Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
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FEATURES
D2 × 30 W (BTL) Into 6 Ω at 1 kHz
D95-dB Dynamic Range (in System With
TAS5026)
D< 0.2% THD+N (in System – 30 W RMS Into
6-Ω Resistive Load)
DDevice Power Efficiency Typical >90% Into
6-Ω Load
DSelf-Protection Design (Including
Undervoltage, Overtemperature, and Short
Conditions) With Error Reports
DInternal Gate Drive Supply Voltage Regulator
DEMI Compliant When Used With
Recommended System Design
SLES088D – AUGUST 2003 – REVISED MAY 2004
TM
APPLICATIONS
DDVD Receiver
DHome Theatre
DMini/Micro Component Systems
DInternet Music Appliance
DESCRIPTION
The TAS5122 is a high-performance, integrated stereo
digital amplifier power stage designed to drive 6-Ω
speakers at up to 30 W per channel. The device
incorporates TI’s PurePath Digitalt technology and is
used with a digital audio PWM processor (TAS50XX) and
a simple passive demodulation filter to deliver high-quality,
high-efficiency, true-digital audio amplification.
The efficiency of this digital amplifier is typically greater
than 90%. Overcurrent protection, overtemperature
protection, and undervoltage protection are built into the
TAS5122, safeguarding the device and speakers against
fault conditions that could damage the system.
1
0.1
THD+N − Total Harmonic Distortion + Noise − %
0.01
40m 100m1040
THD + NOISE vs OUTPUT POWER
RL = 6 Ω
TC = 75°C
THD+N − Total Harmonic Distortion + Noise − %
1
PO − Output Power − W
semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
0.1
0.01
201001k10k
THD + NOISE vs FREQUENCY
RL = 6 Ω
TC = 75°C
PO = 30 W
PO = 10 W
PO = 1 W
f − Frequency − Hz
20k
PurePath Digital and PowerPAD are trademarks of Texas Instruments.
Other trademarks are the property of their respective owners.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
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GENERAL INFORMATION
Terminal Assignment
The TAS5122 is offered in a thermally enhanced 56-pin
DCA package (thermal pad is on the bottom). Output of the
DCA package is highly dependent on thermal design. See
the Thermal Information section. Therefore, it is important
to design the heatsink carefully.
over operating free-air temperature range unless otherwise noted
TAS5122UNITS
DVDD to DGND–0.3 V to 4.2 V
GVDD to GND28 V
PVDD_X to GND (dc voltage)28 V
OUT_X to GND (dc voltage)28 V
BST_X to GND (dc voltage)40 V
GREG to GND
PWM_XP, RESET, M1, M2, M3, SD,
OTW
Maximum operating junction
temperature, T
Storage temperature–40°C to 125°C
(1)
Stresses beyond those listed under “absolute maximum ratings”
may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any
other conditions beyond those indicated under “recommended
operating conditions” is not implied. Exposure to absolutemaximum-rated conditions for extended periods may affect device
reliability.
(2)
GREG is treated as an input when the GREG pin is overdriven by
GVDD of 12 V .
(2)
–0.3 V to DVDD + 0.3 V
J
14.2 V
–40°C to 150°C
ORDERING INFORMATION
T
A
0°C to 70°CTAS5122DCA56-pin small TSSOP
PACKAGEDESCRIPTION
PACKAGE DISSIPATION RATINGS
R
PACKAGE
56-pin DCA TSSOP1.14See Note 1
(1)
The TAS5122 package is thermally enhanced for conductive
cooling using an exposed metal pad area. It is impractical to use the
device with the pad exposed to ambient air as the only heat sinking
of the device.
For this reason, R
thermal treatment provided in the application. An example and
discussion of typical system R
Thermal Information section. This example provides additional
information regarding the power dissipation ratings. This example
should be used as a reference to calculate the heat dissipation
ratings for a specific application. TI application engineering
provides technical support to design heatsinks if needed.
HS bootstrap supply (BST), external capacitor to OUT_A required
HS bootstrap supply (BST), external capacitor to OUT_B required
HS bootstrap supply (BST), external capacitor to OUT_C required
HS bootstrap supply (BST), external capacitor to OUT_D required
Digital I/O reference ground
Digital supply voltage regulator decoupling pin, capacitor connected to GND
Digital supply voltage regulator decoupling return pin
I/O reference supply input (3.3 V)
P
Power ground (I/O reference ground – pin 22)
Gate drive voltage regulator decoupling pin, capacitor to GND
Voltage supply to on−chip gate drive and digital supply voltage regulators
Mode selection pin
Mode selection pin
Mode selection pin
Overtemperature warning output, open drain with internal pullup
Output, half-bridge A
Output, half-bridge B
Output, half-bridge C
Output, half-bridge D
Power supply input for half-bridge A
Power supply input for half-bridge B
Power supply input for half-bridge C
Power supply input for half-bridge D
Input signal (negative), half-bridge A
Input signal (positive), half-bridge A
Input signal (negative), half-bridge B
Input signal (positive), half-bridge B
Input signal (negative), half-bridge C
Input signal (positive), half-bridge C
Input signal (negative), half-bridge D
Input signal (positive), half-bridge D
Reset signal, active low
Reset signal, active low
Shutdown signal for half-bridges A and B
Shutdown signal for half-bridges C and D
3
SLES088D – AUGUST 2003 – REVISED MAY 2004
FUNCTIONAL BLOCK DIAGRAM
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GREG
Gate
PWM_APOUT_A
RESET
PWM_BPOUT_B
OTW
SD
PWM
Receiver
PWM
Receiver
To
Protection
Blocks
OT
Protection
UVP
Protection A
Protection B
Timing
Control
GREG
Timing
Control
GREG
DREG
Drive
Gate
Drive
Gate
Drive
Gate
Drive
GREG
DREG_RTN
BST_A
PVDD_A
GND
BST_B
PVDD_B
GND
DREG
GVDD
GREG
DREG_RTN
GREG
Gate
PWM_CPOUT_C
RESET
PWM_DPOUT_D
4
PWM
Receiver
Protection C
Protection D
PWM
Receiver
Timing
Control
GREG
Timing
Control
Drive
Gate
Drive
Gate
Drive
Gate
Drive
BST_C
PVDD_C
GND
BST_D
PVDD_D
GND
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POOutput power
SLES088D – AUGUST 2003 – REVISED MAY 2004
RECOMMENDED OPERATING CONDITIONS
MINTYPMAXUNIT
DVDDDigital supply
GVDD
PVDD_xHalf-bridge supplyRelative to GND, RL= 6 Ω to 8 Ω02325.5V
T
J
(1)
It is recommended for DVDD to be connected to DREG via a 100-Ω resistor.
Supply for internal gate drive and logic
regulators
Junction temperature0125_C
(1)
Relative to DGND33.33.6V
Relative to GND162325.5V
ELECTRICAL CHARACTERISTICS
PVDD_X = 23 V, GVDD = 23 V, DVDD = 3.3 V, DVDD connected to DREG via a 100-Ω resistor, RL = 6 Ω, 8X fs = 384 kHz, unless otherwise
noted. AC performance is recorded as a chipset with TAS5010 as the PWM processor and TAS5122 as the power stage.