EVM Preamplifier + PGA Frequency Response 1-15. . . . . . . . . . . . . . . . . . . . . . . . .
1–11 THS7002 EVM Preamplifier + PGA Phase Response 1-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–12 PowerPAD PCB Etch and Via Pattern 1-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–13 Maximum Power Dissipation vs Free-Air Temperature 1-18. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 THS7002 EVM Component Placement Silkscreen and Solder Pads 2-3. . . . . . . . . . . . . . . . .
2–2 THS7002 EVM PC Board: Top Assembly 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 THS7002 EVM PC Board: Top Layer 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–4 THS7002 EVM PC Board: Bottom Layer 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
T ables
1–1 THS7002 EVM PGA Nominal Gain/Attenuation 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–2 EVM DIP Switch Functionality 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–3 THS7002 EVM Jumper Settings 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–4 THS7002 EVM DIP Switch Settings 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 THS7002 Programmable-Gain Amplifier EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . .
vi
Chapter 1
General
Information
This chapter details the Texas Instruments (TI) THS7002 programmable-gain amplifier evaluation module (EVM), SLOP136. It includes a list of EVM features, a brief description of the module illustrated with pictorial and schematic diagrams, EVM specifications, details on configuring, connecting, and using the EVM, and a discussion on high-speed amplifier and PowerPAD package design considerations.
Topic Page
1.1 Features 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Programmable Gain Amplifier Gain Control 1–7. . . . . . . . . . . . . . . . . . . . .
1.4 EVM DIP Switch Functionality 1–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 EVM CIrcuit Configuration 1–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Using The THS7002 EVM 1–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 THS7002 EVM Performance 1–13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.8 General High-Speed Amplifier Design Considerations 1–16. . . . . . . . .
1.9 General PowerPAD Design Considerations 1–17. . . . . . . . . . . . . . . . . .
1.10 THS7002 EVM Specifications 1–20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Information
1-1
Features
1.1 Features
1.2 Description
THS7002 programmable-gain amplifier EVM features include:
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Multiple Input Configurations Set Via On-board Jumpers
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DIP Switches Allow Quick and Easy Adjustment of Gain, Shut Down, Reference Voltage, and Output Clamping
J
Includes a THS4001 High-Speed Amplifier as an Inverter
J
Standard BNC Connectors Inputs and Outputs
J
±5-V to ±15-V Operation with 5-V Reference Input
J
Nominal 50- Impedance Inputs and Outputs
J
Includes T est Points for Easy Digital Control of EVM Circuit Gain and Operating Parameters
J
Good Example of PowerPAD Package and High-Speed Amplifier Design and Layout
The TI THS7002 programmable-gain amplifier evaluation module (EVM) is a complete dual-channel low-noise receiver and a highly configurable programmable-gain amplifier circuit. It consists of the TI THS7002 Programmable-Gain Amplifier IC, a TI THS4001 high-speed, low-power operational amplifier IC, and a number of passive parts, all mounted on a multilayer circuit board (Figure 1–1).
Although the THS7002 IC was developed primarily for xDSL receiver front-ends, there are a large number of different circuits that can benefit from the many features incorporated into the THS7002. This EVM illustrates a universal design and can be used for numerous system configurations.
The EVM uses standard BNC connectors for inputs and outputs and also includes test points for user connections and testing. It is completely assembled, fully tested, and ready to use — just connect it to power, a signal source, and a load (if desired).
1-2
General Information
Figure 1–1.THS7002 Evaluation Module
Description
SLOP136
Rev. B
J1
+V
CC
J2
Pre-Amp A Output
J5
1998
Input A
Texas Instruments
Input B
J6
JP1
C6
R6
1
R8
R7
R1C1 R2
C2
U2
C3
R4
U2 Out
J7
R9
C11
C10
C12
R10
C9
R3
R12
JP2
1
R13
1
R14
R16
J8
B
GND
R18
R5
C8
R11
C13
C14
JP4JP3
1
BVREF
R17
Pre-Amp B Output
THS7002 EVM Board
J4J3
+++
CC
C17
AG2
(3)
AG1
(2)
AG0
(1)
C7
R15
VH
BS/D
R20
(6)
(5)
(4)
R23 R25 R27
U1
R29
R11
R33
R35 R37 R39 R41
1
JP5
C18 C19
R24 R26 R28 R30 R32
R34 R36 R38 R40 R42
C20
+5 V–V
S1
PGA – A Output
R44
PGA – B Output
R45
S2
C21L2C5C4L1
GND
AS/D (4)
AVREF (5)
VL (6)
BG2 (1)
BG1 (2)
BG0 (3)
J9
J10
Input power is applied to the EVM through banana jacks J1, J2, J3, and J4. An LC filter on each power bus isolates the EVM circuits from the external supply (Figure 1–2). J4 provides a reference point for numerous circuit functions and draws relatively little current. The schematic for the EVM amplifiers appears in Figure 1–3.
Figure 1–2.THS7002 EVM Power Conditioning Schematic Diagram
J1
V
CC
L1
0.22 µH
15 V
C4
6.8 µF
+
J2
GND
TP1
–V
C5
6.8 µF
+
J3
CC
–15 V
L2
0.22 µH
J4
5 V
C21
6.8 µF
+
5 V
General Information
1-3
Description
J10
PGA-B
R36, 3.3 k
R38, 3.3 k
R40, 3.3 k
Output
5 V
C17, 0.1 µF
5 V15 V
R24, 3.3 k
AG2, TP3
TP2, AG0
TP4, AG1
JP5
R26, 3.3 k
R28, 3.3 k
15 V
U1–D
R39, 330
15
16
R37, 330
17
R35, 330
R11
C10, TBD
R10
TP12
U2-Out
R45
100
19
G0
G1
G2
12
R14
C14, TBD
1
499
499
R4
22
VO
VIN–
U1-C
R13
1
0
2
10
TBD
VREF
GND
SID
11
2
3
C9
JP3
2
13
14
18
C13
R12
9
TBD
TBD
JP4
+
TBD
3
R17
3
R15
R33
49.9
JP2
49.9
330
R34
J8
BVREF
TP14
3.3 k
Pre-amp B
Output
R3
TBD
S2-E
S2-D
BS/D
5 V
TP13
Figure 1–3.THS7002 EVM Schematic Diagram
BG0, TP11
BG1, TP10
J9
PGA-A
Output
R44
R42
S2-F
R41
U1–B 26
27
28
21
C19, 0.1 µF
C6, TBD
1
100
4.7 k
49.9
G2
G1
G0
R6
20
VH
VCC
0
24
3
2
VO
VIN–
JP1
R32
R31
23
VL
VREF
GND
SID
–Vcc
C7
TBD
R20
TBD
3
3
2
1
VH
TP5
R27, 330
R25, 330
R23, 330
BG2, TP9
5 V
C20, 0.1 µF
4.7 k S1-F
VL
TP6
49.9
R18
2
1
R29
25
22
C18, 0.1 µF
J5
Pre-amp
R5
49.9
–15 V
49.9
330
–15 V
A Out
AVREF
TP8
S2-C
S2-B
S2-A
R30
S1-E
S1-D
3.3 k
AS/D
5 V
TP7
C8, TBD
15 V
R8
499
C12, 0.1 µF
R7
499
U1-A
THS7002
8
5
4
J6
1-4
+
6
Input A
R1
15 V
R2
1 k
C3, 0.1 µF
1 k
C1, TBD
C11
0.1 µF
7
–15 V
R9
49.9
U2
7
5
THS4001
2
C2, 0.1 µF
4
+
3
J7
–15 V
Input B
R16
49.9
General Information
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