Datasheet TC213-50, TC213-40, TC213-30 Datasheet (Texas Instruments)

TC213
1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
Copyright 1991, Texas Instruments Incorporated
2-1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
High-Resolution, Solid-State
13.5-mm Image-Area Diagonal
1000 (H) × 510 (V) Active Elements in
Image-Sensing Area
Square Pixels
Low Dark Current
Electron-Hole Recombination Antiblooming
Dynamic Range . . . More Than 60 dB
High Sensitivity
High Photoresponse Uniformity
High Blue Response
Single-Phase Clocking
Solid-State Reliability With No Image
Burn-in, Residual Imaging, Image Distortion, Image Lag, or Microphonics
description
The TC213 is a frame-transfer charge-coupled device (CCD) image sensor that provides very high-resolution image acquisition for image-processing applications such as robotic vision, medical X-ray analysis, and metrology . The image format measures 12.00 mm horizontally by 6.12 mm vertically; the image-area diagonal is 13.5 mm. The image-area pixels are 12-µm square. The image area contains 510 active lines with 1000 active pixels per line. Two additional dark reference lines give a total of 512 lines in the image area, and 24 additional dark-reference pixels per line give a total of 1024 pixels per horizontal line.
The storage section of the TC213 contains 512 lines with 1024 pixels per line. This area is protected from exposure to light by an aluminum light shield. Photoelectric charge that is generated in the image area of the TC213 can be transferred into the storage section in less than 500 µs. After image capture (integration time), the readout is accomplished by transferring the charge, one line at a time, into two serial registers located below the storage area, each of which contains 512 data elements and 12 dummy elements. One serial-register clocks out charge that is generated in the odd-numbered columns of pixels in the imaging area; the other serial-register processes charge from the even-numbered columns of the imaging area. The typical serial-register data rate is 10 megapixels per second. Three transfer gates are used to isolate the serial registers. If the storage area or storage and image areas need to be cleared of all charge, charge may be quickly transferred across the serial registers and into the clearing drain, which is located below the serial-register section.
This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to SUB. Under no circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUTn to ADB during operation to prevent damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is
allowed to flow. Specific guidelines for handling devices of this type are contained in the publication
Guidelines for Handling
Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies
available from Texas Instruments.
TRG
SRG2
SRG1
CDB
RST1
RST2
SUB
ADB
OUT2
AMP GND
OUT1
SAG
ABGI
IAG
SUB
SUB
TDB
SUB
IAG
ABGI
SAG
ABGS
24 23 22 21 20 19 18 17 16 15
11
10
9
8
7
6
5
4
3
2
1
DUAL-IN-LINE PACKAGE
(TOP VIEW)
IDB ABGS
1312
14
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
TC213 1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
description (continued)
Gated floating-diffusion detection structures are used with each serial register to convert charge to signal voltage. External resets allow the application of off-chip correlated clamp sample-and-hold amplifiers for low-noise performance. To provide high output-drive capability, both outputs are buffered by low-noise, two-stage, source-follower amplifiers. These two output signals can provide a data rate of 20 megapixels per second when combined off chip. An output of 30 frames per second with one field per frame is typical. At room temperature, the readout noise is 55 elecrons and a minimum dynamic range of 60 dB is available.
The blooming protection incorporated into the sensor is based on recombining excess charge with charge of opposite polarity in the substrate. This antiblooming is activated by supplying clocking pulses to the antiblooming gate, which is an integral part of each image-sensing element. The storage area antiblooming gate is clocked only for charge transfer in normal use.
The TC213 is built using TI-proprietary virtual-phase technology, which provides devices with high blue response, low dark signal, good uniformity, and single-phase clocking.
The TC213 is characterized for operation from –10°C to 40°C.
functional block diagram
24 Dark Reference Elements
Clearing Drain
Amplifiers
OUT1
OUT2
RST2
IAG
TDB
19
21
6
3
1
2
AMP GND
CDB
8
SRG2 SRG1
TRG
IDB
11
9
10
ABGS
13
SAG
ABGI
14
15
Blooming Protection
Image Area With
Top Drain
12 Dummy Elements
Multiplexer, Transfer Gates,
and Serial Registers
12
IAG
16
ADB
4
ABGI
22
RST1
7
SAG
23
ABGS
24
Storage Area
TC213
1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
sensor topology diagram
22 Pixels
1000 Pixels
2 Lines
12
Dummy Pixels
511
12 511
512 Lines
1 Pixel
1 Pixel
510 Lines
Terminal Functions
TERMINAL
NAME NO.
I/O
DESCRIPTION
ABGI
15 I Antiblooming gate for image area
ABGI
22 I Antiblooming gate for image area
ABGS
13 I Antiblooming gate for storage area
ABGS
24 I Antiblooming gate for storage area
ADB 4 I Supply voltage for amplifier drain bias
AMP GND 2 Amplifier ground
CDB 8 I Supply voltage for clearing drain bias
IAG
16 I Image-area gate
IAG
21 I Image-area gate
IDB 12 I Supply voltage for input diode bias OUT1 1 O Output signal 1 OUT2 3 O Output signal 2 RST1 7 I Reset gate 1 RST2 6 I Reset gate 2 SAG
14 I Storage-area gate
SAG
23 I Storage-area gate SRG1 9 I Serial-register gate 1 SRG2 10 I Serial-register gate 2 SUB
5 Substrate and clock return
SUB
17 Substrate and clock return SUB
18 Substrate and clock return SUB
20 Substrate and clock return
TDB 19 I Supply voltage for top drain bias
TRG 11 I Transfer gate
All pins of the same name should be connected together externally (i.e., pin 15 to pin 22, pin 13 to pin 24, etc.).
TC213 1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
detailed description
The TC213 consists of four basic functional blocks: (1) the image-sensing area, (2) the image-storage area, (3) the multiplexer block with serial registers and transfer gates, and (4) the low-noise signal-processing amplifier block with charge-detection nodes. The location of each of these blocks is identified in the functional block diagram.
image-sensing and image-storage areas
Figures 1 and 2 show cross sections with potential well diagrams and top views of image-sensing elements. As light enters the silicon in the image-sensing area, free electrons are generated and collected in the potential wells of the sensing elements. During this time, blooming protection is activated by applying a burst of pulses to the antiblooming gate inputs every horizontal blanking interval. This prevents blooming caused by the spilling of charge from overexposed elements into neighboring elements. After integration is complete, the signal charge is transferred into the storage area (see Figure 5).
There are 24 full columns of elements at the left edge of the image-sensing area that are shielded from incident light; these elements provide the dark reference used in subsequent video-processing circuits to restore the video black level. There are also two dark lines at the bottom of the image-sensing area that prevent charge leakage from the image-sensing area into the image-storage area.
multiplexer with transfer gates and serial registers
The multiplexer and transfer gates transfer charge line by line from the image-storage area columns into the corresponding serial registers and prepare it for readout. Figure 3 illustrates the layout of the multiplexing gate that vertically separates the pixels for input into the serial registers. Figure 4 shows the layout of the interface region between the serial-register gates and the transfer gates. Multiplexing is activated during the horizontal blanking interval by applying appropriate pulses to the transfer gates and serial registers; the required pulse timing is shown in Figure 6. A drain is also included to provide the capability to clear the image-sensing area of unwanted charge. Such charge can accumulate in the imager during the start-up of operation or under special circumstances when nonstandard timing is desired. The clear timing is given as part of the parallel-transfer timing in Figure 5.
serial-register readout and video processing
After transfer into the serial registers, the pixels are normally read out 180° out of phase (see Figure 7). Each serial register must be reset to the reference level before the next pixel is read out. The timing for the resets and their relationships to the serial-register pulses is shown in Figure 8. Figure 8 also shows the timing for the pixel clamp and sample and hold needed for an off-chip double-correlated sampling circuit. These two output signals can provide a data rate of 20 million pixels per second when combined off chip. After the charge is placed on the detection node, it is buffered and amplified by a low-noise, dual-stage source follower . Each serial register contains 12 dummy elements that are used to span the distance between the serial register and the output amplifier. A schematic is shown in Figure 9. The location of the dummy elements, which are considered to be part of the amplifiers, is shown in the functional block diagram. Figure 10 gives the timing for a single frame of video. An output of 30 frames per second with one field per frame is typical.
TC213
1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
φ-ABG
φ-IAG
12 µm(H)
Clocked Barrier
Virtual Barrier Antiblooming Gate
Virtual Well
Clocked Well
Light
Antiblooming
Clocking Levels
Accumulated Charge
12 µm(V)
Figure 1. Charge-Accumulation Process
φ-PS
Channel Stops
Virtual Phase
Clocked Phase
Figure 2. Charge-Transfer Process
Gate
Transfer
Gate
Register
Serial-
Wells
Clocked
Channel Stops
Channel Stop
Virtual Well
Clocked Well
Multiplexing Gate
Figure 3. Multiplexing-Gate Layout Figure 4. Interface-Region Layout
TC213 1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
High
High
RST2
RST1
SRG2
SRG1
TRG
ABGI
SAG
IAG
Line 512
Line 511Line 2Line 1
1 µs
ABGS
Intermediate
Intermediate
Low
High
SRG1 and SRG2 pulses are extended to equal TRG and SAG pulse widths during parallel transfers from the storage area to the clearing drain.
Figure 5. Parallel-Transfer Timing
TC213
1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
CPOB2
CPOB1
ABGS
SAG
Low
Low
Low
SH2
SH1
CL2
Low
High
High
CL1
RST2
RST1
SRG2
SRG1
TRG
CBLNK
CSYNC
Intermediate
ABGI
Low
IAG
SRG1 and SRG2 pulses are extended to equal TRG and SAG pulse widths during horizontal line transfer operation for readout.
Figure 6. Horizontal Timing
TC213 1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SRG1
SRG2
ImageBlack ReferenceDummy
12 1 2 312 1 212 3
3211211211211321
NOTE A: A minimum of 524 clock pulses is required to transfer out all elements of a serial register. Overclocking is recommended.
Figure 7. Start of Serial-Transfer Timing
TC213
1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SH2
CL2
OUT2
RST2
SRG2
SH1
CL1
OUT1
RST1
SRG1
OUT
SHCLRSTSRG
Clamp
Pixel
BufferCCD
Amplifier
and-Hold
Sample-
NOTE A: The video-processing (off-chip) pulses are defined as follows:
CL1 = Clamp pulse for video from OUT1 CL2 = Clamp pulse for video from OUT2 SH1 = Sample pulse for the sample-and-hold amplifier for video 1 SH2 = Sample pulse for the sample-and-hold amplifier for video 2 CSYNC = Composite video-sync pulse CBLNK = Composite video-blanking pulse CPOB1 = Dark-reference clamp pulse for video from OUT1 CPOB2 = Dark-reference clamp pulse for video from OUT2
Figure 8. Video-Process Timing
TC213 1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-10
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
OUTn
ADB
SRGn
Two-Stage Source­Follower Amplifier
Reset Gate and Output Diode
Detection Node
CCD Register
Virtual Gate
Clocked Gate
Reference Generator
RSTn
Figure 9. Buffer Amplifier and Charge-Detection Node
TC213
1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-11
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
CBLNK
RST2
RST1
ABGS
ABGI
SRG2
SRG1
TRG
SAG
IAG
512 Pulses541 Pulses
Timing
Vertical
Timing
Horizontal
Figure 10. Clock Timing Requirements – Continuous Mode
TC213 1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-12
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
spurious nonuniformity specification
The spurious nonuniformity specification of the TC213 CCD grades –30 and –40 is based on several sensor characteristics:
Amplitude of the nonuniform line or pixel
Polarity of the nonuniform pixel
Black – White
Nonuniform line or pixel count
The CCD sensors are characterized in both an illuminated condition and a dark condition. In the dark condition, the nonuniformity is specified in terms of absolute amplitude as shown in Figure 1 1. In the illuminated condition, the nonuniformity is specified as a percentage of the total illumination as shown in Figure 12.
The pixel nonuniformity specification for the TC213 is as follows (CCD video-output signal is 50 mV ±10 mV):
NONUNIFORMITY TYPE TC213-30 TC213-40
Maximum amplitude = 1.4 mV
Line
Number with amplitude greater than 1 mV is 6
White spot (40°C) Maximum amplitude = 25 mV
Maximum amplitude = 8 mV Maximum amplitude = 12 mV
White spot (25°C)
Number with amplitude greater than 6 mV = B
Number with amplitude greater than 10 mV = B
Maximum amplitude = 20% Maximum amplitude = 25%
Black spot (% of total illumination)
Number with amplitude greater than 10% = C
Number with amplitude greater than 15% = C
Total number of nonuniformities B+C < 11 B+C < 51
mV
Amplitude
t
Illumination
% of Total
t
Figure 11. Pixel Nonuniformity, Figure 12. Pixel Nonuniformity,
Dark Condition Illuminated Condition
TC213
1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-13
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range for ADB, CDB, IDB, TDB (see Note 1) 0 V to 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range for ABGI, ABGS, IAG, RST1, RST2, SAG, SRG1, SRG2, TRG –15 V to 15 V. . . . . . . .
Operating free-air temperature range, T
A
–10°C to 40°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range –30°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to the substrate terminal.
recommended operating conditions
MIN NOM MAX UNIT
Supply voltage for ADB, CDB, IDB, TDB 11 12 13 V Substrate bias voltage 0 V
High level 1.5 2 2.5
IAG
Low level –11 –9 High level 1.5 2 2.5
SAG
Low level –11 –9 High level 1.5 2 2.5
SRG
Low level –11 –9
Input voltage, V
I
High level 1.5 2 2.5
V
I
RST1, RST2
Low level –11 –9 High level (ABGI only) 5 5.5 6
ABGI, ABGS
Intermediate level
§
–1.5 –1.2 – 0.9 Low level –7.5 –7 –6.5 High level 1.5 2 2.5
TRG
Low level –11 –9
RST1, RST2, SRG1, SRG2, TRG 10
Clock frequency, f
clock
IAG, SAG 1 MHz
ABGI, ABGS 1 Capacitive load OUT1, OUT2 8 pF Operating free-air temperature, T
A
–10 40 °C
The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for clock voltage levels.
§
Adjustment is required for optimal performance.
TC213 1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-14
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended operating ranges of supply voltage and free-air temperature
PARAMETER MIN TYP
MAX UNIT
Dynamic range (see Note 2) 60 dB Charge conversion factor 6 µV/e Charge transfer efficiency (see Note 3) 0.99990 Signal response delay time, τ (see Note 4 and Figure 16) 18 20 22 ns Gamma (see Note 5) 0.89 0.94 0.99 Output resistance 600 800
1/f noise (5 kHz) 0.1
Noise voltage
Random noise (f = 100 kHz) 0.08
µV/Hz
Noise equivalent signal 60 electrons
ADB (see Note 6) 20
Rejection ratio at 10 MHz SRGn (see Note 7) 40 dB
ABGx (see Note 8) 30
Supply current 9 mA
IAG, SAG 15000
p
p
ABGI, ABGS 8000
p
Input capacitance, C
i
TRG 350
pF
SRG1, SRG2 200
All typical values are at TA = 25°C.
NOTES: 2. Dynamic range is –20 times the logarithm of the mean noise signal divided by the saturation output signal.
3. Charge transfer efficiency is one minus the charge loss per transfer in the output register (1046 transfers). The test is performed in the dark using an electrical input signal.
4. Signal-response delay time is the time between the falling edge of the SRG clock pulse and the output signal valid state.
5. Gamma (γ) is the value of the exponent in the equation below for two points on the linear portion of the transfer function curve (this value represents points near saturation):
ǒ
Exposure (2) Exposure (1)
Ǔ
g
+
ǒ
Output signal (2) Output signal (1)
Ǔ
6. ADB rejection ratio is –20 times the logarithm of the ac amplitude on OUTn divided by the ac amplitude on ADB.
7. SRGn rejection ratio is –20 times the logarithm of the ac amplitude on OUTn divided by the ac amplitude on SRGn.
8. ABGx rejection ratio is –20 times the logarithm of the ac amplitude on OUTn divided by the ac amplitude on ABGx.
TC213
1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-15
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
optical characteristics, TA = 25°C, integration time = 33 ms (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
No IR filter
Measured at V
518
Sensitivity (see Note 9)
With IR filter
U
(see Note 10)
64
mV/l
x
Saturation signal, V
sat
(see Note 11) 320 mV
Maximum usable signal, V
use
200 mV Blooming overload ratio (see Note 12) 100 Image-area well capacity 60 x 10
3
electrons
Smear (see Note 13) 0.0016 Dark current TA = 21°C 0.027 nA/cm
2
°
TC213-30 5
Dark signal (see Note 14)
T
A
=
40°C
TC213-40 5
mV
TC213-30 8
Pixel uniformit
y
TC213-40 12
mV
TC213-30 1.4
Column uniformit
y
TC213-40 1.4
mV
Shading VO = 1/2 VU (see Note 10) 15%
NOTES: 9. Sensitivity is measured at an integration time of 33 ms with a source temperature of 2859 K. A CM-500 filter is used. Sensitivity is
measured at any illumination level that gives an output voltage level less than VU.
10. VU is the output voltage that represents the threshold of operation of antiblooming. VU 1/2 saturation signal.
11. Saturation is the condition in which further increase in exposure does not lead to further increase in output signal.
12. Blooming is the condition in which charge is induced in an element by light incident on another element. Blooming overload ratio is the ratio of blooming exposure to saturation exposure.
13. Smear is the measure of error induced by transferring charge through an illuminated pixel in shutterless operation. It is equivalent to the ratio of the single-pixel transfer time during a fast dump to the exposure time using an illuminated section that is 1/10 of the image area vertical height with recommended clock frequencies. Exposure time is 33 ms, the fast dump clocking rate during vertical timing is 1 MHz, and the illuminated section is 1/10 of the height of the image section.
14. Dark-signal level is measured from the dark dummy pixels.
timing requirements
MIN MAX UNIT
IAG 200 SRG 10 SAG 200
trRise time
TRG 200
ns
ABGI, ABGS 100 RST1, RST2 10 IAG 200 SRG 10 SAG 200
tfFall time
TRB 200
ns
ABGI, ABGS 100 RST1, RST2 10
TC213 1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-16
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
DR (dynamic range)
+
camera white clip voltage
V
n
Vn = noise floor voltage V
sat (min)
= minimum saturation voltage
V
use (max)
= maximum usable voltage
V
use (typ)
= typical user voltage (camera white clip)
(light input)
Lux
Enabled
With Antiblooming
Blooming Point
Well Capacity
Dependent On
Disabled
With Antiblooming
Blooming Point
Gate High Level
Upon Antiblooming
Level Dependent
DR
V
n
V
sat (min)
V
use (typ)
V
use (max)
V
O
NOTES: A. V
use (typ)
is defined as the voltage determined to equal the camera white clip. This voltage must be less than V
use (max)
.
B. A system trade-off is necessary to determine the system light sensitivity versus the signal/noise ratio. By lowering the V
use (typ)
,
the light sensitivity of the camera is increased; however, this sacrifices the signal/noise ratio of the camera.
Figure 13. Typical V
sat
, V
use
Relationship
TC213
1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-17
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
t
f
t
r
0%
VIL max
10%
Intermediate Level
VIH min
90%
100%
Figure 14. T ypical Clock Waveform for ABGI, ABGS, IAG, and SAG
t
f
t
r
0%
VIL max
10%
VIH min
90%
100%
Intermediate Level
Figure 15. T ypical Clock Waveform for RST1, RST2, SRG1, SRG2, and TRG
100%
90%
OUT
SRG
– 9 V
0%
– 9 V to –11 V
1.5 V to 2.5 V
CCD Delay
τ
15 ns10 ns
Sample
and
Hold
Figure 16. SRG and OUT Waveforms
TC213 1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-18
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
13
12 V
TC213
ABGS
SAG
ABGI
IAG
SUB
SUB
TDB
SUB
IAG
ABGI
SAG
ABGS
IDB
TRG
SRG2
SRG1
CDB
RST1
RST2
SUB
ADB
OUT2
AMP GND
OUT1
12 V
OUT 2
1 k
100
OUT 1
12 V
13
14
15
16
17
18
19
20
21
22
23
24
12
11
10
9
8
7
6
5
4
3
2
1
Master Oscillator
GND
V
CC
GND
OUT V
CC
V
SS
User-Defined Timer
SRG2
SRG1
RST1
RST2
SAG
GT2
ABGS
GT1
ABGI
IAG
TRG
SH1
SH2
CSYNC
CL1
CL2
CBLNK
CLK
SH1
SH2
CL1
CL2
CBLNK
SEL0OUT GND PD SRG3IN SRG2IN SRG1IN TRGIN NC SEL1OUT
SEL0
NC
V
CC
SRG3OUT SRG2OUT SRG1OUT
TRGOUT
V
CC
SEL1
V
CC
V
CC
SEL1
V
CC
TRGOUT
SRG1OUT
SRG2OUT
SRG3OUT
V
CC
NC
SEL0
SEL1OUT
NC
TRGIN
SRG1IN
SRG2IN
SRG3IN
PD
GND
SEL0OUT
1 2 3 4 5 6 7 8 9
19 18 17 16 15 14 13 12 11
11
12
13
14
15
16
17
18
19
9
8
7
6
5
4
3
2
1
IALVL I
/N IAIN ABIN MIDSEL SAIN PD GND V
AGB+
IASR
ABSR
V
CC
ABLVL
IAOUT ABOUT SAOUT
V
CC
V
ABG–
1 2 3 4 5 6 7 8 9
19 18 17 16 15 14
12 11
ABLVL
V
ABG–
V
V
CC
V
ABG+
V
ABG+
V
CC
V
V
ABG–
ABLVL
11
12
13
14
15
16
17
18
19
9
8
7
6
5
4
3
2
1
V
ABG–
V
CC
SAOUT
ABOUT
IAOUT
ABLVL
V
CC
ABSR
IASR
V
AGB+
GND
PD
SAIN
MIDSEL
ABIN
IAIN
I
/N
IALVL
V
100
Parallel Driver
1 k
ADB V
CC
V
SS
V ABLVL V
ABG+
V
ABG–
12 V
5 V
–10 V
2 V
–2.5 V
4 V
–6 V
DC VOLTAGES
V
SS
10
20
V
SS
V
SS
10
V
SS
20
V
SS
10
V
SS
20
10
V
SS
V
SS
20
CSYNC
2N3904
2N3904
12 V
TMS3473B
Parallel Driver
TMS3473B
Serial Driver
SN28846
Serial Driver
SN28846
Image Sensor
SUPPORT CIRCUITS
DEVICE PACKAGE APPLICATION FUNCTION
SN28846DW 20 pin small outline Serial driver Driver for TRG, SRG1, SRG2, RST1, RST2 TMS3473BDW 20 pin small outline Parallel driver Driver for IAG, SAG, ABGI, ABGS
Figure 17. Typical Application Circuit Diagram
TC213
1024- × 512-PIXEL CCD IMAGE SENSOR
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-19
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
The package for the TC213 consists of a ceramic base, a glass window, and a 24-lead frame. The glass window is sealed to the package by an epoxy adhesive. The package leads are configured in a dual in-line organization and fit into mounting holes with 2,54 mm (0.1 in) center-to-center spacings.
T.P.
30,91 (1.217) 30,05 (1.183)
2,54 (1.000)
2,67 (0.105) NOM
2,00 (0.079)
NOM DIA
12,50 (0.492) NOM
6,80 (0.268) 5,80 (0.228)
Optical Center
22,83 (0.899) 22,38 (0.881)
+0.01
(+0.0004)
20,93 (0.824) 20,83 (0.820)
1,40 (0.055) 0,64 (0.025)
6,30 (0.248) 4,70 (0.185)
2,54 (0.100)
20,93 (0.824) 20,83 (0.820)
4,93 (0.194) MAX
3,81 (0.150) NOM
0,33 (0.013) 0,17 (0.007)
23,29 (0.917) 22,43 (0.883)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
3,75 (0.148) 2,75 (0.108)
Package Center
(see Note C)
7/94
NOTES: A. Each pin centerline is located within 2,54 mm (0.1 inch) of its true longitudinal position.
B. The optical center line and the center line of the ceramic package are not coincident. C. Maximum rotation is ±3.5°.
SOCS013B – AUGUST 1989 – REVISED DECEMBER 1991
2-20
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
IMPORTANT NOTICE
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CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
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