Texas Instruments SN75C1406NS, SN75C1406D, SN75C1406DR, SN75C1406DW, SN75C1406DWR Datasheet

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SN75C1406
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
D
Meet or Exceed the Requirements of TIA/EIA-232-F and ITU Recommendation
D, DW, N, OR NS PACKAGE
(TOP VIEW)
D
Very Low Power Consumption . . . 5 mW Typ
D
Wide Driver Supply Voltage Range . . . ±4.5 V to ±15 V
D
Driver Output Slew Rate Limited to 30 V/µs Max
D
Receiver Input Hysteresis . . . 1000 mV Typ
D
Push-Pull Receiver Outputs
D
On-Chip Receiver 1-µs Noise Filter
D
Functionally Interchangeable With Motorola
V
DD
1RA 1DY 2RA 2DY 3RA 3DY
V
SS
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10
V
CC
1RY 1DA 2RY 2DA 3RY 3DA
9
GND
MC145406 and Texas Instruments TL145406
D
Package Options Include Plastic Small-Outline (D, DW, NS) Packages and (N) DIPs
description
The SN75C1406 is a low-power BiMOS device containing three independent drivers and receivers that are used to interface data terminal equipment (DTE) with data circuit-terminating equipment (DCE). This device is designed to conform to TIA/EIA-232-F . The drivers and receivers of the SN75C1406 are similar to those of the SN75C188 quadruple driver and SN75C189A quadruple receiver, respectively. The drivers have a controlled output slew rate that is limited to a maximum of 30 V/µs, and the receivers have filters that reject input noise pulses shorter than 1 µs. Both these features eliminate the need for external components.
The SN75C1406 is designed using low-power techniques in a BiMOS technology. In most applications, the receivers contained in these devices interface to single inputs of peripheral devices such as ACEs, UARTs, or microprocessors. By using sampling, such peripheral devices are usually insensitive to the transition times of the input signals. If this is not the case, or for other uses, it is recommended that the SN75C1406 receiver outputs be buffered by single Schmitt input gates or single gates of the HCMOS, ALS, or 74F logic families.
The SN75C1406 is characterized for operation from 0°C to 70°C.
logic symbol
1RA 2RA 3RA 1DY
2DY 3DY
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2 4 6 3
5 7
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
15 13 11 14
12 10
1RY 2RY 3RY 1DA
2DA 3DA
logic diagram, each driver and receiver
RA
DY
RY
DA
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1999, Texas Instruments Incorporated
1
SN75C1406 TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
schematics of inputs and outputs
Input
DA
EQUIVALENT DRIVER INPUT
V
DD
Internal
1.4-V Reference
V
SS
GND
EQUIVALENT RECEIVER INPUT EQUIVALENT RECEIVER OUTPUT
EQUIVALENT DRIVER OUTPUT
74
72
160
V
DD
Output DY
V
SS
V
CC
Input
RA
ESD
Protection
GND
All resistor values shown are nominal.
3.4 k
ESD
Protection
1.5 k
530
Output RY
GND
2
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SN75C1406
Input voltage, V
V
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
Supply voltage, VSS –15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage, VCC 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI: Driver VSS to V Output voltage range, V
Package thermal impedance, θJA (see Note 2): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to the network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51.
(see Note 1) 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver –30 V to 30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
: Driver (VSS – 6 V) to (VDD + 6 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
Receiver –0.3 V to (VCC + 0.3 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 57°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–65°C to 150 °C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
recommended operating conditions
MIN NOM MAX UNIT
Supply voltage, V Supply voltage, V Supply voltage, V
p
High-level input voltage, V Low-level input voltage, V High-level output current, I Low-level output current, I Operating free-air temperature, T
DD SS CC
I
IH
IL
OH
OL
Driver VSS+2 V Receiver ±25
A
4.5 12 15 V
–4.5 –12 –15 V
4.5 5 6 V DD
2 V
0.8 V
–1 mA
3.2 mA
0 70 °C
DD
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3
SN75C1406
VOHHigh-level output voltage
IH
,
V
V
g
IH
,
V
IDDSupply current from V
,
A
ISSSupply current from V
,
A
L
,
L
,
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
DRIVER SECTION
electrical characteristics over operating free-air temperature range, V
= 5 V ± 10% (unless otherwise noted)
V
CC
PARAMETER TEST CONDITIONS MIN
V
p
OL
I
IH
I
IL
I
OS(H)
I
OS(L)
r
O
All typical values are at TA = 25°C.
Not more than one output should be shorted at a time.
NOTES: 3. The algebraic convention, where the more positive (less negative) limit is designated as maximum, is used in this data sheet for logic
Low-level output voltage V (see Note 3)
High-level input current VI = 5 V, See Figure 2 1 µA Low-level input current VI = 0, See Figure 2 –1 High-level short-circuit
output current Low-level short-circuit
output current
pp
pp
Output resistance
levels only.
4. Test conditions are those specified by TIA/EIA-232-F.
DD
SS
= 0.8 V,
See Figure 1
= 2 V,
See Figure 1
VI = 0.8 V, VO = 0 or VSS, See Figure 1 –7.5 –12 –19.5 mA
VI = 2 V, VO = 0 or VDD, See Figure 1 7.5 12 19.5 mA
No load, All inputs at 2 V or 0.8 V
No load, All inputs at 2 V or 0.8 V
VDD = VSS = VCC = 0, See Note 4
RL = 3 kΩ,
RL = 3 kΩ,
VDD = 5 V, VSS = –5 V 4 4.5 VDD = 12 V, VSS = –12 V 10 10.8 VDD = 5 V, VSS = –5 V –4.4 –4 VDD = 12 V, VSS = –12 V –10.7 –10
VDD = 5 V, VSS = –5 V 115 250 VDD = 12 V, VSS = –12 V 115 250 VDD = 5 V, VSS = –5 V –115 –250 VDD = 12 V, VSS = –12 V –115 –250 VO = –2 V to 2 V,
= 12 V, VSS = – 12 V,
DD
TYP
300 400
MAX UNIT
µ
µ
switching characteristics at TA = 25°C, VDD = 12 V, VSS = –12 V, VCC = 5 V ± 10%
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
Propagation delay time, low- to high-level output
PLH
t
Propagation delay time, high- to low-level output
PHL
t
Transition time, low- to high-level output
TLH
t
Transition time, high- to low-level output
THL
t
Transition time, low- to high-level output
TLH
t
Transition time, high- to low-level output
THL
SR Output slew rate
§
t
and t
PHL
Measured between 10% and 90% points of output waveform
#
Measured between 3-V and –3-V points of output waveform (TIA/EIA-232-F conditions) with all unused inputs tied either high or low
include the additional time due to on-chip slew rate and are measured at the 50% points.
PLH
§
§
R
¶ ¶
#
#
= 3 k to 7 kΩ,C
See Figure 3
RL = 3 kto 7 kΩ,CL = 2500 pF, See Figure 3
RL = 3 kto 7 kΩ,CL = 2500 pF, See Figure 3
RL = 3 k to 7 kΩ,CL = 15 pF, See Figure 3
= 15 pF,
0.53 2 3.2 µs
0.53 2 3.2 µs
1.2 3 µs
2.5 3.5 µs
1 2 µs
1 2 µs
4 10 30 V/µs
4
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TRIPLE LOW-POWER DRIVERS/RECEIVERS
VOHHigh-level output voltage
V
See Figure 5
IIHHigh-level input current
mA
IILLow-level input current
I
g
V
V
See Figure 4
8–15
mA
I
V
V
V
V
See Figure 4
1325mA
ICCSupply current from V
A
L
,
L
,
RECEIVER SECTION
SN75C1406
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
electrical characteristics over operating free-air temperature range, V V
= 5 V ± 10% (unless otherwise noted)
CC
PARAMETER TEST CONDITIONS MIN
V
IT+
V
IT–
V
hys
V
OL
OS(H)
OS(L)
All typical values are at TA = 25°C.
NOTE 5: If the inputs are left unconnected, the receiver interprets this as an input low and the receiver outputs remain in the high state.
Positive-going input threshold voltage
Negative-going input threshold voltage
Input hysteresis voltage (V
IT+–VIT–
Low-level output voltage VI = 3 V, IOL = 3.2 mA, See Figure 5 0.17 0.4 V
High-level short-circuit output current
Low-level short-circuit output current
pp
)
p
p
p
See Figure 5 1.7 2 2.55 V
See Figure 5 0.65 1 1.25 V
VI = 0.75 V, IOH = –20 µA, See Figure 5 and Note 5 3.5
VI = 0.75 V,
VI = 2.5 V 3.6 4.6 8.3 VI = 3 V 0.43 0.55 1 VI = –2.5 V –3.6 –5 –8.3 VI = –3 V –0.43 –0.55 –1
= 0.75 V,
I
=
I
CC
No load,
CC
All inputs at 0 or 5 V
,
IOH = –1 mA,
= 0,
O
=
O
CC
VCC = 4.5 V 2.8 4.4 VCC = 5 V VCC = 5.5 V 4.3 5.4
,
VDD = 5 V, VSS = –5 V 320 450 VDD = 12 V, VSS = –12 V 320 450
= 12 V, VSS = –12 V,
DD
TYP
600 1000 mV
3.8 4.9
MAX UNIT
µ
switching characteristics at TA = 25°C, VDD = 12 V , VSS = –12 V , VCC = 5 V ± 10% (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
Propagation delay time, low- to high-level output 3 4 µs
PLH
t
Propagation delay time, high- to low-level output
PHL
t
Transition time, low- to high-level output
TLH
t
Transition time, high- to low-level output
THL
t
Duration of longest pulse rejected as noise
w(N)
Measured between 10% and 90% points of output waveform
§
The receiver ignores any positive- or negative-going pulse that is less than the minimum value of t pulse greater than the maximum of t
w(N)
‡ ‡
§
.
C
= 50 pF, R
See Figure 6
CL = 50 pF, RL = 5 k 1 4 µs
= 5 kΩ,
) and accepts any positive- or negative-going
w(N
3 4 µs 300 450 ns 100 300 ns
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5
SN75C1406
)
)
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
PARAMETER MEASUREMENT INFORMATION
I
V
DD
V
CC
V
I
V
O
V
SS
Figure 1. Driver Test Circuit
VOH, VOL, I
OS(L
OS(L)
–I
OS(H)
RL = 3 k
, I
OS(H
VDD or GND
VSS or GND
V
DD
I
IH
V
I
–I
IL
V
I
V
CC
V
SS
Figure 2. Driver Test Circuit, IIL, I
IH
V
DD
Input
Pulse
Generator
(See Note B)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
V
CC
R
L
V
SS
TEST CIRCUIT
C
L
(see Note A)
Figure 3. Driver Test Circuit and Voltage Waveforms
V
DD
V
CC
V
I
V
SS
–I
OS(H)
I
OS(L)
V
CC
Input
Output
VIT, V
3 V
1.5
t
PHL
90%
t
THL
V
DD
V
CC
I
V
SS
50%
10%
VOLTAGE WAVEFORMS
V
OL
1.5
I
OL
50%
10%
0 V
t
PLH
V
t
TLH
–I
V
OH
OH
OL
90%
V
OH
Figure 4. Receiver Test Circuit, I
6
, I
OS(H)
OS(L)
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Figure 5. Receiver Test Circuit, VIT, VOL, V
OH
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
PARAMETER MEASUREMENT INFORMATION
SN75C1406
V
DD
Input
Pulse
Generator
(See Note B)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
V
CC
R
L
V
SS
TEST CIRCUIT
C
L
(see Note A)
Input
Output
t
PHL
t
THL
50%
90%
50%
50%
10%
VOLTAGE WAVEFORMS
10%
50%
t
PLH
90%
t
Figure 6. Receiver Test Circuit and Voltage Waveforms
APPLICATION INFORMATION
The TIA/EIA-232-F specification is for data interchange between a host computer and a peripheral at signaling rates up to 20 kbit/s. Many TIA/EIA-232-F devices will operate at higher data rates with lower capacitive loads (short cables). For reliable operation at greater than 20 kbit/s, the designer needs to have control of both ends of the cable. By mixing different types of TIA/EIA-232-F devices and cable lengths, errors can occur at higher frequencies (above 20 kbit/s). When operating within the TIA/EIA-232-F requirements of less than 20 kbit/s and with compliant line circuits, interoperability is assured. For applications operating above 20 kbit/s, the design engineer should consider devices and system designs that meet the TIA/EIA-232-F requirements.
TLH
4 V
0 V
V
V
OH
OL
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TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
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TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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