Texas Instruments SNJ54CBTD3384FK, SNJ54CBTD3384W Datasheet
SN54CBTD3384, SN74CBTD3384
10-BIT FET BUS SWITCHES
WITH LEVEL SHIFTING
SCDS025K – MAY 1995 – REVISED NOVEMBER 1998
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
5-Ω Switch Connection Between Two Ports
D
TTL-Compatible Input Levels
D
Designed to Be Used in Level-Shifting
Applications
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB, DBQ), Thin Very Small-Outline (DGV),
and Thin Shrink Small-Outline (PW)
Packages, Ceramic Flat (W) Package,
Ceramic DIPs (JT), and Ceramic Chip
Carriers (FK)
description
The ’CBTD3384 devices provide ten bits of
high-speed TTL-compatible bus switching. The
low on-state resistance of the switches allows
connections to be made without adding
propagation delay . A diode to V
CC
is integrated on
the die to allow for level shifting between 5-V
inputs and 3.3-V outputs.
These devices are organized as two 5-bit
switches with separate output-enable (OE
)
inputs. When OE
is low, the switch is on and port A
is connected to port B. When OE
is high, the
switch is open and a high-impedance state exists
between the two ports.
The SN54CBTD3384 is characterized for
operation over the full military temperature range
from –55°C to 125°C. The SN74CBTD3384 is
characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each 5-bit bus switch)
INPUTS
INPUTS/OUTPUTS
1OE 2OE 1B1–1B5 2B1–2B5
L L 1A1–1A5 2A1–2A5
L H 1A1–1A5 Z
H LZ2A1–2A5
H H Z Z
Copyright 1998, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SN54CBTD3384 . . . JT OR W PACKAGE
SN74CBTD3384 . . . DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
V
CC
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
SN54CBTD3384 . . . FK PACKAGE
(TOP VIEW)
321
13 14
5
6
7
8
9
10
11
2A4
2B4
2B3
NC
2A3
2A2
2B2
1A2
1B2
1B3
NC
1A3
1A4
1B4
4
15 16 17 18
1A5
GND
NC
2OE
2A1
2B1
1A1
1B1
1OE
NC
28 27 26
12
1B5
2B5
2A5
25
24
23
22
21
20
19
V
CC
NC – No internal connection
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54CBTD3384, SN74CBTD3384
10-BIT FET BUS SWITCHES
WITH LEVEL SHIFTING
SCDS025K – MAY 1995 – REVISED NOVEMBER 1998
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
Pin numbers shown are for the DB, DBQ, DGV, DW, JT, PW, and W packages.
32
1A1
1B1
11
1A5
1
1OE
10
1B5
14 15
2A1
2B1
22
2A5
13
2OE
23
2B5
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
†
Supply voltage range, V
CC
–0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
(see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
IK
(V
I/O
< 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θ
JA
(see Note 2): DB package 104°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DBQ package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package 139°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 81°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 120°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
recommended operating conditions (see Note 3)
SN54CBTD3384 SN74CBTD3384
MIN MAX MIN MAX
UNIT
V
CC
Supply voltage 4.5 5.5 4.5 5.5 V
V
IH
High-level control input voltage 2 2 V
V
IL
Low-level control input voltage 0.8 0.8 V
T
A
Operating free-air temperature –55 125 –40 85 °C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
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