TEXAS INSTRUMENTS THS4120, THS4121 Technical data

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THS4121
D, DGN, OR DGK PACKAGE
(TOP VIEW)
1 2 3 4
8 7 6 5
IN−
OCM
DD
OUT+
IN+
NC GND V
OUT−
THS4120
D, DGN, OR DGK PACKAGE
(TOP VIEW)
1 2 3 4
8 7 6 5
IN−
OCM
DD
OUT+
IN+
PD GND V
OUT−
+
DIGITAL OUTPUT
V
IN
+
DV
DD
V
OCM
AV
SS
AV
DD
A
IN
A
IN
V
DD
V
ref
3.3 V
TYPICAL A/D APPLICATION CIRCUIT
HIGH-SPEED FULLY DIFFERENTIAL I/O AMPLIFIERS

FEATURES KEY APPLICATIONS

High Performance
100 MHz, –3 dB Bandwidth – 50 V/µs Slew Rate – 75 dB Total Harmonic Distortion at 1 MHz
(V
= 2 V
O
5.4 nV/ Hz Input-Referred Noise (10 kHz)
Differential Input/Differential Output
Balanced Outputs Reject Common-Mode
Noise
Differential Reduced Second Harmonic
Distortion
Power Supply Range
V
= 3.3 V
DD
)
PP
THS4120 THS4121
SLOS319D – FEBRUARY 2001 – REVISED OCTOBER 2004
Simple Single-Ended To Differential
Conversion
Differential ADC Driver/Differential
Antialiasing
Differential Transmitter and Receiver
Output Level Shifter

DESCRIPTION

The THS412x is one in a family of fully differen­tial-input, differential-output devices fabricated using Texas Instruments' state-of-the-art submicron CMOS process.
The THS412x consists of a true fully-differential signal path from input to output. This results in THS4121 1 excellent common-mode noise rejection and improved total harmonic distortion.
RELATED DEVICES
DEVICE
(1) See the TI Web site for additional high-speed amplifier devices.
(1)
THS413x 150 MHz, 51 V/µs, 1.3 nV/ Hz 5 V to 30 V ± 2.5 to ± 15 THS414x 160 MHz, 450 V/µs, 6.5 nV/ Hz 5 V to 30 V ± 2.5 to ± 15 THS415x 150 MHz, 650 V/µs, 7.6 nV/ Hz 5 V to 30 V ± 2.5 to ± 15
DESCRIPTION
HIGH-SPEED DIFFERENTIAL I/O FAMILY
DEVICE POWERDOWN
THS4120
(1) For proper functiionality, an external 10-k pullup resistor is
required between the PD pin and the positive supply.
SINGLE SUPPLY SPLIT SUPPLY
VOLTAGE RANGE VOLTAGE RANGE
(1)
NUMBER OF
CHANNELS
1 Yes
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2001–2004, Texas Instruments Incorporated
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THS4120 THS4121
SLOS319D – FEBRUARY 2001 – REVISED OCTOBER 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
0 ° C to 70 ° C
–40 ° C to 85 ° C
SMALL OUTLINE(D)
THS4120CD THS4120CDGN ARL THS4120CDGK ATZ THS4120EVM THS4121CD THS4121CDGN ASB THS4121CDGK ATO THS4121EVM
THS4120ID THS4120IDGN ARM THS4120IDGK ARN – THS4121ID THS4121IDGN ASC THS4121IDGK ASN
MSOP PowerPAD™ MSOP
(DGN) SYMBOL (DGK) SYMBOL

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)
Supply voltage, GND to V
V
Input voltage ± V
I
I
Output current (sink)
O
V
Differential input voltage ± V
ID
Continuous total power dissipation See Dissipation Rating Table
T
Maximum junction temperature
J
T
Maximum junction temperature, continuous operation, long-term reliability
J
T
Operating free-air temperature
A
T
Storage Temperature –65 ° C to 150 ° C
stg
Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds 300 ° C
ESD ratings CDM 1500 V
(1) Stresses beyond those listed under "absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The THS412x may incorporate a PowerPad™ on the underside of the chip. This acts as a heatsink and must be connected to a
thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the
PowerPad™ thermally enhanced package. (3) The absolute maximum temperature under any condition is limited by the constraints of the silicon process. (4) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
DD
(2)
(3)
C suffix 0 ° C to 70 ° C I suffix –40 ° C to 85 ° C
HBM 4000 V
MM 200 V
(1)
(4)
EVALUATION
MODULES
UNIT
3.6 V
DD
110 mA
DD
150 ° C 125 ° C

DISSIPATION RATING TABLE

PACKAGE θ
(1)
( ° C/W) θJC( ° C/W)
JA
POWER RATING
TA= 25 ° C TA= 85 ° C
D 97.5 38.3 1.02 W 410 mW DGN 58.4 4.7 1.71 W 685 mW DGK 260 54.2 385 mW 154 mW
(1) This data was taken using the JEDEC standard High-K test PCB. (2) Power rating is determined with a junction temperature of 125 ° C. This is the point where distortion
starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125 ° C for best performance and long-term reliability.
2
(2)
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RECOMMENDED OPERATING CONDITIONS

V
T
Supply voltage V
DD
Operating free-air temperature ° C
A
Split supply ± 1.5 ± 1.65 ± 1.75 Single supply 3 3.3 3.5 C suffix 0 70 I suffix –40 85

ELECTRICAL CHARACTERISTICS

V
= 3.3 V, RL= 800 , TA= 25 ° C (unless otherwise noted)
DD
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DYNAMIC PERFORMANCE
BW Small-signal bandwidth (–3 dB) V SR Slew rate
t
s
Settling time to 0.1% 60 Settling time to 0.01% 292
(2)
DISTORTION PERFORMANCE
Total harmonic distortion
THD Differential input, differential output V
Gain = 1, Rf= 200 , RL= 800 , VO= 2 V
PP
Total harmonic distortion
THD Differential input, differential output V
Gain = 1, Rf= 200 , RL= 800 , VO= 4 V
PP
Spurious free dynamic range (SFDR) Differential input, differential output, VO= 4 V
PP
Third intermodulation distortion VI= 0.071 V
NOISE PERFORMANCE
V I
n
Input voltage noise f = 10 kHz 5.4 nV/ Hz
n
Input current noise f = 10 kHz 1 fA/ Hz
DC PERFORMANCE
Open-loop gain dB
Input offset voltage
V
S
Input offset voltage, referred to V
OCM
Offset voltage drift TA= full range 25 µV/ ° C
I
IB
I
OS
Input bias current 1.2 pA Input offset current 100 fA Current offset drift TA= full range 5 fA/ ° C
(1) The full range temperature is 0 ° C to 70 ° C for the C suffix, and –40 ° C to 85 ° C for the I suffix. (2) Slew rate is measured differentially from an output level range of 25% to 75%.
(1)
= 3.3 V, Gain = 1, Rf= 200 100 MHz
DD
V
= 3.3 V, Gain = 1 55 V/µs
DD
Differential step voltage = 2 VPP, Gain = 1 ns
= 3.3 V, f = 1 MHz –75 dB
DD
= 3.3 V, f = 1 MHz –66 dB
DD
Rf= 200 , f = 1 MHz –69 dB
RMS
TA= 25 ° C 60 66 TA= full range 66 TA= 25 ° C 3 8 TA= full range 4 9 TA= 25 ° C 5 13 TA= full range 14
TA= full range
THS4120 THS4121
SLOS319D – FEBRUARY 2001 – REVISED OCTOBER 2004
MIN TYP MAX UNIT
Gain = 1, f = 10 MHz –75 dBc
mV
3
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THS4120 THS4121
SLOS319D – FEBRUARY 2001 – REVISED OCTOBER 2004

ELECTRICAL CHARACTERISTICS (Continued)

V
= 3.3 V, RL= 800 , TA= 25 ° C (unless otherwise noted)
DD
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT CHARACTERISTICS
CMRR Common-mode rejection ratio TA= full range 64 96 dB
V
r C r
Common-mode input voltage range TA= full range to V
ICR
Input resistance (dc level) Measured into each input terminal 820 M
i
Input capacitance, closed loop 3 pF
i
Output resistance See Figure 16 1
o
OUTPUT CHARACTERISTICS
V V I I
High-level output Voltage VIC= VDD/2, V
OH
Low-level output Voltage VIC= VDD/2, V
OL
Output current (sink), RL= 7 V
O
Output current (source), RL= 7 V
O
= 3.3 V, TA= 25 ° C 80 100 mA
DD
= 3.3 V, TA= 25 ° C 20 25 mA
DD
POWER SUPPLY
V
I
Supply voltage range Single supply 3.3 V
DD
Quiescent current (per amplifier) V
DD
= 3.3 V mA
DD
PSRR Power supply rejection ratio TA= 25 ° C 68 85 dB
POWER-DOWN CHARACTERISTICS (THS4120 ONLY)
Power-down voltage level
(2)
Power-down quiescent current µA
t t z
Turn-on time delay 4.8 µs
on
Turn-off time delay 3 ns
off
Output impedance f = 1 MHz 1 k
o
Enable >1.4 Power-down <1.2 TA= 25 ° C 120 TA= full range 130
50% of final supply current value
(1)
0.65 to
V
- 0.1
DD
= 3.3 V, TA= 25 ° C 3.05 3.15 V
DD
= 3.3 V, TA= 25 ° C 0.25 0.15 V
DD
0.35 V
DD
TA= 25 ° C 11 13.5 TA= full range 16
V
(1) The full range temperature is 0 ° C to 70 ° C for the C suffix, and –40 ° C to 85 ° C for the I suffix. (2) For detail information on the power-down circuit, see the power-down section in the application section of this data sheet.
4
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−1.5
−1
−0.5
0
0.5
1
1.5
0 20 40 60 80
t − Time − ns
VDD = 3.3 V , VO = 2 VPP, TA= 25°C G = 1 RL = 800
− Output Voltage − VV O
Rising Edge
Falling Edge
−4
−2
−1
0
1
2
100 k 1M 10 M 100 M 1G
G = 1 VI = 22.5 mV
RMS
VDD = 3.3 V
Rf = 270
Rf = 200
Gain − dB
f − Frequency − Hz
Rf = 390
Rf = 150
−3
SLOS319D – FEBRUARY 2001 – REVISED OCTOBER 2004

TYPICAL CHARACTERISTICS

Table of Graphs

Small-signal frequency response 1
SR Slew rate 2
THD Total harmonic distortion
Harmonic distortion
Third intermodulation distortion vs Output voltage 10
V
Output voltage vs Load resistance 11
O
Settling time 12 V V
Voltage noise vs Frequency 13
n
Output offset voltage vs Common-mode input voltage 14
OO
CMMR Common-mode rejection ratio vs Frequency 15 z
os
z
o
Single-ended output impedance (closed loop) vs Frequency 16
Single-ended (V
) input impedance vs Frequency 17
OCM
vs Frequency 3 vs Output voltage 4 vs Frequency 5, 6, 7 vs Output voltage 8, 9
THS4120 THS4121
FIGURE
SMALL-SIGNAL FREQUENCY RESPONSE SLEW RATE
Figure 1. Figure 2.
5
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VO − Output Voltage − V
−90
−80
−70
−60
−50
0 1 2 3 4 5
VDD = 3.3 V , f = 1 MHz Rf = 200 , RL = 800
Differential Input / Differential Output
Single Input / Differential Output
THD − Total Harmonic Distortion − dB
−80
−70
−60
−50
−40
−30
−20
100 k 1 M 10 M
THD − Total Harmonic Distortion − dB
f − Frequency − Hz
Differential Input/ Differential Output
Single−Ended Input /
Differential Output
VDD = 3.3 V , VO = 4 V
PP
Rf = 200 , RL = 800 G = 1
−120
−110
−100
−90
−80
−70
−60
−50
−40
100 k 1 M 10 M
Harmonic Distortion − dB
f − Frequency − Hz
5th_HD
4th_HD
3rd_HD
3rd_HD
VDD = 3.3 V , VO = 2 VPP, RL = 800 , Rf = 270 , G = 1
3rd_HD2nd_HD
Differential Input / Differential Output
−120
−110
−100
−90
−80
−70
−60
−50
−40
−30
5th_HD
4th_HD
3rd_HD
2nd_HD
100 k 1 M 10 M
Harmonic Distortion − dB
f − Frequency − Hz
VDD = 3.3 V , VO = 4 VPP, RL = 800 , Rf = 200 , G = 1
Differential Input / Differential Output
THS4120 THS4121
SLOS319D – FEBRUARY 2001 – REVISED OCTOBER 2004
TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION
TOTAL HARMONIC DISTORTION HARMONIC DISTORTION
vs vs
FREQUENCY OUTPUT VOLTAGE
Figure 3. Figure 4.
THS4121 THS4121
vs vs
FREQUENCY FREQUENCY
6
Figure 5. Figure 6.
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−100
−90
−80
−70
−60
−50
−40
−30
−20
100 k 1 M 10 M
Harmonic Distortion − dB
f − Frequency − Hz
5th_HD
4th_HD
3rd_HD
2nd_HD
VDD = 3.3 V , VO = 4 VPP, RL = 800 , Rf = 200 , G = 1
Single Input / Differential Output
Harmonic Distortion − dB
VDD = 3.3 V , f = 1 MHz, RL = 800 , Rf = 200 , G = 1
VO − Output Voltage − V
−120
−110
−100
−90
−80
−70
−60
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
3rd_HD
2nd_HD
Differential Input / Differential Output
−120
−110
−100
−90
−80
−70
−60
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Harmonic Distortion − dB
5th_HD
4th_HD
3rd_HD
2nd_HD
VDD = 3.3 V , f = 1 MHz, RL = 800 , Rf = 200 , G = 1
Single Input / Differential Output
VO − Output Voltage − V
−90
−80
−70
−60
−50
−40
−30
−20
−10
−25 −20 −15 −10 −5 0 5 10
Third Intermodulation Distortion − dBc
VO − Output Voltage − V
f = 10 MHz
f = 5 MHz
VDD = 3.3 V , f = 1 MHz Rf = 270 , RL = 800
THS4120 THS4121
SLOS319D – FEBRUARY 2001 – REVISED OCTOBER 2004
HARMONIC DISTORTION HARMONIC DISTORTION
HARMONIC DISTORTION THIRD INTERMODULALTION DISTORTION
THS4121 THS4121
vs vs
FREQUENCY OUTPUT VOLTAGE
Figure 7. Figure 8.
THS4121
vs vs
OUTPUT VOLTAGE OUTPUT VOLTAGE
Figure 9. Figure 10.
7
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