T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
Related Documentation From Texas Instruments
J
THS7002 PROGRAMMABLE-GAIN AMPLIFIER
number SLOS214) This is the data sheet for the THS7002
amplifier integrated circuit used on the EVM.
for the THS4001 amplifier integrated circuit used on the EVM.
J
PowerPAD Thermally Enhanced Package
SLMA002) This is the technical brief for the special PowerPAD
package in which the THS7002 amplifier IC is supplied.
(literature number SLOS206) This is the data sheet
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
Preface
(literature
(literature number
Trademarks
TI is a trademark of Texas Instruments Incorporated.
PowerPAD is a trademark of Texas Instruments Incorporated.
This chapter details the Texas Instruments (TI) THS7002
programmable-gain amplifier evaluation module (EVM), SLOP136. It includes
a list of EVM features, a brief description of the module illustrated with pictorial
and schematic diagrams, EVM specifications, details on configuring,
connecting, and using the EVM, and a discussion on high-speed amplifier and
PowerPAD package design considerations.
THS7002 programmable-gain amplifier EVM features include:
J
Multiple Input Configurations Set Via On-board Jumpers
J
DIP Switches Allow Quick and Easy Adjustment of Gain, Shut Down,
Reference Voltage, and Output Clamping
J
Includes a THS4001 High-Speed Amplifier as an Inverter
J
Standard BNC Connectors Inputs and Outputs
J
±5-V to ±15-V Operation with 5-V Reference Input
J
Nominal 50-Ω Impedance Inputs and Outputs
J
Includes T est Points for Easy Digital Control of EVM Circuit Gain and
Operating Parameters
J
Good Example of PowerPAD Package and High-Speed Amplifier
Design and Layout
The TI THS7002 programmable-gain amplifier evaluation module (EVM) is a
complete dual-channel low-noise receiver and a highly configurable
programmable-gain amplifier circuit. It consists of the TI THS7002
Programmable-Gain Amplifier IC, a TI THS4001 high-speed, low-power
operational amplifier IC, and a number of passive parts, all mounted on a
multilayer circuit board (Figure 1–1).
Although the THS7002 IC was developed primarily for xDSL receiver
front-ends, there are a large number of different circuits that can benefit from
the many features incorporated into the THS7002. This EVM illustrates a
universal design and can be used for numerous system configurations.
The EVM uses standard BNC connectors for inputs and outputs and also
includes test points for user connections and testing. It is completely
assembled, fully tested, and ready to use — just connect it to power, a signal
source, and a load (if desired).
1-2
General Information
Figure 1–1.THS7002 Evaluation Module
Description
SLOP136
Rev. B
J1
+V
CC
J2
Pre-Amp A
Output
J5
1998
Input A
Texas Instruments
Input B
J6
JP1
C6
R6
1
R8
R7
R1C1R2
C2
U2
C3
R4
U2 Out
J7
R9
C11
C10
C12
R10
C9
R3
R12
JP2
1
R13
1
R14
R16
J8
B
GND
R18
R5
C8
R11
C13
C14
JP4JP3
1
BVREF
R17
Pre-Amp B
Output
THS7002 EVM Board
J4J3
+++
CC
C17
AG2
(3)
AG1
(2)
AG0
(1)
C7
R15
VH
BS/D
R20
(6)
(5)
(4)
R23
R25
R27
U1
R29
R11
R33
R35
R37
R39
R41
1
JP5
C18
C19
R24
R26
R28
R30
R32
R34
R36
R38
R40
R42
C20
+5 V–V
S1
PGA – A
Output
R44
PGA – B
Output
R45
S2
C21L2C5C4L1
GND
AS/D
(4)
AVREF
(5)
VL
(6)
BG2
(1)
BG1
(2)
BG0
(3)
J9
J10
Input power is applied to the EVM through banana jacks J1, J2, J3, and J4. An
LC filter on each power bus isolates the EVM circuits from the external supply
(Figure 1–2). J4 provides a reference point for numerous circuit functions and
draws relatively little current. The schematic for the EVM amplifiers appears
in Figure 1–3.
Figure 1–2.THS7002 EVM Power Conditioning Schematic Diagram
J1
V
CC
L1
0.22 µH
15 V
C4
6.8 µF
+
J2
GND
TP1
–V
C5
6.8 µF
+
J3
CC
–15 V
L2
0.22 µH
J4
5 V
C21
6.8 µF
+
5 V
General Information
1-3
Description
J10
PGA-B
R36, 3.3 kΩ
R38, 3.3 kΩ
R40, 3.3 kΩ
Output
5 V
C17, 0.1 µF
5 V15 V
R24, 3.3 kΩ
AG2, TP3
TP2, AG0
TP4, AG1
JP5
R26, 3.3 kΩ
R28, 3.3 kΩ
15 V
U1–D
R39, 330Ω
15
16
R37, 330Ω
17
R35, 330Ω
R11
C10, TBD
R10
TP12
U2-Out
R45
100 Ω
19
G0
G1
G2
12
R14
C14, TBD
1
499 Ω
499 Ω
R4
22 Ω
VO
VIN–
U1-C
R13
1
0 Ω
2
10
TBD
VREF
GND
SID
11
–
2
3
C9
JP3
2
13
14
18
C13
R12
9
TBD
TBD
JP4
+
TBD
3
R17
3
R15
R33
49.9 Ω
JP2
49.9 Ω
330 Ω
R34
J8
BVREF
TP14
3.3 kΩ
Pre-amp B
Output
R3
TBD
S2-E
S2-D
BS/D
5 V
TP13
Figure 1–3.THS7002 EVM Schematic Diagram
BG0, TP11
BG1, TP10
J9
PGA-A
Output
R44
R42
S2-F
R41
U1–B
26
27
28
21
C19, 0.1 µF
C6, TBD
1
100 Ω
4.7 kΩ
49.9 Ω
G2
G1
G0
R6
20
VH
VCC
0 Ω
24
3
2
VO
VIN–
JP1
R32
R31
23
VL
VREF
GND
SID
–Vcc
C7
TBD
R20
TBD
3
3
2
1
VH
TP5
R27, 330Ω
R25, 330Ω
R23, 330 Ω
BG2, TP9
5 V
C20, 0.1 µF
4.7 kΩ
S1-F
VL
TP6
49.9 Ω
R18
2
1
R29
25
22
C18, 0.1 µF
J5
Pre-amp
R5
49.9 Ω
–15 V
49.9 Ω
330 Ω
–15 V
A Out
AVREF
TP8
S2-C
S2-B
S2-A
R30
S1-E
S1-D
3.3 kΩ
AS/D
5 V
TP7
C8, TBD
15 V
R8
499 Ω
C12, 0.1 µF
R7
499 Ω
U1-A
THS7002
8
5
4
–
J6
1-4
+
6
Input A
R1
15 V
R2
1 kΩ
C3, 0.1 µF
1 kΩ
C1, TBD
C11
0.1 µF
7
–15 V
R9
49.9 Ω
U2
7
5
THS4001
–
2
C2, 0.1 µF
4
+
3
J7
–15 V
Input B
R16
49.9 Ω
General Information
Loading...
+ 22 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.