Meets or Exceeds the Requirements of
ANSI TIA/EIA-644 Standard
D
Low-Voltage Differential Signaling With
Typical Output Voltage of 350 mV and a
100-Ω Load
D
Signaling Rates up to 155 Mbps
D
Operates From a Single 3.3-V Supply
D
Driver at High Impedance When Disabled or
With VCC = 0
D
Low-Voltage TTL (LVTTL) Logic Input
Levels
D
Characterized For Operation From
0°C to 70°C
description
The SN75LVDS31 and SN75LVDS9638 are
differential line drivers that implement the
electrical characteristics of low-voltage differential
signaling (L VDS). This signaling technique lowers
the output voltage levels of 5 V differential
SN75LVDS31, SN75LVDS9638
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
SLLS359A – JUNE 1999 – REVISED MARCH 2000
SN75LVDS31D (Marked as 75LVDS31)
SN75LVDS9638D (Marked as DF638 or 7L9638)
GND
V
CC
1A
2A
GND
(TOP VIEW)
1A
1Y
1Z
G
2Z
2Y
2A
(TOP VIEW)
16
15
14
13
12
11
10
V
CC
4A
4Y
4Z
G
3Z
3Y
9
3A
1Y
8
1Z
7
2Y
6
5
2Z
1
2
3
4
5
6
7
8
1
2
3
4
standard levels (such as TIA/EIA-422B) to reduce the power, increase the switching speeds, and allow
operation with a 3.3-V supply rail. Any of the four current-mode drivers will deliver a minimum differential output
voltage magnitude of 247 mV into a 100-Ω load when enabled.
The intended application of these devices and signaling technique is for point-to-point baseband data
transmission over controlled impedance media of approximately 100 Ω. The transmission media may be
printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent
upon the attenuation characteristics of the media and the noise coupling to the environment.
The SN75LVDS31 and SN75LVDS9638 are characterized for operation from 0°C to 70°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2000, Texas Instruments Incorporated
1
SN75LVDS31, SN75LVDS9638
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
SLLS359A – JUNE 1999 – REVISED MARCH 2000
4
12
1
7
9
15
†
SN75LVDS31
≥ 1
EN
2
1Y
3
1Z
6
2Y
5
2Z
10
3Y
11
3Z
14
4Y
13
4Z
†
SN75LVDS9638
8
2
3
1Y
7
1Z
6
2Y
5
2Z
logic symbol
G
G
1A
2A
3A
4A
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC
Publication 617-12.
logic symbol
1A
2A
’LVDS31 logic diagram (positive logic)
4
G
12
1A
2A
3A
4A
G
1
7
9
15
10
11
14
13
2
1Y
3
1Z
6
2Y
5
2Z
3Y
3Z
4Y
4Z
’LVDS9638 logic diagram (positive logic)
8
1A
2A
2
3
1Y
7
1Z
6
2Y
5
2Z
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC
Publication 617-12.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
Function Tables
SN75LVDS31
INPUT
A
HHXHL
LHXLH
HXLHL
LXLLH
XLHZZ
OpenHXLH
OpenXLLH
H = high level, L = low level, X = irrelevant,
Z = high impedance (off)
ENABLESOUTPUTS
G
G
SN75LVDS9638
INPUT
A
HHL
LLH
OPENLH
H = high level, L = low level
OUTPUTS
YZ
YZ
SN75LVDS31, SN75LVDS9638
SLLS359A – JUNE 1999 – REVISED MARCH 2000
equivalent input and output schematic diagrams
EQUIVALENT OF EACH A INPUTEQUIVALENT OF G, G INPUTSTYPICAL OF ALL OUTPUTS
Input
7 V
50 Ω
300 kΩ
V
CC
Input
50 Ω
7 V
V
CC
10 kΩ
V
CC
5 Ω
Y or Z
Output
7 V
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN75LVDS31, SN75LVDS9638
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
SLLS359A – JUNE 1999 – REVISED MARCH 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages, except differential I/O bus voltages, are with respect to the network ground terminal.
DISSIPATION RATING TABLE
PACKAGE
D (8)725 mW5.8 mW/°C464 mW
D (16)950 mW7.6 mW/°C608 mW
‡
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with
no air flow.
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
‡
POWER RATING
TA = 70°C
recommended operating conditions
MINNOMMAXUNIT
Supply voltage, V
High-level input voltage, V
Low-level input voltage, V
Operating free-air temperature, T
CC
IH
IL
A
33.33.6V
2V
0.8V
070°C
†
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN75LVDS31, SN75LVDS9638
ICCSu ly current
SN75LVDS9638
V
V
IOSShort-circuit output current
See Figure 2
See Figure 4
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
SLLS359A – JUNE 1999 – REVISED MARCH 2000
electrical characteristics over recommended operating conditions (unless otherwise noted)
SN75LVDS31,
PARAMETERTEST CONDITIONS
V
OD
∆V
OD
∆V
OC(SS)
V
OC(SS)
V
OC(PP)
I
IH
I
IL
I
OZ
I
O(OFF)
C
I
†
All typical values are at TA = 25°C and with VCC = 3.3 V.
Differentialoutputvoltagemagnitude
Change in differential output voltage magnitude
between logic states
Change in steady-state common-mode output voltage
between logic states
Steady-state common-mode output voltage
Peak-to-peak common-mode output voltage50150mV
switching characteristics over recommended operating conditions (unless otherwise noted)
SN75LVDS31,
PARAMETERTEST CONDITIONS
t
pLH
t
pHL
t
r
t
f
t
sk(p)
t
sk(o)
t
sk(pp)
t
pZH
t
pZL
t
pHZ
t
pLZ
†
All typical values are at TA = 25°C and with VCC = 3.3 V.
‡
t
sk(p)
§
t
sk(o)
¶
t
sk(pp)
with the same supply voltages, same temperature, and have identical packages and test circuits.
Propagation delay time, low-to-high-level output6ns
Propagation delay time, high-to-low-level output6ns
Differential output signal rise time (20% to 80%)
Differential output signal fall time (80% to 20%)
Pulse skew (|t
Channel-to-channel output skew
Part-to-part skew
Propagation delay time, high-impedance-to-high-level output25ns
Propagation delay time, high-impedance-to-low-level output
Propagation delay time, high-level-to-high-impedance output
Propagation delay time, low-level-to-high-impedance output25ns
is the magnitude of the time difference between the high-to-low and low-to-high propagation delay times at an output.
is the magnitude of the time difference between the outputs of a single device with all of their inputs connected together.
is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate
PHL
– t
¶
PLH
‡
|)
§
RL = 100 Ω, CL = 10 pF,
SN75LVDS9638
MIN TYP†MAX
0.51.2ns
0.51.2ns
0.6ns
0.6ns
1ps
25ns
25ns
UNIT
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
SN75LVDS31, SN75LVDS9638
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
SLLS359A – JUNE 1999 – REVISED MARCH 2000
PARAMETER MEASUREMENT INFORMATION
I
OY
I
I
A
V
I
Figure 1. Voltage and Current Definitions
Y
Input
(see Note A)
NOTES: A. All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 50 Mpps,
pulse width = 10 ± 0.2 ns.
B. CL includes instrumentation and fixture capacitance within 6 mm of the D.U.T.
Z
V
Y
Z
OD
CL = 10 pF
(2 Places)
(see Note B)
I
OZ
100 ± 1 %
V
OD
V
OZ
Input
V
OD
t
PLH
V
OY
V
OC
0
(VOY + VOZ)/2
t
f
t
PHL
2 V
1.4 V
0.8 V
t
r
100%
80%
20%
0%
Figure 2. Test Circuit, Timing, and Voltage Definitions for the Differential Output Signal
49.9 Ω ± 1% (2 Places)
Y
Input
(see Note A)
NOTES: A. All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 50 Mpps,
pulse width = 10 ± 0.2 ns.
B. CL includes instrumentation and fixture capacitance within 6 mm of the D.U.T.
C. The measurement of V
A
Z
V
OC
CL = 10 pF
(2 Places)
(see Note B)
is made on test equipment with a –3 dB bandwidth of at least 300 MHz.
OC(PP)
A
V
OC(PP)
(see Note C)
V
OC
3 V
0
V
OC(SS)
Figure 3. Test Circuit and Definitions for the Driver Common-Mode Output V oltage
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN75LVDS31, SN75LVDS9638
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
SLLS359A – JUNE 1999 – REVISED MARCH 2000
PARAMETER MEASUREMENT INFORMATION
Y
Inputs
(see Note A)
G
G
t
PZH
V
OY
or
V
OZ
t
PZL
V
OZ
or
V
NOTES: A. All input pulses are supplied by a generator having the following characteristics: tr or tf < 1 ns, pulse repetition rate (PRR) = 0.5 Mpps,
B. CL includes instrumentation and fixture capacitance within 6 mm of the D.U.T.
OY
pulse width = 500 ± 10 ns.
0.8 V or 2 V
G
G
Z
CL = 10 pF
(2 Places)
(see Note B)
t
PHZ
t
PLZ
2 V
1.4 V
0.8 V
2 V
1.4 V
0.8 V
100%, ≅ 1.4 V
50%
0%, 1.2 V
100%, 1.2 V
50%
0%, ≅ 1 V
49.9 Ω ± 1% (2 Places)
1.2 V
V
OYVOZ
A at 2 V, G at VCC and Input to G
or
G at GND and Input to G for ’LVDS31 only
A at 0.8 V, G at VCC and Input to G
or
G at GND and Input to G for ’LVDS31 only
Figure 4. Enable and Disable Time Circuit and Definitions
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
SN75LVDS31, SN75LVDS9638
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
SLLS359A – JUNE 1999 – REVISED MARCH 2000
APPLICATIONS INFORMATION
Figure 5. T ypical Transmission Distance Versus Signaling Rate
1
1A
2
1Y
ZO = 100 Ω
ZO = 100 Ω
3
1Z
4
V
CC
G
5
2Z
6
2Y
7
2A
8
GND
3.3 V
16
V
CC
0.001 µF
(see Note A)
4A
4Y
4Z
3Z
3Y
3A
0.1 µF
15
14
13
12
G
11
10
9
(see Note A)
ZO = 100 Ω
See Note B
ZO = 100 Ω
NOTES: A. Place a 0.1 µF and a 0.001 µF Z5U ceramic, mica or polystyrene dielectric, 0805 size, chip capacitor between VCC and the ground
plane. The capacitors should be located as close as possible to the device terminals.
B. Unused enable inputs should be tied to VCC or GND as appropriate.
Figure 6. Typical Application Circuit Schematic
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TP
TP
TpBias on
Twisted-Pair A
55 Ω
55 Ω
5 kΩ
VG on
Twisted-Pair B
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
APPLICATIONS INFORMATION
1/4 ’LVDS31
’LVDS32
3.3 V
500 Ω
500 Ω
20 kΩ
20 kΩ
3.3 V
SN75LVDS31, SN75LVDS9638
SLLS359A – JUNE 1999 – REVISED MARCH 2000
Strb/Data_TX
Strb/Data_Enable
Data/Strobe
1 Arb_RX
500 Ω
500 Ω
3.3 V
7 kΩ7 kΩ
NOTES: A. Resistors are leadless thick-film (0603) 5% tolerance.
B. Decoupling capacitance is not shown but recommended.
C. VCC is 3 V to 3.6 V.
D. The differential output voltage of the ’LVDS31 can exceed that specified by IEEE1394.
Figure 7. 100 Mbps IEEE1394 Transceiver
20 kΩ
2 Arb_RX
20 kΩ
Twisted-Pair B Only
10 kΩ
Port_Status
3.3 kΩ
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
9
SN75LVDS31, SN75LVDS9638
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
SLLS359A – JUNE 1999 – REVISED MARCH 2000
APPLICATIONS INFORMATION
0.01 µF
1
1A
2
1Y
ZO = 100 Ω
ZO = 100 Ω
NOTE A: Place a 0.1 µF Z5U ceramic, mica or polystyrene dielectric, 0805 size, chip capacitor between VCC and the ground plane. The capacitor
should be located as close as possible to the device terminals.
3
1Z
4
V
CC
G
5
2Z
6
2Y
7
2A
8
GND
16
V
CC
15
4A
14
4Y
13
4Z
12
G
11
3Z
10
3Y
9
3A
≈3.6 V
0.1 µF
(see Note A)
See Note B
5 V
1N645
(2 places)
ZO = 100 Ω
ZO = 100 Ω
Figure 8. Operation with a 5-V Supply
related information
IBIS modeling is available for this device. Please contact the local TI sales office or the TI Web site at
for more information.
For more application guidelines, please see the following documents:
D
Low-Voltage Differential Signalling Design Notes
D
Interface Circuits for TIA/EIA-644
D
Reducing EMI with LVDS
D
Slew Rate Control of LVDS Circuits
D
Using an LVDS Receiver with RS-422 Data
D
Evaluating the LVDS EVM
(SLLA030)
(SLLA033)
(LVDS) (SLLA038)
(SLLA034)
(SLLA014)
(SLLA031)
www.ti.com
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN75LVDS31, SN75LVDS9638
HIGH-SPEED DIFFERENTIAL LINE DRIVERS
SLLS359A – JUNE 1999 – REVISED MARCH 2000
MECHANICAL INFORMATION
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0.050 (1,27)
14
1
0.069 (1,75) MAX
A
0.020 (0,51)
0.014 (0,35)
0.010 (0,25)
0.004 (0,10)
DIM
8
7
PINS **
0.010 (0,25)
0.157 (4,00)
0.150 (3,81)
M
0.244 (6,20)
0.228 (5,80)
Seating Plane
0.004 (0,10)
8
14
0.008 (0,20) NOM
0°–8°
16
Gage Plane
0.010 (0,25)
0.044 (1,12)
0.016 (0,40)
A MAX
A MIN
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.197
(5,00)
0.189
(4,80)
0.344
(8,75)
0.337
(8,55)
0.394
(10,00)
0.386
(9,80)
4040047/D 10/96
11
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCTOR PRODUCTS MA Y INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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