ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), Thin Very Small-Outline (DGV), Thin
Shrink Small-Outline (PW), and Ceramic
Flat (W) Packages, Ceramic Chip Carriers
(FK), and Standard Plastic (N) and Ceramic
(J) DIPs
description
The ’AHCT574 devices are octal edge-triggered
D-type flip-flops that feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. These devices
are particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
On the positive transition of the clock (CLK) input,
the Q outputs are set to the logic levels of the data
(D) inputs.
SN74AHCT574 . . . DB, DGV, DW, N, OR PW PACKAGE
SN54AHCT574 ...J OR W PACKAGE
(TOP VIEW)
OE
1
1D
2
2D
3
3D
4
4D
5
5D
6
6D
7
7D
8
9
8D
GND
SN54AHCT574 . . . FK PACKAGE
3D
4D
5D
6D
7D
10
(TOP VIEW)
2D1DOE
3212019
4
5
6
7
8
910111213
8D
GND
20
19
18
17
16
15
14
13
12
11
CLK
V
8Q
CC
V
CC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
CLK
18
17
16
15
14
7Q1Q
2Q
3Q
4Q
5Q
6Q
A buffered output-enable (OE
) input places the eight outputs in either a normal logic state (high or low) or the
high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly .
The high-impedance state and the increased drive provide the capability to drive bus lines without interface or
pullup components.
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
T o ensure the high-impedance state during power up or power down, OE
should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54AHCT574 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74AHCT574 is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 2000, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54AHCT574, SN74AHCT574
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCLS245J – OCTOBER 1995 – REVISED JANUARY 2000
FUNCTION TABLE
(each flip-flop)
INPUTS
OECLKD
L↑HH
L↑LL
LH or LXQ
HXXZ
OUTPUT
Q
0
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
†
OE
CLK
1D
2D
3D
4D
5D
6D
7D
8D
1
11
2
3
4
5
6
7
8
9
EN
C1
1D
logic diagram (positive logic)
1
OE
11
CLK
C1
1D
2
1D
19
18
17
16
15
14
13
12
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
19
1Q
To Seven Other Channels
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
UNIT
SN54AHCT574, SN74AHCT574
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCLS245J – OCTOBER 1995 – REVISED JANUARY 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCLS245J – OCTOBER 1995 – REVISED JANUARY 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
CC
OH
OL
I
I
I
OZ
I
CC
∆I
CC
C
i
C
o
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
†
This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or VCC.
IOH = –50 mA
IOH = –8 mA
IOL = 50 mA
IOL = 8 mA
VI = VCC or GND0 V to 5.5 V±0.1±1*±1
VO = VCC or GND5.5 V±0.25±2.5±2.5
VI = VCC or GND,IO = 05.5 V44040
One input at 3.4 V ,
†
Other inputs at VCC or GND
VI = VCC or GND5 V31010pF
VO = VCC or GND5 V3pF
5.5 V1.351.51.5mA
TA = 25°CSN54AHCT574SN74AHCT574
MINTYPMAXMINMAXMINMAX
4.44.54.44.4
3.943.83.8
0.10.10.1
0.360.440.44
m
A
m
A
m
A
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°CSN54AHCT574SN74AHCT574
MINMAXMINMAXMINMAX
t
Pulse duration, CLK high or low55.55.5ns
w
t
Setup time, data before CLK↑
su
t
Hold time, data after CLK↑1.51.51.5ns
h
33.53.5ns
switching characteristics over recommended operating free-air temperature range,
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
max
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
sk(o)
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
*** On products compliant to MIL-PRF-38535, this parameter does not apply.
Power dissipation capacitanceNo load,f = 1 MHz28pF
pd
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
(see Note A)
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Input
Test
Point
C
L
t
w
1.5 V1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
= 5 V, TA = 25°C
CC
PARAMETERTEST CONDITIONSTYPUNIT
V
CC
Open
GND
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
t
t
Open Drain
1.5 V
TESTS1
PLH/tPHL
t
PLZ/tPZL
PHZ/tPZH
t
h
Open
V
CC
GND
V
CC
3 V
0 V
3 V
0 V
From Output
Under Test
C
(see Note A)
L
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
RL = 1 kΩ
3 V
0 V
S1
Timing Input
Data Input
Input
t
PLH
In-Phase
Output
t
PHL
Out-of-Phase
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
50% V
50% V
CC
CC
Figure 1. Load Circuit and Voltage Waveforms
t
PHL
50% V
t
PLH
50% V
3 V
0 V
V
CC
V
V
CC
V
OH
OL
OH
OL
Output
Control
Output
Waveform 1
S1 at V
(see Note B)
Waveform 2
(see Note B)
CC
Output
S1 at GND
1.5 V1.5 V1.5 V1.5 V
t
PZL
50% V
CC
t
PZH
50% V
CC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
t
PLZ
VOL + 0.3 V
t
PHZ
VOH – 0.3 V
3 V
0 V
≈V
V
OL
V
OH
≈0 V
CC
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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