TEXAS INSTRUMENTS TAS5122 Technical data

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
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FEATURES
D 2 × 30 W (BTL) Into 6 at 1 kHz D 95-dB Dynamic Range (in System With
TAS5026)
6- Resistive Load)
D Device Power Efficiency Typical >90% Into
6- Load
D Self-Protection Design (Including
Undervoltage, Overtemperature, and Short Conditions) With Error Reports
D Internal Gate Drive Supply Voltage Regulator D EMI Compliant When Used With
Recommended System Design
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SLES088D – AUGUST 2003 – REVISED MAY 2004
TM
APPLICATIONS
D DVD Receiver D Home Theatre D Mini/Micro Component Systems D Internet Music Appliance
DESCRIPTION
The TAS5122 is a high-performance, integrated stereo digital amplifier power stage designed to drive 6- speakers at up to 30 W per channel. The device incorporates TI’s PurePath Digitalt technology and is used with a digital audio PWM processor (TAS50XX) and a simple passive demodulation filter to deliver high-quality, high-efficiency, true-digital audio amplification.
The efficiency of this digital amplifier is typically greater than 90%. Overcurrent protection, overtemperature protection, and undervoltage protection are built into the TAS5122, safeguarding the device and speakers against fault conditions that could damage the system.
1
0.1
THD+N − Total Harmonic Distortion + Noise − %
0.01 40m 100m 10 40
THD + NOISE vs OUTPUT POWER
RL = 6 TC = 75°C
THD+N − Total Harmonic Distortion + Noise − %
1
PO − Output Power − W
semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
0.1
0.01 20 100 1k 10k
THD + NOISE vs FREQUENCY
RL = 6 TC = 75°C
PO = 30 W
PO = 10 W
PO = 1 W
f − Frequency − Hz
20k
PurePath Digital and PowerPAD are trademarks of Texas Instruments. Other trademarks are the property of their respective owners.
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Copyright 2004, Texas Instruments Incorporated
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D
R
A A
B B
C C
D D
DCA PACKAGE
SLES088D – AUGUST 2003 – REVISED MAY 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
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GENERAL INFORMATION
Terminal Assignment
The TAS5122 is offered in a thermally enhanced 56-pin DCA package (thermal pad is on the bottom). Output of the DCA package is highly dependent on thermal design. See the Thermal Information section. Therefore, it is important to design the heatsink carefully.
(TOP VIEW)
GND GVDD BST_A PVDD_ PVDD_ OUT_A OUT_A GND GND OUT_B OUT_B PVDD_ PVDD_ BST_B BST_C PVDD_ PVDD_ OUT_C OUT_C GND GND OUT_D OUT_D PVDD_ PVDD_ BST_D GVDD GND
GND GND
GREG
DVDD
GND
DGND
GND
PWM_AP
PWM_AM
RESET_AB
PWM_BM
PWM_BP
DREG
M1 M2 M3
REG_RTN
PWM_CP
PWM_CM
ESET_CD
PWM_DM
PWM_DP
SD_AB
SD_CD
OTW
GREG
GND GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
TAS5122 UNITS
DVDD to DGND –0.3 V to 4.2 V GVDD to GND 28 V PVDD_X to GND (dc voltage) 28 V OUT_X to GND (dc voltage) 28 V BST_X to GND (dc voltage) 40 V GREG to GND PWM_XP, RESET, M1, M2, M3, SD,
OTW Maximum operating junction
temperature, T Storage temperature –40°C to 125°C
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute­maximum-rated conditions for extended periods may affect device reliability.
(2)
GREG is treated as an input when the GREG pin is overdriven by GVDD of 12 V .
(2)
–0.3 V to DVDD + 0.3 V
J
14.2 V
–40°C to 150°C
ORDERING INFORMATION
T
A
0°C to 70°C TAS5122DCA 56-pin small TSSOP
PACKAGE DESCRIPTION
PACKAGE DISSIPATION RATINGS
R
PACKAGE
56-pin DCA TSSOP 1.14 See Note 1
(1)
The TAS5122 package is thermally enhanced for conductive cooling using an exposed metal pad area. It is impractical to use the device with the pad exposed to ambient air as the only heat sinking of the device.
For this reason, R thermal treatment provided in the application. An example and discussion of typical system R Thermal Information section. This example provides additional information regarding the power dissipation ratings. This example should be used as a reference to calculate the heat dissipation ratings for a specific application. TI application engineering provides technical support to design heatsinks if needed.
a system parameter that characterizes the
θJA
θJC
C/W)
values are provided in the
θJA
R
θJA
(°C/W)
(1)
2
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FUNCTION
(1)
DESCRIPTION
TERMINAL
NAME NO.
BST_A BST_B BST_C BST_D DGND DREG DREG_RTN DVDD GND
GREG GVDD M1 M2 M3 OTW OUT_A OUT_B OUT_C OUT_D PVDD_A PVDD_B PVDD_C PVDD_D PWM_AM PWM_AP PWM_BM PWM_BP PWM_CM PWM_CP PWM_DM PWM_DP RESET_AB RESET_CD SD_AB SD_CD
(1)
I = input, O = output, P = power
54 P 43 P 42 P 31 P
6 P 13 P 17 P
4 P
1, 2, 5,
7, 27, 28,
29, 36, 37,
48, 49, 56
3, 26 P
30, 55 P
14 I 15 I 16 I 25 O
50, 51 O 46, 47 O 38, 39 O 34, 35 O 52, 53 P 44, 45 P 40, 41 P 32, 33 P
9 I
8 I 11 I 12 I 19 I 18 I 21 I 22 I 10 I 20 I 23 O 24 O
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SLES088D – AUGUST 2003 – REVISED MAY 2004
Terminal Functions
HS bootstrap supply (BST), external capacitor to OUT_A required HS bootstrap supply (BST), external capacitor to OUT_B required HS bootstrap supply (BST), external capacitor to OUT_C required HS bootstrap supply (BST), external capacitor to OUT_D required Digital I/O reference ground Digital supply voltage regulator decoupling pin, capacitor connected to GND Digital supply voltage regulator decoupling return pin I/O reference supply input (3.3 V)
P
Power ground (I/O reference ground – pin 22)
Gate drive voltage regulator decoupling pin, capacitor to GND Voltage supply to on−chip gate drive and digital supply voltage regulators Mode selection pin Mode selection pin Mode selection pin Overtemperature warning output, open drain with internal pullup Output, half-bridge A Output, half-bridge B Output, half-bridge C Output, half-bridge D Power supply input for half-bridge A Power supply input for half-bridge B Power supply input for half-bridge C Power supply input for half-bridge D Input signal (negative), half-bridge A Input signal (positive), half-bridge A Input signal (negative), half-bridge B Input signal (positive), half-bridge B Input signal (negative), half-bridge C Input signal (positive), half-bridge C Input signal (negative), half-bridge D Input signal (positive), half-bridge D Reset signal, active low Reset signal, active low Shutdown signal for half-bridges A and B Shutdown signal for half-bridges C and D
3
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SLES088D – AUGUST 2003 – REVISED MAY 2004
FUNCTIONAL BLOCK DIAGRAM
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GREG
Gate
PWM_AP OUT_A
RESET
PWM_BP OUT_B
OTW
SD
PWM
Receiver
PWM
Receiver
To
Protection
Blocks
OT
Protection
UVP
Protection A
Protection B
Timing
Control
GREG
Timing
Control
GREG
DREG
Drive
Gate
Drive
Gate
Drive
Gate
Drive
GREG
DREG_RTN
BST_A
PVDD_A
GND
BST_B
PVDD_B
GND
DREG
GVDD
GREG
DREG_RTN
GREG
Gate
PWM_CP OUT_C
RESET
PWM_DP OUT_D
4
PWM
Receiver
Protection C
Protection D
PWM
Receiver
Timing
Control
GREG
Timing
Control
Drive
Gate
Drive
Gate
Drive
Gate
Drive
BST_C
PVDD_C
GND
BST_D
PVDD_D
GND
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POOutput power
SLES088D – AUGUST 2003 – REVISED MAY 2004
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RECOMMENDED OPERATING CONDITIONS
MIN TYP MAX UNIT
DVDD Digital supply GVDD PVDD_x Half-bridge supply Relative to GND, RL= 6 to 8 0 23 25.5 V
T
J
(1)
It is recommended for DVDD to be connected to DREG via a 100- resistor.
Supply for internal gate drive and logic regulators
Junction temperature 0 125 _C
(1)
Relative to DGND 3 3.3 3.6 V Relative to GND 16 23 25.5 V
ELECTRICAL CHARACTERISTICS
PVDD_X = 23 V, GVDD = 23 V, DVDD = 3.3 V, DVDD connected to DREG via a 100- resistor, RL = 6 , 8X fs = 384 kHz, unless otherwise noted. AC performance is recorded as a chipset with TAS5010 as the PWM processor and TAS5122 as the power stage.
SYMBOL PARAMETER TEST CONDITIONS
AC PERFORMANCE, BTL MODE, 1 kHz
RL = 8 , unclipped, AES17 filter
RL = 8 , THD = 10%, AES17 filter
RL = 6 , THD = 0.4%, AES17 filter
RL = 6 , THD = 10%, AES17 filter
Po = 1 W/ channel, RL = 6 Ω, AES17 filter
THD+N Total harmonic distortion + noise
V
n
SNR Signal-to-noise ratio
DR Dynamic range
INTERNAL VOLTAGE REGULATOR
DREG Voltage regulator
GREG Voltage regulator
IVGDD GVDD supply current, operating IDVDD DVDD supply current, operating fS = 384 kHz, no load 1 5 mA Max
OUTPUT STAGE MOSFETs
R
DSon,LS
R
DSon ,HS
Output RMS noise
Forward on-resistance, LS TJ = 25°C 155 m Max Forward on-resistance, HS TJ = 25°C 155 m Max
Po = 10 W/channel, RL = 6 Ω, AES17 filter
Po = 30 W/channel, RL = 6 Ω, AES17 filter
A-weighted, mute, RL = 6 Ω, 20 Hz to 20 kHz, AES17 filter
f = 1 kHz, A-weighted, RL = 6 ,, AES17 filter
f = 1 kHz, A-weighted, RL = 6 ,, AES17 filter
Io = 1 mA, PVDD = 18 V−30.5 V
Io = 1.2 mA, PVDD = 18 V−30.5 V
fS = 384 kHz, no load, 50% duty cycle
TYPICAL
TA=25°C
3.1 V Typ
13.4 V Typ
TA=25°C
T
=
Case
75°C
0.05% Typ
0.05% Typ
0.2% Typ
240 µV Max
24 mA Max
UNITS
24 W Typ
29 W Typ
30 W Typ
37 W Typ
95 dB Typ
95 dB Typ
MIN/TYP/
MAX
5
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V
Undervoltage protection limit, GVDD
7.4
VIHHigh-level input voltage
Leakage
Input leakage current
SLES088D – AUGUST 2003 – REVISED MAY 2004
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ELECTRICAL CHARACTERISTICS
PVDD_x = 23 V, GVDD = 23 V, DVDD = 3.3 V, RL = 6 , 8X fs = 384 kHz, unless otherwise noted
SYMBOL
INPUT/OUTPUT PROTECTION
uvp,G
OTW Overtemperature warning 125 °C Typ OTE Overtemperature error 150 °C Typ OC Overcurrent protection 5.0 A Min
STATIC DIGITAL SPECIFICATION
PWM_AP, PWM_BP, M1, M2, M3, SD, OTW
V
IL
OTW/SHUTDOWN (SD)
V
OL
Low-level input voltage 0.8 V Max
Internally pullup R from OTW/SD to DVDD
Low level output voltage IO = 4 mA 0.4 V Max
PARAMETER TEST CONDITIONS
TYPICAL
TA=25°C
30 22.5 k Min
TA=25°C
6.9 V Min
7.9 V Max
DVDD V Max
−10 µA Min
T
=
Case
75°C
2 V Min
10 µA Max
UNITS
MIN/TYP/
MAX
6
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