Datasheet THS4001CD, THS4001IDR, THS4001EVM, THS4001ID, THS4001CDR Datasheet (Texas Instruments)
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Very High Speed
– 270 MHz Bandwidth (Gain = 1, –3 dB)
– 400 V/µsec Slew Rate
– 40-ns Settling Time (0.1%)
D
High Output Drive, IO = 100 mA
D
Excellent Video Performance
– 60 MHz Bandwidth (0.1 dB, G = 1)
– 0.04% Differential Gain
– 0.15° Differential Phase
D
Very Low Distortion
– THD = –72 dBc at f = 1 MHz
D
Wide Range of Power Supplies
V
CC
= ± 2.5 V to ± 15 V,
I
CC
= 7.5 mA
D
Evaluation Module Available
description
The THS4001 is a very high-performance,
voltage-feedback operational amplifier especially
suited for a wide range of video applications. The
device is specified to operate over a wide range of
supply voltages from ± 15 V to ± 2.5 V. With a
bandwidth of 270 MHz, a slew rate of over
400 V/µs, and settling times of less than 30 ns, the
THS4001 offers the unique combination of high
performance in an easy to use voltage feedback
configuration over a wide range of power supply
voltages.
The THS4001 is stable at all gains for both
inverting and noninverting configurations. It has a
high output drive capability of 100 mA and draws
only 7.5 mA of quiescent current. Excellent professional video results can be obtained with the differential
gain/phase performance of 0.04%/0.15° and 0.1 dB gain flatness to 60 MHz. For applications requiring low
distortion, the THS4001 is ideally suited with total harmonic distortion of –72 dBc at f = 1 MHz.
HIGH-SPEED AMPLIFIER FAMILY
DEVICE
ARCH.
SUPPLY
VOLTAGE
BW
SR
THD
f = 1 MHz
t
s
0.1%
DIFF.
DIFF.
V
n
VFB CFB 5 V ±5 V ±15 V
(MHz)
(V/µs)
(dB) (ns)
GAIN
PHASE
(nV/√Hz)
THS3001 • • • 420 6500 –96 40 0.01% 0.02° 1.6
THS4001 • • • • 270 400 –72 40 0.04% 0.15° 12.5
THS4031/32 • • • 100 100 –72 60 0.02% 0.03° 1.6
THS4061/62 • • • 180 400 –72 40 0.02% 0.02° 14.5
Copyright 1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
8
7
6
5
NULL
IN–
IN+
V
CC
–
NULL
V
CC
+
OUT
NC
D PACKAGE
(TOP VIEW)
NC – No internal connection
CLOSED-LOOP GAIN
vs
FREQUENCY
–2
–6
–10
–14
1M 100M
f – Frequency – Hz
0
–4
–8
–12
10M 1G 3G
2
6
300k
Closed-Loop Gain – dB
4
8
VCC = ±15 V
Gain = 1
+
–
3.9 pF
200 Ω
50 Ω
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
SMALL OUTLINE
†
(D)
EVALUATION
MODULE
0°C to 70°C THS4001CD THS4001EVM
–40°C to 85°C THS4001ID —
†
The D packages are available taped and reeled. Add an R suffix to the
device type (i.e., THS4001CDR).
symbol
VCC+
OUT
NULL
NULL
IN–
IN+
VCC–NC
_
+
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
†
Supply voltage, V
CC–
to V
CC+
33 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, V
I
±V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, I
O
175 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, V
ID
±4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See Dissipation Ratings Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free air temperature, T
A
:C suffix 0°C to 70 °C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I suffix –40°C to 85 °C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
–65°C to 150 °C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds 300°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
T
≤ 25°C DERATING FACTOR T
= 70°C T
= 85°C
PACKAGE
A
POWER RATING ABOVE TA = 25°C
A
POWER RATING
A
POWER RATING
°
D
740 mW
6 mW/ C
475 mW
385 mW
CAUTION: The THS4001 provides ESD protection circuitry. However, permanent damage can still occur if this device is
subjected to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance
degradation or loss of functionality
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
MIN TYP MAX UNIT
pp
Dual supply ±2.5 ±16
Suppl
y v
oltage, V
CC
Single supply 5 32
V
±15 V 7.8 9.5
Quiescent current, I
CC
±5 V, ±2.5 V 6.7 8
mA
p
p
C suffix 0 70
°
Operating free-air temperature, T
A
I suffix –40 85
°C
electrical characteristics, VCC = ±15 V, RL = 150 Ω, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V
CC
MIN TYP MAX UNIT
±15 V 0.04%
Differential gain error
Gain = 2, R
= 150 Ω,
±5 V
0.01%
p
,
f = 3.58 MHz
L
,
±15 V 0.15°
Differential phase error
±5 V 0.08°
p
TA = 25°C
±15 V,
2 8
VIOInput offset voltage
TA = full range
,
±5 V
10
mV
p
TA = 25°C
±15 V,
2.6 5
IIBIn ut bias current
TA = full range
±5 V
6
µA
p
TA = 25°C
±15 V,
35 200
IOSIn ut offset current
TA = full range
±5 V
500
nA
VO = ±10 V , TA = 25°C
5 10
p
p
RL = 1 kΩ TA = full range
±15 V
3
Open-loop gain
VO = ±2.5 V , TA = 25°C
3 6
V/mV
RL = 500 Ω TA = full range
±5 V
2
TA = 25°C
85 100
CMRR
Common-mode rejection ratio
V
(CM)
=
±12 V
TA = full range
±15 V75dB
pp
TA = 25°C
±15 V,
75 85
PSRR
Power supply rejection ratio
TA = full range
±5 V
70
dB
p
±15 V
13.5
to
–13
14.8
to
–14
V
ICR
Common-mode input voltage range
±5 V
3.6
to
–2.7
4.4
to
–3.6
V
±15 V ±13 ±13.5
V
O
Output voltage swing RL = 500 Ω
±5 V ±3.3 ±3.8
V
±2.5 V ±0.8 ±1.3
±15 V 50 100
I
O
Output current
±5 V 50 100
mA
±2.5 V 50 100
THD Total harmonic distortion VI = 1 V
(PP)
, f = 1 MHz ±15 V –72 dBc
R
I
Input resistance 10 MΩ
C
I
Input capacitance 1.5 pF
R
O
Output resistance Open loop 10 Ω
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
operating characteristics, VCC = ±15 V, RL = 150 Ω, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP MAX UNIT
±15 V 400
Slew rate Gain = –1
±5 V 400
V/µs
±2.5 V 350
10 V step (0 to 10 V), Gain = –1 ±15 V 40
Settling time to 0.1%
–2.5 V to 2.5 V step, Gain = –1 ±5 V 30
ns
±15 V 270
Gain = +1,
RL = 150 Ω,
±5 V
220
MHz
R
f
=
150 Ω
±2.5 V 180
–3 dB
Bandwidth
±15 V 80
Gain = –1,
RL = 150 Ω,
±5 V
75
MHz
R
f
=
150 Ω
±2.5 V 70
±15 V 60
Bandwidth for 0.1 dB flatness Gain = +1
±5 V 50
MHz
±2.5 V 40
V
n
Equivalent input noise voltage f = 10 kHz
±15 V,
±5 V
12.5 nV/√Hz
I
n
Equivalent input noise current f = 10 kHz
±15 V,
±5 V
1.5 pA/√Hz
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
I
IB
Input bias current vs Free-air temperature 1
V
IO
Input offset voltage vs Free-air temperature 2
Open-loop gain vs Frequency 3
Phase vs Frequency 3
Differential gain vs DC voltage 4, 5
Differential phase vs DC voltage 4, 5
Closed-loop gain vs Frequency 6, 7
CMRR Common-mode rejection ratio vs Frequency 8
pp
vs Frequency 9
PSRR
Power-supply rejection ratio
vs Free-air temperature 10
p
vs Supply voltage 11
V
O(PP)
Output voltage swing
vs Load resistance 12
Bandwidth (–3 dB) vs Feedback resistance 13, 14
pp
vs Supply voltage 15
ICCSupply current
vs Free-air temperature 16
E
nv
Noise spectral density vs Frequency 17
THD Total harmonic distortion vs Frequency 18
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 1
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE
–40 –20 0 20 80
TA – Free-Air Temperature – °C
6040
I
IB
– Input Bias Current –
3
2.5
2
1.5
2.75
2.25
1.75
Aµ
100
VCC = ±2.5 V
VCC = ±5 V
VCC = ±15 V
Figure 2
TA – Free-Air Temperature – °C
INPUT OFFSET VOLTAGE
vs
FREE-AIR TEMPERATURE
–40 –20 0 804020
0
1
–1
V
IO
– Input Offset Voltage – mV
60
VCC = ±15 V
VCC = ±5 V
1.5
0.5
–0.5
–1.5
100
OPEN-LOOP GAIN AND PHASE
vs
FREQUENCY
40
20
0
–20
10k 1M
f – Frequency – Hz
50
30
10
–10
100k 10M 100M
60
80
1k
Open-Loop Gain – dB
70
90
135
°
180
5°
90°
Phase
45°
0°
VCC = ±15 V
1G
Figure 3
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
0
0.036
0.012
–0.012
–0.036
0.1 0.2 0.3 0.5 0.6
DC Voltage – V
0.4
0.048
Differential Gain – (%/div)
0.024
0
–0.024
0.7
–0.02°
–0.06°
0°
Differential Phase
0.02°
0.04°
–0.04°
0.1°
0.06°
0.08°
Gain
Phase
DIFFERENTIAL GAIN AND
DIFFERENTIAL PHASE
vs
DC VOLTAGE
VCC = ±5
–0.048
Figure 4
0
0.036
0.012
–0.012
–0.036
0.1 0.2 0.3 0.5 0.6
DC Voltage – V
0.4
Differential Gain – (%/div)
0.024
0
–0.024
0.7
–0.02°
–0.06°
0°
Differential Phase
0.02°
0.04°
–0.04°
0.1°
0.06°
0.08°
DIFFERENTIAL GAIN AND
DIFFERENTIAL PHASE
vs
DC VOLTAGE
Gain
Phase
VCC = ±15
–0.048
–0.06
0.12°0.048
Figure 5
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 6
CLOSED-LOOP GAIN
vs
FREQUENCY
–2
–6
–10
–14
1M 100M
f – Frequency – Hz
0
–4
–8
–12
10M 1G 3G
2
6
300k
Closed-Loop Gain – dB
4
8
VCC = ±15 V
Gain = 1
+
–
3.9 pF
200 Ω
50 Ω
Figure 7
CLOSED-LOOP GAIN
vs
FREQUENCY
–15
–25
–35
–45
1M 100M
f – Frequency – Hz
–10
–20
–30
–40
10M 1G 3G
–5
5
300k
Closed-Loop Gain – dB
0
VCC = ±15 V
Gain = –1
+
–
50 Ω
1 kΩ
1 kΩ
Figure 8
CMRR – Common-Mode Rejection Ratio – dB
COMMON-MODE REJECTION RATIO
vs
FREQUENCY
10 100 1k 10k 10M 100M
f – Frequency – Hz
1M100k
100
60
20
0
80
40
120
VCC = ±15 V to ±2.5 V
Figure 9
f – Frequency – Hz
PSRR – Power Supply Rejection Ratio – dB
POWER SUPPLY REJECTION RATIO
vs
FREQUENCY
10 100 1k 10k 10M 100M1M100k
60
40
20
0
50
30
10
100
80
90
70
+V
CC
–V
CC
VCC = ±15 V to ±2.5 V
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 10
TA – Free-Air Temperature – °C
PSRR – Power Supply Rejection Ratio – dB
POWER SUPPLY REJECTION RATIO
vs
FREE-AIR TEMPERATURE
–40 –20 0 804020
110
90
70
60
100
80
120
VCC = –15 V
60 100
VCC = 15 V
Figure 11
OUTPUT VOLTAGE SWING
vs
SUPPLY VOLTAGE
2 4 6 8 14 16
VCC – Supply Voltage – V
1210
30
20
10
0
25
15
5
RL = 150 Ω
V
O(PP)
– Output Voltage Swing – V
RL = 1 kΩ
Figure 12
OUTPUT VOLTAGE SWING
vs
LOAD RESISTANCE
10 100 10000
RL – Load Resistance – Ω
1000
30
20
10
0
25
15
5
V
O(PP)
– Output Voltage Swing – V
VCC = ±15 V
VCC = ±2.5 V
VCC = ±5 V
Figure 13
BANDWIDTH (–3 dB)
vs
FEEDBACK RESISTANCE
500 700 900 1100 1700 1900
R
(FB)
– Feedback Resistance – Ω
15001300
60
40
20
0
50
30
10
BW – Bandwidth (–3 dB) – MHz
100
80
90
70
VCC = ±2.5 V
VCC = ±5 V
VCC = ±15 V
Gain = –1
f = –3 dB
RL = 150 Ω
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 14
R
(FB)
– Feedback Resistance – Ω
BANDWIDTH (–3 dB)
vs
FEEDBACK RESISTANCE
100 200 300 400 700 800600500 900
300
200
100
0
250
150
50
1000
VCC = ±2.5 V
VCC = ±5 V
VCC = ±15 V
Gain = 1
f = –3 dB
RL = 150 Ω
BW – Bandwidth (–3 dB) – MHz
Figure 15
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
2468 14
VCC – Supply Voltage – V
1210
6
4
2
0
5
3
1
8
9
7
I
CC
– Supply Current – mA
Figure 16
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
–40 –20 0 20 80
TA – Free-Air Temperature – °C
6040
6
4
2
0
7
5
3
1
8
9
I
CC
– Supply Current – mA
VCC = ±15 V
VCC = ±5 V
VCC = ±2.5 V
100
Figure 17
NOISE SPECTRAL DENSITY
vs
FREQUENCY
10 100 1k 10k
f – Frequency – Hz
100k
60
40
20
0
50
30
10
80
70
E
nv
– Noise Spectral Density –
nV/
Hz
VCC = ±5 V
and ±2.5 V
VCC = ±15 V
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 18
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
1
f – Frequency – MHz
THD – Total Harmonic Distortion – dB
10
0.5
–55
–65
–75
–85
–50
–60
–70
–80
2 nd Harmonic
3 rd Harmonic
G = +2
VIN = 1 V(
PP)
VCC = ±15 V
RL = 150 Ω
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
theory of operation
The THS4001 is a high speed, operational amplifier configured in a voltage feedback architecture. It is built
using a 30-V , dielectrically isolated, complementary bipolar process with NPN and PNP transistors possessing
f
T
s of several GHz. This results in an exceptionally high performance amplifier that has a wide bandwidth, high
slew rate, fast settling time, and low distortion. A simplified schematic is shown in Figure 19.
IN– (2)
IN+ (3)
NULL (1) NULL (8)
(6) OUT
(4) VCC–
(7) VCC+
Figure 19. THS4001 Simplified Schematic
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
offset nulling
The THS4001 has very low input offset voltage for a high-speed amplifier . However, if additional correction is
required, an offset nulling function has been provided. By placing a potentiometer between terminals 1 and 8
of the device and tying the wiper to the negative supply, the input offset can be adjusted. This is shown in
Figure 20.
_
+
THS4001
VCC–
VCC+
0.1 µF
0.1 µF
10 kΩ
Figure 20. Offset Nulling Schematic
optimizing unity gain response
Internal frequency compensation of the THS4001 was selected to provide very wideband performance yet still
maintain stability when operated in a noninverting unity gain configuration. When amplifiers are compensated
in this manner there is usually peaking in the closed loop response and some ringing in the step response for
very fast input edges, depending upon the application. This is because a minimum phase margin is maintained
for the G=+1 configuration. For optimum settling time and minimum ringing, a feedback resistor of 200 Ω should
be used as shown in Figure 21. Additional capacitance can also be used in parallel with the feedback resistance
if even finer optimization is required.
_
+
THS4001
200 Ω
Input
Output
Figure 21. Noninverting, Unity Gain Schematic
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
13
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
driving a capacitive load
Driving capacitive loads with high performance amplifiers is not a problem as long as certain precautions are
taken. The first is to realize that the THS4001 has been internally compensated to maximize its bandwidth and
slew rate performance. When the amplifier is compensated in this manner, capacitive loading directly on the
output will decrease the device’s phase margin leading to high frequency ringing or oscillations. Therefore, for
capacitive loads of greater than 10 pF, it is recommended that a resistor be placed in series with the output of
the amplifier, as shown in Figure 22. A minimum value of 20 Ω should work well for most applications. For
example, in 75-Ω transmission systems, setting the series resistor value to 75 Ω both isolates any capacitance
loading and provides the proper line impedance matching at the source end.
+
_
THS4001
C
LOAD
1 kΩ
Input
Output
1 kΩ
20 Ω
Figure 22. Driving a Capacitive Load
circuit layout considerations
In order to achieve the levels of high frequency performance of the THS4001, it is essential that proper
printed-circuit board high frequency design techniques be followed. A general set of guidelines is given below.
In addition, a THS4001 evaluation board is available to use as a guide for layout or for evaluating the device
performance.
D
Ground planes – It is highly recommended that a ground plane be used on the board to provide all
components with a low inductive ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
D
Proper power supply decoupling – Use a 6.8-µF tantalum capacitor in parallel with a 0.1-µF ceramic
capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers
depending on the application, but a 0.1-µF ceramic capacitor should always be used on the supply terminal
of every amplifier. In addition, the 0.1-µF capacitor should be placed as close as possible to the supply
terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less
effective. The designer should strive for distances of less than 0.1 inches between the device power
terminals and the ceramic capacitors.
D
Sockets – Sockets are not recommended for high speed op amps. The additional lead inductance in the
socket pins will often lead to stability problems. Surface-mount packages soldered directly to the
printed-circuit board is the best implementation.
D
Short trace runs/compact part placements – Optimum high frequency performance is achieved when stray
series inductance has been minimized. To realize this, the circuit layout should be made as compact as
possible thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting
input of the amplifier. Its length should be kept as short as possible. This will help to minimize stray
capacitance at the input of the amplifier.
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
circuit layout considerations (continued)
D
Surface-mount passive components – Using surface mount passive components is recommended for high
frequency amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be
kept as short as possible.
evaluation board
An evaluation board is available for the THS4001 (literature number SLOP1 19). This board has been configured
for very low parasitic capacitance in order to realize the full performance of the amplifier. A schematic of the
evaluation board is shown in Figure 23. The circuitry has been designed so that the amplifier may be used in
either an inverting or noninverting configuration. T o order the evaluation board contact your local TI sales office
or distributor. For more detailed information, refer to the
THS4001 EVM User’s Manual
(literature number
SLOU017).
_
+
THS4001
VCC–
VCC+
C3
6.8 µF
C4
0.1 µF
C1
6.8 µF
C2
0.1 µF
R1
1 kΩ
R5
1 kΩ
R3
49.9 Ω
R2
49.9 Ω
R4
49.9 Ω
IN–
IN+
NULL
OUT
NULL
+
+
Figure 23.
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL INFORMATION
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
4040047/D 10/96
0.228 (5,80)
0.244 (6,20)
0.069 (1,75) MAX
0.010 (0,25)
0.004 (0,10)
1
14
0.014 (0,35)
0.020 (0,51)
A
0.157 (4,00)
0.150 (3,81)
7
8
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.010 (0,25)
PINS **
0.008 (0,20) NOM
A MIN
A MAX
DIM
Gage Plane
0.189
(4,80)
(5,00)
0.197
8
(8,55)
(8,75)
0.337
14
0.344
(9,80)
16
0.394
(10,00)
0.386
0.004 (0,10)
M
0.010 (0,25)
0.050 (1,27)
0°–8°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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