Texas instruments STELLARIS LM3S1133 DATA SHEET

Stellaris® LM3S1133 Microcontroller

DATA SHEET
Copyright © 2007-2010 Texas Instruments
Incorporated
DS-LM3S1133-7787
TEXAS INSTRUMENTS-PRODUCTION DATA
Copyright
Copyright ©2007-2010 Texas Instruments Incorporated All rights reserved. Stellaris and StellarisWare are registered trademarks of Texas Instruments
property of others.
PRODUCTION DATA information is current as of publication date. Products conform to specications per the terms of Texas Instruments standard
warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor
products and disclaimers thereto appears at the end of this data sheet.
Texas Instruments Incorporated
108 Wild Basin, Suite 350
Austin, TX 78746
http://www.ti.com/stellaris
http://www-k.ext.ti.com/sc/technical-support/product-information-centers.htm
September 04, 20102
Texas Instruments-Production Data

Table of Contents

Revision History ............................................................................................................................. 22
About This Document .................................................................................................................... 26
Audience .............................................................................................................................................. 26
About This Manual ................................................................................................................................ 26
Related Documents ............................................................................................................................... 26
Documentation Conventions .................................................................................................................. 27
1 Architectural Overview .......................................................................................... 29
1.1 Product Features .......................................................................................................... 29
1.2 Target Applications ........................................................................................................ 37
1.3 High-Level Block Diagram ............................................................................................. 37
1.4 Functional Overview ...................................................................................................... 39
1.4.1 ARM Cortex™-M3 ......................................................................................................... 39
1.4.2 Motor Control Peripherals .............................................................................................. 40
1.4.3 Analog Peripherals ........................................................................................................ 40
1.4.4 Serial Communications Peripherals ................................................................................ 41
1.4.5 System Peripherals ....................................................................................................... 42
1.4.6 Memory Peripherals ...................................................................................................... 43
1.4.7 Additional Features ....................................................................................................... 44
1.4.8 Hardware Details .......................................................................................................... 44
2 The Cortex-M3 Processor ...................................................................................... 45
2.1 Block Diagram .............................................................................................................. 46
2.2 Overview ...................................................................................................................... 47
2.2.1 System-Level Interface .................................................................................................. 47
2.2.2 Integrated Configurable Debug ...................................................................................... 47
2.2.3 Trace Port Interface Unit (TPIU) ..................................................................................... 48
2.2.4 Cortex-M3 System Component Details ........................................................................... 48
2.3 Programming Model ...................................................................................................... 49
2.3.1 Processor Mode and Privilege Levels for Software Execution ........................................... 49
2.3.2 Stacks .......................................................................................................................... 49
2.3.3 Register Map ................................................................................................................ 50
2.3.4 Register Descriptions .................................................................................................... 51
2.3.5 Exceptions and Interrupts .............................................................................................. 64
2.3.6 Data Types ................................................................................................................... 64
2.4 Memory Model .............................................................................................................. 64
2.4.1 Memory Regions, Types and Attributes ........................................................................... 66
2.4.2 Memory System Ordering of Memory Accesses .............................................................. 66
2.4.3 Behavior of Memory Accesses ....................................................................................... 66
2.4.4 Software Ordering of Memory Accesses ......................................................................... 67
2.4.5 Bit-Banding ................................................................................................................... 68
2.4.6 Data Storage ................................................................................................................ 70
2.4.7 Synchronization Primitives ............................................................................................. 71
2.5 Exception Model ........................................................................................................... 72
2.5.1 Exception States ........................................................................................................... 72
2.5.2 Exception Types ............................................................................................................ 73
2.5.3 Exception Handlers ....................................................................................................... 76
3September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
2.5.4 Vector Table .................................................................................................................. 76
2.5.5 Exception Priorities ....................................................................................................... 77
2.5.6 Interrupt Priority Grouping .............................................................................................. 78
2.5.7 Exception Entry and Return ........................................................................................... 78
2.6 Fault Handling .............................................................................................................. 80
2.6.1 Fault Types ................................................................................................................... 81
2.6.2 Fault Escalation and Hard Faults .................................................................................... 81
2.6.3 Fault Status Registers and Fault Address Registers ........................................................ 82
2.6.4 Lockup ......................................................................................................................... 82
2.7 Power Management ...................................................................................................... 82
2.7.1 Entering Sleep Modes ................................................................................................... 83
2.7.2 Wake Up from Sleep Mode ............................................................................................ 83
2.8 Instruction Set Summary ............................................................................................... 84
3 Cortex-M3 Peripherals ........................................................................................... 87
3.1 Functional Description ................................................................................................... 87
3.1.1 System Timer (SysTick) ................................................................................................. 87
3.1.2 Nested Vectored Interrupt Controller (NVIC) .................................................................... 88
3.1.3 System Control Block (SCB) .......................................................................................... 90
3.1.4 Memory Protection Unit (MPU) ....................................................................................... 90
3.2 Register Map ................................................................................................................ 95
3.3 System Timer (SysTick) Register Descriptions ................................................................ 97
3.4 NVIC Register Descriptions .......................................................................................... 101
3.5 System Control Block (SCB) Register Descriptions ........................................................ 114
3.6 Memory Protection Unit (MPU) Register Descriptions .................................................... 143
4 JTAG Interface ...................................................................................................... 153
4.1 Block Diagram ............................................................................................................ 154
4.2 Functional Description ................................................................................................. 154
4.2.1 JTAG Interface Pins ..................................................................................................... 154
4.2.2 JTAG TAP Controller ................................................................................................... 156
4.2.3 Shift Registers ............................................................................................................ 157
4.2.4 Operational Considerations .......................................................................................... 157
4.3 Initialization and Configuration ..................................................................................... 160
4.4 Register Descriptions .................................................................................................. 160
4.4.1 Instruction Register (IR) ............................................................................................... 160
4.4.2 Data Registers ............................................................................................................ 162
5 System Control ..................................................................................................... 165
5.1 Functional Description ................................................................................................. 165
5.1.1 Device Identification .................................................................................................... 165
5.1.2 Reset Control .............................................................................................................. 165
5.1.3 Power Control ............................................................................................................. 168
5.1.4 Clock Control .............................................................................................................. 169
5.1.5 System Control ........................................................................................................... 175
5.2 Initialization and Configuration ..................................................................................... 176
5.3 Register Map .............................................................................................................. 176
5.4 Register Descriptions .................................................................................................. 178
6 Hibernation Module .............................................................................................. 231
6.1 Block Diagram ............................................................................................................ 232
September 04, 20104
Texas Instruments-Production Data
Table of Contents
6.2 Functional Description ................................................................................................. 232
6.2.1 Register Access Timing ............................................................................................... 232
6.2.2 Clock Source .............................................................................................................. 233
6.2.3 Battery Management ................................................................................................... 234
6.2.4 Real-Time Clock .......................................................................................................... 235
6.2.5 Non-Volatile Memory ................................................................................................... 235
6.2.6 Power Control ............................................................................................................. 235
6.2.7 Initiating Hibernate ...................................................................................................... 236
6.2.8 Interrupts and Status ................................................................................................... 236
6.3 Initialization and Configuration ..................................................................................... 236
6.3.1 Initialization ................................................................................................................. 237
6.3.2 RTC Match Functionality (No Hibernation) .................................................................... 237
6.3.3 RTC Match/Wake-Up from Hibernation ......................................................................... 237
6.3.4 External Wake-Up from Hibernation .............................................................................. 237
6.3.5 RTC/External Wake-Up from Hibernation ...................................................................... 238
6.4 Register Map .............................................................................................................. 238
6.5 Register Descriptions .................................................................................................. 238
7 Internal Memory ................................................................................................... 251
7.1 Block Diagram ............................................................................................................ 251
7.2 Functional Description ................................................................................................. 251
7.2.1 SRAM Memory ............................................................................................................ 251
7.2.2 Flash Memory ............................................................................................................. 252
7.3 Flash Memory Initialization and Configuration ............................................................... 253
7.3.1 Flash Programming ..................................................................................................... 253
7.3.2 Nonvolatile Register Programming ............................................................................... 254
7.4 Register Map .............................................................................................................. 255
7.5 Flash Register Descriptions (Flash Control Offset) ......................................................... 256
7.6 Flash Register Descriptions (System Control Offset) ...................................................... 264
8 General-Purpose Input/Outputs (GPIOs) ........................................................... 277
8.1 Functional Description ................................................................................................. 277
8.1.1 Data Control ............................................................................................................... 278
8.1.2 Interrupt Control .......................................................................................................... 279
8.1.3 Mode Control .............................................................................................................. 280
8.1.4 Commit Control ........................................................................................................... 280
8.1.5 Pad Control ................................................................................................................. 280
8.1.6 Identification ............................................................................................................... 281
8.2 Initialization and Configuration ..................................................................................... 281
8.3 Register Map .............................................................................................................. 282
8.4 Register Descriptions .................................................................................................. 284
9 General-Purpose Timers ...................................................................................... 319
9.1 Block Diagram ............................................................................................................ 320
9.2 Functional Description ................................................................................................. 321
9.2.1 GPTM Reset Conditions .............................................................................................. 321
9.2.2 32-Bit Timer Operating Modes ...................................................................................... 321
9.2.3 16-Bit Timer Operating Modes ...................................................................................... 322
9.3 Initialization and Configuration ..................................................................................... 326
9.3.1 32-Bit One-Shot/Periodic Timer Mode ........................................................................... 326
9.3.2 32-Bit Real-Time Clock (RTC) Mode ............................................................................. 327
5September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
9.3.3 16-Bit One-Shot/Periodic Timer Mode ........................................................................... 327
9.3.4 16-Bit Input Edge Count Mode ..................................................................................... 328
9.3.5 16-Bit Input Edge Timing Mode .................................................................................... 328
9.3.6 16-Bit PWM Mode ....................................................................................................... 329
9.4 Register Map .............................................................................................................. 329
9.5 Register Descriptions .................................................................................................. 330
10 Watchdog Timer ................................................................................................... 355
10.1 Block Diagram ............................................................................................................ 356
10.2 Functional Description ................................................................................................. 356
10.3 Initialization and Configuration ..................................................................................... 357
10.4 Register Map .............................................................................................................. 357
10.5 Register Descriptions .................................................................................................. 358
11 Analog-to-Digital Converter (ADC) ..................................................................... 379
11.1 Block Diagram ............................................................................................................ 379
11.2 Functional Description ................................................................................................. 380
11.2.1 Sample Sequencers .................................................................................................... 380
11.2.2 Module Control ............................................................................................................ 381
11.2.3 Hardware Sample Averaging Circuit ............................................................................. 382
11.2.4 Analog-to-Digital Converter .......................................................................................... 382
11.2.5 Differential Sampling ................................................................................................... 382
11.2.6 Test Modes ................................................................................................................. 384
11.2.7 Internal Temperature Sensor ........................................................................................ 385
11.3 Initialization and Configuration ..................................................................................... 385
11.3.1 Module Initialization ..................................................................................................... 385
11.3.2 Sample Sequencer Configuration ................................................................................. 386
11.4 Register Map .............................................................................................................. 386
11.5 Register Descriptions .................................................................................................. 387
12 Universal Asynchronous Receivers/Transmitters (UARTs) ............................. 416
12.1 Block Diagram ............................................................................................................ 417
12.2 Functional Description ................................................................................................. 417
12.2.1 Transmit/Receive Logic ............................................................................................... 417
12.2.2 Baud-Rate Generation ................................................................................................. 418
12.2.3 Data Transmission ...................................................................................................... 419
12.2.4 Serial IR (SIR) ............................................................................................................. 419
12.2.5 FIFO Operation ........................................................................................................... 420
12.2.6 Interrupts .................................................................................................................... 420
12.2.7 Loopback Operation .................................................................................................... 421
12.2.8 IrDA SIR block ............................................................................................................ 421
12.3 Initialization and Configuration ..................................................................................... 421
12.4 Register Map .............................................................................................................. 422
12.5 Register Descriptions .................................................................................................. 423
13 Synchronous Serial Interface (SSI) .................................................................... 457
13.1 Block Diagram ............................................................................................................ 457
13.2 Functional Description ................................................................................................. 458
13.2.1 Bit Rate Generation ..................................................................................................... 458
13.2.2 FIFO Operation ........................................................................................................... 458
13.2.3 Interrupts .................................................................................................................... 458
September 04, 20106
Texas Instruments-Production Data
Table of Contents
13.2.4 Frame Formats ........................................................................................................... 459
13.3 Initialization and Configuration ..................................................................................... 466
13.4 Register Map .............................................................................................................. 467
13.5 Register Descriptions .................................................................................................. 468
14 Inter-Integrated Circuit (I
2
C) Interface ................................................................ 494
14.1 Block Diagram ............................................................................................................ 495
14.2 Functional Description ................................................................................................. 495
14.2.1 I
2
C Bus Functional Overview ........................................................................................ 495
14.2.2 Available Speed Modes ............................................................................................... 497
14.2.3 Interrupts .................................................................................................................... 498
14.2.4 Loopback Operation .................................................................................................... 499
14.2.5 Command Sequence Flow Charts ................................................................................ 499
14.3 Initialization and Configuration ..................................................................................... 506
14.4 Register Map .............................................................................................................. 507
14.5 Register Descriptions (I
2
C Master) ............................................................................... 508
14.6 Register Descriptions (I
2
C Slave) ................................................................................. 521
15 Analog Comparator .............................................................................................. 530
15.1 Block Diagram ............................................................................................................ 530
15.2 Functional Description ................................................................................................. 530
15.2.1 Internal Reference Programming .................................................................................. 531
15.3 Initialization and Configuration ..................................................................................... 532
15.4 Register Map .............................................................................................................. 532
15.5 Register Descriptions .................................................................................................. 533
16 Pulse Width Modulator (PWM) ............................................................................ 541
16.1 Block Diagram ............................................................................................................ 542
16.2 Functional Description ................................................................................................. 543
16.2.1 PWM Timer ................................................................................................................. 543
16.2.2 PWM Comparators ...................................................................................................... 543
16.2.3 PWM Signal Generator ................................................................................................ 544
16.2.4 Dead-Band Generator ................................................................................................. 545
16.2.5 Interrupt/ADC-Trigger Selector ..................................................................................... 545
16.2.6 Synchronization Methods ............................................................................................ 546
16.2.7 Fault Conditions .......................................................................................................... 546
16.2.8 Output Control Block ................................................................................................... 546
16.3 Initialization and Configuration ..................................................................................... 546
16.4 Register Map .............................................................................................................. 547
16.5 Register Descriptions .................................................................................................. 548
17 Pin Diagram .......................................................................................................... 578
18 Signal Tables ........................................................................................................ 580
18.1 100-Pin LQFP Package Pin Tables ............................................................................... 580
18.2 108-Pin BGA Package Pin Tables ................................................................................ 592
18.3 Connections for Unused Signals ................................................................................... 604
19 Operating Characteristics ................................................................................... 606
20 Electrical Characteristics .................................................................................... 607
20.1 DC Characteristics ...................................................................................................... 607
20.1.1 Maximum Ratings ....................................................................................................... 607
7September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
20.1.2 Recommended DC Operating Conditions ...................................................................... 607
20.1.3 On-Chip Low Drop-Out (LDO) Regulator Characteristics ................................................ 608
20.1.4 GPIO Module Characteristics ....................................................................................... 608
20.1.5 Power Specifications ................................................................................................... 608
20.1.6 Flash Memory Characteristics ...................................................................................... 610
20.1.7 Hibernation ................................................................................................................. 610
20.2 AC Characteristics ....................................................................................................... 610
20.2.1 Load Conditions .......................................................................................................... 610
20.2.2 Clocks ........................................................................................................................ 611
20.2.3 JTAG and Boundary Scan ............................................................................................ 612
20.2.4 Reset ......................................................................................................................... 614
20.2.5 Sleep Modes ............................................................................................................... 616
20.2.6 Hibernation Module ..................................................................................................... 616
20.2.7 General-Purpose I/O (GPIO) ........................................................................................ 617
20.2.8 Analog-to-Digital Converter .......................................................................................... 617
20.2.9 Synchronous Serial Interface (SSI) ............................................................................... 618
20.2.10 Inter-Integrated Circuit (I
2
C) Interface ........................................................................... 620
20.2.11 Analog Comparator ..................................................................................................... 621
A Serial Flash Loader .............................................................................................. 622
A.1 Serial Flash Loader ..................................................................................................... 622
A.2 Interfaces ................................................................................................................... 622
A.2.1 UART ......................................................................................................................... 622
A.2.2 SSI ............................................................................................................................. 622
A.3 Packet Handling .......................................................................................................... 623
A.3.1 Packet Format ............................................................................................................ 623
A.3.2 Sending Packets ......................................................................................................... 623
A.3.3 Receiving Packets ....................................................................................................... 623
A.4 Commands ................................................................................................................. 624
A.4.1 COMMAND_PING (0X20) ............................................................................................ 624
A.4.2 COMMAND_GET_STATUS (0x23) ............................................................................... 624
A.4.3 COMMAND_DOWNLOAD (0x21) ................................................................................. 624
A.4.4 COMMAND_SEND_DATA (0x24) ................................................................................. 625
A.4.5 COMMAND_RUN (0x22) ............................................................................................. 625
A.4.6 COMMAND_RESET (0x25) ......................................................................................... 625
B Register Quick Reference ................................................................................... 627
C Ordering and Contact Information ..................................................................... 647
C.1 Ordering Information .................................................................................................... 647
C.2 Part Markings .............................................................................................................. 647
C.3 Kits ............................................................................................................................. 648
C.4 Support Information ..................................................................................................... 648
D Package Information ............................................................................................ 649
D.1 108-Ball BGA Package ................................................................................................ 649
D.1.1 Package Dimensions ................................................................................................... 649
D.1.2 Tray Dimensions ......................................................................................................... 651
D.1.3 Tape and Reel Dimensions .......................................................................................... 652
D.2 100-Pin LQFP Package ............................................................................................... 653
D.2.1 Package Dimensions ................................................................................................... 653
September 04, 20108
Texas Instruments-Production Data
Table of Contents
D.2.2 Tray Dimensions ......................................................................................................... 655
D.2.3 Tape and Reel Dimensions .......................................................................................... 656
9September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller

List of Figures

Figure 1-1. Stellaris
®
LM3S1133 Microcontroller High-Level Block Diagram ............................. 38
Figure 2-1. CPU Block Diagram ............................................................................................. 47
Figure 2-2. TPIU Block Diagram ............................................................................................ 48
Figure 2-3. Cortex-M3 Register Set ........................................................................................ 50
Figure 2-4. Bit-Band Mapping ................................................................................................ 70
Figure 2-5. Data Storage ....................................................................................................... 71
Figure 2-6. Vector table ......................................................................................................... 77
Figure 2-7. Exception Stack Frame ........................................................................................ 79
Figure 3-1. SRD Use Example ............................................................................................... 93
Figure 4-1. JTAG Module Block Diagram .............................................................................. 154
Figure 4-2. Test Access Port State Machine ......................................................................... 157
Figure 4-3. IDCODE Register Format ................................................................................... 163
Figure 4-4. BYPASS Register Format ................................................................................... 163
Figure 4-5. Boundary Scan Register Format ......................................................................... 164
Figure 5-1. Basic RST Configuration .................................................................................... 166
Figure 5-2. External Circuitry to Extend Power-On Reset ....................................................... 167
Figure 5-3. Reset Circuit Controlled by Switch ...................................................................... 167
Figure 5-4. Power Architecture ............................................................................................ 169
Figure 5-5. Main Clock Tree ................................................................................................ 172
Figure 6-1. Hibernation Module Block Diagram ..................................................................... 232
Figure 6-2. Clock Source Using Crystal ................................................................................ 234
Figure 6-3. Clock Source Using Dedicated Oscillator ............................................................. 234
Figure 7-1. Flash Block Diagram .......................................................................................... 251
Figure 8-1. GPIO Port Block Diagram ................................................................................... 278
Figure 8-2. GPIODATA Write Example ................................................................................. 279
Figure 8-3. GPIODATA Read Example ................................................................................. 279
Figure 9-1. GPTM Module Block Diagram ............................................................................ 320
Figure 9-2. 16-Bit Input Edge Count Mode Example .............................................................. 324
Figure 9-3. 16-Bit Input Edge Time Mode Example ............................................................... 325
Figure 9-4. 16-Bit PWM Mode Example ................................................................................ 326
Figure 10-1. WDT Module Block Diagram .............................................................................. 356
Figure 11-1. ADC Module Block Diagram ............................................................................... 380
Figure 11-2. Differential Sampling Range, V
IN_ODD
= 1.5 V ...................................................... 383
Figure 11-3. Differential Sampling Range, V
IN_ODD
= 0.75 V .................................................... 384
Figure 11-4. Differential Sampling Range, V
IN_ODD
= 2.25 V .................................................... 384
Figure 11-5. Internal Temperature Sensor Characteristic ......................................................... 385
Figure 12-1. UART Module Block Diagram ............................................................................. 417
Figure 12-2. UART Character Frame ..................................................................................... 418
Figure 12-3. IrDA Data Modulation ......................................................................................... 420
Figure 13-1. SSI Module Block Diagram ................................................................................. 457
Figure 13-2. TI Synchronous Serial Frame Format (Single Transfer) ........................................ 460
Figure 13-3. TI Synchronous Serial Frame Format (Continuous Transfer) ................................ 460
Figure 13-4. Freescale SPI Format (Single Transfer) with SPO=0 and SPH=0 .......................... 461
Figure 13-5. Freescale SPI Format (Continuous Transfer) with SPO=0 and SPH=0 .................. 461
Figure 13-6. Freescale SPI Frame Format with SPO=0 and SPH=1 ......................................... 462
September 04, 201010
Texas Instruments-Production Data
Table of Contents
Figure 13-7. Freescale SPI Frame Format (Single Transfer) with SPO=1 and SPH=0 ............... 463
Figure 13-8. Freescale SPI Frame Format (Continuous Transfer) with SPO=1 and SPH=0 ........ 463
Figure 13-9. Freescale SPI Frame Format with SPO=1 and SPH=1 ......................................... 464
Figure 13-10. MICROWIRE Frame Format (Single Frame) ........................................................ 465
Figure 13-11. MICROWIRE Frame Format (Continuous Transfer) ............................................. 466
Figure 13-12. MICROWIRE Frame Format, SSIFss Input Setup and Hold Requirements ............ 466
Figure 14-1. I
2
C Block Diagram ............................................................................................. 495
Figure 14-2. I
2
C Bus Configuration ........................................................................................ 495
Figure 14-3. START and STOP Conditions ............................................................................. 496
Figure 14-4. Complete Data Transfer with a 7-Bit Address ....................................................... 496
Figure 14-5. R/S Bit in First Byte ............................................................................................ 496
Figure 14-6. Data Validity During Bit Transfer on the I
2
C Bus ................................................... 497
Figure 14-7. Master Single SEND .......................................................................................... 500
Figure 14-8. Master Single RECEIVE ..................................................................................... 501
Figure 14-9. Master Burst SEND ........................................................................................... 502
Figure 14-10. Master Burst RECEIVE ...................................................................................... 503
Figure 14-11. Master Burst RECEIVE after Burst SEND ............................................................ 504
Figure 14-12. Master Burst SEND after Burst RECEIVE ............................................................ 505
Figure 14-13. Slave Command Sequence ................................................................................ 506
Figure 15-1. Analog Comparator Module Block Diagram ......................................................... 530
Figure 15-2. Structure of Comparator Unit .............................................................................. 531
Figure 15-3. Comparator Internal Reference Structure ............................................................ 531
Figure 16-1. PWM Unit Diagram ............................................................................................ 542
Figure 16-2. PWM Module Block Diagram .............................................................................. 543
Figure 16-3. PWM Count-Down Mode .................................................................................... 544
Figure 16-4. PWM Count-Up/Down Mode .............................................................................. 544
Figure 16-5. PWM Generation Example In Count-Up/Down Mode ........................................... 545
Figure 16-6. PWM Dead-Band Generator ............................................................................... 545
Figure 17-1. 100-Pin LQFP Package Pin Diagram .................................................................. 578
Figure 17-2. 108-Ball BGA Package Pin Diagram (Top View) ................................................... 579
Figure 20-1. Load Conditions ................................................................................................ 611
Figure 20-2. JTAG Test Clock Input Timing ............................................................................. 613
Figure 20-3. JTAG Test Access Port (TAP) Timing .................................................................. 614
Figure 20-4. JTAG TRST Timing ............................................................................................ 614
Figure 20-5. External Reset Timing (RST) .............................................................................. 615
Figure 20-6. Power-On Reset Timing ..................................................................................... 615
Figure 20-7. Brown-Out Reset Timing .................................................................................... 615
Figure 20-8. Software Reset Timing ....................................................................................... 615
Figure 20-9. Watchdog Reset Timing ..................................................................................... 616
Figure 20-10. Hibernation Module Timing ................................................................................. 617
Figure 20-11. ADC Input Equivalency Diagram ......................................................................... 618
Figure 20-12. SSI Timing for TI Frame Format (FRF=01), Single Transfer Timing
Measurement .................................................................................................... 619
Figure 20-13. SSI Timing for MICROWIRE Frame Format (FRF=10), Single Transfer ................. 619
Figure 20-14. SSI Timing for SPI Frame Format (FRF=00), with SPH=1 ..................................... 620
Figure 20-15. I
2
C Timing ......................................................................................................... 621
Figure D-1. 108-Ball BGA Package Dimensions .................................................................... 649
Figure D-2. 108-Ball BGA Tray Dimensions ........................................................................... 651
11September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
Figure D-3. 108-Ball BGA Tape and Reel Dimensions ............................................................ 652
Figure D-4. 100-Pin LQFP Package Dimensions ................................................................... 653
Figure D-5. 100-Pin LQFP Tray Dimensions .......................................................................... 655
Figure D-6. 100-Pin LQFP Tape and Reel Dimensions ........................................................... 656
September 04, 201012
Texas Instruments-Production Data
Table of Contents

List of Tables

Table 1. Revision History .................................................................................................. 22
Table 2. Documentation Conventions ................................................................................ 27
Table 2-1. Summary of Processor Mode, Privilege Level, and Stack Use ................................ 50
Table 2-2. Processor Register Map ....................................................................................... 51
Table 2-3. PSR Register Combinations ................................................................................. 56
Table 2-4. Memory Map ....................................................................................................... 64
Table 2-5. Memory Access Behavior ..................................................................................... 66
Table 2-6. SRAM Memory Bit-Banding Regions .................................................................... 68
Table 2-7. Peripheral Memory Bit-Banding Regions ............................................................... 69
Table 2-8. Exception Types .................................................................................................. 74
Table 2-9. Interrupts ............................................................................................................ 75
Table 2-10. Exception Return Behavior ................................................................................... 80
Table 2-11. Faults ................................................................................................................. 81
Table 2-12. Fault Status and Fault Address Registers .............................................................. 82
Table 2-13. Cortex-M3 Instruction Summary ........................................................................... 84
Table 3-1. Core Peripheral Register Regions ......................................................................... 87
Table 3-2. Memory Attributes Summary ................................................................................ 90
Table 3-3. TEX, S, C, and B Bit Field Encoding ..................................................................... 93
Table 3-4. Cache Policy for Memory Attribute Encoding ......................................................... 94
Table 3-5. AP Bit Field Encoding .......................................................................................... 94
Table 3-6. Memory Region Attributes for Stellaris
®
Microcontrollers ........................................ 94
Table 3-7. Peripherals Register Map ..................................................................................... 95
Table 3-8. Interrupt Priority Levels ...................................................................................... 121
Table 3-9. Example SIZE Field Values ................................................................................ 150
Table 4-1. JTAG Port Pins Reset State ............................................................................... 155
Table 4-2. JTAG Instruction Register Commands ................................................................. 160
Table 5-1. Clock Source Options ........................................................................................ 170
Table 5-2. Possible System Clock Frequencies Using the SYSDIV Field ............................... 173
Table 5-3. Examples of Possible System Clock Frequencies Using the SYSDIV2 Field .......... 173
Table 5-4. System Control Register Map ............................................................................. 177
Table 5-5. RCC2 Fields that Override RCC fields ................................................................. 192
Table 6-1. Hibernation Module Register Map ....................................................................... 238
Table 7-1. Flash Protection Policy Combinations ................................................................. 252
Table 7-2. User-Programmable Flash Memory Resident Registers ....................................... 254
Table 7-3. Flash Register Map ............................................................................................ 255
Table 8-1. GPIO Pad Configuration Examples ..................................................................... 281
Table 8-2. GPIO Interrupt Configuration Example ................................................................ 281
Table 8-3. GPIO Register Map ........................................................................................... 283
Table 9-1. Available CCP Pins ............................................................................................ 320
Table 9-2. 16-Bit Timer With Prescaler Configurations ......................................................... 323
Table 9-3. Timers Register Map .......................................................................................... 329
Table 10-1. Watchdog Timer Register Map ............................................................................ 357
Table 11-1. Samples and FIFO Depth of Sequencers ............................................................ 380
Table 11-2. Differential Sampling Pairs ................................................................................. 382
Table 11-3. ADC Register Map ............................................................................................. 386
Table 12-1. UART Register Map ........................................................................................... 422
13September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
Table 13-1. SSI Register Map .............................................................................................. 467
Table 14-1. Examples of I
2
C Master Timer Period versus Speed Mode ................................... 498
Table 14-2. Inter-Integrated Circuit (I
2
C) Interface Register Map ............................................. 507
Table 14-3. Write Field Decoding for I2CMCS[3:0] Field (Sheet 1 of 3) .................................... 512
Table 15-1. Internal Reference Voltage and ACREFCTL Field Values ..................................... 532
Table 15-2. Analog Comparators Register Map ..................................................................... 533
Table 16-1. PWM Register Map ............................................................................................ 547
Table 18-1. Signals by Pin Number ....................................................................................... 580
Table 18-2. Signals by Signal Name ..................................................................................... 584
Table 18-3. Signals by Function, Except for GPIO ................................................................. 588
Table 18-4. GPIO Pins and Alternate Functions ..................................................................... 591
Table 18-5. Signals by Pin Number ....................................................................................... 592
Table 18-6. Signals by Signal Name ..................................................................................... 597
Table 18-7. Signals by Function, Except for GPIO ................................................................. 600
Table 18-8. GPIO Pins and Alternate Functions ..................................................................... 603
Table 18-9. Connections for Unused Signals (100-pin LQFP) ................................................. 604
Table 18-10. Connections for Unused Signals, 108-pin BGA .................................................... 605
Table 19-1. Temperature Characteristics ............................................................................... 606
Table 19-2. Thermal Characteristics ..................................................................................... 606
Table 19-3. ESD Absolute Maximum Ratings ........................................................................ 606
Table 20-1. Maximum Ratings .............................................................................................. 607
Table 20-2. Recommended DC Operating Conditions ............................................................ 607
Table 20-3. LDO Regulator Characteristics ........................................................................... 608
Table 20-4. GPIO Module DC Characteristics ........................................................................ 608
Table 20-5. Detailed Power Specifications ............................................................................ 609
Table 20-6. Flash Memory Characteristics ............................................................................ 610
Table 20-7. Hibernation Module DC Characteristics ............................................................... 610
Table 20-8. Phase Locked Loop (PLL) Characteristics ........................................................... 611
Table 20-9. Actual PLL Frequency ........................................................................................ 611
Table 20-10. Clock Characteristics ......................................................................................... 611
Table 20-11. Crystal Characteristics ....................................................................................... 612
Table 20-12. System Clock Characteristics with ADC Operation ............................................... 612
Table 20-13. JTAG Characteristics ......................................................................................... 612
Table 20-14. Reset Characteristics ......................................................................................... 614
Table 20-15. Sleep Modes AC Characteristics ......................................................................... 616
Table 20-16. Hibernation Module AC Characteristics ............................................................... 616
Table 20-17. GPIO Characteristics ......................................................................................... 617
Table 20-18. ADC Characteristics ........................................................................................... 617
Table 20-19. ADC Module Internal Reference Characteristics .................................................. 618
Table 20-20. SSI Characteristics ............................................................................................ 618
Table 20-21. I
2
C Characteristics ............................................................................................. 620
Table 20-22. Analog Comparator Characteristics ..................................................................... 621
Table 20-23. Analog Comparator Voltage Reference Characteristics ........................................ 621
Table C-1. Part Ordering Information ................................................................................... 647
September 04, 201014
Texas Instruments-Production Data
Table of Contents

List of Registers

The Cortex-M3 Processor ............................................................................................................. 45
Register 1: Cortex General-Purpose Register 0 (R0) ........................................................................... 52
Register 2: Cortex General-Purpose Register 1 (R1) ........................................................................... 52
Register 3: Cortex General-Purpose Register 2 (R2) ........................................................................... 52
Register 4: Cortex General-Purpose Register 3 (R3) ........................................................................... 52
Register 5: Cortex General-Purpose Register 4 (R4) ........................................................................... 52
Register 6: Cortex General-Purpose Register 5 (R5) ........................................................................... 52
Register 7: Cortex General-Purpose Register 6 (R6) ........................................................................... 52
Register 8: Cortex General-Purpose Register 7 (R7) ........................................................................... 52
Register 9: Cortex General-Purpose Register 8 (R8) ........................................................................... 52
Register 10: Cortex General-Purpose Register 9 (R9) ........................................................................... 52
Register 11: Cortex General-Purpose Register 10 (R10) ....................................................................... 52
Register 12: Cortex General-Purpose Register 11 (R11) ........................................................................ 52
Register 13: Cortex General-Purpose Register 12 (R12) ....................................................................... 52
Register 14: Stack Pointer (SP) ........................................................................................................... 53
Register 15: Link Register (LR) ............................................................................................................ 54
Register 16: Program Counter (PC) ..................................................................................................... 55
Register 17: Program Status Register (PSR) ........................................................................................ 56
Register 18: Priority Mask Register (PRIMASK) .................................................................................... 60
Register 19: Fault Mask Register (FAULTMASK) .................................................................................. 61
Register 20: Base Priority Mask Register (BASEPRI) ............................................................................ 62
Register 21: Control Register (CONTROL) ........................................................................................... 63
Cortex-M3 Peripherals ................................................................................................................... 87
Register 1: SysTick Control and Status Register (STCTRL), offset 0x010 ............................................. 98
Register 2: SysTick Reload Value Register (STRELOAD), offset 0x014 .............................................. 100
Register 3: SysTick Current Value Register (STCURRENT), offset 0x018 ........................................... 101
Register 4: Interrupt 0-31 Set Enable (EN0), offset 0x100 .................................................................. 102
Register 5: Interrupt 32-43 Set Enable (EN1), offset 0x104 ................................................................ 103
Register 6: Interrupt 0-31 Clear Enable (DIS0), offset 0x180 .............................................................. 104
Register 7: Interrupt 32-43 Clear Enable (DIS1), offset 0x184 ............................................................ 105
Register 8: Interrupt 0-31 Set Pending (PEND0), offset 0x200 ........................................................... 106
Register 9: Interrupt 32-43 Set Pending (PEND1), offset 0x204 ......................................................... 107
Register 10: Interrupt 0-31 Clear Pending (UNPEND0), offset 0x280 ................................................... 108
Register 11: Interrupt 32-43 Clear Pending (UNPEND1), offset 0x284 .................................................. 109
Register 12: Interrupt 0-31 Active Bit (ACTIVE0), offset 0x300 ............................................................. 110
Register 13: Interrupt 32-43 Active Bit (ACTIVE1), offset 0x304 ........................................................... 111
Register 14: Interrupt 0-3 Priority (PRI0), offset 0x400 ......................................................................... 112
Register 15: Interrupt 4-7 Priority (PRI1), offset 0x404 ......................................................................... 112
Register 16: Interrupt 8-11 Priority (PRI2), offset 0x408 ....................................................................... 112
Register 17: Interrupt 12-15 Priority (PRI3), offset 0x40C .................................................................... 112
Register 18: Interrupt 16-19 Priority (PRI4), offset 0x410 ..................................................................... 112
Register 19: Interrupt 20-23 Priority (PRI5), offset 0x414 ..................................................................... 112
Register 20: Interrupt 24-27 Priority (PRI6), offset 0x418 ..................................................................... 112
Register 21: Interrupt 28-31 Priority (PRI7), offset 0x41C .................................................................... 112
Register 22: Interrupt 32-35 Priority (PRI8), offset 0x420 ..................................................................... 112
15September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
Register 23: Interrupt 36-39 Priority (PRI9), offset 0x424 ..................................................................... 112
Register 24: Interrupt 40-43 Priority (PRI10), offset 0x428 ................................................................... 112
Register 25: Software Trigger Interrupt (SWTRIG), offset 0xF00 .......................................................... 114
Register 26: CPU ID Base (CPUID), offset 0xD00 ............................................................................... 115
Register 27: Interrupt Control and State (INTCTRL), offset 0xD04 ........................................................ 116
Register 28: Vector Table Offset (VTABLE), offset 0xD08 .................................................................... 120
Register 29: Application Interrupt and Reset Control (APINT), offset 0xD0C ......................................... 121
Register 30: System Control (SYSCTRL), offset 0xD10 ....................................................................... 123
Register 31: Configuration and Control (CFGCTRL), offset 0xD14 ....................................................... 125
Register 32: System Handler Priority 1 (SYSPRI1), offset 0xD18 ......................................................... 127
Register 33: System Handler Priority 2 (SYSPRI2), offset 0xD1C ........................................................ 128
Register 34: System Handler Priority 3 (SYSPRI3), offset 0xD20 ......................................................... 129
Register 35: System Handler Control and State (SYSHNDCTRL), offset 0xD24 .................................... 130
Register 36: Configurable Fault Status (FAULTSTAT), offset 0xD28 ..................................................... 134
Register 37: Hard Fault Status (HFAULTSTAT), offset 0xD2C .............................................................. 140
Register 38: Memory Management Fault Address (MMADDR), offset 0xD34 ........................................ 142
Register 39: Bus Fault Address (FAULTADDR), offset 0xD38 .............................................................. 143
Register 40: MPU Type (MPUTYPE), offset 0xD90 ............................................................................. 144
Register 41: MPU Control (MPUCTRL), offset 0xD94 .......................................................................... 145
Register 42: MPU Region Number (MPUNUMBER), offset 0xD98 ....................................................... 147
Register 43: MPU Region Base Address (MPUBASE), offset 0xD9C ................................................... 148
Register 44: MPU Region Base Address Alias 1 (MPUBASE1), offset 0xDA4 ....................................... 148
Register 45: MPU Region Base Address Alias 2 (MPUBASE2), offset 0xDAC ...................................... 148
Register 46: MPU Region Base Address Alias 3 (MPUBASE3), offset 0xDB4 ....................................... 148
Register 47: MPU Region Attribute and Size (MPUATTR), offset 0xDA0 ............................................... 150
Register 48: MPU Region Attribute and Size Alias 1 (MPUATTR1), offset 0xDA8 .................................. 150
Register 49: MPU Region Attribute and Size Alias 2 (MPUATTR2), offset 0xDB0 .................................. 150
Register 50: MPU Region Attribute and Size Alias 3 (MPUATTR3), offset 0xDB8 .................................. 150
System Control ............................................................................................................................ 165
Register 1: Device Identification 0 (DID0), offset 0x000 ..................................................................... 179
Register 2: Brown-Out Reset Control (PBORCTL), offset 0x030 ........................................................ 181
Register 3: LDO Power Control (LDOPCTL), offset 0x034 ................................................................. 182
Register 4: Raw Interrupt Status (RIS), offset 0x050 .......................................................................... 183
Register 5: Interrupt Mask Control (IMC), offset 0x054 ...................................................................... 184
Register 6: Masked Interrupt Status and Clear (MISC), offset 0x058 .................................................. 185
Register 7: Reset Cause (RESC), offset 0x05C ................................................................................ 186
Register 8: Run-Mode Clock Configuration (RCC), offset 0x060 ......................................................... 187
Register 9: XTAL to PLL Translation (PLLCFG), offset 0x064 ............................................................. 191
Register 10: Run-Mode Clock Configuration 2 (RCC2), offset 0x070 .................................................... 192
Register 11: Deep Sleep Clock Configuration (DSLPCLKCFG), offset 0x144 ........................................ 194
Register 12: Device Identification 1 (DID1), offset 0x004 ..................................................................... 195
Register 13: Device Capabilities 0 (DC0), offset 0x008 ........................................................................ 197
Register 14: Device Capabilities 1 (DC1), offset 0x010 ........................................................................ 198
Register 15: Device Capabilities 2 (DC2), offset 0x014 ........................................................................ 200
Register 16: Device Capabilities 3 (DC3), offset 0x018 ........................................................................ 202
Register 17: Device Capabilities 4 (DC4), offset 0x01C ....................................................................... 204
Register 18: Run Mode Clock Gating Control Register 0 (RCGC0), offset 0x100 ................................... 206
Register 19: Sleep Mode Clock Gating Control Register 0 (SCGC0), offset 0x110 ................................. 208
September 04, 201016
Texas Instruments-Production Data
Table of Contents
Register 20: Deep Sleep Mode Clock Gating Control Register 0 (DCGC0), offset 0x120 ....................... 210
Register 21: Run Mode Clock Gating Control Register 1 (RCGC1), offset 0x104 ................................... 212
Register 22: Sleep Mode Clock Gating Control Register 1 (SCGC1), offset 0x114 ................................. 215
Register 23: Deep Sleep Mode Clock Gating Control Register 1 (DCGC1), offset 0x124 ....................... 218
Register 24: Run Mode Clock Gating Control Register 2 (RCGC2), offset 0x108 ................................... 221
Register 25: Sleep Mode Clock Gating Control Register 2 (SCGC2), offset 0x118 ................................. 223
Register 26: Deep Sleep Mode Clock Gating Control Register 2 (DCGC2), offset 0x128 ....................... 225
Register 27: Software Reset Control 0 (SRCR0), offset 0x040 ............................................................. 227
Register 28: Software Reset Control 1 (SRCR1), offset 0x044 ............................................................. 228
Register 29: Software Reset Control 2 (SRCR2), offset 0x048 ............................................................. 230
Hibernation Module ..................................................................................................................... 231
Register 1: Hibernation RTC Counter (HIBRTCC), offset 0x000 ......................................................... 239
Register 2: Hibernation RTC Match 0 (HIBRTCM0), offset 0x004 ....................................................... 240
Register 3: Hibernation RTC Match 1 (HIBRTCM1), offset 0x008 ....................................................... 241
Register 4: Hibernation RTC Load (HIBRTCLD), offset 0x00C ........................................................... 242
Register 5: Hibernation Control (HIBCTL), offset 0x010 ..................................................................... 243
Register 6: Hibernation Interrupt Mask (HIBIM), offset 0x014 ............................................................. 245
Register 7: Hibernation Raw Interrupt Status (HIBRIS), offset 0x018 .................................................. 246
Register 8: Hibernation Masked Interrupt Status (HIBMIS), offset 0x01C ............................................ 247
Register 9: Hibernation Interrupt Clear (HIBIC), offset 0x020 ............................................................. 248
Register 10: Hibernation RTC Trim (HIBRTCT), offset 0x024 ............................................................... 249
Register 11: Hibernation Data (HIBDATA), offset 0x030-0x12C ............................................................ 250
Internal Memory ........................................................................................................................... 251
Register 1: Flash Memory Address (FMA), offset 0x000 .................................................................... 257
Register 2: Flash Memory Data (FMD), offset 0x004 ......................................................................... 258
Register 3: Flash Memory Control (FMC), offset 0x008 ..................................................................... 259
Register 4: Flash Controller Raw Interrupt Status (FCRIS), offset 0x00C ............................................ 261
Register 5: Flash Controller Interrupt Mask (FCIM), offset 0x010 ........................................................ 262
Register 6: Flash Controller Masked Interrupt Status and Clear (FCMISC), offset 0x014 ..................... 263
Register 7: USec Reload (USECRL), offset 0x140 ............................................................................ 265
Register 8: Flash Memory Protection Read Enable 0 (FMPRE0), offset 0x130 and 0x200 ................... 266
Register 9: Flash Memory Protection Program Enable 0 (FMPPE0), offset 0x134 and 0x400 ............... 267
Register 10: User Debug (USER_DBG), offset 0x1D0 ......................................................................... 268
Register 11: User Register 0 (USER_REG0), offset 0x1E0 .................................................................. 269
Register 12: User Register 1 (USER_REG1), offset 0x1E4 .................................................................. 270
Register 13: Flash Memory Protection Read Enable 1 (FMPRE1), offset 0x204 .................................... 271
Register 14: Flash Memory Protection Read Enable 2 (FMPRE2), offset 0x208 .................................... 272
Register 15: Flash Memory Protection Read Enable 3 (FMPRE3), offset 0x20C ................................... 273
Register 16: Flash Memory Protection Program Enable 1 (FMPPE1), offset 0x404 ............................... 274
Register 17: Flash Memory Protection Program Enable 2 (FMPPE2), offset 0x408 ............................... 275
Register 18: Flash Memory Protection Program Enable 3 (FMPPE3), offset 0x40C ............................... 276
General-Purpose Input/Outputs (GPIOs) ................................................................................... 277
Register 1: GPIO Data (GPIODATA), offset 0x000 ............................................................................ 285
Register 2: GPIO Direction (GPIODIR), offset 0x400 ......................................................................... 286
Register 3: GPIO Interrupt Sense (GPIOIS), offset 0x404 .................................................................. 287
Register 4: GPIO Interrupt Both Edges (GPIOIBE), offset 0x408 ........................................................ 288
Register 5: GPIO Interrupt Event (GPIOIEV), offset 0x40C ................................................................ 289
Register 6: GPIO Interrupt Mask (GPIOIM), offset 0x410 ................................................................... 290
17September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
Register 7: GPIO Raw Interrupt Status (GPIORIS), offset 0x414 ........................................................ 291
Register 8: GPIO Masked Interrupt Status (GPIOMIS), offset 0x418 ................................................... 292
Register 9: GPIO Interrupt Clear (GPIOICR), offset 0x41C ................................................................ 293
Register 10: GPIO Alternate Function Select (GPIOAFSEL), offset 0x420 ............................................ 294
Register 11: GPIO 2-mA Drive Select (GPIODR2R), offset 0x500 ........................................................ 296
Register 12: GPIO 4-mA Drive Select (GPIODR4R), offset 0x504 ........................................................ 297
Register 13: GPIO 8-mA Drive Select (GPIODR8R), offset 0x508 ........................................................ 298
Register 14: GPIO Open Drain Select (GPIOODR), offset 0x50C ......................................................... 299
Register 15: GPIO Pull-Up Select (GPIOPUR), offset 0x510 ................................................................ 300
Register 16: GPIO Pull-Down Select (GPIOPDR), offset 0x514 ........................................................... 301
Register 17: GPIO Slew Rate Control Select (GPIOSLR), offset 0x518 ................................................ 302
Register 18: GPIO Digital Enable (GPIODEN), offset 0x51C ................................................................ 303
Register 19: GPIO Lock (GPIOLOCK), offset 0x520 ............................................................................ 304
Register 20: GPIO Commit (GPIOCR), offset 0x524 ............................................................................ 305
Register 21: GPIO Peripheral Identification 4 (GPIOPeriphID4), offset 0xFD0 ....................................... 307
Register 22: GPIO Peripheral Identification 5 (GPIOPeriphID5), offset 0xFD4 ....................................... 308
Register 23: GPIO Peripheral Identification 6 (GPIOPeriphID6), offset 0xFD8 ....................................... 309
Register 24: GPIO Peripheral Identification 7 (GPIOPeriphID7), offset 0xFDC ...................................... 310
Register 25: GPIO Peripheral Identification 0 (GPIOPeriphID0), offset 0xFE0 ....................................... 311
Register 26: GPIO Peripheral Identification 1 (GPIOPeriphID1), offset 0xFE4 ....................................... 312
Register 27: GPIO Peripheral Identification 2 (GPIOPeriphID2), offset 0xFE8 ....................................... 313
Register 28: GPIO Peripheral Identification 3 (GPIOPeriphID3), offset 0xFEC ...................................... 314
Register 29: GPIO PrimeCell Identification 0 (GPIOPCellID0), offset 0xFF0 .......................................... 315
Register 30: GPIO PrimeCell Identification 1 (GPIOPCellID1), offset 0xFF4 .......................................... 316
Register 31: GPIO PrimeCell Identification 2 (GPIOPCellID2), offset 0xFF8 .......................................... 317
Register 32: GPIO PrimeCell Identification 3 (GPIOPCellID3), offset 0xFFC ......................................... 318
General-Purpose Timers ............................................................................................................. 319
Register 1: GPTM Configuration (GPTMCFG), offset 0x000 .............................................................. 331
Register 2: GPTM TimerA Mode (GPTMTAMR), offset 0x004 ............................................................ 332
Register 3: GPTM TimerB Mode (GPTMTBMR), offset 0x008 ............................................................ 334
Register 4: GPTM Control (GPTMCTL), offset 0x00C ........................................................................ 336
Register 5: GPTM Interrupt Mask (GPTMIMR), offset 0x018 .............................................................. 339
Register 6: GPTM Raw Interrupt Status (GPTMRIS), offset 0x01C ..................................................... 341
Register 7: GPTM Masked Interrupt Status (GPTMMIS), offset 0x020 ................................................ 342
Register 8: GPTM Interrupt Clear (GPTMICR), offset 0x024 .............................................................. 343
Register 9: GPTM TimerA Interval Load (GPTMTAILR), offset 0x028 ................................................. 345
Register 10: GPTM TimerB Interval Load (GPTMTBILR), offset 0x02C ................................................ 346
Register 11: GPTM TimerA Match (GPTMTAMATCHR), offset 0x030 ................................................... 347
Register 12: GPTM TimerB Match (GPTMTBMATCHR), offset 0x034 .................................................. 348
Register 13: GPTM TimerA Prescale (GPTMTAPR), offset 0x038 ........................................................ 349
Register 14: GPTM TimerB Prescale (GPTMTBPR), offset 0x03C ....................................................... 350
Register 15: GPTM TimerA Prescale Match (GPTMTAPMR), offset 0x040 ........................................... 351
Register 16: GPTM TimerB Prescale Match (GPTMTBPMR), offset 0x044 ........................................... 352
Register 17: GPTM TimerA (GPTMTAR), offset 0x048 ........................................................................ 353
Register 18: GPTM TimerB (GPTMTBR), offset 0x04C ....................................................................... 354
Watchdog Timer ........................................................................................................................... 355
Register 1: Watchdog Load (WDTLOAD), offset 0x000 ...................................................................... 359
Register 2: Watchdog Value (WDTVALUE), offset 0x004 ................................................................... 360
September 04, 201018
Texas Instruments-Production Data
Table of Contents
Register 3: Watchdog Control (WDTCTL), offset 0x008 ..................................................................... 361
Register 4: Watchdog Interrupt Clear (WDTICR), offset 0x00C .......................................................... 362
Register 5: Watchdog Raw Interrupt Status (WDTRIS), offset 0x010 .................................................. 363
Register 6: Watchdog Masked Interrupt Status (WDTMIS), offset 0x014 ............................................. 364
Register 7: Watchdog Test (WDTTEST), offset 0x418 ....................................................................... 365
Register 8: Watchdog Lock (WDTLOCK), offset 0xC00 ..................................................................... 366
Register 9: Watchdog Peripheral Identification 4 (WDTPeriphID4), offset 0xFD0 ................................. 367
Register 10: Watchdog Peripheral Identification 5 (WDTPeriphID5), offset 0xFD4 ................................. 368
Register 11: Watchdog Peripheral Identification 6 (WDTPeriphID6), offset 0xFD8 ................................. 369
Register 12: Watchdog Peripheral Identification 7 (WDTPeriphID7), offset 0xFDC ................................ 370
Register 13: Watchdog Peripheral Identification 0 (WDTPeriphID0), offset 0xFE0 ................................. 371
Register 14: Watchdog Peripheral Identification 1 (WDTPeriphID1), offset 0xFE4 ................................. 372
Register 15: Watchdog Peripheral Identification 2 (WDTPeriphID2), offset 0xFE8 ................................. 373
Register 16: Watchdog Peripheral Identification 3 (WDTPeriphID3), offset 0xFEC ................................. 374
Register 17: Watchdog PrimeCell Identification 0 (WDTPCellID0), offset 0xFF0 .................................... 375
Register 18: Watchdog PrimeCell Identification 1 (WDTPCellID1), offset 0xFF4 .................................... 376
Register 19: Watchdog PrimeCell Identification 2 (WDTPCellID2), offset 0xFF8 .................................... 377
Register 20: Watchdog PrimeCell Identification 3 (WDTPCellID3 ), offset 0xFFC .................................. 378
Analog-to-Digital Converter (ADC) ............................................................................................. 379
Register 1: ADC Active Sample Sequencer (ADCACTSS), offset 0x000 ............................................. 388
Register 2: ADC Raw Interrupt Status (ADCRIS), offset 0x004 ........................................................... 389
Register 3: ADC Interrupt Mask (ADCIM), offset 0x008 ..................................................................... 390
Register 4: ADC Interrupt Status and Clear (ADCISC), offset 0x00C .................................................. 391
Register 5: ADC Overflow Status (ADCOSTAT), offset 0x010 ............................................................ 393
Register 6: ADC Event Multiplexer Select (ADCEMUX), offset 0x014 ................................................. 394
Register 7: ADC Underflow Status (ADCUSTAT), offset 0x018 ........................................................... 398
Register 8: ADC Sample Sequencer Priority (ADCSSPRI), offset 0x020 ............................................. 399
Register 9: ADC Processor Sample Sequence Initiate (ADCPSSI), offset 0x028 ................................. 401
Register 10: ADC Sample Averaging Control (ADCSAC), offset 0x030 ................................................. 402
Register 11: ADC Sample Sequence Input Multiplexer Select 0 (ADCSSMUX0), offset 0x040 ............... 403
Register 12: ADC Sample Sequence Control 0 (ADCSSCTL0), offset 0x044 ........................................ 405
Register 13: ADC Sample Sequence Result FIFO 0 (ADCSSFIFO0), offset 0x048 ................................ 408
Register 14: ADC Sample Sequence Result FIFO 1 (ADCSSFIFO1), offset 0x068 ................................ 408
Register 15: ADC Sample Sequence Result FIFO 2 (ADCSSFIFO2), offset 0x088 ................................ 408
Register 16: ADC Sample Sequence Result FIFO 3 (ADCSSFIFO3), offset 0x0A8 ............................... 408
Register 17: ADC Sample Sequence FIFO 0 Status (ADCSSFSTAT0), offset 0x04C ............................. 409
Register 18: ADC Sample Sequence FIFO 1 Status (ADCSSFSTAT1), offset 0x06C ............................. 409
Register 19: ADC Sample Sequence FIFO 2 Status (ADCSSFSTAT2), offset 0x08C ............................ 409
Register 20: ADC Sample Sequence FIFO 3 Status (ADCSSFSTAT3), offset 0x0AC ............................ 409
Register 21: ADC Sample Sequence Input Multiplexer Select 1 (ADCSSMUX1), offset 0x060 ............... 410
Register 22: ADC Sample Sequence Input Multiplexer Select 2 (ADCSSMUX2), offset 0x080 ............... 410
Register 23: ADC Sample Sequence Control 1 (ADCSSCTL1), offset 0x064 ........................................ 411
Register 24: ADC Sample Sequence Control 2 (ADCSSCTL2), offset 0x084 ........................................ 411
Register 25: ADC Sample Sequence Input Multiplexer Select 3 (ADCSSMUX3), offset 0x0A0 ............... 413
Register 26: ADC Sample Sequence Control 3 (ADCSSCTL3), offset 0x0A4 ........................................ 414
Register 27: ADC Test Mode Loopback (ADCTMLB), offset 0x100 ....................................................... 415
Universal Asynchronous Receivers/Transmitters (UARTs) ..................................................... 416
Register 1: UART Data (UARTDR), offset 0x000 ............................................................................... 424
19September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
Register 2: UART Receive Status/Error Clear (UARTRSR/UARTECR), offset 0x004 ........................... 426
Register 3: UART Flag (UARTFR), offset 0x018 ................................................................................ 428
Register 4: UART IrDA Low-Power Register (UARTILPR), offset 0x020 ............................................. 430
Register 5: UART Integer Baud-Rate Divisor (UARTIBRD), offset 0x024 ............................................ 431
Register 6: UART Fractional Baud-Rate Divisor (UARTFBRD), offset 0x028 ....................................... 432
Register 7: UART Line Control (UARTLCRH), offset 0x02C ............................................................... 433
Register 8: UART Control (UARTCTL), offset 0x030 ......................................................................... 435
Register 9: UART Interrupt FIFO Level Select (UARTIFLS), offset 0x034 ........................................... 437
Register 10: UART Interrupt Mask (UARTIM), offset 0x038 ................................................................. 439
Register 11: UART Raw Interrupt Status (UARTRIS), offset 0x03C ...................................................... 441
Register 12: UART Masked Interrupt Status (UARTMIS), offset 0x040 ................................................. 442
Register 13: UART Interrupt Clear (UARTICR), offset 0x044 ............................................................... 443
Register 14: UART Peripheral Identification 4 (UARTPeriphID4), offset 0xFD0 ..................................... 445
Register 15: UART Peripheral Identification 5 (UARTPeriphID5), offset 0xFD4 ..................................... 446
Register 16: UART Peripheral Identification 6 (UARTPeriphID6), offset 0xFD8 ..................................... 447
Register 17: UART Peripheral Identification 7 (UARTPeriphID7), offset 0xFDC ..................................... 448
Register 18: UART Peripheral Identification 0 (UARTPeriphID0), offset 0xFE0 ...................................... 449
Register 19: UART Peripheral Identification 1 (UARTPeriphID1), offset 0xFE4 ...................................... 450
Register 20: UART Peripheral Identification 2 (UARTPeriphID2), offset 0xFE8 ...................................... 451
Register 21: UART Peripheral Identification 3 (UARTPeriphID3), offset 0xFEC ..................................... 452
Register 22: UART PrimeCell Identification 0 (UARTPCellID0), offset 0xFF0 ........................................ 453
Register 23: UART PrimeCell Identification 1 (UARTPCellID1), offset 0xFF4 ........................................ 454
Register 24: UART PrimeCell Identification 2 (UARTPCellID2), offset 0xFF8 ........................................ 455
Register 25: UART PrimeCell Identification 3 (UARTPCellID3), offset 0xFFC ........................................ 456
Synchronous Serial Interface (SSI) ............................................................................................ 457
Register 1: SSI Control 0 (SSICR0), offset 0x000 .............................................................................. 469
Register 2: SSI Control 1 (SSICR1), offset 0x004 .............................................................................. 471
Register 3: SSI Data (SSIDR), offset 0x008 ...................................................................................... 473
Register 4: SSI Status (SSISR), offset 0x00C ................................................................................... 474
Register 5: SSI Clock Prescale (SSICPSR), offset 0x010 .................................................................. 476
Register 6: SSI Interrupt Mask (SSIIM), offset 0x014 ......................................................................... 477
Register 7: SSI Raw Interrupt Status (SSIRIS), offset 0x018 .............................................................. 479
Register 8: SSI Masked Interrupt Status (SSIMIS), offset 0x01C ........................................................ 480
Register 9: SSI Interrupt Clear (SSIICR), offset 0x020 ....................................................................... 481
Register 10: SSI Peripheral Identification 4 (SSIPeriphID4), offset 0xFD0 ............................................. 482
Register 11: SSI Peripheral Identification 5 (SSIPeriphID5), offset 0xFD4 ............................................. 483
Register 12: SSI Peripheral Identification 6 (SSIPeriphID6), offset 0xFD8 ............................................. 484
Register 13: SSI Peripheral Identification 7 (SSIPeriphID7), offset 0xFDC ............................................ 485
Register 14: SSI Peripheral Identification 0 (SSIPeriphID0), offset 0xFE0 ............................................. 486
Register 15: SSI Peripheral Identification 1 (SSIPeriphID1), offset 0xFE4 ............................................. 487
Register 16: SSI Peripheral Identification 2 (SSIPeriphID2), offset 0xFE8 ............................................. 488
Register 17: SSI Peripheral Identification 3 (SSIPeriphID3), offset 0xFEC ............................................ 489
Register 18: SSI PrimeCell Identification 0 (SSIPCellID0), offset 0xFF0 ............................................... 490
Register 19: SSI PrimeCell Identification 1 (SSIPCellID1), offset 0xFF4 ............................................... 491
Register 20: SSI PrimeCell Identification 2 (SSIPCellID2), offset 0xFF8 ............................................... 492
Register 21: SSI PrimeCell Identification 3 (SSIPCellID3), offset 0xFFC ............................................... 493
Inter-Integrated Circuit (I
2
C) Interface ........................................................................................ 494
Register 1: I
2
C Master Slave Address (I2CMSA), offset 0x000 ........................................................... 509
September 04, 201020
Texas Instruments-Production Data
Table of Contents
Register 2: I
2
C Master Control/Status (I2CMCS), offset 0x004 ........................................................... 510
Register 3: I
2
C Master Data (I2CMDR), offset 0x008 ......................................................................... 514
Register 4: I
2
C Master Timer Period (I2CMTPR), offset 0x00C ........................................................... 515
Register 5: I
2
C Master Interrupt Mask (I2CMIMR), offset 0x010 ......................................................... 516
Register 6: I
2
C Master Raw Interrupt Status (I2CMRIS), offset 0x014 ................................................. 517
Register 7: I
2
C Master Masked Interrupt Status (I2CMMIS), offset 0x018 ........................................... 518
Register 8: I
2
C Master Interrupt Clear (I2CMICR), offset 0x01C ......................................................... 519
Register 9: I
2
C Master Configuration (I2CMCR), offset 0x020 ............................................................ 520
Register 10: I
2
C Slave Own Address (I2CSOAR), offset 0x000 ............................................................ 522
Register 11: I
2
C Slave Control/Status (I2CSCSR), offset 0x004 ........................................................... 523
Register 12: I
2
C Slave Data (I2CSDR), offset 0x008 ........................................................................... 525
Register 13: I
2
C Slave Interrupt Mask (I2CSIMR), offset 0x00C ........................................................... 526
Register 14: I
2
C Slave Raw Interrupt Status (I2CSRIS), offset 0x010 ................................................... 527
Register 15: I
2
C Slave Masked Interrupt Status (I2CSMIS), offset 0x014 .............................................. 528
Register 16: I
2
C Slave Interrupt Clear (I2CSICR), offset 0x018 ............................................................ 529
Analog Comparator ..................................................................................................................... 530
Register 1: Analog Comparator Masked Interrupt Status (ACMIS), offset 0x000 .................................. 534
Register 2: Analog Comparator Raw Interrupt Status (ACRIS), offset 0x004 ....................................... 535
Register 3: Analog Comparator Interrupt Enable (ACINTEN), offset 0x008 ......................................... 536
Register 4: Analog Comparator Reference Voltage Control (ACREFCTL), offset 0x010 ....................... 537
Register 5: Analog Comparator Status 0 (ACSTAT0), offset 0x020 ..................................................... 538
Register 6: Analog Comparator Control 0 (ACCTL0), offset 0x024 ..................................................... 539
Pulse Width Modulator (PWM) .................................................................................................... 541
Register 1: PWM Master Control (PWMCTL), offset 0x000 ................................................................ 549
Register 2: PWM Time Base Sync (PWMSYNC), offset 0x004 ........................................................... 550
Register 3: PWM Output Enable (PWMENABLE), offset 0x008 .......................................................... 551
Register 4: PWM Output Inversion (PWMINVERT), offset 0x00C ....................................................... 552
Register 5: PWM Output Fault (PWMFAULT), offset 0x010 ................................................................ 553
Register 6: PWM Interrupt Enable (PWMINTEN), offset 0x014 ........................................................... 554
Register 7: PWM Raw Interrupt Status (PWMRIS), offset 0x018 ........................................................ 555
Register 8: PWM Interrupt Status and Clear (PWMISC), offset 0x01C ................................................ 556
Register 9: PWM Status (PWMSTATUS), offset 0x020 ...................................................................... 557
Register 10: PWM0 Control (PWM0CTL), offset 0x040 ....................................................................... 558
Register 11: PWM0 Interrupt and Trigger Enable (PWM0INTEN), offset 0x044 .................................... 560
Register 12: PWM0 Raw Interrupt Status (PWM0RIS), offset 0x048 .................................................... 563
Register 13: PWM0 Interrupt Status and Clear (PWM0ISC), offset 0x04C ........................................... 564
Register 14: PWM0 Load (PWM0LOAD), offset 0x050 ....................................................................... 565
Register 15: PWM0 Counter (PWM0COUNT), offset 0x054 ................................................................ 566
Register 16: PWM0 Compare A (PWM0CMPA), offset 0x058 ............................................................. 567
Register 17: PWM0 Compare B (PWM0CMPB), offset 0x05C ............................................................. 568
Register 18: PWM0 Generator A Control (PWM0GENA), offset 0x060 ................................................ 569
Register 19: PWM0 Generator B Control (PWM0GENB), offset 0x064 ................................................ 572
Register 20: PWM0 Dead-Band Control (PWM0DBCTL), offset 0x068 ................................................ 575
Register 21: PWM0 Dead-Band Rising-Edge Delay (PWM0DBRISE), offset 0x06C ............................. 576
Register 22: PWM0 Dead-Band Falling-Edge-Delay (PWM0DBFALL), offset 0x070 ............................. 577
21September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller

Revision History

The revision history table notes changes made between the indicated revisions of the LM3S1133
data sheet.
Table 1. Revision History
DescriptionRevisionDate
Reorganized ARM Cortex-M3 Processor Core, Memory Map and Interrupts chapters, creating two
new chapters, The Cortex-M3 Processor and Cortex-M3 Peripherals. Much additional content was
added, including all the Cortex-M3 registers.
Changed register names to be consistent with StellarisWare
®
names: the Cortex-M3 Interrupt
Control and Status (ICSR) register to the Interrupt Control and State (INTCTRL) register, and
the Cortex-M3 Interrupt Set Enable (SETNA) register to the Interrupt 0-31 Set Enable (EN0)
register.
Added clarification of instruction execution during Flash operations.
Modified Figure 8-1 on page 278 to clarify operation of the GPIO inputs when used as an alternate
function.
Corrected GPIOAMSEL bit field in GPIO Analog Mode Select (GPIOAMSEL) register to be eight-bits
wide, bits[7:0].
Added caution not to apply a Low value to PB7 when debugging; a Low value on the pin causes
the JTAG controller to be reset, resulting in a loss of JTAG communication.
In General-Purpose Timers chapter, clarified operation of the 32-bit RTC mode.
In Electrical Characteristics chapter:
Added I
LKG
parameter (GPIO input leakage current) to Table 20-4 on page 608.
Corrected values for t
CLKRF
parameter (SSIClk rise/fall time) in Table 20-20 on page 618.
Added dimensions for Tray and Tape and Reel shipping mediums.
7787September 2010
Corrected base address for SRAM in architectural overview chapter.
Clarified system clock operation, adding content to “Clock Control” on page 169.
In Signal Tables chapter, added table "Connections for Unused Signals."
In "Thermal Characteristics" table, corrected thermal resistance value from 34 to 32.
In "Reset Characteristics" table, corrected value for supply voltage (VDD) rise time.
Additional minor data sheet clarifications and corrections.
7393June 2010
Added caution note to the I
2
C Master Timer Period (I2CMTPR) register description and changed
field width to 7 bits.
Removed erroneous text about restoring the Flash Protection registers.
Added note about RST signal routing.
Clarified the function of the TnSTALL bit in the GPTMCTL register.
Additional minor data sheet clarifications and corrections.
7007April 2010
September 04, 201022
Texas Instruments-Production Data
Revision History
Table 1. Revision History (continued)
DescriptionRevisionDate
In "System Control" section, clarified Debug Access Port operation after Sleep modes.
Clarified wording on Flash memory access errors.
Added section on Flash interrupts.
Changed the reset value of the ADC Sample Sequence Result FIFO n (ADCSSFIFOn) registers
to be indeterminate.
Clarified operation of SSI transmit FIFO.
Made these changes to the Operating Characteristics chapter:
Added storage temperature ratings to "Temperature Characteristics" table
Added "ESD Absolute Maximum Ratings" table
Made these changes to the Electrical Characteristics chapter:
In "Flash Memory Characteristics" table, corrected Mass erase time
Added sleep and deep-sleep wake-up times ("Sleep Modes AC Characteristics" table)
In "Reset Characteristics" table, corrected units for supply voltage (VDD) rise time
6712January 2010
Deleted MAXADCSPD bit field from DCGC0 register as it is not applicable in Deep-Sleep mode.
Removed erroneous reference to the WRC bit in the Hibernation chapter.
Deleted reset value for 16-bit mode from GPTMTAILR, GPTMTAMATCHR, and GPTMTAR registers
because the module resets in 32-bit mode.
Clarified PWM source for ADC triggering.
Made these changes to the Electrical Characteristics chapter:
Removed V
SIH
and V
SIL
parameters from Operating Conditions table.
Added table showing actual PLL frequency depending on input crystal.
Changed the name of the t
HIB_REG_WRITE
parameter to t
HIB_REG_ACCESS
.
Revised ADC electrical specifications to clarify, including reorganizing and adding new data.
Changed SSI set up and hold times to be expressed in system clocks, not ns.
6462October 2009
Corrected ordering numbers.5920July 2009
Clarified Power-on reset and RST pin operation; added new diagrams.
Corrected the reset value of the Hibernation Data (HIBDATA) and Hibernation Control (HIBCTL)
registers.
Clarified explanation of nonvolatile register programming in Internal Memory chapter.
Added explanation of reset value to FMPRE0/1/2/3, FMPPE0/1/2/3, USER_DBG, and USER_REG0/1
registers.
Changed buffer type for WAKE pin to TTL and HIB pin to OD.
In ADC characteristics table, changed Max value for GAIN parameter from ±1 to ±3 and added E
IR
(Internal voltage reference error) parameter.
Additional minor data sheet clarifications and corrections.
5902July 2009
23September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
Table 1. Revision History (continued)
DescriptionRevisionDate
Added JTAG/SWD clarification (see “Communication with JTAG/SWD” on page 159).
Added clarification that the PLL operates at 400 MHz, but is divided by two prior to the application
of the output divisor.
Added "GPIO Module DC Characteristics" table (see Table 20-4 on page 608).
Additional minor data sheet clarifications and corrections.
5367April 2009
Corrected bit type for RELOAD bit field in SysTick Reload Value register; changed to R/W.
Clarification added as to what happens when the SSI in slave mode is required to transmit but there
is no data in the TX FIFO.
Additional minor data sheet clarifications and corrections.
4660January 2009
Revised High-Level Block Diagram.
Additional minor data sheet clarifications and corrections were made.
4283November 2008
Corrected values for DSOSCSRC bit field in Deep Sleep Clock Configuration (DSLPCLKCFG)
register.
The FMA value for the FMPRE3 register was incorrect in the Flash Resident Registers table in the
Internal Memory chapter. The correct value is 0x0000.0006.
Incorrect Comparator Operating Modes tables were removed from the Analog Comparators chapter.
4149October 2008
Added note on clearing interrupts to Interrupts chapter.
Added Power Architecture diagram to System Control chapter.
Additional minor data sheet clarifications and corrections.
3447August 2008
Additional minor data sheet clarifications and corrections.3108July 2008
The 108-Ball BGA pin diagram and pin tables had an error. The following signals were erroneously
indicated as available and have now been changed to a No Connect (NC):
Ball C1: Changed PE7 to NC
Ball C2: Changed PE6 to NC
As noted in the PCN, the option to provide VDD25 power from external sources was removed. Use
the LDO output as the source of VDD25 input.
Additional minor data sheet clarifications and corrections.
2972May 2008
2881April 2008 The Θ
JA
value was changed from 55.3 to 34 in the "Thermal Characteristics" table in the Operating
Characteristics chapter.
Bit 31 of the DC3 register was incorrectly described in prior versions of the data sheet. A reset of
1 indicates that an even CCP pin is present and can be used as a 32-KHz input clock.
Values for I
DD_HIBERNATE
were added to the "Detailed Power Specifications" table in the "Electrical
Characteristics" chapter.
The "Hibernation Module DC Electricals" table was added to the "Electrical Characteristics" chapter.
The T
VDDRISE
parameter in the "Reset Characteristics" table in the "Electrical Characteristics" chapter
was changed from a max of 100 to 250.
September 04, 201024
Texas Instruments-Production Data
Revision History
Table 1. Revision History (continued)
DescriptionRevisionDate
The maximum value on Core supply voltage (V
DD25
) in the "Maximum Ratings" table in the "Electrical
Characteristics" chapter was changed from 4 to 3.
The operational frequency of the internal 30-kHz oscillator clock source is 30 kHz ± 50% (prior data
sheets incorrectly noted it as 30 kHz ± 30%).
A value of 0x3 in bits 5:4 of the MISC register (OSCSRC) indicates the 30-KHz internal oscillator is
the input source for the oscillator. Prior data sheets incorrectly noted 0x3 as a reserved value.
The reset for bits 6:4 of the RCC2 register (OSCSRC2) is 0x1 (IOSC). Prior data sheets incorrectly
noted the reset was 0x0 (MOSC).
Two figures on clock source were added to the "Hibernation Module":
Clock Source Using Crystal
Clock Source Using Dedicated Oscillator
The following notes on battery management were added to the "Hibernation Module" chapter:
Battery voltage is not measured while in Hibernate mode.
System level factors may affect the accuracy of the low battery detect circuit. The designer
should consider battery type, discharge characteristics, and a test load during battery voltage
measurements.
A note on high-current applications was added to the GPIO chapter:
For special high-current applications, the GPIO output buffers may be used with the following
restrictions. With the GPIO pins configured as 8-mA output drivers, a total of four GPIO outputs may
be used to sink current loads up to 18 mA each. At 18-mA sink current loading, the VOL value is
specified as 1.2 V. The high-current GPIO package pins must be selected such that there are only
a maximum of two per side of the physical package or BGA pin group with the total number of
high-current GPIO outputs not exceeding four for the entire package.
A note on Schmitt inputs was added to the GPIO chapter:
Pins configured as digital inputs are Schmitt-triggered.
The Buffer type on the WAKE pin changed from OD to - in the Signal Tables.
The "Differential Sampling Range" figures in the ADC chapter were clarified.
The last revision of the data sheet (revision 2550) introduced two errors that have now been corrected:
The LQFP pin diagrams and pin tables were missing the comparator positive and negative input
pins.
The base address was listed incorrectly in the FMPRE0 and FMPPE0 register bit diagrams.
Additional minor data sheet clarifications and corrections.
Started tracking revision history.2550March 2008
25September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller

About This Document

This data sheet provides reference information for the LM3S1133 microcontroller, describing the
functional blocks of the system-on-chip (SoC) device designed around the ARM® Cortex™-M3
core.

Audience

This manual is intended for system software developers, hardware designers, and application
developers.

About This Manual

This document is organized into sections that correspond to each major feature.

Related Documents

The following related documents are available on the Stellaris
®
web site at www.ti.com/stellaris:
Stellaris® Errata
ARM® Cortex™-M3 Errata
Cortex™-M3 Instruction Set Technical User's Manual
Stellaris® Graphics Library User's Guide
Stellaris® Peripheral Driver Library User's Guide
The following related documents are also referenced:
ARM® Debug Interface V5 Architecture Specification
IEEE Standard 1149.1-Test Access Port and Boundary-Scan Architecture
This documentation list was current as of publication date. Please check the web site for additional
documentation, including application notes and white papers.
September 04, 201026
Texas Instruments-Production Data
About This Document

Documentation Conventions

This document uses the conventions shown in Table 2 on page 27.
Table 2. Documentation Conventions
MeaningNotation
General Register Notation
APB registers are indicated in uppercase bold. For example, PBORCTL is the Power-On and
Brown-Out Reset Control register. If a register name contains a lowercase n, it represents more
than one register. For example, SRCRn represents any (or all) of the three Software Reset Control
registers: SRCR0, SRCR1 , and SRCR2.
REGISTER
A single bit in a register.bit
Two or more consecutive and related bits.bit field
A hexadecimal increment to a register's address, relative to that module's base address as specified
in Table 2-4 on page 64.
offset 0xnnn
Registers are numbered consecutively throughout the document to aid in referencing them. The
register number has no meaning to software.
Register N
Register bits marked reserved are reserved for future use. In most cases, reserved bits are set to
0; however, user software should not rely on the value of a reserved bit. To provide software
compatibility with future products, the value of a reserved bit should be preserved across a
read-modify-write operation.
reserved
The range of register bits inclusive from xx to yy. For example, 31:15 means bits 15 through 31 in
that register.
yy:xx
This value in the register bit diagram indicates whether software running on the controller can
change the value of the bit field.
Register Bit/Field
Types
Software can read this field. The bit or field is cleared by hardware after reading the bit/field.RC
Software can read this field. Always write the chip reset value.RO
Software can read or write this field.R/W
Software can read or write this field. Writing to it with any value clears the register.R/WC
Software can read or write this field. A write of a 0 to a W1C bit does not affect the bit value in the
register. A write of a 1 clears the value of the bit in the register; the remaining bits remain unchanged.
This register type is primarily used for clearing interrupt status bits where the read operation
provides the interrupt status and the write of the read value clears only the interrupts being reported
at the time the register was read.
R/W1C
Software can read or write a 1 to this field. A write of a 0 to a R/W1S bit does not affect the bit
value in the register.
R/W1S
Software can write this field. A write of a 0 to a W1C bit does not affect the bit value in the register.
A write of a 1 clears the value of the bit in the register; the remaining bits remain unchanged. A
read of the register returns no meaningful data.
This register is typically used to clear the corresponding bit in an interrupt register.
W1C
Only a write by software is valid; a read of the register returns no meaningful data.WO
This value in the register bit diagram shows the bit/field value after any reset, unless noted.Register Bit/Field
Reset Value
Bit cleared to 0 on chip reset.0
Bit set to 1 on chip reset.1
Nondeterministic.-
Pin/Signal Notation
Pin alternate function; a pin defaults to the signal without the brackets.[ ]
Refers to the physical connection on the package.pin
27September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
Table 2. Documentation Conventions (continued)
MeaningNotation
Refers to the electrical signal encoding of a pin.signal
Change the value of the signal from the logically False state to the logically True state. For active
High signals, the asserted signal value is 1 (High); for active Low signals, the asserted signal value
is 0 (Low). The active polarity (High or Low) is defined by the signal name (see SIGNAL and SIGNAL
below).
assert a signal
Change the value of the signal from the logically True state to the logically False state.deassert a signal
Signal names are in uppercase and in the Courier font. An overbar on a signal name indicates that
it is active Low. To assert SIGNAL is to drive it Low; to deassert SIGNAL is to drive it High.
SIGNAL
Signal names are in uppercase and in the Courier font. An active High signal has no overbar. To
assert SIGNAL is to drive it High; to deassert SIGNAL is to drive it Low.
SIGNAL
Numbers
An uppercase X indicates any of several values is allowed, where X can be any legal pattern. For
example, a binary value of 0X00 can be either 0100 or 0000, a hex value of 0xX is 0x0 or 0x1, and
so on.
X
Hexadecimal numbers have a prefix of 0x. For example, 0x00FF is the hexadecimal number FF.
All other numbers within register tables are assumed to be binary. Within conceptual information,
binary numbers are indicated with a b suffix, for example, 1011b, and decimal numbers are written
without a prefix or suffix.
0x
September 04, 201028
Texas Instruments-Production Data
About This Document

1 Architectural Overview

The Stellaris
®
family of microcontrollers—the first ARM® Cortex™-M3 based controllers—brings
high-performance 32-bit computing to cost-sensitive embedded microcontroller applications. These
pioneering parts deliver customers 32-bit performance at a cost equivalent to legacy 8- and 16-bit
devices, all in a package with a small footprint.
The Stellaris
®
family offers efficient performance and extensive integration, favorably positioning
the device into cost-conscious applications requiring significant control-processing and connectivity
capabilities. The Stellaris
®
LM3S1000 series extends the Stellaris
®
family with larger on-chip
memories, enhanced power management, and expanded I/O and control capabilities.
The LM3S1133 microcontroller is targeted for industrial applications, including remote monitoring,
electronic point-of-sale machines, test and measurement equipment, network appliances and
switches, factory automation, HVAC and building control, gaming equipment, motion control, medical
instrumentation, and fire and security.
For applications requiring extreme conservation of power, the LM3S1133 microcontroller features
a battery-backed Hibernation module to efficiently power down the LM3S1133 to a low-power state
during extended periods of inactivity. With a power-up/power-down sequencer, a continuous time
counter (RTC), a pair of match registers, an APB interface to the system bus, and dedicated
non-volatile memory, the Hibernation module positions the LM3S1133 microcontroller perfectly for
battery applications.
In addition, the LM3S1133 microcontroller offers the advantages of ARM's widely available
development tools, System-on-Chip (SoC) infrastructure IP applications, and a large user community.
Additionally, the microcontroller uses ARM's Thumb®-compatible Thumb-2 instruction set to reduce
memory requirements and, thereby, cost. Finally, the LM3S1133 microcontroller is code-compatible
to all members of the extensive Stellaris
®
family; providing flexibility to fit our customers' precise
needs.
Texas Instruments offers a complete solution to get to market quickly, with evaluation and
development boards, white papers and application notes, an easy-to-use peripheral driver library,
and a strong support, sales, and distributor network. See “Ordering and Contact
Information” on page 647 for ordering information for Stellaris
®
family devices.

1.1 Product Features

The LM3S1133 microcontroller includes the following product features:
32-Bit RISC Performance
32-bit ARM® Cortex™-M3 v7M architecture optimized for small-footprint embedded
applications
System timer (SysTick), providing a simple, 24-bit clear-on-write, decrementing, wrap-on-zero
counter with a flexible control mechanism
Thumb®-compatible Thumb-2-only instruction set processor core for high code density
50-MHz operation
Hardware-division and single-cycle-multiplication
29September 04, 2010
Texas Instruments-Production Data
Stellaris® LM3S1133 Microcontroller
Integrated Nested Vectored Interrupt Controller (NVIC) providing deterministic interrupt
handling
33 interrupts with eight priority levels
Memory protection unit (MPU), providing a privileged mode for protected operating system
functionality
Unaligned data access, enabling data to be efficiently packed into memory
Atomic bit manipulation (bit-banding), delivering maximum memory utilization and streamlined
peripheral control
ARM® Cortex™-M3 Processor Core
Compact core.
Thumb-2 instruction set, delivering the high-performance expected of an ARM core in the
memory size usually associated with 8- and 16-bit devices; typically in the range of a few
kilobytes of memory for microcontroller class applications.
Rapid application execution through Harvard architecture characterized by separate buses
for instruction and data.
Exceptional interrupt handling, by implementing the register manipulations required for handling
an interrupt in hardware.
Deterministic, fast interrupt processing: always 12 cycles, or just 6 cycles with tail-chaining
Memory protection unit (MPU) to provide a privileged mode of operation for complex
applications.
Migration from the ARM7™ processor family for better performance and power efficiency.
Full-featured debug solution
Serial Wire JTAG Debug Port (SWJ-DP)
Flash Patch and Breakpoint (FPB) unit for implementing breakpoints
Data Watchpoint and Trigger (DWT) unit for implementing watchpoints, trigger resources,
and system profiling
Instrumentation Trace Macrocell (ITM) for support of printf style debugging
Trace Port Interface Unit (TPIU) for bridging to a Trace Port Analyzer
Optimized for single-cycle flash usage
Three sleep modes with clock gating for low power
Single-cycle multiply instruction and hardware divide
Atomic operations
ARM Thumb2 mixed 16-/32-bit instruction set
September 04, 201030
Texas Instruments-Production Data
Architectural Overview
Loading...
+ 627 hidden pages