Texas Instruments TAS5782M Datasheet

Supply Voltage (V)
Output Power (W)
5 10 15 20 24
0
20
40
60
80
10 20
D002
System
PP
CH2
CH1
Control and
Status
Digital Audio
I2C
TAS5782M
Power Bridge
DAC
PCDSP
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SLASEG8A –MARCH 2016–REVISED JULY 2017
TAS5782M 30 W Stereo Class-D Amplifier with 96-kHz Processing
TAS5782M

1 Features

1
Flexible Audio I/O Configuration – Supports I2S, TDM, LJ, RJ Digital Input – Sample Rate Support – BD Amplifier Modulation – Supports 3-Wire Digital Audio Interface (No
MCLK required)
High-Performance Closed-Loop Architecture (PVDD = 12 V, R
– Closed-Loop = reduced component count/
smaller solution size – Idle Channel Noise = 62 µVrms (A-Wtd) – THD+N = 0.2% (at 1 W, 1 kHz) – SNR = 103dB A-Wtd (Ref. to THD+N = 1%)
Flexible Processing Features – 15 BiQuads / SmartEQ – 2 x 5 BiQuads for X-Over / EQ – 3-Band Advanced DRC + AGL – Dynamic EQ and SmartBass – Sound Field Spatializer (SFS) – 96-kHz Processor Sampling
Communication Features – Software Mode Control via I2C Port – Two Address Select Pins – Up to 4 Devices
Robustness and Reliability Features – Clock Error , DC, and Short-Circuit Protection – Overtemperature and Overcurrent Protection
SPACE
Simplified Block Diagram
= 8 Ω, SPK_GAIN = 20 dB)
SPK

2 Applications

LCD, LED TV, and Multi-Purpose Monitors
Sound Bars, Docking Stations, and PC Audio
Wireless Subwoofers, Bluetooth Speakers, and Active Speakers

3 Description

The TAS5782M device is a high-performance, stereo closed-loop Class-D amplifier with integrated audio processor with up to 96-kHz architecture. To convert from digital to analog, the device uses a high performance DAC with Burr Brown™ audio technology. It requires only two power supplies: one DVDD for low-voltage circuitry and one PVDD for high-voltage circuitry. It is controlled by a software control port using standard I2C communication.
An optimal mix of thermal performance and device cost is provided in the 90 mΩ r MOSFETs. Additionally, a thermally enhanced 48-Pin TSSOP provides excellent operation in the elevated ambient temperatures found in modern consumer electronic devices.
Device Information
PART NUMBER PACKAGE BODY SIZE (NOM)
TAS5782M TSSOP (48) 12.50 mm × 6.10 mm (1) For all available packages, see the orderable addendum at
the end of the data sheet.
Power at 10% THD+N vs PVDD
DS(on)
(1)
of the output
(1)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
(1) Tested on TAS5782MEVM Board.
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
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Table of Contents

1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions......................... 4
6.1 Internal Pin Configurations........................................ 6
7 Specifications......................................................... 9
7.1 Absolute Maximum Ratings ...................................... 9
7.2 ESD Ratings.............................................................. 9
7.3 Recommended Operating Conditions..................... 10
7.4 Thermal Information................................................ 10
7.5 Electrical Characteristics......................................... 11
7.6 Power Dissipation Characteristics .......................... 15
7.7 MCLK Timing ......................................................... 20
7.8 Serial Audio Port Timing – Slave Mode.................. 20
7.9 Serial Audio Port Timing – Master Mode................ 21
7.10 I2C Bus Timing – Standard................................... 21
7.11 I2C Bus Timing – Fast........................................... 21
7.12 SPK_MUTE Timing .............................................. 22
7.13 Typical Characteristics.......................................... 24
8 Parametric Measurement Information ............... 33
9 Detailed Description............................................ 34
9.1 Overview................................................................. 34
9.2 Functional Block Diagram ....................................... 34
9.3 Feature Description................................................. 35
9.4 Device Functional Modes........................................ 56
10 Application and Implementation........................ 59
10.1 Application Information.......................................... 59
10.2 Typical Applications ............................................. 61
11 Power Supply Recommendations ..................... 70
11.1 Power Supplies ..................................................... 70
12 Layout................................................................... 72
12.1 Layout Guidelines ................................................. 72
12.2 Layout Example .................................................... 74
13 Register Maps...................................................... 80
13.1 Registers - Page 0 ................................................ 80
13.2 Registers - Page 1 .............................................. 116
14 Device and Documentation Support ............... 120
14.1 Device Support.................................................... 120
14.2 Receiving Notification of Documentation
Updates.................................................................. 120
14.3 Community Resources........................................ 121
14.4 Trademarks......................................................... 121
14.5 Electrostatic Discharge Caution.......................... 121
14.6 Glossary.............................................................. 121
15 Mechanical, Packaging, and Orderable
Information......................................................... 121

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (March 2017) to Revision A Page
Added missing cross references to the Quick Reference Table .......................................................................................... 24
Changed Changed the Volume Ramp Up/Down Step default value to 11 .......................................................................... 50
Changed 5th bit of the I2C Slave Address table .................................................................................................................. 54
Added DSP Book, Page, and Register Update section ....................................................................................................... 56
Deleted Page 0 Registers 0x0A, 0x50, 0x51, 0x52, and 0x54............................................................................................. 80
Changed the PLLE bit type of Register 4 from R to R/W..................................................................................................... 81
Changed Bit configuration of Register 0x14......................................................................................................................... 88
Changed PJDV bit in Register 21 from 5-4 to 5-0................................................................................................................ 89
Changed Reset value of Register 0x3D to '00110000'......................................................................................................... 98
Changed Bit configuration of Register 0x5D ...................................................................................................................... 112
Deleted Page 1 Registers 0x05 and 0x08.......................................................................................................................... 116
2
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5 Device Comparison Table

DEVICE NAME MODULATION STYLE PROCESSING TYPE
TAS5782MDCA BD Modulation
TAS5754MDCA 1SPW (Ternary)
TAS5756MDCA BD Modulation TAS5766MDCA BD Modulation 50 MIPs, Fixed-Function (Uses single ROM image of process flow)
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
100 MIPs, Flexible Process flow (Uses mixture of RAM and ROM
components to create several process flows)
50 MIPs, HybridFlow (Uses mixture of RAM and ROM components to
create several process flows)
50 MIPs, HybridFlow (Uses mixture of RAM and ROM components to
create several process flows)
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3
1
5
4
3
2
6
10
9
8
7
12
11
36
32
33
34
35
31
27
28
29
30
25
26
PowerPAD
TM
SPK_OUTA-
PGND
SPK_OUTA+
PVDD
SPK_GAIN/FSW
BSTRPA+
SPK_INA-
DVDD_REG
CN
GND
CPVSS
CP
SPK_OUTB+
CPVDD
DVDD
LRCLK/FS
DGND
ADR0
SPK_MUTE
14
13
16
15
18
17
20
19
22
21
24
23
48
44
45
46
47
43
39
40
41
42
37
38
PVDD
SPK_OUTB-
PGND
BSTRPB-
BSTRPB+
PVDD
SPK_FAULT
SPK_INB-
PVDD
SPK_INB+
DAC_OUTB
PGND
SPK_INA+
DAC_OUTA
AGND
SCL
RESET
ADR1
GPIO0
GPIO2
BSTRPA-
SDA
SCLK
SDIN
PVDD
AGND
AVDD
GVDD_REG
MCLK
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017

6 Pin Configuration and Functions

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48-Pin TSSOP with PowerPAD™
DCA Package
Top View
4
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Pin Functions
PIN
NAME NO.
ADR0 26 DI ADR1 20 DI
AGND
AVDD 14 P Figure 2 Power supply for internal analog circuitry BSTRPA– 1 P
BSTRPA+ 5 P
BSTRPB– 48 P
BSTRPB+ 44 P CN 34 P Figure 14 Negative pin for capacitor connection used in the line-driver charge pump
CP 32 P Figure 13 Positive pin for capacitor connection used in the line-driver charge pump CPVDD 31 P Figure 2 Power supply for charge pump circuitry CPVSS 35 P Figure 14 –3.3-V supply generated by charge pump for the DAC DAC_OUTA 13 AO DAC_OUTB 36 AO Single-ended output for Channel B of the DAC DGND 29 G Ground reference for digital circuitry. Connect this pin to the system ground. DVDD 30 P Figure 2 Power supply for the internal digital circuitry
DVDD_REG 28 P Figure 15
GND 33 G Ground pin for device. This pin should be connected to the system ground. GPIO0 18 GPIO2 21
GVDD_REG 8 P Figure 5
LRCK/FS 25 DI/O
MCLK 22 DI Master clock used for internal clock tree and sub-circuit and state machine clocking
PGND
PVDD
RESET 19 DI Figure 17 Device reset input. Pull down to reset, pull up to activate device. SCL 17 DI Figure 10 SCLK 23 DI/O Figure 11 Bit clock for the digital signal that is active on the input data line of the serial data port SDA 16 DI/O Figure 9 SDIN 24 D1 Figure 11 Data line to the serial data port SPK_INA– 11 AI SPK_INA+ 12 AI Positive pin for differential speaker amplifier input A SPK_INB– 38 AI Negative pin for differential speaker amplifier input B SPK_INB+ 37 AI Positive pin for differential speaker amplifier input B
TYPE
10 15
3
46
6
7 41 42 43
G Ground reference for analog circuitry
DI/O General purpose input/output pins (GPIOx). Refer to GPIO registers for configuration.
G Ground reference for power device circuitry. Connect this pin to the system ground.39
P Figure 1 Power supply for internal power circuitry
(1)
TERMINATION
INTERNAL
Figure 3
Figure 8
Figure 11
Figure 7
DESCRIPTION
Sets the LSB of the I2C address to 0 if pulled to GND, to 1 if pulled to DVDD Sets the second LSB of the I2C address to 0 if pulled to GND, to 1 if pulled to DVDD
(2)
Connection point for the SPK_OUTA– bootstrap capacitor which is used to create a power supply for the high-side gate drive for SPK_OUTA–
Connection point for the SPK_OUTA+ bootstrap capacitor which is used to create a power supply for the high-side gate drive for SPK_OUTA+
Connection point for the SPK_OUTB– bootstrap capacitor which is used to create a power supply for the high-side gate drive for SPK_OUTB–
Connection point for the SPK_OUTB+ bootstrap capacitor which is used to create a power supply for the high-side gate drive for SPK_OUTB+
Single-ended output for Channel A of the DAC
Voltage regulator derived from DVDD supply for use for internal digital circuitry. This pin is provided as a connection point for filtering capacitors for this supply and must not be used to power any external circuitry.
Voltage regulator derived from PVDD supply to generate the voltage required for the gate drive of output MOSFETs. This pin is provided as a connection point for filtering capacitors for this supply and must not be used to power any external circuitry.
Word select clock for the digital signal that is active on the serial port's input data line. In I2S, LJ, and RJ, this corresponds to the left channel and right channel boundary. In TDM mode, this corresponds to the frame sync boundary.
I2C serial control port clock
I2C serial control port data
Negative pin for differential speaker amplifier input A
TAS5782M
(1) AI = Analog input, AO = Analog output, DI = Digital Input, DO = Digital Output, DI/O = Digital Bi-directional (input and output), P =
Power, G = Ground (0 V)
(2) This pin should be connected to the system ground.
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PVDD
SPK_OUTxx
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GVDD
PVDD
SPK_OUTxx
BSTRPxx
7 V ESD
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PVDD
30 V ESD
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DVDD
3.3 V ESD
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TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
Pin Functions (continued)
PIN
NAME NO.
SPK_FAULT 40 DO Figure 16 Fault pin which is pulled low when an overcurrent, overtemperature, or DC detect fault occurs SPK_GAIN/F
REQ SPK_OUTA– 2 AO SPK_OUTA+ 4 AO Positive pin for differential speaker amplifier output A SPK_OUTB– 47 AO Negative pin for differential speaker amplifier output B SPK_OUTB+ 45 AO Positive pin for differential speaker amplifier output B
SPK_MUTE 27 I Figure 12
PowerPAD G
TYPE
9 AI Figure 6 Sets the gain and switching frequency of the speaker amplifier, latched in upon start-up of the device.
(1)
TERMINATION
INTERNAL
Figure 4
DESCRIPTION
Negative pin for differential speaker amplifier output A
Speaker amplifier mute which must be pulled low (connected to DGND) to mute the device and pulled high (connected to DVDD) to unmute the device.
Provides both electrical and thermal connection from the device to the board. A matching ground pad must be provided on the PCB and the device connected to it through solder. For proper electrical operation, this ground pad must be connected to the system ground.

6.1 Internal Pin Configurations

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Figure 1. PVDD Pins Figure 2. AVDD, DVDD and CPVDD Pins
Figure 3. BSTRPxx Pins Figure 4. SPK_OUTxx Pins
6
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SDA
3.3 V ESD
DVDD
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SCL
3.3 V ESD
DVDD
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SPK_INxx
7 V ESD
Gain Switch
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AVDD
CPVSS
DAC_OUTA
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GVDD
7 V ESD
PVDD
10 Ÿ
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GVDD
SPK_GAIN/FREQ
7 V ESD
10 NŸ
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Internal Pin Configurations (continued)
Figure 5. GVDD_REG Pin Figure 6. SPK_GAIN/FREQ Pin
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Figure 7. SPK_INxx Pins Figure 8. DAC_OUTx Pins
Figure 9. SDA Pin Figure 10. SCL Pin
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DVDD
1.8 V ESD
DVDD_REG
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28 V ESD
SPK_FAULT
100 Ÿ
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CVPDD
3.3 V ESD
CP
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CN
3.3 V ESD
CPVSS
3.3 V ESD
GND
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DVDD
3.3 V ESD
MCLK
SCLK
SDIN
LRCK/FS
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DVDD
3.3 V ESD
SPK_MUTE
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TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
Internal Pin Configurations (continued)
Figure 11. SCLK, MCLK, SDIN, and LRCK/FS Pins Figure 12. SPK_MUTE Pin
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8
Figure 13. CP Pin Figure 14. CN and CPVSS Pins
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Figure 15. DVDD_REG Pin Figure 16. SPK_FAULT Pin
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RESET
3.3 V ESD
DVDD
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Internal Pin Configurations (continued)
Figure 17. RESET Pin

7 Specifications

7.1 Absolute Maximum Ratings

Free-air room temperature 25°C (unless otherwise noted)
DVDD, AVDD, CPVDD
PVDD PVDD supply –0.3 30 V V
I(AmpCtrl)
V
I(DigIn)
V
I(SPK_INxx)
V
I(SPK_OUTxx)
T
J
T
stg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) DVDD referenced digital pins include: ADR0, ADR1, GPIO0, GPIO2, LRCK/FS, MCLK, RESET, SCL, SCLK, SDA, SDIN, and
SPK_MUTE.
Low-voltage digital, analog, charge pump supply –0.3 3.9 V
Input voltage for SPK_GAIN/FREQ and SPK_FAULT pins –0.3 V DVDD referenced digital inputs
(2)
Analog input into speaker amplifier –0.3 6.3 V Voltage at speaker output pins –0.3 32 V Ambient operating temperature, T
A
Operating junction temperature, digital die –40 125 °C Operating junction temperature, power die –40 165 °C Storage temperature –40 125 °C
(1)
MIN MAX UNIT
+ 0.3 V
GVDD
–0.5 V
+ 0.5 V
DVDD
–25 85 °C

7.2 ESD Ratings

VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 Charged-device model (CDM), per JEDEC specification JESD22-C101
(1) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.
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(1)
(2)
±2000
±500
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V
9
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7.3 Recommended Operating Conditions

Free-air room temperature 25°C (unless otherwise noted)
MIN NOM MAX UNIT
V
(POWER)
R
SPK
V
IH(DigIn)
V
IL(DigIn)
L
OUT
Power supply inputs
Minimum speaker load
Input logic high for DVDD referenced digital inputs Input logic low for DVDD referenced digital inputs Minimum inductor value in LC filter under short-circuit
condition
(1) DVDD referenced digital pins include: ADR0, ADR1, GPIO0, GPIO2, LRCK/FS, MCLK, RESET, SCL, SCLK, SDA, SDIN, and
SPK_MUTE.
(2) The best practice for driving the input pins of the TAS5782M device is to power the drive circuit or pullup resistor from the same supply
which provides the DVDD power supply.
(3) The best practice for driving the input pins of the TAS5782M device low is to pull them down, either actively or through pulldown
resistors to the system ground.
DVDD, AVDD, CPVDD 2.9 3.63 PVDD 4.5 26.4 BTL Mode 3 Ω PBTL Mode 2 Ω
(1)(2)
(1)(3)
0.9 × V V
DVDD DVDD
0 0.1 × V
V
DVDD DVDD
1 4.7 µH
V
V V

7.4 Thermal Information

TAS5782M
DCA (TSSOP)
THERMAL METRIC
(1)
JEDEC
STANDARD
2-LAYER PCB
R
θJA
R
θJC(top)
R
θJB
ψ
JT
ψ
JB
R
θJC(bot)
Junction-to-ambient thermal resistance 41.8 27.6 19.4 °C/W Junction-to-case (top) thermal resistance 14.4 14.4 14.4 °C/W Junction-to-board thermal resistance 9.4 9.4 9.4 °C/W Junction-to-top characterization parameter 0.6 0.6 2 °C/W Junction-to-board characterization parameter 8.1 9.3 4.8 °C/W Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
48 PINS
JEDEC
STANDARD
4-LAYER PCB
UNIT
TAS5782MEVM
4-LAYER PCB
10
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7.5 Electrical Characteristics

Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5782MEVM board and Audio Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to 768 kHz unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DIGITAL I/O
|IIH|1
|IIL|1
V
IH1
V
IL1
V
OH(DigOut)
V
OL(DigOut)
V
OL(SPK_FAULT)
GVDD_REG GVDD regulator voltage 7 V
I2C CONTROL PORT
C
L(I2C)
f
SCL(fast)
f
SCL(slow)
V
NH
MCLK AND PLL SPECIFICATIONS
D
MCLK
f
MCLK
f
PLL
SERIAL AUDIO PORT
t
DLY
D
SCLK
f
S
f
SCLK
f
SCLK
SPEAKER AMPLIFIER (ALL OUTPUT CONFIGURATIONS)
A
V(SPK_AMP)
ΔA
V(SPK_AMP)
Input logic high current level for DVDD referenced digital input pins
(1)
V
IN(DigIn)
= V
DVDD
10 µA
Input logic low current level for DVDD referenced digital input pins
(1)
V
= 0 V –10 µA
IN(DigIn)
Input logic high threshold for DVDD referenced digital
(1)
inputs
70% V
DVDD
Input logic low threshold for DVDD referenced digital
(1)
inputs Output logic high voltage
(1)
level Output logic low voltage
(1)
level Output logic low voltage level
for SPK_FAULT
Allowable load capacitance for each I2C Line
IOH= 4 mA 80% V
IOH= –4 mA 22% V
With 100-kΩ pullup resistor 0.8 V
30% V
400 pF
DVDD
DVDD
DVDD
Support SCL frequency No wait states, fast mode 400 kHz Support SCL frequency No wait states, slow mode 100 kHz Noise margin at High level for
each connected device (including hysteresis)
0.2 × V
DD
V
Allowable MCLK duty cycle 40% 60% Supported MCLK frequencies Up to 50 MHz 128 512 f
PLL input frequency
Required LRCK/FS to SCLK rising edge delay
Clock divider uses fractional divide D > 0, P = 1
Clock divider uses integer divide D = 0, P = 1
6.7 20
1 20
5 ns
S
MHz
Allowable SCLK duty cycle 40% 60% Supported input sample rates 8 96 kHz Supported SCLK frequencies 32 64 f
S
SCLK frequency Either master mode or slave mode 24.576 MHz
SPK_GAIN/FREQ voltage < 3 V,
Speaker amplifier gain
see Adjustable Amplifier Gain and Switching
Frequency Selection
SPK_GAIN/FREQ voltage > 3.3 V, see Adjustable Amplifier Gain and Switching
20
dBV
26
Frequency Selection
Typical variation of speaker amplifier gain
±1 dBV
(2)
(2)
(1) DVDD referenced digital pins include: ADR0, ADR1, GPIO0, GPIO2, LRCK/FS, MCLK,RESET, SCL, SCLK, SDA, SDIN, and
SPK_MUTE.
(2) A unit of fSindicates that the specification is the value listed in the table multiplied by the sample rate of the audio used in the
TAS5782M device.
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Electrical Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5782MEVM board and Audio Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to 768 kHz unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Switching frequency depends on voltage
f
SPK_AMP
K
SVR
Switching frequency of the speaker amplifier
Power supply rejection ratio
Drain-to-source on resistance
r
DS(on)
OCE
OTE
THRES
THRES
of the individual output MOSFETs
SPK_OUTxx overcurrent error threshold
Overtemperature error threshold
Time required to clear
OCE
CLRTIME
overcurrent error after error condition is removed.
Time required to clear
OTE
OVE
UVE
CLRTIME
THRES(PVDD)
THRES(PVDD)
overtemperature error after error condition is removed.
PVDD overvoltage error threshold
PVDD undervoltage error threshold
SPEAKER AMPLIFIER (STEREO BTL)
|VOS| Amplifier offset voltage
I
CN(SPK)
P
O(SPK)
Idle channel noise
Output Power (Per Channel)
presented at SPK_GAIN/FREQ pin and the clocking arrangement, including the incoming sample rate, see Adjustable Amplifier Gain and
Switching Frequency Selection
Injected Noise = 50 Hz to 60 Hz, 200 mV = 26 dB, input audio signal = digital zero
V
= 24 V, I
PVDD
includes PVDD/PGND pins, leadframe, bondwires
= 500 mA, TJ= 25°C,
(SPK_OUT)
P-P
, Gain
and metallization layers. V
PVDD
= 24 V, I
= 500 mA, TJ= 25°C 90
(SPK_OUT)
Measured differentially with zero input data, SPK_GAIN/FREQ pin configured for 20 dB gain, V
= 12 V
PVDD
Measured differentially with zero input data, SPK_GAIN/FREQ pin configured for 26 dB gain, V
= 24 V
PVDD
V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
Weighted V
= 15 V, SPK_GAIN = 20 dB, R
PVDD
Weighted V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
Weighted V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
Weighted V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
THD+N = 0.1% V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
THD+N = 0.1% V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1% V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1% V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1% V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1% V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1% V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1%
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
= 8 Ω, A-
= 8 Ω, A-
= 8 Ω, A-
= 8 Ω, A-
= 4 Ω,
= 8 Ω,
= 4 Ω,
= 8 Ω,
= 4 Ω,
= 8 Ω,
= 4 Ω,
= 8 Ω,
176.4 768 kHz
60 dB
120
mΩ
7.5 A
165 °C
1.3 s
1.3 s
27 V
4.3 V
2
mV
5 15
49
59
µV
81
82
14
8
23
13
W
34
20
40
33
RMS
12
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Electrical Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5782MEVM board and Audio Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to 768 kHz unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
SNR
(referenced to 0 dBFS input signal)
Signal-to-noise ratio
THD+N
SPK
Total harmonic distortion and noise
Cross-talk (worst case
X-talk
SPK
between left-to-right and right-to-left coupling)
SPEAKER AMPLIFIER (MONO PBTL)
|VOS| Amplifier offset voltage
I
CN
Idle channel noise
= 12 V, SPK_GAIN = 20 dB, R
PVDD
Weighted, –120 dBFS Input V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
Weighted, –120 dBFS Input V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
Weighted, –120 dBFS Input V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
Weighted, –120 dBFS Input V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
Input Signal 250 mVrms, 1-kHz Sine, across f(S)
V
= 15 V, SPK_GAIN = 26 dBV, R
PVDD
Input Signal 250 mVrms, 1-kHz Sine, across f(S)
V
= 19 V, SPK_GAIN = 26 dBV, R
PVDD
Input Signal 250 mVrms, 1-kHz Sine, across f(S)
V
= 24 V, SPK_GAIN = 26 dBV, R
PVDD
Input Signal 250 mVrms, 1-kHz Sine, across f(S)
Measured differentially with zero input data, SPK_GAIN/FREQ pin configured for 20 dB gain, V
= 12 V
PVDD
Measured differentially with zero input data, SPK_GAIN/FREQ pin configured for 26 dB gain, V
= 24 V
PVDD
V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
Weighted V
= 15 V, SPK_GAIN = 20 dB, RSPK = 8 Ω,
PVDD
A-Weighted V
= 19 V, SPK_GAIN = 26 dB, RSPK = 8 Ω,
PVDD
A-Weighted V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
Weighted
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
= 8 Ω, A-
= 8 Ω, A-
= 8 Ω, A-
= 8 Ω, A-
= 4 Ω,
= 8 Ω,
= 4 Ω,
= 8 Ω,
= 4 Ω,
= 8 Ω,
= 4 Ω,
= 8 Ω,
= 8 Ω,
= 8 Ω,
= 8 Ω,
= 8 Ω,
= 8 Ω, A-
= 8 Ω, A-
103
102
103
105
0.021%
0.022%
0.02%
0.037%
0021%
0.028%
0.027%
0.038%
–90
–102
–93
–93
0.7
48
49
83
82
dB
dB
mV
4
µV
RMS
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SLASEG8A –MARCH 2016–REVISED JULY 2017
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Electrical Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5782MEVM board and Audio Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to 768 kHz unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
P
O
SNR
THD+N
Output power (per channel)
Signal-to-noise ratio (referenced to 0 dBFS input signal)
Total harmonic distortion and noise
= 12 V, SPK_GAIN = 20 dB, R
PVDD
THD+N = 0.1%, Unless otherwise noted V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
THD+N = 0.1%, Unless otherwise noted V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
THD+N = 0.1% V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1%, Unless otherwise noted V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1%, Unless otherwise noted V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1% V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1%, Unless otherwise noted V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1%, Unless otherwise noted V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1% V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1%, Unless otherwise noted V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1%, Unless otherwise noted V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
THD+N = 0.1% V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
Weighted, –120 dBFS Input V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
Weighted, –120 dBFS Input V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
Weighted, –120 dBFS Input V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
Weighted, –120 dBFS Input V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V, R
= 4 Ω, PO= 1 W, f = 1kHz 0.012%
SPK
V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
SPK
= 2 Ω,
= 4 Ω,
= 8 Ω,
= 2 Ω,
= 4 Ω,
= 8 Ω,
= 2 Ω,
= 4 Ω,
= 8 Ω,
= 2 Ω,
= 4 Ω,
= 8 Ω,
= 8 Ω, A-
= 8 Ω, A-
= 8 Ω, A-
= 8 Ω, A-
= 2 Ω,
= 4 Ω,
= 8 Ω,
= 2 Ω,
= 4 Ω,
= 8 Ω,
= 2 Ω,
= 8 Ω,
= 2 Ω,
= 4 Ω,
= 8 Ω,
30
16
9
44
22
13
W
50
36
20
40
61
34
105
104
dB
105
107
0.014%
0.011%
0.014%
0.015%
0.013%
0.015%
0.018%
0.020%
0.028%
0.02%
0.027%
14
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7.6 Power Dissipation Characteristics

Free-air room temperature 25°C (unless otherwise noted)
V
PVDD
(V)
SPK_GAIN
7.4 20
(dBV)
(1)(2)(3)
f
SPK_AMP
(kHz)
384
768
STATE OF
OPERATION
Mute
Standby
Powerdown
Mute
Standby
Powerdown
Idle
Idle
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
R
SPK
(Ω)
I
PVDD
(mA)
(4)
4 21.30 59.70 0.355 6 21.33 59.68 0.355 8 21.30 59.70 0.355 4 21.33 58.82 0.352 6 21.34 58.81 0.352 8 21.36 58.81 0.352 4 2.08 12.41 0.056 6 2.11 12.41 0.057 8 2.17 12.41 0.057 4 2.03 0.730 0.017 6 2.04 0.740 0.018 8 2.06 0.740 0.018 4 27.48 59.7 0.400 6 27.49 59.73 0.401 8 24.46 59.72 0.378 4 27.50 58.8 0.398 6 27.51 58.8 0.398 8 27.52 58.81 0.398 4 2.04 12.41 0.056 6 2.08 12.41 0.056 8 2.11 12.41 0.057 4 2.06 0.73 0.018 6 2.07 0.74 0.018 8 2.08 0.74 0.018
I
DVDD
(mA)
(5)
P
DISS
(W)
(1) Mute: B0-P0-R3-D0,D4 = 1 (2) Standby: B0-P0-R2-D4 = 1 (3) Power down: B0-P0-R2-D0 = 1 (4) I
(5) I
refers to all current that flows through the PVDD supply for the DUT. Any other current sinks not directly related to the DUT current
PVDD
draw were removed.
refers to all current that flows through the DVDD (3.3-V) supply for the DUT. Any other current sinks not directly related to the
DVDD
DUT current draw were removed.
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TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
Power Dissipation Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted)
V
PVDD
(V)
SPK_GAIN
11.1 20
(dBV)
(1)(2)(3)
f
SPK_AMP
(kHz)
384
768
STATE OF
OPERATION
Idle
Mute
Standby
Powerdown
Idle
Mute
Standby
Powerdown
R
SPK
(Ω)
I
PVDD
(mA)
(4)
I
DVDD
(mA)
(5)
4 24.33 59.74 0.467 6 24.32 59.74 0.467 8 24.36 59.70 0.467 4 24.36 58.81 0.464 6 24.32 58.82 0.464 8 24.37 58.84 0.465 4 3.58 12.40 0.081 6 3.57 12.41 0.081 8 3.58 12.42 0.081 4 3.52 0.74 0.042 6 3.52 0.74 0.042 8 3.54 0.74 0.042 4 30.70 59.70 0.538 6 30.65 59.72 0.537 8 30.67 59.71 0.537 4 3.072 58.80 0.528 6 30.69 58.81 0.535 8 30.69 58.81 0.535 4 3.54 12.40 0.080 6 3.54 12.41 0.080 8 3.58 12.42 0.081 4 3.53 0.74 0.042 6 3.53 0.74 0.042 8 3.55 0.74 0.042
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P
DISS
(W)
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Power Dissipation Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted)
V
PVDD
(V)
SPK_GAIN
12 20
(dBV)
(1)(2)(3)
f
SPK_AMP
(kHz)
384
768
STATE OF
OPERATION
Idle
Mute
Standby
Powerdown
Idle
Mute
Standby
Powerdown
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
R
SPK
(Ω)
I
PVDD
(mA)
(4)
4 25.07 59.72 0.498 6 25.08 59.73 0.498 8 25.10 59.71 0.498 4 25.12 58.84 0.496 6 25.08 58.82 0.495 8 25.11 58.82 0.495 4 3.92 12.40 0.088 6 3.93 12.41 0.088 8 3.94 12.41 0.088 4 3.87 0.75 0.049 6 3.85 0.74 0.049 8 3.87 0.75 0.049 4 31.31 59.72 0.573 6 31.29 59.71 0.573 8 31.31 59.74 0.573 4 31.31 58.80 0.570 6 31.33 58.81 0.570 8 31.32 58.81 0.570 4 3.88 12.40 0.087 6 3.90 12.41 0.088 8 3.91 12.41 0.088 4 3.89 0.75 0.049 6 3.91 0.74 0.049 8 3.88 0.75 0.049
I
DVDD
(mA)
(5)
P
DISS
(W)
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TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
Power Dissipation Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted)
V
PVDD
(V)
SPK_GAIN
15 26
(dBV)
(1)(2)(3)
f
SPK_AMP
(kHz)
384
768
STATE OF
OPERATION
Idle
Mute
Standby
Powerdown
Idle
Mute
Standby
Powerdown
R
SPK
(Ω)
I
PVDD
(mA)
(4)
I
DVDD
(mA)
(5)
4 27.94 59.73 0.616 6 27.91 59.75 0.616 8 27.75 59.69 0.613 4 27.98 58.84 0.614 6 27.94 58.87 0.613 8 27.88 58.85 0.612 4 5.09 12.41 0.117 6 5.12 12.41 0.118 8 5.19 12.41 0.119 4 5.02 0.74 0.078 6 5.06 0.74 0.078 8 5.14 0.74 0.080 4 33.05 59.7 0.693 6 33.03 59.72 0.693 8 33.08 59.68 0.693 4 33.03 58.81 0.690 6 33.04 58.81 0.690 8 33.05 58.80 0.690 4 5.07 12.41 0.117 6 5.09 12.41 0.117 8 5.14 12.41 0.118 4 5.02 0.74 0.078 6 5.04 0.74 0.078 8 5.09 0.74 0.079
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P
DISS
(W)
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Power Dissipation Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted)
V
PVDD
(V)
SPK_GAIN
19.6 26
(dBV)
(1)(2)(3)
f
SPK_AMP
(kHz)
384
768
STATE OF
OPERATION
Idle
Mute
Standby
Powerdown
Idle
Mute
Standby
Powerdown
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
R
SPK
(Ω)
I
PVDD
(mA)
(4)
4 32.27 59.77 0.830 6 32.19 59.76 0.828 8 32.08 59.75 0.826 4 32.27 58.85 0.827 6 32.24 58.87 0.826 8 32.22 58.86 0.826 4 6.95 12.40 0.177 6 6.93 12.42 0.177 8 7.00 12.41 0.178 4 6.89 0.74 0.137 6 6.90 0.74 0.138 8 6.96 0.73 0.139 4 34.99 59.74 0.883 6 34.95 59.74 0.882 8 34.97 59.71 0.882 4 34.96 58.85 0.879 6 34.98 58.83 0.880 8 34.96 58.81 0.879 4 6.93 12.40 0.177 6 6.93 12.42 0.177 8 6.98 12.41 0.178 4 6.84 0.74 0.137 6 6.89 0.74 0.137 8 6.90 0.73 0.138
I
DVDD
(mA)
(5)
P
DISS
(W)
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SLASEG8A –MARCH 2016–REVISED JULY 2017
Power Dissipation Characteristics (continued)
Free-air room temperature 25°C (unless otherwise noted)
V
PVDD
(V)
SPK_GAIN
24 26
(dBV)
(1)(2)(3)
f
SPK_AMP
(kHz)
384
768
STATE OF
OPERATION
Idle
Mute
Standby
Powerdown
Idle
Mute
Standby
Powerdown
R
SPK
(Ω)
I
PVDD
(mA)
(4)
I
DVDD
(mA)
(5)
4 36.93 59.80 1.084 6 36.87 59.81 1.082 8 36.77 59.76 1.080 4 36.94 58.91 1.081 6 36.89 58.89 1.080 8 36.85 58.90 1.079 4 8.73 12.40 0.250 6 8.72 12.40 0.250 8 8.71 12.40 0.250 4 8.64 0.74 0.210 6 8.66 0.74 0.210 8 8.69 0.73 0.211 4 36.84 59.73 1.081 6 36.86 59.76 1.082 8 36.83 59.78 1.081 4 36.85 58.85 1.079 6 36.84 58.84 1.078 8 36.82 58.83 1.078 4 8.66 12.40 0.249 6 8.68 12.40 0.249 8 8.71 12.40 0.250 4 8.63 0.74 0.210 6 8.64 0.74 0.210 8 8.65 0.73 0.210
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P
DISS
(W)

7.7 MCLK Timing

See Figure 18.
t
MCLK
t
MCLKH
t
MCLKL
MCLK period 20 1000 ns MCLK pulse width, high 9 ns MCLK pulse width, low 9 ns

7.8 Serial Audio Port Timing – Slave Mode

See Figure 19.
f
SCLK
t
SCLK
t
SCLKL
t
SCLKH
t
SL
t
LS
t
SU
t
DH
t
DFS
20
SCLK frequency 1.024 MHz SCLK period 40 ns SCLK pulse width, low 16 ns SCLK pulse width, high 16 ns SCLK rising to LRCK/FS edge 8 ns LRCK/FS Edge to SCLK rising edge 8 ns Data setup time, before SCLK rising edge 8 ns Data hold time, after SCLK rising edge 8 ns Data delay time from SCLK falling edge 15 ns
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MIN NOM MAX UNIT
MIN NOM MAX UNIT
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7.9 Serial Audio Port Timing – Master Mode

See Figure 20.
t
SCLK
t
SCLKL
t
SCLKH
t
LRD
t
SU
t
DH
t
DFS
SCLK period 40 ns SCLK pulse width, low 16 ns SCLK pulse width, high 16 ns LRCK/FS delay time from to SCLK falling edge –10 20 ns Data setup time, before SCLK rising edge 8 ns Data hold time, after SCLK rising edge 8 ns Data delay time from SCLK falling edge 15 ns

7.10 I2C Bus Timing – Standard

f
SCL
t
BUF
t
LOW
t
HI
t
RS-SU
t
S-HD
t
D-SU
t
D-HD
t
SCL-R
t
SCL-R1
t
SCL-F
t
SDA-R
t
SDA-F
t
P-SU
SCL clock frequency 100 kHz Bus free time between a STOP and START condition 4.7 µs Low period of the SCL clock 4.7 µs High period of the SCL clock 4 µs Setup time for (repeated) START condition 4.7 µs Hold time for (repeated) START condition 4 µs Data setup time 250 ns Data hold time 0 900 ns Rise time of SCL signal 20 + 0.1C Rise time of SCL signal after a repeated START condition and after an acknowledge bit 20 + 0.1C Fall time of SCL signal 20 + 0.1C Rise time of SDA signal 20 + 0.1C Fall time of SDA signal 20 + 0.1C Setup time for STOP condition 4 µs
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
MIN NOM MAX UNIT
MIN MAX UNIT
1000 ns
B
1000 ns
B
1000 ns
B
1000 ns
B
1000 ns
B

7.11 I2C Bus Timing – Fast

See Figure 21.
f
SCL
t
BUF
t
LOW
t
HI
t
RS-SU
t
RS-HD
t
D-SU
t
D-HD
t
SCL-R
t
SCL-R1
t
SCL-F
t
SDA-R
t
SDA-F
t
P-SU
t
SP
SCL clock frequency 400 kHz Bus free time between a STOP and START condition 1.3 µs Low period of the SCL clock 1.3 µs High period of the SCL clock 600 ns Setup time for (repeated)START condition 600 ns Hold time for (repeated)START condition 600 ns Data setup time 100 ns Data hold time 0 900 ns Rise time of SCL signal 20 + 0.1C Rise time of SCL signal after a repeated START condition and after an acknowledge bit 20 + 0.1C Fall time of SCL signal 20 + 0.1C Rise time of SDA signal 20 + 0.1C Fall time of SDA signal 20 + 0.1C Setup time for STOP condition 600 ns Pulse width of spike suppressed 50 ns
MIN MAX UNIT
B B B B B
300 ns 300 ns 300 ns 300 ns 300 ns
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21
SCLK
(Input)
0.5 × DVDD
t
SCLKH
0.5 × DVDD
t
SCLKL
t
SCLK
t
SL
t
SU
t
DH
0.5 × DVDD
0.5 × DVDD
t
DFS
t
LS
LRCK/FS
(Input)
DATA
(Input)
DATA
(Output)
"L"
"H"
0.7 × V
DVDD
t
MCLKH
t
MCLKL
t
MCLK
0.3 × V
DVDD
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017

7.12 SPK_MUTE Timing

See Figure 22.
t
r
t
f
Rise time 20 ns Fall time 20 ns
Figure 18. Timing Requirements for MCLK Input
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MIN MAX UNIT
22
Figure 19. Serial Audio Port Timing in Slave Mode
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SPK_MUTE
t
f
<20ns
t
r
< 20 ns
t
f
< 20 ns
0.9 × DV
DD
0.1 × DV
DD
SDA
SCL
START
Repeated
START
STOP
t
D-SU
t
LOW
.
t
SCL-R
.
t
HI
.
t
S-HD
.
t
BUF
.
t
SCL-F
.
t
D-HD
t
RS-HD
t
RS-SU
t
SDA-R
t
SDA-FtP-SU
t
SP
t
BCL
LRCK/FS
(Input)
SCLK
(Input)
DATA
(Input)
DATA
(Output)
t
SCLK
.
t
BCL
t
SCLK
t
DH
t
DFS
t
LRD
0.5 × DVDD
0.5 × DVDD
0.5 × DVDD
0.5 × DVDD
t
SU
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TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
Figure 20. Serial Audio Port Timing in Master Mode
Figure 21. I2C Communication Port Timing Diagram
Figure 22. SPK_MUTE Timing Diagram for Soft Mute Operation via Hardware Pin
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TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
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7.13 Typical Characteristics

All performance plots were taken using the TAS5782MEVM Board at room temperature, unless otherwise noted. The term "traditional LC filter" refers to the output filter that is present by default on the TAS5782MEVM Board.
Table 1. Quick Reference Table
OUTPUT
CONFIGURATIONS
Bridge Tied Load (BTL)
Configuration Curves
Parallel Bridge Tied Load
(PBTL) Configuration
Frequency Response Figure 42 Output Power vs PVDD Figure 23 THD+N vs Frequency, V THD+N vs Frequency, V THD+N vs Frequency, V THD+N vs Frequency, V THD+N vs Power, V THD+N vs Power, V THD+N vs Power, V THD+N vs Power, V Idle Channel Noise vs PVDD Figure 32 Efficiency vs Output Power Figure 33 Efficiency vs Output Power Figure 34 Efficiency vs Output Power Figure 35 Idle Current Draw (Filterless) vs PVDD Figure 36 Crosstalk vs. Frequency Figure 37 PVDD PSRR vs Frequency Figure 38 DVDD PSRR vs Frequency Figure 39 AVDD PSRR vs Frequency Figure 40 CPVDD PSRR vs Frequency Figure 41 THD+N vs Frequency, V THD+N vs Frequency, V THD+N vs Frequency, V THD+N vs Frequency, V Output Power vs PVDD Figure 47 THD+N vs Frequency, V THD+N vs Frequency, V THD+N vs Frequency, V THD+N vs Frequency, V THD+N vs Power, V THD+N vs Power, V THD+N vs Power, V THD+N vs Power, V Idle Channel Noise vs PVDD Figure 56 Efficiency vs Output Power Figure 57 THD+N vs Frequency, V THD+N vs Frequency, V THD+N vs Frequency, V THD+N vs Frequency, V
PLOT TITLE FIGURE NUMBER
= 12 V Figure 24
PVDD
= 15 V Figure 25
PVDD
= 18 V Figure 26
PVDD
= 24 V Figure 27
PVDD
= 12 V Figure 28
PVDD
= 15 V Figure 29
PVDD
= 18 V Figure 30
PVDD
= 24 V Figure 31
PVDD
= 12 V Figure 43
PVDD
= 15 V Figure 44
PVDD
= 18 V Figure 45
PVDD
= 24 V Figure 46
PVDD
= 12 V Figure 48
PVDD
= 15 V Figure 49
PVDD
= 18 V Figure 50
PVDD
= 24 V Figure 51
PVDD
= 12 V Figure 52
PVDD
= 15 V Figure 53
PVDD
= 18 V Figure 54
PVDD
= 24 V Figure 55
PVDD
= 12 V Figure 60
PVDD
= 15 V Figure 61
PVDD
= 18 V Figure 62
PVDD
= 24 V Figure 63
PVDD
24
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Frequency (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100 1k 10k20 40k
D004
4 : Load 6 : Load 8 : Load
Frequency (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100 1k 10k20 40k
D005
4 : Load 6 : Load 8 : Load
Supply Voltage (V)
Output Power (W)
5 10 15 20 24
0
20
40
60
80
10 20
D002
8 : Load Peak 6 : Load Peak 4 : Load Peak 6 : Load Continous 4 : Load Continous
Frequency (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100 1k 10k20 40k
D003
4 : Load 6 : Load 8 : Load
TAS5782M
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SLASEG8A –MARCH 2016–REVISED JULY 2017

7.13.1 Bridge Tied Load (BTL) Configuration Curves

Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5782MEVM board and Audio Precision System 2722 with Analog Analyzer filter set to 40-kHz brickwall filter. All measurements taken with audio frequency set to 1 kHz and device PWM frequency set to 768 kHz, unless otherwise noted. For both the BTL plots and the PBTL plots, the LC filter used was 4.7 µH / 0.68 µF. Return to
Quick Reference Table.
A
V(SPK_AMP)
A
V(SPK_AMP)
= 26 dBV
Figure 23. Output Power vs PVDD – BTL
= 20 dBV PO= 1 W V
Figure 25. THD+N vs Frequency – BTL
PVDD
= 15 V
A
V(SPK_AMP)
A
V(SPK_AMP)
= 20 dBV PO= 1 W V
Figure 24. THD+N vs Frequency – BTL
= 26 dBV PO= 1 W V
Figure 26. THD+N vs Frequency – BTL
PVDD
PVDD
= 12 V
= 18 V
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Output Power (W)
Total Harmonic Distortion + Noise (%)
0.001
0.01
0.1
1
10
10m 100m 1 10 50
D010
4 : Load 6 : Load 8 : Load
Supply Voltage (V)
Idle Channel Noise (PVrms)
0
10
20
30
40
50
60
70
80
90
100
1510 20
D011
Gain = 20 dB, PWM Freq = 384 kHz Gain = 26 dB, PWM Freq = 384 kHz Gain = 20 dB, PWM Freq = 768 kHz Gain = 26 dB, PWM Freq = 768 kHz
Output Power (W)
Total Harmonic Distortion + Noise (%)
0.001
0.01
0.1
1
10
10m 100m 1 10 40
D008
4 : Load 6 : Load 8 : Load
Output Power (W)
Total Harmonic Distortion + Noise (%)
0.001
0.01
0.1
1
10
10m 100m 1 10 50
D009
4 : Load 6 : Load 8 : Load
Frequency (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100 1k 10k20 40k
D006
4 : Load 6 : Load 8 : Load
Output Power (W)
Total Harmonic Distortion + Noise (%)
0.001
0.01
0.1
1
10
10m 100m 1 10 30
D007
4 : Load 6 : Load 8 : Load
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
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A
V(SPK_AMP)
A
V(SPK_AMP)
dBV
= 26 dBV PO= 1 W V
Figure 27. THD+N vs Frequency – BTL
= 20
Figure 29. THD+N vs Power – BTL
V
PVDD
PVDD
= 24 V
= 15 V
A
V(SPK_AMP)
A
V(SPK_AMP)
dBV
= 20 dBV V
Figure 28. THD+N vs Power – BTL
= 26
Figure 30. THD+N vs Power – BTL
PVDD
= 12 V
V
PVDD
=
18 V
A
V(SPK_AMP)
26
= 26 dBV V
Figure 31. THD+N vs Power – BTL
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= 24 V
PVDD
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R
= 4 Ω
SPK
Figure 32. Idle Channel Noise vs PVDD – BTL
Frequency (Hz)
Crosstalk (dB)
-120
-100
-80
-60
-40
-20
0
100 1k 10k20 40k
D016
Ch 1 to Ch 2 Ch 2 to Ch 1
Frequency
PSRR (dB)
-100
-80
-60
-40
-20
0
100 1k 10k20 40k
D017
Left Channel Right Channel
Output Power (W)
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
0 20 40 60 80
D014
PVDD = 12 V PVDD = 15 V PVDD = 18 V PVDD = 24 V
Supply Voltage (V)
PVDD Idle Current (mA)
0
10
20
30
40
50
60
205 15 2510 20
D015
Output Power (W)
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
0 20 40 60 80
D012
PVDD = 12 V PVDD = 15 V PVDD = 18 V PVDD = 24 V
Output Power (W)
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
0 20 40 60 80
D013
PVDD = 12 V PVDD = 15 V PVDD = 18 V PVDD = 24 V
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R
= 4 Ω
SPK
Figure 33. Efficiency vs Output Power – BTL
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
R
= 6 Ω
SPK
Figure 34. Efficiency vs Output Power – BTL
R
SPK
Figure 35. Efficiency vs Output Power – BTL
A
V(SPK_AMP)
= 26 dBV V
Figure 37. Crosstalk vs Frequency – BTL
= 8 Ω
f
SPK_AMP
= 768 kHz R
Figure 36. Idle Current Draw (Filterless) vs V
PVDD
= 24 V
A
V(SPK_AMP)
Product Folder Links: TAS5782M
SPK
PVDD
= 26 dBV V
= 24 V + 250 mVac
PVDD
Figure 38. PVDD PSRR vs Frequency – BTL
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= 8 Ω
– BTL
27
Frequency (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100 1k 10k20 20k
D035
4 : Load 6 : Load 8 : Load
Frequency (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100 1k 10k20 20k
D036
4 : Load 6 : Load 8 : Load
Frequency
PSRR (dB)
-100
-80
-60
-40
-20
0
100 1k 10k20 40k
D020
Left Channel Right Channel
Frequency (Hz)
Gain (dB)
12
16
20
24
28
100 1k 10k20 40k
D001
Frequency
PSRR (dB)
-100
-80
-60
-40
-20
0
100 1k 10k20 40k
D018
Left Channel Right Channel
Frequency
PSRR (dB)
-100
-80
-60
-40
-20
0
100 1k 10k20 40k
D019
Left Channel Right Channel
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
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A
V(SPK_AMP)
V
= 3.3 V + 250 mVac
DVDD
A
V(SPK_AMP)
V
= 3.3 V + 250 mVac
CPVDD
= 26 dBV V
PVDD
Figure 39. DVDD PSRR vs Frequency – BTL
= 26 dBV V
PVDD
Figure 41. CPVDD PSRR vs Frequency – BTL
= 24 V
= 24 V
A
V(SPK_AMP)
V
= 3.3 V + 250 mVac
AVDD
A
V(SPK_AMP)
= 26 dBV V
PVDD
Figure 40. AVDD PSRR vs Frequency – BTL
= 20 dB P
= 1 W PVDD = 12 V
OUT
Figure 42. Gain vs Frequency – BTL
= 24 V
A
V(SPK_AMP)
dB
= 20
P
= 1 W PVDD = 12 V
OUT
Figure 43. THD vs Frequency – BTL
28
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A
V(SPK_AMP)
dB
Product Folder Links: TAS5782M
= 20
P
= 1 W PVDD = 15 V
OUT
Figure 44. THD vs Frequency - BTL
Frequency (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100 1k 10k20 20k
D037
4 : Load 6 : Load 8 : Load
Frequency (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100 1k 10k20 20k
D038
4 : Load 6 : Load 8 : Load
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TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
A
V(SPK_AMP)
dB
= 20
P
= 1 W PVDD = 18 V
OUT
Figure 45. THD vs Frequency – BTL
A
V(SPK_AMP)
dB
= 20
P
= 1 W PVDD = 24 V
OUT
Figure 46. THD vs Frequency – BTL
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Frequency (Hz)
Total Harmonic Distortion + Noise (%)
0.001
0.01
0.1
1
10
100 1k 10k20 40k
D025
2 : Load 3 : Load 4 : Load
Output Power (W)
Total Harmonic Distortion + Noise (%)
0.001
0.01
0.1
1
10
10m 100m 1 10 50
D026
2 : Load 3 : Load 4 : Load
Frequency (Hz)
Total Harmonic Distortion + Noise (%)
0.001
0.01
0.1
1
10
100 1k 10k20 40k
D023
2 : Load 3 : Load 4 : Load
Frequency (Hz)
Total Harmonic Distortion + Noise (%)
0.001
0.01
0.1
1
10
100 1k 10k20 40k
D024
2 : Load 3 : Load 4 : Load
Supply Voltage (V)
Output Power (W)
5 10 15 20 24
0
20
40
60
80
100
120
140
160
10 20
D021
4 : Load Peak 3 : Load Peak 2 : Load Peak 3 : Load Continous 2 : Load Continous
Frequency (Hz)
Total Harmonic Distortion + Noise (%)
0.001
0.01
0.1
1
10
100 1k 10k20 40k
D022
2 : Load 3 : Load 4 : Load
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017

7.13.2 Parallel Bridge Tied Load (PBTL) Configuration

Return to Quick Reference Table.
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A
V(SPK_AMP)
A
V(SPK_AMP)
= 26 dBV
Figure 47. Output Power vs PVDD – PBTL
= 20 dBV PO= 1 W V
PVDD
Figure 49. THD+N vs Frequency – PBTL
= 15 V
A
V(SPK_AMP)
A
V(SPK_AMP)
= 20 dBV PO= 1 W V
Figure 48. THD+N vs Frequency – PBTL
= 26 dBV PO= 1 W V
Figure 50. THD+N vs Frequency – PBTL
PVDD
PVDD
= 12 V
= 18 V
A
V(SPK_AMP)
= 26 dBV PO= 1 W V
Figure 51. THD+N vs Frequency – PBTL
30
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= 24 V
PVDD
Product Folder Links: TAS5782M
A
V(SPK_AMP)
= 20 dBV V
Figure 52. THD+N vs Power – PBTL
PVDD
= 12 V
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