25-W DIGITAL AUDIO POWER AMPLIFIER WITH EQ AND DRC
Check for Samples: TAS5713
1
FEATURES
2
•Audio Input/Output
– 25-W Into an 8-Ω Load From a 20-V Supply– EQ: Speaker Equalization Improves Audio
– Wide PVDD Range, From 8 V to 26 V
– Supports BTL Configuration With 4-Ω Load
– Efficient Class-D Operation Eliminates
Need for Heatsinks
– One Serial Audio Input (Two Audio
Channels)
– I2C Address Selection Pin (Chip Select)
– Single Output Filter PBTL Support
– Supports 8-kHz to 48-kHz Sample Rate
(LJ/RJ/I2S)
•Audio/PWM ProcessingExternal Microprocessor Intervention
– Independent Channel Volume Controls With
Gain of 24 dB to Mute
– Programmable Two-Band Dynamic-Range
Control
– 22 Programmable Biquads for Speaker EQ
and Other Audio-Processing Features
– Programmable Coefficients for DRC Filters
– DC Blocking Filters
•General Features
– I2C Serial Control Interface Operational
Without MCLK
– Requires Only 3.3 V and PVDD
– No External Oscillator: Internal Oscillator
for Automatic Rate Detection
– Surface-Mount, 48-Pin, 7-mm × 7-mm
HTQFP Package
– Thermal and Short-Circuit Protection
– 106-dB SNR, A-Weighted
– AD and BD PWM-Mode Support
– Up to 90% Efficient
A
•Benefits
Performance
– DRC: Dynamic Range Compression. Can
Be Used As Power Limiter. Enables
Speaker Protection, Easy Listening,
Night-Mode Listening
– Autobank Switching: Preload Coefficients
for Different Sample Rates. No Need to
Write New Coefficients to the Part When
Sample Rate Changes
– Autodetect: Automatically Detects
Sample-Rate Changes. No Need for
DESCRIPTION
The TAS5713 is a 25-W, efficient, digital-audio power
amplifier for driving stereo bridge-tied speakers. One
serial data input allows processing of up to two
discrete audio channels and seamless integration to
most digital audio processors and MPEG decoders.
The device accepts a wide range of input data and
data rates. A fully programmable data path routes
these channels to the internal speaker drivers.
The TAS5713 is a slave-only device receiving all
clocks from external sources. The TAS5713 operates
with a PWM carrier between a 384-kHz switching rate
and a 352-KHz switching rate, depending on the input
samplerate.Oversamplingcombinedwitha
fourth-order noise shaper provides a flat noise floor
and excellent dynamic range from 20 Hz to 20 kHz..
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPad is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
SIMPLIFIED APPLICATION DIAGRAM
www.ti.com
(1)
See the TAS5713 User's Guide for loop filter values
AGND30PLocal analog ground for power stage
A_SEL_FAULT14DIOThis pin is monitored on the rising edge of RESET. A value of 0
AVDD13P3.3-V analog power supply
AVSS9PAnalog 3.3-V supply ground
BST_A4PHigh-side bootstrap supply for half-bridge A
BST_B43PHigh-side bootstrap supply for half-bridge B
BST_C42PHigh-side bootstrap supply for half-bridge C
BST_D33PHigh-side bootstrap supply for half-bridge D
DVDD27P3.3-V digital power supply
TYPE
(1) TYPE: A = analog; D = 3.3-V digital; P = power/ground/decoupling; I = input; O = output
(2) All pullups are weak pullups and all pulldowns are weak pulldowns. The pullups and pulldowns are included to assure proper input logic
levels if the pins are left unconnected (pullups → logic 1 input; pulldowns → logic 0 input).
(15-kΩ pulldown) sets the I2C device address to 0x34 and a value of
1 (15-kΩ pullup) sets it to 0x36. this dual-function pin can be
programmed to output internal power-stage errors.
Product Folder Link(s): TAS5713
DESCRIPTION
TAS5713
www.ti.com
SLOS637 –DECEMBER 2009
PIN FUNCTIONS (continued)
PIN
NAMENO.
DVSS28PDigital ground
DVSSO17POscillator ground
GND29PAnalog ground for power stage
GVDD_OUT32PGate drive internal regulator output
LRCLK20DI5-VPulldownInput serial audio data left/right clock (sample-rate clock)
MCLK15DI5-VPulldownMaster clock input
NC5, 7–No connect
OSC_RES16AOOscillator trim resistor. Connect an 18.2-kΩ, 1% resistor to DVSSO.
OUT_A1OOutput, half-bridge A
OUT_B46OOutput, half-bridge B
OUT_C39OOutput, half-bridge C
OUT_D36OOutput, half-bridge D
PBTL8DILow means BTL or SE mode; high means PBTL mode. Information
PDN19DI5-VPullupPower down, active-low. PDN prepares the device for loss of power
PGND_AB47, 48PPower ground for half-bridges A and B
PGND_CD37, 38PPower ground for half-bridges C and D
PLL_FLTM10AOPLL negative loop-filter terminal
PLL_FLTP11AOPLL positive loop-filter terminal
PVDD_A2, 3PPower-supply input for half-bridge output A
PVDD_B44, 45PPower-supply input for half-bridge output B
PVDD_C40, 41PPower-supply input for half-bridge output C
PVDD_D34, 35PPower-supply input for half-bridge output D
RESET25DI5-VPullupReset, active-low. A system reset is generated by applying a logic
SCL24DI5-VI2C serial control clock input
SCLK21DI5-VPulldownSerial audio-data clock (shift clock). SCLK is the serial-audio-port
SDA23DIO5-VI2C serial control data interface input/output
SDIN22DI5-VPulldownSerial audio data input. SDIN supports three discrete (stereo) data
SSTIMER6AIControls ramp time of OUT_x to minimize pop. Leave this pin
STEST26DIFactory test pin. Connect directly to DVSS.
VR_ANA12PInternally regulated 1.8-V analog supply voltage. This pin must not
VR_DIG18PInternally regulated 1.8-V digital supply voltage. This pin must not be
VREG31PDigital regulator output. Not to be used for powering external
TYPE
(1)
TOLERANT
5-V
TERMINATION
(2)
goes directly to power stage.
supplies by shutting down the noise shaper and initiating the PWM
stop sequence.
low to this pin. RESET is an asynchronous control signal that
restores the DAP to its default conditions and places the PWM in the
hard-mute (high-impedance) state.
input-data bit clock.
formats.
floating for BD mode. Requires capacitor of 2.2 nF to GND in AD
mode. The capacitor determines the ramp time.
over operating free-air temperature range (unless otherwise noted)
Supply voltage
Input voltage5-V tolerant
OUT_x to PGND_x32
BST_x to PGND_x43
Input clamp current, I
Output clamp current, I
Operating free-air temperature0 to 85°C
Operating junction temperature range0 to 150°C
Storage temperature range, T
(1) Stresses beyond those listed under absolute ratings may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under recommended operation conditions are
not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability.
(2) 5-V tolerant inputs are PDN, RESET, SCLK, LRCLK, MCLK, SDIN, SDA, and SCL.
(3) Maximum pin voltage should not exceed 6 V.
(4) DC voltage + peak ac waveform measured at the pin should be below the allowed limit for all conditions.
DISSIPATION RATINGS
PACKAGE
7-mm × 7-mm HTQFP40 mW/°C5 W4.2 W3.2 W
(1) This data was taken using 1-oz. (0.035-mm thick) trace and copper pad that is soldered directly to a JEDEC-standard high-k PCB. The
thermal pad must be soldered to a thermal land on the printed-circuit board. See the PowerPad™ Thermally Enhanced Package
application report (SLMA002) for more information about using the HTQFP thermal pad.
Drain-to-source resistance, LS TJ= 25°C, includes metallization resistance110
(2)
Drain-to-source resistance,
HS
TJ= 25°C, includes metallization resistance110
I/O Protection
V
uvp
V
uvp,hyst
(3)
OTE
OTE
HYST
OLPCOverload protection counterf
I
OC
I
OCT
R
PD
Undervoltage protection limitPVDD falling7.2V
Undervoltage protection limitPVDD rising7.6V
Overtemperature error150°C
Extra temperature drop
(3)
required to recover from error
= 384 kHz0.63ms
PWM
Overcurrent limit protection4.5A
Overcurrent response time150ns
Internal pulldown resistor atConnected when drivers are tristated to provide bootstrap
the output of each half-bridge capacitor charge.
(1) IIHfor the PBTL pin has a maximum limit of 200 µA due to an internal pulldown on the pin.
(2) This does not include bond-wire or pin resistance.
(3) Specified by design
IOH= –4 mA
DVDD = 3 V
IOL= 4 mA
DVDD = 3 V
VI< VIL; DVDD = AVDD
= 3.6V
VI> VIH; DVDD =
AVDD = 3.6V
Normal mode4883
Reset (RESET = low,2640
PDN = high)
Normal mode4175
Reset (RESET = low,513
over recommended operating conditions (unless otherwise noted)
PARAMETERMINTYPMAXUNIT
f
SCLKIN
t
su1
t
h1
t
su2
t
h2
t
(edge)
tr/t
f
Frequency, SCLK 32 × fS, 48 × fS, 64 × f
S
Setup time, LRCLK to SCLK rising edge10ns
Hold time, LRCLK from SCLK rising edge10ns
Setup time, SDIN to SCLK rising edge10ns
Hold time, SDIN from SCLK rising edge10ns
LRCLK frequency84848kHz
SCLK duty cycle40%50%60%
LRCLK duty cycle40%50%60%
SCLK rising edges between LRCLK rising edges3264
LRCLK clock edge with respect to the falling edge of SCLK–1/41/4
Rise/fall time for SCLK/LRCLK8ns
Timing characteristics for I2C Interface signals over recommended operating conditions (unless otherwise noted)
PARAMETERTEST CONDITIONSMINMAXUNIT
f
t
t
t
t
t
t
t
t
t
t
C
SCL
w(H)
w(L)
r
f
su1
h1
(buf)
su2
h2
su3
Frequency, SCLNo wait states400kHz
Pulse duration, SCL high0.6μs
Pulse duration, SCL low1.3μs
Rise time, SCL and SDA300ns
Fall time, SCL and SDA300ns
Setup time, SDA to SCL100ns
Hold time, SCL to SDA0ns
Bus free time between stop and start conditions1.3μs
Setup time, SCL to start condition0.6μs
Hold time, start condition to SCL0.6μs
Setup time, SCL to stop condition0.6μs
Load capacitance for each bus line400pF
Control signal parameters over recommended operating conditions (unless otherwise noted). Please refer to Recommended
Use Model section on usage of all terminals.
PARAMETERMINTYPMAXUNIT
t
w(RESET)
t
d(I2C_ready)
NOTES: On power up, it is recommended that the TAS5713 RESET be held LOW for at least 100 μs after DVDD has
reached 3 V.
If RESET is asserted LOW while PDN is LOW, then RESET must continue to be held LOW for at least 100 μs after
PDN is deasserted (HIGH).
Pulse duration, RESET active100μs
Time to enable I2C12.0ms