The THS1230 is a CMOS, low power, 12-bit, 30 MSPS analog-to-digital converter (ADC) that operates with a
3.3-V supply . The THS1230 gives circuit developers complete flexibility . The analog input to the THS1230 can
be either single-ended, single-ended with offset, or differential. The THS1230 provides a wide selection of
voltage references to match the user’s design requirements. For more design flexibility, the internal reference
can be bypassed to use an external reference to suit the dc accuracy and temperature drift requirements of the
application. The out-of-range output is used to monitor any out-of-range condition in the THS1230’s input range.
The speed, resolution, and single-supply operation of the THS1230 are suited for applications in set top box
(STB), video, multimedia, high-speed acquisition, and communications. The speed and resolution ideally suit
charge-couple device (CCD) input systems such as digital copiers, digital cameras, and camcorders. The wide
input voltage range between V
REFB
and V
allows the THS1230 to be designed into multiple systems.
REFT
The THS1230C is characterized for operation from 0°C to 70°C. The THS1230I is characterized for operation
from –40°C to 85°C.
AVAILABLE OPTIONS
A
0°C to 70°CTHS1230CPWTHS1230CDW
–40°C to 85°CTHS1230IPWTHS1230IDW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
28-TSSOP (PW)28-SOIC (DW)
PACKAGED DEVICES
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2000, Texas Instruments Incorporated
1
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
AIN+5IPositive analog input
AIN–6INegative analog input
CLK28IADC conversion clock
CON12IConfiguration Input 1
CON03IConfiguration Input 0
DGND19IDigital ground
DV
DD
D1112OADC data bit 11
D1013OADC data bit 10
D914OADC data bit 9
D815OADC data bit 8
D716OADC data bit 7
D617OADC data bit 6
D518OADC data bit 5
D421OADC data bit 4
D322OADC data bit 3
D223OADC data bit 2
D124OADC data bit 1
D025OADC data bit 0
EXTREF4IReference select input, high = external, low = internal
OVRNG11OOut of range indicator
OE26IOutput enable, high = disable, low = enable
REFT9I/OUpper ADC reference voltage
REFB10I/OLower ADC reference voltage
8, 27IAnalog supply
20IDigital supply
THS1230
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
†
Supply voltage range:AVDD to AGND, DVDD to DGND –0.3 to 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 in) from case for 10 seconds 300°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All other inputs0.8 × DV
CLK0.8 × AV
All other inputs0.2 × DV
CLK0.2 × AV
= 50 µADVDD–0.4V
load
= –50 µA0.4V
load
DD
DD
min
to T
max
DD
DD
) (unless
V
V
power supply (CLK = 30 MHz)
PARAMETERTEST CONDITIONMINTYPMAXUNIT
XV
DD
I
DD
I
(analog)
I
(digital)
I
I(standby)
t
(PU)
P
D
P
D(STBY)
PSRRPower supply rejection ratio±0.1%FS
Supply voltage (all supplies)33.33.6V
Supply current active – total4866mA
Supply current active – analog35mA
Supply current active – digital13mA
Standby supply currentCLK = 0 MHz10µA
Power-up time for references from standby100µs
Power dissipationCLK = 30 MHz168220mW
Standby power dissipationCLK = 0 MHz36µW
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
Number of missing codesAll modes0codes
DNLDifferential nonlinearityAll modes±0.4±1LSB
INLIntegral nonlinearityAll modes–2.5±1.22LSB
Offset errorAll modes0.51.2%FSR
Gain errorAll modes0.53.5%FSR
dynamic performance (all supplies = 3.3 V)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
fi = 3.58 MHz10.9
ENOBEffective number of bits
THDTotal harmonic distortion
SNRSignal-to-noise ratio
SINADSignal-to-noise + distortion
SFDRSpurious free dynamic range
Analog input bandwidth180MHz
Differential phase, DP0.12degree
G
Differential gain0.01%
(diff)
timing (all supplies = 3.3 V)
PARAMETERTEST CONDITIONMINTYPMAXUNIT
f
CLK
t
d(O)
t
d(PZ)
t
d(EN)
†
The clock frequency may be extended to 5 MHz without degradation in specified performance.
Clock frequency
Clock duty cycle45%50%55%
Output delay time19ns
Delay time, output disable to Hi-Z output3.2ns
Delay time, output enable to output valid1619ns
Latency5cycles
†
fi = 10 MHz
fi = 15 MHz10.8
fi = 3.58 MHz–76
fi = 10 MHz
fi = 15 MHz–72.5
fi = 3.58 MHz68
fi = 10 MHz
fi = 15 MHz67.7
fi = 3.58 MHz67.4
fi = 10 MHz
fi = 15 MHz66.6
fi = 3.58 MHz78.1
fi = 10 MHz
fi = 15 MHz74.6
to T
min
10.610.9
–74–65
6668
65.667.4
6776.4
530MHz
max
) (unless
Bits
dB
dB
dB
dB
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
PARAMETER MEASUREMENT INFORMATION
timing diagram
Analog
CLK
OE
D[9:0]
OE
D[9:0]
S1
123456789
S2S3
t
d(EN)
t
PIPELINE
t
d(O)
S1S2S3
Figure 2. Input Timing
t
d(EN)
Hi–ZHi–Z
DataDataData
t
d(PZ)
10
t
d(PZ)
Figure 3. Output Timing
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
TYPICAL CHARACTERISTICS
POWER
vs
TEMPERATURE
200
190
180
170
Power – mW
160
150
–40–1510356085
TA – Temperature – °C
Figure 4
SPURIOUS FREE DYNAMIC RANGE
vs
TEMPERATURE
80
AVDD = DVDD = 3.3 V
79
78
fs = 30 MSPS
fi = 10 MHz
Mode 1
SIGNAL-TO-NOISE RATIO
vs
TEMPERATURE
70
AVDD = DVDD = 3.3 V
69
68
67
66
SNR – Signal-to-Noise Ratio – dB
65
fs = 30 MSPS
fi = 10 MHz
Mode 1
–40–1510356085
TA – Temperature – °C
Figure 5
TOTAL HARMONIC DISTORTION
vs
TEMPERATURE
–65
–66
–67
–68
–69
AVDD = DVDD = 3.3 V
fs = 30 MSPS
fi = 10 MHz
Mode 1
77
76
SFDR – Spurious Free Dynamic Range – dB
75
–40–1510356085
TA – Temperature – °C
Figure 6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
–70
–71
–72
–73
THD – Total Harmonic Distortion – dB
–74
–75
–40–1510356085
TA – Temperature – °C
Figure 7
9
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
TYPICAL CHARACTERISTICS
SIGNAL-TO-NOISE AND DISTORTION
vs
TEMPERATURE
70
AVDD = DVDD = 3.3 V
69
68
67
66
SINAD – Signal-to-Noise and Distortion – dB
65
fs = 30 MSPS
fi = 10 MHz
Mode 1
–40–1510356085
TA – Temperature – °C
Figure 8
SIGNAL-TO-NOISE AND DISTORTION
vs
TEMPERATURE
12
AVDD = DVDD = 3.3 V
fs = 30 MSPS
fi = 10 MHz
Mode 1
11
10
SINAD – Signal-to-Noise and Distortion – dB
9
–40–1510356085
TA – Temperature – °C
Figure 9
DIFFERENTIAL NONLINEARITY
1
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
050010001500200025003000
DNL – Differential Nonlinearity – LSB
ADC Code
Figure 10
35004000
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
TYPICAL CHARACTERISTICS
INTEGRAL NONLINEARITY
2
1.5
1
0.5
0
–0.5
–1
–1.5
INL – Integral Nonlinearity – LSB
–2
050010001500200025003000
ADC Code
Figure 11
35004000
FAST FOURIER TRANSFORM
0
–20
–40
–60
–80
Power – dBFS
–100
–120
–140
03691215
f – Frequency – MHz
AVDD = DVDD = 3.3 V
fs = 30 MSPS
fi = 3.5 MHz
Mode 1
Figure 12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
PRINCIPLES OF OPERATION
analog input
The analog input AIN is sampled in the sample and hold unit, the output of which feeds the ADC CORE, where
the process of analog to digital conversion is performed against ADC reference voltages, V
Connecting the EXTREF pin to one of two voltages, DGND or DVDD selects one of the two configurations of
ADC reference generation. The ADC reference voltages come from either the internal reference buffer or
completely external sources. Connect EXTREF to DGND for internal reference generation or to DVDD for
external reference generation.
CON0 and CON1 as described below, select the input configuration mode or place the device in powerdown.
The ADC core drives out through output buffers to the data pins D0 to D1 1. The output buffers can be disabled
by the OE pin.
A single, sample-rate clock (30 MHz maximum) is required at pin CLK. The analog input signal is sampled on
the rising edge of CLK, and corresponding data is output after the fifth following rising edge.
The THS1233 can operate in four input modes, controlled by the configuration pins CON0 and CON1 as shown
in Table 1.
REFT
and V
REFB
.
Table 1. Input Modes of Operation
MODECON1CON0MODE OF OPERATION
000Device powered down
101Single-ended mode/differential mode × 1
210Differential mode ×0.5
311Single-ended mode with of fset
The difference between the AIN– and the AIN+ inputs is different in all three cases. The THS1230 automatically
switches gain and offset in the S/H to accommodate for the input signals. This automatic switching is covered
in Table 2.
Table 2. Input Mode Switching
MODECON1CON0
101–1 V1 V×10 V
210–2 V2 V×0.50 V
3110 V1 V×1–1 V
(AIN+) – (AIN–)
MIN
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
(AIN+) – (AIN–)
MAX
S/H GAINS/H OFFSET
13
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
PRINCIPLES OF OPERATION
analog input (continued)
Table 2 assumes that the delta in ADC reference voltages V
V
REFT
– V
= 1 V . Note that V
REFB
REFB
and V
can be set externally , which will scale the numbers given in
REFT
REFT
and V
is set to 1 V, i.e.,
REFB
this table.
The user-chosen operating configuration and reference voltages determine what input signal voltage range the
THS1230 can handle.
The following sections explain both the internal signal flow of the device and how the input signal span is related
to the ADC reference voltages, as well as the ways in which the ADC reference voltages can be buffered
internally or externally applied.
signal processing chain (sample and hold, ADC)
Figure 14 shows the signal flow through the sample and hold unit and the PGA to the ADC core.
REFT
AIN+
AIN–
+1
–1
SAMPLE
AND
HOLD
Figure 14. Analog Input Signal Flow
VP+
ADC
CORE
VP–
REFB
sample and hold
The differential sample and hold processes AIN with respect to the voltages applied to the REFT and REFB pins,
to give a differential output (VP+) – (VP–) = VP given by:
VP = (AIN+) – ( AIN–)
For single-ended input signals, AIN– is a constant voltage; usually the AIN midscale input voltage. However if
MODE = 3 (see Table 1) then AIN– or AIN+ can be used to create an offset for the other input in single-ended
mode.
No matter what operating configuration is chosen, VP is digitized against ADC reference voltages V
V
at AIN greater than REFTS or less than V
REFB
. The V
REFT
and V
voltages set the analog input span limits FS+ and FS– respectively . Any voltages
REFB
REFBS
will cause ADC over-range, which is signaled by OVR going
high when the conversion result is output.
analog input
A first-order approximation for the equivalent analog input circuit of the THS1230 is shown in Figure 15. The
equivalent input capacitance C
is 5 pF typical. The input must charge/discharge this capacitance within the
I
sample period of one half of a clock cycle. When a full-scale voltage step is applied, the input source provides
the charging current through the switch resistance R
(200 Ω) of S1 and quickly settles. In this case the input
SW
impedance is low. Alternatively, when the source voltage equals the value previously stored on CI, the hold
capacitor requires no input current and the equivalent input impedance is very high.
THS1230
R
R
VS+V
+
V
CM
_
–
S
R
S
S
SW
R
SW
C
I
V
CM
C
I
+
_
REFT
and
Figure 15. Simplified Equivalent Input Circuit
To maintain the frequency performance outlined in the specifications, the total source impedance should be
limited to the following equation with f
RSt
2f
CLK
1
CI
In(256)
–R
SW
So, for applications running at a lower f
= 30 MHz, CI = 5 pF, RSW = 200 Ω:
CLK
, the total source resistance can increase proportionally.
CLK
The analog input of the THS1230 is a differential input that can be configured in various ways depending on
the signal source and the required level of performance. A fully differential connection (see Figure 16) will deliver
the best performance from the converter.
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15
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
PRINCIPLES OF OPERATION
analog input (continued)
AV
DD
2
R2
THS1230
AIN+
V
IN+
C1
R1
–
+
R2
–
+
AIN–
REFT
REFB
V
IN–
C2
C1
C2
R1
Figure 16. AC-Coupled Differential Input
The analog input can be dc-coupled (see Figure 17) as long as the inputs are within the analog input common
mode voltage range. For example (see Figure 17), V+ and V– are signals centered on GND with a peak-to-peak
voltage of 2 V , and the circuit in Figure 17 is used to interface it with the THS1230. Assume AVDD of the converter
is 3 V . T wo problems have to be solved. The first is to shift CML from 0 V to 1.5 V (A VDD/2). T o do that, a V bias
voltage and an adequate ratio of R1 and R2 have to be selected. For instance, if V bias = AVDD = 3 V, then
R1 = R2. The second is that the differential voltage has to be reduced from 4 V (2 x 2 V) to 1 V, and for that an
attenuation of 4 to1 is needed. The attenuation is determined by the relation: (R3||2R2)/((R3||2R2) + 2R1). One
possible solution is R1 = R2 = R3 = 150 Ω. In this case, moreover, the input impedance (2R1 + (R3||2R2)) will
be 400 Ω. The values can be changed to match any other input impedance. A capacitor , C, connected from AIN+
to AIN– will help filter any high frequency noise on the inputs, also improving performance. Note that the chosen
value of capacitor C must take into account the highest frequency component of the analog input signal.
The configuration shown in Figure 18 may be used with a single-ended ac-coupled input. If VIN is a 1 V
PP
sinewave, then AIN+ is a 1 VPP sinewave riding on a positive voltage equal to AVDD/2. The converter will be
at positive full scale when AIN+ is at AV
/2 + 0.5 V and will be at negative full scale when AIN+ is equal to
DD
AVDD/2 – 0.5 V. Sufficient headroom must be provided such that the input voltage never goes above 3.3 V or
below AGND.
A single-ended source may give better overall system performance if it is first converted to differential before
driving the THS1230.
AV
DD
2
THS1230
V
IN
AIN+
AIN–
REFT
REFB
Figure 18. Transformer Coupled Single-Ended Input
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17
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
PRINCIPLES OF OPERATION
digital outputs
The output of THS1230 is in unsigned binary code. The ADC input over-range indicator is output on pin OVRNG.
Capacitive loading on the output should be kept as low as possible (a maximum loading of 10 pF is
recommended) to ensure best performance. Higher output loading causes higher dynamic output currents and
can therefore increase noise coupling into the part’s analog front end. T o drive higher loads the use of an output
buffer is recommended.
When clocking output data from THS1230, it is important to observe its timing relation to CLK. The pipeline ADC
delay is 5 clock cycles to which the maximum output propagation delay needs to be added.
THS1230
DA11
DA0
CLK
SN74ALVCH16841
1Q9
1Q0
2Q1
2Q0
2Q9
2Q2
12
1D9
1D0
2D1
2D0
2D7
2D2
LE
OE
Figure 19. Buffered Output Connection
THS1230
DA11
DA0
12
D11
D0
D15
D12
WRTCLK
12
FIFO
1Q15
1Q0
16
HF flagINTR
ASIC
or
DSP
DSP
30 MHz
Clock
Figure 20. FIFO Connection
layout, decoupling and grounding rules
Proper grounding and layout of the PCB on which THS1230 is populated is essential to achieve the stated
performance. It is advised to use separate analog and digital ground planes that are spliced underneath the IC.
THS1230 has digital and analog pins on opposite sides of the package to make this easier. Since there is no
connection internally between analog and digital grounds, they have to be joined on the PCB. It is advised to
do this at one point in close proximity to THS1230.
Because of the high sampling rate and switched-capacitor architecture, THS1230 generates transients on the
supply and reference lines. Proper decoupling of these lines is therefore essential. Decoupling is recommended
as shown in the schematic of the THS1230 evaluation module in this data sheet.
18
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
PRINCIPLES OF OPERATION
definitions of specifications and terminology
integral nonlinearity (INL)
Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale.
The point used as zero occurs 1/2 LSB before the first code transition. The full-scale point is defined as level
1/2 LSB beyond the last code transition. The deviation is measured from the center of each particular code to
the true straight line between these two end points.
differential nonlinearity (DNL)
An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value.
Therefore, this measure indicates how uniform the transfer function step sizes are. The ideal step size is defined
here as the step size for the device under test, i.e. (last transition level – first transition level)/(2n –2). Using this
definition for DNL separates the effects of gain and offset error. A minimum DNL better than –1 LSB ensures
no missing codes.
offset and gain error
Offset error (in LSBs) is defined as the average offset for all inputs, and gain error is defined as the maximum
error (in LSBs) caused by the angular deviation from the offset corrected straight line.
THS1230
analog input bandwidth
The analog input bandwidth is defined as the maximum frequency of a 1 –dBFS input sine wave that can be
applied to the device for which an extra 3 –dB attenuation is observed in the reconstructed output signal.
output timing
Output timing td(O) is measured from the 50% level of the CLK input falling edge to the 10%/90% level of the
digital output. The digital output load is not higher than 10 pF.
Output hold time t
is measured from the 50% level of the CLK input falling edge to the10%/90% level of the
h(O)
digital output. The digital output load is not less than 2 pF.
Aperture delay t
is measured from the 50% level of the CLK input to the actual sampling instant.
d(A)
The OE signal is asynchronous.
OE timing t
is measured from the V
d(PZ)
IH(min)
level of OE to the high-impedance state of the output data. The
digital output load is not higher than 10 pF.
OE timing t
or V
OL(max)
is measured from the V
d(EN)
level of OE to the instant when the output data reaches V
IL(max)
output levels. The digital output load is not higher than 10 pF.
signal-to-noise ratio + distortion (SINAD)
SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components
below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in
decibels.
OH(min)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
19
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
PRINCIPLES OF OPERATION
definitions of specifications and terminology (continued)
effective number of bits (ENOB)
For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula,
N = (SINAD – 1.76)/6.02
it is possible to get a measure of performance expressed as N, the effective number of bits. Thus, effective
number of bits for a device for sine wave inputs at a given input frequency can be calculated directly from its
measured SINAD.
total harmonic distortion (THD)
THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal
and is expressed as a percentage or in decibels.
spurious free dynamic range (SFDR)
SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal.
20
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
MECHANICAL DATA
DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
16 PINS SHOWN
0.050 (1,27)
16
1
0.020 (0,51)
0.014 (0,35)
9
0.299 (7,59)
0.291 (7,39)
8
A
0.010 (0,25)
0.419 (10,65)
0.400 (10,15)
M
0.010 (0,25) NOM
0°–8°
Gage Plane
0.010 (0,25)
0.050 (1,27)
0.016 (0,40)
0.104 (2,65) MAX
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-013
0.012 (0,30)
0.004 (0,10)
DIM
A MAX
A MIN
PINS **
0.410
(10,41)
0.400
(10,16)
16
Seating Plane
0.004 (0,10)
20
0.510
(12,95)
0.500
(12,70)
0.610
(15,49)
0.600
(15,24)
24
28
0.710
(18,03)
0.700
(17,78)
4040000/D 01/00
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
21
THS1230
3.3-V, 12-BIT, 30 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER
WITH POWER DOWN
SLAS291A – OCTOBER 2000 – REVISED NOVEMBER 2000
MECHANICAL DATA
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
22
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Copyright 2000, Texas Instruments Incorporated
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