Datasheet SN75LP1185DBR, SN75LP1185DWR, SN75LP1185N, SN75LP1185PWR Datasheet (Texas Instruments)

SN75LP1185

LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS

SLLS335 – JANUARY 1999

D

Single-Chip TIA/EIA-232-F Interface for
IBM PC/AT Serial Port

D

Designed to Transmit and Receive 4-µs
Pulses (Equivalent to 256 kbit/s)

D

Less Than 21-mW Power Consumption

D

Wide Supply-Voltage Range, 4.75 V to 15 V

D

Driver Output Slew Rates Are Internally
Controlled to 30 V/µs Max

D

Receiver Input Hysteresis, 1000 mV Typ

D

TIA/EIA-232-F Bus-Pin ESD Protection
Exceeds:
– 15-kV, Human-Body Model
– IEC1000-4-2 Level-4 Compliant

D

Three Drivers and Five Receivers Meet or
Exceed the Requirements of TIA/EIA-232-F
and ITU V.28

D

Complements the SN75LP196

D

Designed to Replace the Industry-Standard
SN75185 and SN75C185 With the Same
Flow-Through Pinout

D

Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), Thin Shrink Small-Outline (PW), and
Dual-In-Line (N) Packages

DB, DW, N, OR PW PACKAGE

V

DD

RA1
RA2
RA3
DY1
DY2
RA4
DY3
RA5

V

SS

(TOP VIEW)

1

20

2

19

3

18

4

17

5

16

6

15

7

14

8

13

9

12

10

11

V

CC

RY1
RY2
RY3
DA1
DA2
RY4
DA3
RY5
GND

description

The SN75LP1 185 is a low-power bipolar device containing three drivers and five receivers with 15 kV of ESD
protection on the bus pins with respect to each other. Bus pins are defined as those pins that tie directly to the
serial-port connector, including GND. The pinout matches the flow-through design of the industry-standard
SN75185 and SN75C185. The flow-through pinout of the SN75LP1185 allows easy interconnection of the
UART and serial-port connector of the IBM PC/AT and compatibles. The SN75LP1185 provides a rugged,
low-cost solution for this function with the combination of the bipolar processing and 15 kV of ESD protection.

The SN75LP1185 has internal slew-rate control to provide a maximum rate of change in the output signal of
30 V/µs. The driver output swing is nominally clamped at ±6 V to enable the higher data rates associated with
this device and to reduce EMI emissions. Even though the driver outputs are clamped, they can handle voltages
up to ±15 V without damage. All the logic inputs can accept 3.3-V or 5-V input signals.

The SN75LP1 185 complies with the requirements of TIA/EIA-232-F and ITU V .28. These standards are for data
interchange between a host computer and peripheral at signaling rates up to 20 kbit/s. The switching speeds
of the SN75LP1185 support rates up to 256 kbit/s.

The SN75LP1185 is characterized for operation from 0°C to 70°C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

IBM and PC/AT are trademarks of International Business Machines Corporation.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Copyright  1999, Texas Instruments Incorporated

1

SN75LP1185
LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS

SLLS335 – JANUARY 1999

Function Tables

DRIVER

INPUT

DA

Open L

INPUT

RA

Open H

logic diagram (positive logic)

OUTPUT

DY

H L

L H

RECEIVER

OUTPUT

RY

H L

L H

RA1

RA2

RA3

DY1

DY2

RA4

DY3

RA5

2

3

4

5

6

7

8

9

19

18

17

16

15

14

13

12

RY1

RY2

RY3

DA1

DA2

RY4

DA3

RY5

2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN75LP1185

LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS

SLLS335 – JANUARY 1999

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Positive supply-voltage range (see Note 1): V
Negative supply-voltage range, V

Input-voltage range, V

: Receiver (RA) –30 V to 30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

I

(see Note 1) 0.5 V to –15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SS

CC

V

DD

Driver (DA) –0.5 V to V

Output-voltage range, V

: Receiver (RY) –0.5 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

O

Driver (DY) –15 V to 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrostatic discharge: Bus pins (human-body model) (see Note 2) Class 3: 15 kV. . . . . . . . . . . . . . . . . . . . .

Bus pins (machine model) 500 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Bus pins (IEC1000-4-2, contact) 8 kV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

All pins (human-body model) (see Note 2) Class 3: 5 kV. . . . . . . . . . . . . . . . . . . . . . . .

All pins (machine model) 400 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance, θ

(see Note 3): DB package 115°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

JA

DW package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PW package 128°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, T

stg

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. All voltage values are with respect to network ground terminal, unless otherwise noted.

2. Per MIL-STD-883, Method 3015.7

3. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.

–0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–0.5 V to 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

+ 0.4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CC

65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†

recommended operating conditions

V
V
V
V
V
V
I

OH

I

OL

T

NOTES: 4. VCC cannot be greater than VDD.

Supply voltage (see Note 4) 4.75 5 5.25 V

CC

Supply voltage (see Note 5) 9 12 15 V

DD

Supply voltage (see Note 5) –9 –12 –15 V

SS

High-level input voltage DA 2 V

IH

Low-level input voltage DA 0.8 V

IL

Receiver input voltage RA –25 25 V

I

High-level output current RY –1 mA
Low-level output current RY 2 mA
Operating free-air temperature 0 70 °C

A

5. The device operates down to VDD = VCC and |VSS| = VCC, but supply currents increase and other parameters may vary slightly from
the data sheet limits.

MIN NOM MAX UNIT

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

3

SN75LP1185

Supply current for V

I

Supply current for V

I

All in uts at minimum V

OH

or

A

maximum V

OL

Supply current for V

I

VOHHigh-level output voltage

R

V

VOLLow-level output voltage

R

V

LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS

SLLS335 – JANUARY 1999

supply currents over the recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS

pp

pp

pp

CC,

DD,

SS,

CC

No load,

DD

SS

p

maximum V

VDD = 9 V, VSS = –9 V 1000
VDD = 12 V, VSS = –12 V 1000
VDD = 9 V, VSS = –9 V 800
VDD = 12 V, VSS = –12 V 800
VDD = 9 V, VSS = –9 V –625
VDD = 12 V, VSS = –12 V –625

driver electrical characterisitics over the recommended operating conditions (unless otherwise
noted)

PARAMETER TEST CONDITIONS

p

p

I

IH

I

IL

I

OS(H)

I

OS(L)

r

o

NOTES: 6. Maximum output swing is nominally clamped at ±6 V to enable the higher data rates associated with this device and to reduce EMI

High-level input current VI at V
Low-level input current VI at GND –1 µA
Short-circuit

high-level output current
Short-circuit

low-level output current
Output resistance VDD = VSS = VCC = 0, VO = 2 V 300 Ω

emissions. The driver outputs may slightly exceed the maximum output voltage over the full VCC and temperature ranges.

7. Not more than one output should be shorted at one time.

VIL = 0.8 V,

= 3 kΩ,

L

See Figure 1
VIH = 2 V,

= 3 kΩ,

L

See Figure 1

CC

VO = GND or VSS, See Figure 2 and Note 7 –30 –55 mA

VO = GND or VDD, See Figure 2 and Note 7 30 55 mA

VDD = 9 V, VSS = –9 V 5 5.8 6.6
VDD = 12 V, VSS = –12 V, See Note 6 5 5.8 6.6
VDD = 9 V, VSS = –9 V –5 –5.8 –6.9
VDD = 12 V, VSS = –12 V, See Note 6 –5 –5.9 –6.9

MIN TYP MAX UNIT

µ

MIN TYP MAX UNIT

1 µA

4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

CC

TLH

l

t

R

Note 9

CC

THL

high- to l

t

R

Note 9

IIHHigh-level input current

mA

IILLow-level input current

mA

SN75LP1185

LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS

SLLS335 – JANUARY 1999

driver switching characteristics over recommended operating free-air temperature range (unless
otherwise noted)

PARAMETER TEST CONDITIONS

t

PHL

t

PLH

t

t

SR Output slew rate

NOTES: 8. Equivalent to the SN75C185. The SN75LP1185 output-voltage swing is clamped to about 70% of the typical SN75C185

Propagation delay time,
high- to low-level output

Propagation delay time,
low- to high-level output

Transition time,

ow- to high-level outpu

Transition time,

ow-level outpu

output-voltage swing, and the specified limits reflect the reduced output swing.

9. Maximum output swing is limited to ±6 V to enable the higher data rates associated with this device and to reduce EMI emissions.

RL = 3 kΩ to 7 kΩ, CL = 15 pF, See Figure 1 300 800 1600 ns

RL = 3 kΩ to 7 kΩ, CL = 15 pF, See Figure 1 300 800 1600 ns

Using VTR = 10%-to-90% transition region,
Driver speed = 250 kbit/s, CL = 15 pF,

VCC = 5 V,
VDD = 12 V,
VSS = –12 V,

p

L

See Figure 1 and
Note 9

VCC = 5 V,
VDD = 12 V,
VSS = –12 V,

p

L

See Figure 1 and
Note 9

VCC = 5 V,
VDD = 12 V,
VSS = –12 V

= 3 kΩ to 7 kΩ,

= 3 kΩ to 7 kΩ,

See Note 8
Using VTR = ±3 V transition region,

Driver speed = 250 kbit/s, CL = 15 pF
Using VTR = ±2 V transition region,

Driver speed = 250 kbit/s, CL = 15 pF
Using VTR = ±3 V transition region,

Driver speed = 125 kbit/s, CL = 2500 pF
Using VTR = 10%-to-90% transition region,

Driver speed = 250 kbit/s, CL = 15 pF,
See Note 8

Using VTR = ±3 V transition region,
Driver speed = 250 kbit/s, CL = 15 pF

Using VTR = ± 2 V transition region,
Driver speed = 250 kbit/s, CL = 15 pF

Using VTR = ±3 V transition region,
Driver speed = 125 kbit/s, CL = 2500 pF

Using VTR = ±3 V transition region,
Driver speed = 0 to 250 kbit/s, CL = 15 pF

MIN TYP MAX UNIT

375 2240

200 1500

133 1000

2750

375 2240

200 1500

133 1000

2750

4 20 30 V/µs

ns

ns

receiver electrical characteristics over recommended operating free-air temperature range
(unless otherwise noted)

PARAMETER TEST CONDITIONS

V

IT+

V

IT–

V

HYS

V

OH

V

OL

I

OS(H)

I

OS(L)

R

IN

NOTE 7: Not more than one output should be shorted at one time.

Positive-going input threshold voltage See Figure 3 1.6 2 2.55 V
Negative-going input threshold voltage See Figure 3 0.6 1 1.45 V
Input hysteresis, V
High-level output voltage IOH = –1 mA 2.5 3.9 V
Low-level output voltage IOL = 2 mA 0.33 0.5 V

Short-circuit high-level output current VO = 0, See Figure 5 and Note 7 –20 mA
Short-circuit low-level output current VO = VCC, See Figure 5 and Note 7 20 mA
Input resistance VI = ±3 V to ±25 V 3 5 7 kΩ

IT+ VIT–

p

p

See Figure 3 600 1000 mV

VI = 3 V 0.43 0.6 1
VI = 25 V 3.6 5.1 8.3
VI = –3 V –0.43 –0.6 –1
VI = –25 V –3.6 –5.1 –8.3

MIN TYP MAX UNIT

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

5

SN75LP1185
LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS

SLLS335 – JANUARY 1999

receiver switching characteristics over recommended operating free-air temperature range,

= 50 pF (unless otherwise noted) (see Figure 4)

C

L

t

PHL

t

PLH

t

TLH

t

THL

t

SK(p)

PARAMETER

Propagation delay time, high- to low-level output 400 900 ns
Propagation delay time, low- to high-level output 400 900 ns
Transition time, low- to high-level output 200 500 ns
Transition time, high- to low-level output 200 400 ns
Pulse skew |t

PLH

– t

| 200 425 ns

PHL

PARAMETER MEASUREMENT INFORMATION

t

w

Inputs Outputs

I

I

V

I

I

O

V

O

V

I

C

L

V

O

R

L

50% 50%

50% 50%

V

TR–

t

TLH

V

MIN TYP MAX UNIT

t

PLH

TR+VTR+

t

V

PHL

TR–

t

THL

3 V

0 V

V

V

OH

OL

NOTES: A. The pulse generator has the following characteristics:

For CL < 1000 pF: tw = 4 µs, PRR = 250 kbit/s, ZO = 50 Ω, tr and tf < 50 ns.
For CL = 2500 pF: tw = 8 µs, PRR = 125 kbit/s, ZO = 50 Ω, tr and tf < 50 ns.

B. CL includes probe and jig capacitance.

Figure 1. Driver Parameter Test Circuit and Waveform

Inputs Outputs

I

I

V

I

V

Figure 2. Driver IOS Test

Inputs Outputs

I

I

V

I

V

I

O

O

V

O

DD

V

CC

GND

V

SS

I

O

Figure 3. Receiver VIT Test

6

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN75LP1185

LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS

SLLS335 – JANUARY 1999

PARAMETER MEASUREMENT INFORMATION

t

w

t

PHL

4 V

0 V

V

V

t

THL

OH

OL

Inputs Outputs

I

I

V

I

I

O

V

O

V

I

C

L

V

O

50% 50%

t

PLH

50% 50%

10% 10%

t

TLH

90% 90%

NOTES: A. The pulse generator has the following characteristics: tw = 4 µs, PRR = 250 kbit/s, ZO = 50 Ω, tr and tf < 50 ns.

B. CL includes probe and jig capacitance.

Figure 4. Receiver Parameter Test Circuit and Waveform

Inputs Outputs

V

I

I

V

I

V

I

O

O

CC

GND

Figure 5. Receiver IOS Test

APPLICATION INFORMATION

Diodes placed in series with the VDD and VSS leads protect the SN75LP1 185 in the fault condition when the device
outputs are shorted to ±15 V and the power supplies are at low voltage and provide low-impedance paths to ground
(see Figure 6).

V

DD

SN75LP1185Output SN75LP1185Output

V

SS

Figure 6. Power-Supply Protection to Meet Power-Off Fault Conditions of TIA/EIA-232-F

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

7

IMPORTANT NOTICE

T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.

CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.

TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

Copyright  1999, Texas Instruments Incorporated