Meet or Exceed the Requirements of
TIA/EIA-232-F and ITU Recommendation
D, DW, N, OR NS PACKAGE
(TOP VIEW)
V.28
D
Very Low Power Consumption . . .
5 mW Typ
D
Wide Driver Supply Voltage Range . . .
±4.5 V to ±15 V
D
Driver Output Slew Rate Limited to
30 V/µs Max
D
Receiver Input Hysteresis . . . 1000 mV Typ
D
Push-Pull Receiver Outputs
D
On-Chip Receiver 1-µs Noise Filter
D
Functionally Interchangeable With Motorola
V
DD
1RA
1DY
2RA
2DY
3RA
3DY
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
V
CC
1RY
1DA
2RY
2DA
3RY
3DA
9
GND
MC145406 and Texas Instruments
TL145406
D
Package Options Include Plastic
Small-Outline (D, DW, NS) Packages and
(N) DIPs
description
The SN75C1406 is a low-power BiMOS device containing three independent drivers and receivers that are used
to interface data terminal equipment (DTE) with data circuit-terminating equipment (DCE). This device is
designed to conform to TIA/EIA-232-F . The drivers and receivers of the SN75C1406 are similar to those of the
SN75C188 quadruple driver and SN75C189A quadruple receiver, respectively. The drivers have a controlled
output slew rate that is limited to a maximum of 30 V/µs, and the receivers have filters that reject input noise
pulses shorter than 1 µs. Both these features eliminate the need for external components.
The SN75C1406 is designed using low-power techniques in a BiMOS technology. In most applications, the
receivers contained in these devices interface to single inputs of peripheral devices such as ACEs, UARTs, or
microprocessors. By using sampling, such peripheral devices are usually insensitive to the transition times of
the input signals. If this is not the case, or for other uses, it is recommended that the SN75C1406 receiver outputs
be buffered by single Schmitt input gates or single gates of the HCMOS, ALS, or 74F logic families.
The SN75C1406 is characterized for operation from 0°C to 70°C.
logic symbol
1RA
2RA
3RA
1DY
2DY
3DY
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
†
2
4
6
3
5
7
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
15
13
11
14
12
10
1RY
2RY
3RY
1DA
2DA
3DA
logic diagram, each driver and receiver
RA
DY
RY
DA
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to the network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51.
switching characteristics at TA = 25°C, VDD = 12 V , VSS = –12 V , VCC = 5 V ± 10% (unless otherwise
noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
t
Propagation delay time, low- to high-level output34µs
PLH
t
Propagation delay time, high- to low-level output
PHL
t
Transition time, low- to high-level output
TLH
t
Transition time, high- to low-level output
THL
t
Duration of longest pulse rejected as noise
w(N)
‡
Measured between 10% and 90% points of output waveform
§
The receiver ignores any positive- or negative-going pulse that is less than the minimum value of t
pulse greater than the maximum of t
w(N)
‡
‡
§
.
C
= 50 pF,R
See Figure 6
CL = 50 pF,RL = 5 kΩ14µs
= 5 kΩ,
) and accepts any positive- or negative-going
w(N
34µs
300450ns
100300ns
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
SN75C1406
)
)
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
PARAMETER MEASUREMENT INFORMATION
I
V
DD
V
CC
V
I
V
O
V
SS
Figure 1. Driver Test Circuit
VOH, VOL, I
OS(L
OS(L)
–I
OS(H)
RL = 3 kΩ
, I
OS(H
VDD or GND
VSS or GND
V
DD
I
IH
V
I
–I
IL
V
I
V
CC
V
SS
Figure 2. Driver Test Circuit, IIL, I
IH
V
DD
Input
Pulse
Generator
(See Note B)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
V
CC
R
L
V
SS
TEST CIRCUIT
C
L
(see Note A)
Figure 3. Driver Test Circuit and Voltage Waveforms
V
DD
V
CC
V
I
V
SS
–I
OS(H)
I
OS(L)
V
CC
Input
Output
VIT, V
3 V
1.5
t
PHL
90%
t
THL
V
DD
V
CC
I
V
SS
50%
10%
VOLTAGE WAVEFORMS
V
OL
1.5
I
OL
50%
10%
0 V
t
PLH
V
t
TLH
–I
V
OH
OH
OL
90%
V
OH
Figure 4. Receiver Test Circuit, I
6
, I
OS(H)
OS(L)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Figure 5. Receiver Test Circuit, VIT,VOL,V
OH
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
PARAMETER MEASUREMENT INFORMATION
SN75C1406
V
DD
Input
Pulse
Generator
(See Note B)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
V
CC
R
L
V
SS
TEST CIRCUIT
C
L
(see Note A)
Input
Output
t
PHL
t
THL
50%
90%
50%
50%
10%
VOLTAGE WAVEFORMS
10%
50%
t
PLH
90%
t
Figure 6. Receiver Test Circuit and Voltage Waveforms
APPLICATION INFORMATION
The TIA/EIA-232-F specification is for data interchange between a host computer and a peripheral at signaling
rates up to 20 kbit/s. Many TIA/EIA-232-F devices will operate at higher data rates with lower capacitive loads
(short cables). For reliable operation at greater than 20 kbit/s, the designer needs to have control of both ends
of the cable. By mixing different types of TIA/EIA-232-F devices and cable lengths, errors can occur at higher
frequencies (above 20 kbit/s). When operating within the TIA/EIA-232-F requirements of less than 20 kbit/s and
with compliant line circuits, interoperability is assured. For applications operating above 20 kbit/s, the design
engineer should consider devices and system designs that meet the TIA/EIA-232-F requirements.
TLH
4 V
0 V
V
V
OH
OL
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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