•Flexible Processing Features
– 15 BiQuads / SmartEQ
– 2 x 5 BiQuads for X-Over / EQ
– 3-Band Advanced DRC + AGL
– Dynamic EQ and SmartBass
– Sound Field Spatializer (SFS)
– 96-kHz Processor Sampling
•Communication Features
– Software Mode Control via I2C Port
– Two Address Select Pins – Up to 4 Devices
•Robustness and Reliability Features
– Clock Error , DC, and Short-Circuit Protection
– Overtemperature and Overcurrent Protection
SPACE
Simplified Block Diagram
= 8 Ω, SPK_GAIN = 20 dB)
SPK
2Applications
•LCD, LED TV, and Multi-Purpose Monitors
•Sound Bars, Docking Stations, and PC Audio
•Wireless Subwoofers, Bluetooth Speakers, and
Active Speakers
3Description
The TAS5782M device is a high-performance, stereo
closed-loop Class-D amplifier with integrated audio
processor with up to 96-kHz architecture. To convert
from digital to analog, the device uses a high
performanceDACwithBurrBrown™audio
technology. It requires only two power supplies: one
DVDD for low-voltage circuitry and one PVDD for
high-voltage circuitry. It is controlled by a software
control port using standard I2C communication.
An optimal mix of thermal performance and device
cost is provided in the 90 mΩ r
MOSFETs. Additionally, a thermally enhanced 48-Pin
TSSOP provides excellent operation in the elevated
ambient temperatures found in modern consumer
electronic devices.
Device Information
PART NUMBERPACKAGEBODY SIZE (NOM)
TAS5782MTSSOP (48)12.50 mm × 6.10 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Power at 10% THD+N vs PVDD
DS(on)
(1)
of the output
(1)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (March 2017) to Revision APage
•Added missing cross references to the Quick Reference Table .......................................................................................... 24
•Changed Changed the Volume Ramp Up/Down Step default value to 11 .......................................................................... 50
•Changed 5th bit of the I2C Slave Address table .................................................................................................................. 54
•Added DSP Book, Page, and Register Update section ....................................................................................................... 56
•Changed the PLLE bit type of Register 4 from R to R/W..................................................................................................... 81
•Changed Bit configuration of Register 0x14......................................................................................................................... 88
•Changed PJDV bit in Register 21 from 5-4 to 5-0................................................................................................................ 89
•Changed Reset value of Register 0x3D to '00110000'......................................................................................................... 98
•Changed Bit configuration of Register 0x5D ...................................................................................................................... 112
•Deleted Page 1 Registers 0x05 and 0x08.......................................................................................................................... 116
AVDD14PFigure 2Power supply for internal analog circuitry
BSTRPA–1P
BSTRPA+5P
BSTRPB–48P
BSTRPB+44P
CN34PFigure 14Negative pin for capacitor connection used in the line-driver charge pump
CP32PFigure 13Positive pin for capacitor connection used in the line-driver charge pump
CPVDD31PFigure 2Power supply for charge pump circuitry
CPVSS35PFigure 14–3.3-V supply generated by charge pump for the DAC
DAC_OUTA13AO
DAC_OUTB36AOSingle-ended output for Channel B of the DAC
DGND29G—Ground reference for digital circuitry. Connect this pin to the system ground.
DVDD30PFigure 2Power supply for the internal digital circuitry
DVDD_REG28PFigure 15
GND33G—Ground pin for device. This pin should be connected to the system ground.
GPIO018
GPIO221
GVDD_REG8PFigure 5
LRCK/FS25DI/O
MCLK22DIMaster clock used for internal clock tree and sub-circuit and state machine clocking
PGND
PVDD
RESET19DIFigure 17Device reset input. Pull down to reset, pull up to activate device.
SCL17DIFigure 10
SCLK23DI/OFigure 11Bit clock for the digital signal that is active on the input data line of the serial data port
SDA16DI/OFigure 9
SDIN24D1Figure 11Data line to the serial data port
SPK_INA–11AI
SPK_INA+12AIPositive pin for differential speaker amplifier input A
SPK_INB–38AINegative pin for differential speaker amplifier input B
SPK_INB+37AIPositive pin for differential speaker amplifier input B
TYPE
10
15
3
46
6
7
41
42
43
G—Ground reference for analog circuitry
DI/OGeneral purpose input/output pins (GPIOx). Refer to GPIO registers for configuration.
G—Ground reference for power device circuitry. Connect this pin to the system ground.39
PFigure 1Power supply for internal power circuitry
(1)
TERMINATION
INTERNAL
Figure 3
Figure 8
Figure 11
Figure 7
DESCRIPTION
Sets the LSB of the I2C address to 0 if pulled to GND, to 1 if pulled to DVDD
Sets the second LSB of the I2C address to 0 if pulled to GND, to 1 if pulled to DVDD
(2)
Connection point for the SPK_OUTA– bootstrap capacitor which is used to create a power supply for
the high-side gate drive for SPK_OUTA–
Connection point for the SPK_OUTA+ bootstrap capacitor which is used to create a power supply for
the high-side gate drive for SPK_OUTA+
Connection point for the SPK_OUTB– bootstrap capacitor which is used to create a power supply for
the high-side gate drive for SPK_OUTB–
Connection point for the SPK_OUTB+ bootstrap capacitor which is used to create a power supply for
the high-side gate drive for SPK_OUTB+
Single-ended output for Channel A of the DAC
Voltage regulator derived from DVDD supply for use for internal digital circuitry. This pin is provided
as a connection point for filtering capacitors for this supply and must not be used to power any
external circuitry.
Voltage regulator derived from PVDD supply to generate the voltage required for the gate drive of
output MOSFETs. This pin is provided as a connection point for filtering capacitors for this supply and
must not be used to power any external circuitry.
Word select clock for the digital signal that is active on the serial port's input data line. In I2S, LJ, and
RJ, this corresponds to the left channel and right channel boundary. In TDM mode, this corresponds
to the frame sync boundary.
I2C serial control port clock
I2C serial control port data
Negative pin for differential speaker amplifier input A
TAS5782M
(1) AI = Analog input, AO = Analog output, DI = Digital Input, DO = Digital Output, DI/O = Digital Bi-directional (input and output), P =
Power, G = Ground (0 V)
(2) This pin should be connected to the system ground.
SPK_FAULT40DOFigure 16Fault pin which is pulled low when an overcurrent, overtemperature, or DC detect fault occurs
SPK_GAIN/F
REQ
SPK_OUTA–2AO
SPK_OUTA+4AOPositive pin for differential speaker amplifier output A
SPK_OUTB–47AONegative pin for differential speaker amplifier output B
SPK_OUTB+45AOPositive pin for differential speaker amplifier output B
SPK_MUTE27IFigure 12
PowerPAD—G—
TYPE
9AIFigure 6Sets the gain and switching frequency of the speaker amplifier, latched in upon start-up of the device.
(1)
TERMINATION
INTERNAL
Figure 4
DESCRIPTION
Negative pin for differential speaker amplifier output A
Speaker amplifier mute which must be pulled low (connected to DGND) to mute the device and
pulled high (connected to DVDD) to unmute the device.
Provides both electrical and thermal connection from the device to the board. A matching ground pad
must be provided on the PCB and the device connected to it through solder. For proper electrical
operation, this ground pad must be connected to the system ground.
6.1 Internal Pin Configurations
www.ti.com
Figure 1. PVDD PinsFigure 2. AVDD, DVDD and CPVDD Pins
Input voltage for SPK_GAIN/FREQ and SPK_FAULT pins–0.3V
DVDD referenced digital inputs
(2)
Analog input into speaker amplifier–0.36.3V
Voltage at speaker output pins–0.332V
Ambient operating temperature, T
A
Operating junction temperature, digital die–40125°C
Operating junction temperature, power die–40165°C
Storage temperature–40125°C
(1)
MINMAXUNIT
+ 0.3V
GVDD
–0.5V
+ 0.5V
DVDD
–2585°C
7.2 ESD Ratings
VALUEUNIT
V
(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
Charged-device model (CDM), per JEDEC specification JESD22-C101
(1) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.
Free-air room temperature 25°C (unless otherwise noted)
MINNOMMAXUNIT
V
(POWER)
R
SPK
V
IH(DigIn)
V
IL(DigIn)
L
OUT
Power supply inputs
Minimum speaker load
Input logic high for DVDD referenced digital inputs
Input logic low for DVDD referenced digital inputs
Minimum inductor value in LC filter under short-circuit
condition
(1) DVDD referenced digital pins include: ADR0, ADR1, GPIO0, GPIO2, LRCK/FS, MCLK, RESET, SCL, SCLK, SDA, SDIN, and
SPK_MUTE.
(2) The best practice for driving the input pins of the TAS5782M device is to power the drive circuit or pullup resistor from the same supply
which provides the DVDD power supply.
(3) The best practice for driving the input pins of the TAS5782M device low is to pull them down, either actively or through pulldown
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5782MEVM board and Audio
Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to
768 kHz unless otherwise noted.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
DIGITAL I/O
|IIH|1
|IIL|1
V
IH1
V
IL1
V
OH(DigOut)
V
OL(DigOut)
V
OL(SPK_FAULT)
GVDD_REGGVDD regulator voltage7V
I2C CONTROL PORT
C
L(I2C)
f
SCL(fast)
f
SCL(slow)
V
NH
MCLK AND PLL SPECIFICATIONS
D
MCLK
f
MCLK
f
PLL
SERIAL AUDIO PORT
t
DLY
D
SCLK
f
S
f
SCLK
f
SCLK
SPEAKER AMPLIFIER (ALL OUTPUT CONFIGURATIONS)
A
V(SPK_AMP)
ΔA
V(SPK_AMP)
Input logic high current level
for DVDD referenced digital
input pins
(1)
V
IN(DigIn)
= V
DVDD
10µA
Input logic low current level
for DVDD referenced digital
input pins
(1)
V
= 0 V–10µA
IN(DigIn)
Input logic high threshold for
DVDD referenced digital
(1)
inputs
70%V
DVDD
Input logic low threshold for
DVDD referenced digital
(1)
inputs
Output logic high voltage
(1)
level
Output logic low voltage
(1)
level
Output logic low voltage level
for SPK_FAULT
Allowable load capacitance
for each I2C Line
IOH= 4 mA80%V
IOH= –4 mA22%V
With 100-kΩ pullup resistor0.8V
30%V
400pF
DVDD
DVDD
DVDD
Support SCL frequencyNo wait states, fast mode400kHz
Support SCL frequencyNo wait states, slow mode100kHz
Noise margin at High level for
each connected device
(including hysteresis)
0.2 × V
DD
V
Allowable MCLK duty cycle40%60%
Supported MCLK frequencies Up to 50 MHz128512f
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5782MEVM board and Audio
Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to
768 kHz unless otherwise noted.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Switching frequency depends on voltage
f
SPK_AMP
K
SVR
Switching frequency of the
speaker amplifier
Power supply rejection ratio
Drain-to-source on resistance
r
DS(on)
OCE
OTE
THRES
THRES
of the individual output
MOSFETs
SPK_OUTxx overcurrent
error threshold
Overtemperature error
threshold
Time required to clear
OCE
CLRTIME
overcurrent error after error
condition is removed.
Time required to clear
OTE
OVE
UVE
CLRTIME
THRES(PVDD)
THRES(PVDD)
overtemperature error after
error condition is removed.
PVDD overvoltage error
threshold
PVDD undervoltage error
threshold
SPEAKER AMPLIFIER (STEREO BTL)
|VOS|Amplifier offset voltage
I
CN(SPK)
P
O(SPK)
Idle channel noise
Output Power (Per Channel)
presented at SPK_GAIN/FREQ pin and the
clocking arrangement, including the incoming
sample rate, see Adjustable Amplifier Gain and
Switching Frequency Selection
Injected Noise = 50 Hz to 60 Hz, 200 mV
= 26 dB, input audio signal = digital zero
V
= 24 V, I
PVDD
includes PVDD/PGND pins, leadframe, bondwires
= 500 mA, TJ= 25°C,
(SPK_OUT)
P-P
, Gain
and metallization layers.
V
PVDD
= 24 V, I
= 500 mA, TJ= 25°C90
(SPK_OUT)
Measured differentially with zero input data,
SPK_GAIN/FREQ pin configured for 20 dB gain,
V
= 12 V
PVDD
Measured differentially with zero input data,
SPK_GAIN/FREQ pin configured for 26 dB gain,
V
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5782MEVM board and Audio
Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to
768 kHz unless otherwise noted.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
V
SNR
(referenced to 0 dBFS input
signal)
Signal-to-noise ratio
THD+N
SPK
Total harmonic distortion and
noise
Cross-talk (worst case
X-talk
SPK
between left-to-right and
right-to-left coupling)
SPEAKER AMPLIFIER (MONO PBTL)
|VOS|Amplifier offset voltage
I
CN
Idle channel noise
= 12 V, SPK_GAIN = 20 dB, R
PVDD
Weighted, –120 dBFS Input
V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
Weighted, –120 dBFS Input
V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
Weighted, –120 dBFS Input
V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
Weighted, –120 dBFS Input
V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
PO= 1 W, f = 1kHz
V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
PO= 1 W, f = 1kHz
V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz
V
= 15 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz
V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz
V
= 19 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz
V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz
V
= 24 V, SPK_GAIN = 26 dB, R
PVDD
PO= 1 W, f = 1kHz
V
= 12 V, SPK_GAIN = 20 dB, R
PVDD
Input Signal 250 mVrms,
1-kHz Sine, across f(S)
V
= 15 V, SPK_GAIN = 26 dBV, R
PVDD
Input Signal 250 mVrms,
1-kHz Sine, across f(S)
V
= 19 V, SPK_GAIN = 26 dBV, R
PVDD
Input Signal 250 mVrms,
1-kHz Sine, across f(S)
V
= 24 V, SPK_GAIN = 26 dBV, R
PVDD
Input Signal 250 mVrms,
1-kHz Sine, across f(S)
Measured differentially with zero input data,
SPK_GAIN/FREQ pin configured for 20 dB gain,
V
= 12 V
PVDD
Measured differentially with zero input data,
SPK_GAIN/FREQ pin configured for 26 dB gain,
V
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5782MEVM board and Audio
Precision System 2722 with Analog Analyzer filter set to 40 kHz brickwall filter. The device output PWM frequency was set to
768 kHz unless otherwise noted.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
V
P
O
SNR
THD+N
Output power (per channel)
Signal-to-noise ratio
(referenced to 0 dBFS input
signal)
SCLK frequency1.024MHz
SCLK period40ns
SCLK pulse width, low16ns
SCLK pulse width, high16ns
SCLK rising to LRCK/FS edge8ns
LRCK/FS Edge to SCLK rising edge8ns
Data setup time, before SCLK rising edge8ns
Data hold time, after SCLK rising edge8ns
Data delay time from SCLK falling edge15ns
SCLK period40ns
SCLK pulse width, low16ns
SCLK pulse width, high16ns
LRCK/FS delay time from to SCLK falling edge–1020ns
Data setup time, before SCLK rising edge8ns
Data hold time, after SCLK rising edge8ns
Data delay time from SCLK falling edge15ns
7.10 I2C Bus Timing – Standard
f
SCL
t
BUF
t
LOW
t
HI
t
RS-SU
t
S-HD
t
D-SU
t
D-HD
t
SCL-R
t
SCL-R1
t
SCL-F
t
SDA-R
t
SDA-F
t
P-SU
SCL clock frequency100kHz
Bus free time between a STOP and START condition4.7µs
Low period of the SCL clock4.7µs
High period of the SCL clock4µs
Setup time for (repeated) START condition4.7µs
Hold time for (repeated) START condition4µs
Data setup time250ns
Data hold time0900ns
Rise time of SCL signal20 + 0.1C
Rise time of SCL signal after a repeated START condition and after an acknowledge bit20 + 0.1C
Fall time of SCL signal20 + 0.1C
Rise time of SDA signal20 + 0.1C
Fall time of SDA signal20 + 0.1C
Setup time for STOP condition4µs
TAS5782M
SLASEG8A –MARCH 2016–REVISED JULY 2017
MINNOMMAXUNIT
MINMAXUNIT
1000ns
B
1000ns
B
1000ns
B
1000ns
B
1000ns
B
7.11 I2C Bus Timing – Fast
See Figure 21.
f
SCL
t
BUF
t
LOW
t
HI
t
RS-SU
t
RS-HD
t
D-SU
t
D-HD
t
SCL-R
t
SCL-R1
t
SCL-F
t
SDA-R
t
SDA-F
t
P-SU
t
SP
SCL clock frequency400kHz
Bus free time between a STOP and START condition1.3µs
Low period of the SCL clock1.3µs
High period of the SCL clock600ns
Setup time for (repeated)START condition600ns
Hold time for (repeated)START condition600ns
Data setup time100ns
Data hold time0900ns
Rise time of SCL signal20 + 0.1C
Rise time of SCL signal after a repeated START condition and after an acknowledge bit20 + 0.1C
Fall time of SCL signal20 + 0.1C
Rise time of SDA signal20 + 0.1C
Fall time of SDA signal20 + 0.1C
Setup time for STOP condition600ns
Pulse width of spike suppressed50ns
All performance plots were taken using the TAS5782MEVM Board at room temperature, unless otherwise noted.
The term "traditional LC filter" refers to the output filter that is present by default on the TAS5782MEVM Board.
Table 1. Quick Reference Table
OUTPUT
CONFIGURATIONS
Bridge Tied Load (BTL)
Configuration Curves
Parallel Bridge Tied Load
(PBTL) Configuration
Frequency ResponseFigure 42
Output Power vs PVDDFigure 23
THD+N vs Frequency, V
THD+N vs Frequency, V
THD+N vs Frequency, V
THD+N vs Frequency, V
THD+N vs Power, V
THD+N vs Power, V
THD+N vs Power, V
THD+N vs Power, V
Idle Channel Noise vs PVDDFigure 32
Efficiency vs Output PowerFigure 33
Efficiency vs Output PowerFigure 34
Efficiency vs Output PowerFigure 35
Idle Current Draw (Filterless) vs PVDDFigure 36
Crosstalk vs. FrequencyFigure 37
PVDD PSRR vs FrequencyFigure 38
DVDD PSRR vs FrequencyFigure 39
AVDD PSRR vs FrequencyFigure 40
CPVDD PSRR vs FrequencyFigure 41
THD+N vs Frequency, V
THD+N vs Frequency, V
THD+N vs Frequency, V
THD+N vs Frequency, V
Output Power vs PVDDFigure 47
THD+N vs Frequency, V
THD+N vs Frequency, V
THD+N vs Frequency, V
THD+N vs Frequency, V
THD+N vs Power, V
THD+N vs Power, V
THD+N vs Power, V
THD+N vs Power, V
Idle Channel Noise vs PVDDFigure 56
Efficiency vs Output PowerFigure 57
THD+N vs Frequency, V
THD+N vs Frequency, V
THD+N vs Frequency, V
THD+N vs Frequency, V
Free-air room temperature 25°C (unless otherwise noted) Measurements were made using TAS5782MEVM
board and Audio Precision System 2722 with Analog Analyzer filter set to 40-kHz brickwall filter. All
measurements taken with audio frequency set to 1 kHz and device PWM frequency set to 768 kHz, unless
otherwise noted. For both the BTL plots and the PBTL plots, the LC filter used was 4.7 µH / 0.68 µF. Return to