Small-Outline (DW) Packages, Ceramic
Chip Carriers (FK), and Standard Plastic
(NT) and Ceramic (JT) 300-mil DIPs
description
These synchronous, presettable, 8-bit up/down
counters feature internal-carry look-ahead
circuitry for cascading in high-speed counting
applications. Synchronous operation is provided
by having all flip-flops clocked simultaneously so
that the outputs change coincidentally with each
other when so instructed by the count-enable
(ENP
, ENT) inputs and internal gating. This mode
of operation eliminates the output counting spikes
normally associated with asynchronous (rippleclock) counters. A buffered clock (CLK) input
triggers the eight flip-flops on the rising (positivegoing) edge of the clock waveform.
These counters are fully programmable; they may
be preset to any number between 0 and 255. The
load-input circuitry allows parallel loading of the
cascaded counters. Because loading is
synchronous, selecting the load mode disables
the counter and causes the outputs to agree with
the data inputs after the next clock pulse.
SN54AS867, SN54AS869 . . . JT PACKAGE
SN74ALS867A, SN74ALS869, SN74AS867,
SN74AS869 . . . DW OR NT PACKAGE
SN54AS867, SN54AS869 . . . FK PACKAGE
B
C
D
NC
E
F
G
NC – No internal connection
(TOP VIEW)
S0
1
S1
2
A
3
B
4
C
5
D
6
E
7
F
8
G
9
H
10
ENT
11
GND
12
(TOP VIEW)
AS1S0
432128
5
6
7
8
9
10
11
12 13 14 15 16
H
ENT
GND
NC
NC
24
23
22
21
20
19
18
17
16
15
14
13
V
CC
27 26
17 18
RCO
V
CC
ENP
Q
A
Q
B
Q
C
Q
D
Q
E
Q
F
Q
G
Q
H
CLK
RCO
ENP
CLK
Q
25
24
23
22
21
20
19
Q
A
H
Q
Q
Q
NC
Q
Q
Q
B
C
D
E
F
G
The carry look-ahead circuitry provides for cascading counters for n-bit synchronous applications without
additional gating. Two count-enable (ENP
in accomplishing this function. Both ENP
by the levels of the select (S0, S1) inputs as shown in the function table. ENT
and ENT) inputs and a ripple-carry (RCO) output are instrumental
and ENT must be low to count. The direction of the count is determined
is fed forward to enable RCO. RCO
thus enabled produces a low-level pulse while the count is zero (all outputs low) counting down or 255 counting
up (all outputs high). This low-level overflow-carry pulse can be used to enable successive cascaded stages.
Transitions at ENP
and ENT are allowed regardless of the level of CLK. All inputs are diode clamped to minimize
transmission-line effects, thereby simplifying system design.
These counters feature a fully independent clock circuit. With the exception of the asynchronous clear on the
SN74ALS867A and ′AS867, changes at S0 and S1 that modify the operating mode have no effect on the Q
outputs until clocking occurs. For the ′AS867 and ′AS869, any time ENP
goes or remains high. For the SN74ALS867A and SN74ALS869, any time ENT
and/or ENT is taken high, RCO either
is taken high, RCO either goes
or remains high. The function of the counter (whether enabled, disabled, loading, or counting) is dictated solely
by the conditions meeting the stable setup and hold times.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
The SN54AS867 and SN54AS869 are characterized for operation over the full military temperature range of
–55°C to 125°C. The SN74ALS867A, SN74ALS869, SN74AS867, and SN74AS869 are characterized for
operation from 0°C to 70°C.
FUNCTION TABLE
S1
S0FUNCTION
LLClear
LHCount down
HLLoad
HHCount up
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AS867, SN54AS869
SN74ALS867A, SN74ALS869, SN74AS867, SN74AS869
SYNCHRONOUS 8-BIT UP/DOWN COUNTERS
SDAS115C – DECEMBER 1982 – REVISED JANUARY 1995
logic symbols
†
SN74ALS867A
S0
S1
ENT
ENP
CLK
S0
S1
ENT
ENP
CLK
1
2
11
23
14
3
A
4
B
5
C
6
D
7
E
8
F
9
G
10
H
1
2
11
23
14
3
A
4
B
5
C
6
D
7
E
8
F
9
G
10
H
CTRDIV 256
0
1
G4
G5
2,6D
0
1
G4
G5
2,6D
0
M
3
C6/1,4,5–/3,4,5+
0R
SN74ALS869
CTRDIV 256
0
M
3
C6/1,4,5–/3,4,5+
0,6R
1,4CT=0
3,4CT=255
1,4CT=0
3,4CT=255
13
22
21
20
19
18
17
16
15
13
22
21
20
19
18
17
16
15
RCO
Q
A
Q
B
Q
C
Q
D
Q
E
Q
F
Q
G
Q
H
RCO
Q
A
Q
B
Q
C
Q
D
Q
E
Q
F
Q
G
Q
H
†
These symbols are in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the DW, JT, and NT packages.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
S0 and S1 low (clear)13
S0 low and S1 high (load)13
S0 high and S1 low (count down)13
S0 and S1 high (count up)13
S0 high after S1↑ or S1 high after S0↑3
Data inputs A–H0
†
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN74ALS869
MIN TYP‡MAX
V
IK
V
OH
I
I
I
IH
I
IL
§
I
O
I
‡
All typical values are at VCC = 5 V, TA = 25°C.
§
The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS.
CC
VCC = 4.5 V,II = –18 mA–1.2V
VCC = 4.5 V to 5.5 V,IOH = –0.4 mAVCC –2V
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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