Designed for TIA/EIA-485, TIA/EIA-422, ISO
8482, and ANSI X3.277 (HVD SCSI Fast–20)
Applications
D
Common-Mode Bus Voltage Range
–7 V to 12 V
D
ESD Protection on Bus Terminals
Exceeds 12 kV
D
Driver Output Current up to ±60 mA
D
Thermal Shutdown Protection
D
Driver Positive and Negative Current
Limiting
D
Power-Up, Power-Down Glitch-Free
Operation
D
Pin-Compatible With the SN75ALS171
D
Available in Shrink Small-Outline Package
description
The SN65LBC171 and SN75LBC171 are
monolithic integrated circuits designed for
bidirectional data communication on multipoint
bus-transmission lines. Potential applications
include serial or parallel data transmission, cabled
peripheral buses with twin axial, ribbon, or
twisted-pair cabling. These devices are suitable
for FAST–20 SCSI and can transmit or receive
data pulses as short as 25 ns, with skew less than
3 ns.
These devices combine three 3-state differential
line drivers and three differential input line
receivers, all of which operate from a single 5-V
power supply.
SN65LBC171DB (Marked as BL171)
SN75LBC171DB (Marked as LB171)
SN65LBC171DW (Marked as 65LBC171)
SN75LBC171DW (Marked as 75LBC171)
logic diagram
CDE
1DE
1D
RE
1R
2DE
2D
2R
3DE
3D
3R
1R
1DE
1D
GND
GND
2R
2DE
2D
3R
3DE
(TOP VIEW)
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
1B
1A
RE
CDE
V
CC
2B
2A
3B
3A
3D
1A
1B
2A
2B
3A
3B
The driver differential outputs and the receiver differential inputs are connected internally to form three
differential input/output (I/O) bus ports that are designed to offer minimum loading to the bus whenever the driver
is disabled or V
= 0. These ports feature a wide common-mode voltage range making the device suitable for
CC
party-line applications over long cable runs.
The SN75LBC171 is characterized for operation over the temperature range of 0°C to 70°C. The SN65LBC171
is characterized for operation over the temperature range of –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
The signaling rate of a line is the number of voltage transitions that are made per second expressed in the units bps (bits per second).
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
2. Tested in accordance with JEDEC Standard 22, Test Method A114–A.
3. Tested in accordance with JEDEC Standard 22, Test Method C101.
POWER DISSIPATION RATING TABLE
PACKAGE
DB995 mW8.0 mW/°C635 mW515 mW
DW1480 mW11.8 mW/°C950 mW770 mW
‡
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
‡
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
recommended operating conditions
MINNOMMAXUNIT
Supply voltage, V
Voltage at any bus I/O terminalA, B–712V
High-level input voltage, V
Low-level input voltage, V
Differential input voltage, V
p
p
CC
IH
IL
ID
p
A
A with respect to B–1212V
Driver–6060
Receiver–88
SN75LBC171070
SN65LBC171–4085
4.7555.25V
2V
00.8
CC
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN65LBC171, SN75LBC171
(SS)
‡
()
magnitude
‡
C
L
F
R
54 Ω
C
50 pF
See Figure 3
S
(HVD SCSI double-terminated load)
See Figure 5
ns
See Figure 6
ns
TRIPLE DIFFERENTIAL TRANSCEIVERS
SLLS460A – NOVEMBER 2000 – REVISED FEBRUARY 2001
DRIVER SECTION
electrical characteristics over recommended operating conditions
PARAMETERTEST CONDITIONSMINTYP†MAXUNIT
V
IK
V
O
|V
OD
∆V
OD
V
OC(SS)
∆V
OC(SS)
I
I
I
O
I
OS
I
CC
†
All typical values are at VCC = 5 V and TA = 25°C.
‡
The minimum VOD may not fully comply with TIA/EIA-485-A at operating temperatures below 0°C. System designers should take the possibly
lower output signal into account in determining the maximum signal-transmission distance.
Input clamp voltageD, DE, CDEII = 18 mA–1.5–0.7V
Open-circuit output voltage (single-ended)A or B, No load0V
Steady-state differential output voltage
|
Change in differential output voltage
magnitude, | V
Steady-state common-mode output voltage
Change in steady-state common-mode
output voltage (V
Input currentD, DE, CDE–100100µA
Output current with power offVCC = 0 V,VO = –7 V to 12 V–700900µA
Short-circuit output currentVO = –7 V to 12 V,See Figure 7–250250mA
Supply current (driver enabled)D at 0 V or VCC,
OD(H)
OC(H)
| – |V
– V
OD(L)
OC(L)
|
)
No load3.84.3V
RL = 54 Ω,See Figure 111.62.4V
With common-mode loading, See Figure 211.62.4V
–0.20.2V
RL = 54 Ω,
= 50
p
See Figure 1
CDE, DE, RE at
VCC, No load
22.42.8V
–0.20.2V
1420mA
CC
CC
V
V
switching characteristics over recommended operating conditions
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
t
PLH
t
PHL
t
r
t
f
t
sk(p)
t
sk(o)
t
sk(pp)
t
PLH
t
PHL
t
r
t
f
t
sk(p)
t
sk(o)
t
sk(pp)
t
PZH
t
PHZ
t
PZL
t
PLZ
§
Output skew (t
¶
Part-to-part skew (t
both devices operate with the same input signals, the same supply voltages, at the same temperature, and have identical packages and test
circuits.
Differential output propagation delay, low-to high48.512
Differential output propagation delay, high-to-low48.511
Differential output rise time
Differential output fall time
Pulse skew | (t
Output skew
Part-to-part skew
Differential output propagation delay, low-to high3710
Differential output propagation delay, high-to-low37.510
Differential output rise time
Differential output fall time
Pulse skew | (t
Output skew
Part-to-part skew
Output enable time to high level
Output disable time from high level
Output enable time to low level
Output disable time from low level
) is the magnitude of the time delay difference between the outputs of a single device with all of the inputs connected together.
sk(o)
sk(pp)
– t
– t
PHL
PHL
) |
) |
PLH
§
¶
PLH
§
¶
) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when
L
ee Figure 4,
=
,
L
-
=
,
37.511
3
7.511
1.5
37.512
37.512
1.5
2.5
1525
1825
1025
1725
ns
2
2
ns
3
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
V
V
IILine input current
Other input
V
mA
V
3 V to 3 V, See Figure 9
See Figure 10
ns
See Figure 11
ns
TRIPLE DIFFERENTIAL TRANSCEIVERS
SLLS460A – NOVEMBER 2000 – REVISED FEBRUARY 2001
RECEIVER SECTION
electrical characteristics over recommended operating conditions
PARAMETERTEST CONDITIONSMINTYP†MAXUNIT
V
IT+
V
IT–
V
hys
V
OH
V
OL
I
I
R
I
I
CC
†
All typical values are at VCC = 5 V and TA = 25°C.
switching characteristics over recommended operating conditions
Positive-going differential input voltage threshold0.2
Negative-going differential input voltage threshold–0.2
Hysteresis voltage (V
High-level output voltageVID = 200 mV, IOH = –8 mA, see Figure 1044.7V
Low-level output voltageVID = –200 mV , IOL = –8 mA, see Figure 1000.20.4
p
Input currentRE–100100µA
Input resistanceA, B12kΩ
Supply current (receiver enabled)A, B, D open, RE, DE, and CDE at 0 V16mA
IT+
– V
)40mV
IT–
p
= 0
VI = 12 V0.9
VI = –7 V–0.7
SN65LBC171, SN75LBC171
CC
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
t
PLH
t
PHL
t
r
t
f
t
PZH
t
PHZ
t
PZL
t
PLZ
t
sk(p)
t
sk(o)
t
sk(pp)
‡
Output skew (t
§
Part-to-part skew (t
both devices operate with the same input signals, the same supply voltages, at the same temperature, and have identical packages and test
circuits.
Propagation delay time, low-to-high level output716ns
Propagation delay time, high-to-low level output
Receiver output rise time
Receiver output fall time1.33ns
Receiver output enable time to high level
Receiver output disable time from high level
Receiver output enable time to low level
Receiver output enable time to high level
Pulse skew (| ( t
Output skew
Part-to-part skew
) is the magnitude of the time delay difference between the outputs of a single device with all of the inputs connected together.
sk(o)
sk(pp)
– t
PLH
}
w
) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /D 09/00
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN65LBC171, SN75LBC171
TRIPLE DIFFERENTIAL TRANSCEIVERS
SLLS460A – NOVEMBER 2000 – REVISED FEBRUARY 2001
MECHANICAL DATA
DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
16 PINS SHOWN
0.050 (1,27)
16
1
0.020 (0,51)
0.014 (0,35)
9
0.299 (7,59)
0.291 (7,39)
8
A
0.010 (0,25)
0.419 (10,65)
0.400 (10,15)
M
0.010 (0,25) NOM
0°–8°
Gage Plane
0.010 (0,25)
0.050 (1,27)
0.016 (0,40)
0.104 (2,65) MAX
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-013
0.012 (0,30)
0.004 (0,10)
DIM
A MAX
A MIN
PINS **
16
0.410
(10,41)
0.400
(10,16)
Seating Plane
0.004 (0,10)
20
0.510
(12,95)
0.500
(12,70)
24
0.610
(15,49)
0.600
(15,24)
28
0.710
(18,03)
0.700
(17,78)
4040000/D 01/00
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
15
PACKAGE OPTION ADDENDUM
www.ti.com
20-Mar-2007
PACKAGING INFORMATION
Orderable DeviceStatus
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
SN65LBC171DBACTIVESSOPDB2070Green (RoHS &
no Sb/Br)
SN65LBC171DBG4ACTIVESSOPDB2070Green (RoHS &
no Sb/Br)
SN65LBC171DBRACTIVESSOPDB202000 Green (RoHS &
no Sb/Br)
SN65LBC171DBRG4ACTIVESSOPDB202000 Green (RoHS &
no Sb/Br)
SN65LBC171DWACTIVESOICDW2025Green (RoHS &
no Sb/Br)
SN65LBC171DWG4ACTIVESOICDW2025Green (RoHS &
no Sb/Br)
SN65LBC171DWRACTIVESOICDW202000 Green(RoHS &
no Sb/Br)
SN65LBC171DWRG4ACTIVESOICDW202000 Green (RoHS &
no Sb/Br)
SN75LBC171DBACTIVESSOPDB2070Green (RoHS &
no Sb/Br)
SN75LBC171DBG4ACTIVESSOPDB2070Green (RoHS &
no Sb/Br)
SN75LBC171DBRACTIVESSOPDB202500 Green (RoHS &
no Sb/Br)
SN75LBC171DBRG4ACTIVESSOPDB202500 Green (RoHS &
no Sb/Br)
SN75LBC171DWACTIVESOICDW2025Green (RoHS &
no Sb/Br)
SN75LBC171DWG4ACTIVESOICDW2025Green (RoHS &
no Sb/Br)
SN75LBC171DWRACTIVESOICDW202500 Green (RoHS &
no Sb/Br)
SN75LBC171DWRG4ACTIVESOICDW202500 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.