Package Options Include Plastic
Small-Outline (D), Shrink Small-Outline
(DB), Thin Very Small-Outline (DGV), Thin
Shrink Small-Outline (PW), and Ceramic Flat
(W) Packages, Ceramic Chip Carriers (FK),
and Standard Plastic (N) and Ceramic (J)
DIPs
description
The ’AHCT32 devices are quadruple 2-input
positive-OR gates. These devices perform the
Boolean function Y+A • B or Y+A)B in
positive logic.
The SN54AHCT32 is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74AHCT32 is characterized for
operation from –40°C to 85°C.
SN54AHCT32 ...J OR W PACKAGE
SN74AHCT32 . . . D, DB, DGV, N, OR PW PACKAGE
SN54AHCT32 . . . FK PACKAGE
1Y
NC
2A
NC
2B
NC – No internal connection
(TOP VIEW)
1
1A
2
1B
3
1Y
4
2A
5
2B
6
2Y
GND
7
(TOP VIEW)
1B1ANC
3212019
4
5
6
7
8
910111213
2Y
GND
NC
14
13
12
11
10
9
8
CC
V
3Y
4B
18
17
16
15
14
3A
V
4B
4A
4Y
3B
3A
3Y
CC
4A
NC
4Y
NC
3B
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
FUNCTION TABLE
(each gate)
INPUTS
AB
HXH
XHH
LLL
OUTPUT
Y
Copyright 2000, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
IOH = –50 mA
IOH = –8 mA
IOL = 50 mA
IOL = 8 mA
VI = VCC or GND0 V to 5.5 V±0.1±1*±1
VI = VCC or GND,IO = 05.5 V22020
One input at 3.4 V ,
†
Other inputs at VCC or GND
VI = VCC or GND5 V21010pF
I
I
∆I
C
OH
OL
I
CC
CC
i
, literature number SCBA004.
CC
5.5 V1.351.51.5mA
TA = 25°CSN54AHCT32 SN74AHCT32
MINTYPMAXMINMAXMINMAX
4.44.54.44.4
3.943.83.8
0.10.10.1
0.360.440.44
CC
0V
CC
V
m
A
m
A
switching characteristics over recommended operating free-air temperature range,
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PLH
t
PHL
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
=
L
= 50
L
p
p
TA = 25°CSN54AHCT32 SN74AHCT32
MINTYPMAXMINMAXMINMAX
5**6.9**1**8**18
5**6.9**1**8**18
5.57.91919
5.57.91919
3
SN54AHCT32, SN74AHCT32
PARAMETER
UNIT
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCLS248I – OCTOBER 1995 – REVISED JANUARY 2000
noise characteristics, V
V
OL(P)
V
OL(V)
V
OH(V)
V
IH(D)
V
IL(D)
NOTE 4: Characteristics are for surface-mount packages only.
Quiet output, maximum dynamic V
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage2V
Low-level dynamic input voltage0.8V
operating characteristics, V
C
Power dissipation capacitanceNo load,f = 1 MHz11.5pF
pd
= 5 V, CL = 50 pF, TA = 25°C (see Note 4)
CC
OL
OL
OH
= 5 V, TA = 25°C
CC
PARAMETERTEST CONDITIONSTYPUNIT
SN74AHCT32
MINTYPMAX
0.40.8V
–0.4–0.8V
4.5V
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
(see Note A)
SN54AHCT32, SN74AHCT32
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCLS248I – OCTOBER 1995 – REVISED JANUARY 2000
PARAMETER MEASUREMENT INFORMATION
V
Test
Point
C
L
From Output
Under Test
(see Note A)
C
L
RL = 1 kΩ
S1
CC
Open
GND
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open Drain
Open
V
CC
GND
V
CC
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
t
w
Input
Input
In-Phase
Output
Out-of-Phase
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
1.5 V1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
t
PLH
50% V
CC
t
PHL
50% V
CC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
3-STATE AND OPEN-DRAIN OUTPUTS
t
PHL
50% V
t
PLH
50% V
LOAD CIRCUIT FOR
Timing Input
3 V
0 V
3 V
0 V
V
CC
CC
OH
V
OL
V
OH
V
OL
Waveform 1
(see Note B)
Waveform 2
(see Note B)
Data Input
Output
Control
Output
S1 at V
CC
Output
S1 at GND
1.5 V
t
CC
CC
h
t
PLZ
VOL + 0.3 V
t
PHZ
VOH – 0.3 V
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
1.5 V1.5 V1.5 V1.5 V
t
PZL
50% V
t
PZH
50% V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
3 V
0 V
3 V
0 V
3 V
0 V
≈V
V
OL
V
OH
≈0 V
CC
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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